STT3524C N-Ch: 4.1 A, 20 V, RDS(ON) 47 mΩ Ω P-Ch: -3.2 A, -20 V, RDS(ON) 79 mΩ Ω N & P-Channel Enhancement Mode Mos.FET Elektronische Bauelemente RoHS Compliant Product A suffix of “-C” specifies halogen and lead-free TSOP-6 DESCRIPTION These miniature surface mount MOSFETs utilize high cell density process. Low RDS(on) assures minimal power loss and conserves energy, making this device ideal for use in power management circuitry. Typical applications are DC-DC converters, power management in portable and battery-powered products such as computers, printers, PCMCIA cards, cellular and cordless telephones. A E L 5 6 4 B 1 2 3 F FEATURES C Millimeter Min. Max. 2.70 3.10 2.60 3.00 1.40 1.80 1.10 MAX. 1.90 REF. 0.30 0.50 REF. A B C D E F PACKAGE INFORMATION Package MPQ Leader Size TSOP-6 3K 7’ inch J K DG Low RDS(on) Provides Higher Efficiency And Extends Battery Life. Miniature TSOP-6 Surface Mount Package Saves Board Space. H Millimeter Min. Max. 0 0.10 0.60 REF. 0.12 REF. 0° 10° 0.95 REF. REF. G H J K L Top View ABSOLUTE MAXIMUM RATINGS(TA=25℃ UNLESS OTHERWISE NOTED) Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage VGS Continuous Drain Current Pulsed Drain Current TA=25°C 1 Power Dissipation 2 1 TA=25°C 1 N-Channel P-Channel 20 Operating Junction and Storage Temperature Range Unit V V 4.1 -3.2 3.3 -2.6 IDM 8 -8 A IS 1.05 -1.05 A 1.15 PD TA=70°C -20 ±8 ID TA=70°C Continuous Source Current (Diode Conduction) Ratings W 0.7 TJ, TSTG A -55 ~ 150 °C THERMAL RESISTANCE RATINGS Parameter Maximum Junction to Ambient 1 Symbol t ≦ 10 sec Steady State RθJA N-Channel P-Channel Typ. Max. Typ. Max. 93 110 93 110 130 150 130 150 Unit °C / W Notes: 1 Surface Mounted on 1” x 1” FR4 Board. 2 Pulse width limited by maximum junction temperature. http://www.SeCoSGmbH.com/ 23-Jan-2014 Rev. A Any changes of specification will not be informed individually. Page 1 of 2 STT3524C N-Ch: 4.1 A, 20 V, RDS(ON) 47 mΩ Ω P-Ch: -3.2 A, -20 V, RDS(ON) 79 mΩ Ω N & P-Channel Enhancement Mode Mos.FET Elektronische Bauelemente ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) Min. Typ. Max. 0.4 - - -0.4 - - - - 100 P-Ch - - -100 N-Ch - - 1 - - -1 N-Ch - - 10 VDS=16V, VGS=0 V, TJ=55℃ P-Ch - - -10 VDS= -16V, VGS=0 V, TJ=55℃ 5 - - P-Ch -5 - - N-Ch - - 47 - - 79 N-Ch - - 55 VGS=2.5V, ID=3.8A P-Ch - - 110 VGS=-2.5V, ID= -2.7A - 10 - - 5 - - 0.80 - - -0.83 - Parameter Symbol N-Ch Gate-Threshold Voltage VGS(th) P-Ch N-Ch Gate-Body Leakage Current Zero Gate Voltage Drain Current On-State Drain Current N-Ch 1 Drain-Source On-Resistance Forward Transconductance P-Ch 1 1 P-Ch N-Ch IGSS IDSS ID(on) RDS(ON) gfs P-Ch Diode Forward Voltage 1 N-Ch VSD P-Ch DYNAMIC Total Gate Charge N-Ch 7.5 - - 3.8 - - 0.6 - - 0.6 - - 1.0 - - 1.5 - - 5 - P-Ch - 5 - N-Ch - 12 - P-Ch - 15 - N-Ch - 13 - - 20 - - 7 - - 20 - P-Ch Gate-Source Charge N-Ch Qgs P-Ch Gate-Drain Charge N-Ch Qgd P-Ch Turn-on Delay Time Rise Time Turn-off Delay Time N-Ch Td(on) Tr Td(off) P-Ch Fall Time N-Ch Tf P-Ch Test Conditions VDS=VGS, ID=250uA V VDS=VGS, ID= -250uA VDS=0, VGS=8V uA VDS=0, VGS= -8V VDS=16 V, VGS=0 V VDS=-16V, VGS=0 V uA VDS = 5V, VGS=4.5 V A VDS = -5V, VGS= -4.5 V VGS=4.5V, ID=4.1A mΩ S VGS=-4.5V, ID= -3.2A VDS= 5V, ID= 4.1A VDS= -5V, ID= -3.2A S IS= 1.05A, VGS=0 IS= -1.05A, VGS=0 2 - Qg Unit N-Channel VDS=15V, VGS= 4.5V, ID= 4.1A nC P-Channel VDS= -15V, VGS= -4.5V, ID= -3.2A N-Channel VDD= 15V, RGEN= 15Ω, VGS= 4.5V, ID= 1A nS P-Channel VDD= -15V, RGEN= 15Ω VGS= -4.5V, ID= -1A Notes 1 Pulse test:PW ≦ 300 us duty cycle ≦ 2%. 2 Guaranteed by design, not subject to production testing. http://www.SeCoSGmbH.com/ 23-Jan-2014 Rev. A Any changes of specification will not be informed individually. Page 2 of 2