RClamp7524T

RClamp7524T
Low Capacitance RClamp®
4-Line ESD protection
PROTECTION PRODUCTS - RailClamp®
Description
PRELIMINARY
Features
RailClamp® TVS arrays are ultra low capacitance ESD
protection devices designed to protect high speed data
interfaces. This series has been specifically engineered
to protect sensitive components which are connected
to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE
(Cable Discharge Events), and EFT (electrical fast
transients).
The RClamp®7524T will protect four lines or two
differential pairs. Each line has a maximum capacitance of only 0.60pF between any I/O pin and ground.
This allows it to be used on circuits operating in excess
of 5GHz without signal attenuation. They feature high
maximum ESD withstand voltage of +/- 25kV contact,
+/-30kV air discharge per IEC 61000-4-2.
The RClamp7524T is in a 5-pin SLP1308N5T package.
It measures 1.3 x 0.8mm with a nominal height of
0.40mm. The innovative flow through package design
simplifies pcb layout and allows matched trace lengths
for consistant impedance between high speed differential lines.
The combination of small size, low capacitance, and high
level of ESD protection makes this device a flexible solution for applications such as HDMI, MHL, MDDI, and eDP
interfaces.
 ESD protection for high-speed data lines to







IEC 61000-4-2 (ESD) ±30kV (air), ±25kV (contact)
IEC 61000-4-5 (Lightning) 5A (8/20μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Package design optimized for high speed lines
Flow-Through design
Protects four high-speed lines
Low capacitance: 0.60pF Maximum (I/O to Ground)
Low ESD clamping voltage
Low dynamic resistance: 0.50 Ohms (Typ)
Solid-state silicon-avalanche technology
Mechanical Characteristics






SLP1308N5T 5-pin package (1.3 x 0.8 x 0.40mm)
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Lead Pitch: 0.45mm
Lead finish: NiPdAu
Marking: Marking Code
Packaging: Tape and Reel
Applications







