RClamp1821Z Ultra Small RailClamp® 1-Line ESD protection PROTECTION PRODUCTS - Z-PakTM Description Features High ESD withstand Voltage: +/-15kV (Contact), RailClamp TVS arrays are ultra low capacitance ESD protection devices designed