Dimensions
HDMI 1.3 and HDMI 1.4
V-By-One
USB 3.0
MHL
eDP
LVDS Interfaces
eSATA Interfaces
Circuit Diagram
1.30
0.45 BSC
1
2
0.80
1
0.50 BSC
4
5
2
0.40
Nominal Dimensions in mm (Bottom View)
Revision 7/25/2013
3
4-Line Protection
1
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RClamp7524T
PRELIMINARY
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
75
Watts
Peak Pulse Current (tp = 8/20μs)
IP P
5
A
ESD per IEC 61000-4-2 (Air)1
ESD per IEC 61000-4-2 (Contact)1
VESD
+/- 30
+/- 25
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Operating Temperature
Storage Temperature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Any I/O to GN D
Reverse Breakdown Voltage
V BR
It = 1mA,
Any I/O to GN D
Reverse Leakage Current
IR
VRWM = 5.0V,
Any I/O to GN D
Clamping Voltage
VC
Clamping Voltage
Minimum
Maximum
Units
5
V
9
11
V
0.005
0.100
μA
IPP = 1A, tp = 8/20μs
Any I/O to GN D
12
V
VC
IPP = 5A, tp = 8/20μs
Any I/O to GN D
15
V
ESD Clamping Voltage2
VC
IPP = 4A,
tlp = 0.2/100ns
11
V
ESD Clamping Voltage2
VC
IPP = 16A,
tlp = 0.2/100ns
17
V
Dynamic Resistance3
RD
tp = 100ns
0.50
Ohms
Junction Capacitance
Cj
VR = 0V, f = 1MHz,
Any I/O to GN D
0.50
0.60
pF
VR = 0V, f = 1MHz,
Between I/O pins
0.25
0.4
pF
6.5
Typical
Notes
1)Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path
connected to ESD ground plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to
t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
© 2013 Semtech Corporation
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RClamp7524T
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
8/20us Pulse Waveform
110
DR040412-75
Waveform
Parameters:
tr = 8µs
td = 20µs
90
80
1
Percent of IPP
Peak Pulse Power - PPP (kW)
100
0.1
70
e
60
-t
50
40
td = IPP/2
30
20
10
0
0.01
0
0.1
1
10
Pulse Duration - tp (µs)
100
10
20
25
30
Junction Capacitance vs. Reverse Voltage
(Between any I/O and Ground)
1.0
14
0.9
13
0.8
Capacitance - Cj (pf)
12
11
10
9
8
Waveform
Parameters:
tr = 8µs
td = 20µs
7
0.7
0.6
0.5
0.4
0.3
0.2
0.1
f = 1 MHz
0.0
6
0
1
2
3
4
5
0
6
0.5
1
1.5
2
2.5
3
Reverse Voltage - VR (V)
Peak Pulse Current - IPP (A)
TLP Characteristic (Positive)
TLP Characteristic (Negative)
30
0
25
-5
20
-10
Current (A)
Current (A)
15
Time (µs)
Clamping Voltage vs. Peak Pulse Current
(Between any I/O and Ground)
Clamping Voltage -VC (V)
5
1000
15
10
-15
-20
Transmission Line Pulse Test (TLP)
Settings:
tp=100ns, tr=0.2ns,
ITLP and VTLP averaging window:
t =70ns to t =90ns
5
Transmission Line Pulse Test (TLP)
Settings:
tp=100ns, tr=0.2ns,
ITLP and VTLP averaging window:
t =70ns to t =90ns
-25
0
-30
0
5
10
15
20
25
30
-20
Voltage (V)
© 2013 Semtech Corporation
-15
-10
-5
0
Voltage (V)
3
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RClamp7524T
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics (Con’t)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
(Between any I/O and Ground)
ESD Clamping (-8kV Contact per IEC 61000-4-2)
(Between any I/O and Ground)
70
0
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground
plane
60
-20
Voltage (V)
Voltage (V)
50
-10
40
30
-30
-40
20
-50
10
-60
0
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground
plane
-70
-10
0
10
20
30
40
50
60
70
80
-10
0
10
20
30
Time (ns)
40
50
60
70
80
Time (ns)
Typical Insertion Loss S21
Analog Crosstalk
0
0
-20
Insertion Loss (dB)
Insertion Loss (dB)
-3
-6
-9
-40
-60
-80
-100
-12
-120
-15
1.00E+06
1.00E+07
1.00E+08
1.00E+09
-140
1.00E+07
1.00E+10
Frequency (Hz)
© 2013 Semtech Corporation
1.00E+08
1.00E+09
1.00E+10
Frequency (Hz)
4
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RClamp7524T
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufacturing parameters will require some experimentation to
get the desired solder application.
Assembly Parameter
Stencil Opening (210x440 mm)
Land Pad (180x400 mm)
1.30
.25
1.05
R ecommendation
All Dimensions are in mm.
Land Pad.
Solder Stencil Design
Aper ture shape
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
© 2013 Semtech Corporation
Stencil opening
Component
Laser cut, Electro-polished
Recommended Mounting Pattern
Rectangular
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
N on-Solder mask defined
OSP OR N iAu
5
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RClamp7524T
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
HDMI 1.4 Type A Connector
RClamp7528T
RClamp7524T
RClamp7524T
HDMI 1.4 Layout and Eye Diagram with RClamp7524T
RClamp7524T
VBus
TMDS‐
TMDS+
CBUS
GND
MHL Layout and Eye Diagram with RClamp7524T
© 2013 Semtech Corporation
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RClamp7524T
PRELIMINARY
PROTECTION PRODUCTS
Outline
OutlineDrawing
Drawing- -SO-8
SLP1308N5T
D
A
DIMENSIONS
MILLIMETERS
MIN NOM MAX
B
DIM
PIN 1
INDICATOR
(LASER MARK)
E
A
SEATING
PLANE
aaa C
A
A1
A2
b
D
E
e
e1
L
N
aaa
bbb
0.37 0.40 0.43
0.00 0.02 0.05
(0.13)
0.13 0.18 0.23
1.20 1.30 1.40
0.70 0.80 0.90
0.45 BSC
0.50 BSC
0.20 0.25 0.30
5
0.08
0.10
C
A2
A1
D/2
e
1
2
LxN
E/2
N
bxN
e1/2
bbb
C A B
e1
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP1308N5T
P1
DIMENSIONS
DIM
C
G
P
P1
X
Y
Z
P1/2
Z
(C) G
Y
MILLIMETERS
(0.65)
0.25
0.45
0.50
0.18
0.40
1.05
X
P
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2013 Semtech Corporation
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RClamp7524T
PRELIMINARY
PROTECTION PRODUCTS
Marking Code
PIN 1
INDICATOR
(LASER MARK)
Ordering Information
7524T
Part Number
Qty per
Reel
Reel
Size
YYWW
RClamp7524T.TN T
10,000
7 Inch
RailClamp and RClamp are trademarks of Semtech Corporation.
YYWW = Date Code
Carrier Tape Specification
7524T
YYWW
7524T
YYWW
7524T
YYWW
7524T
YYWW
7524T
YYWW
7524T
YYWW
Pin 1 Location (Towards Sprocket Holes)
User Direction of feed
Device Orientation in Tape
© 2013 Semtech Corporation
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RClamp7524T
PRELIMINARY
PROTECTION PRODUCTS
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2013 Semtech Corporation
9
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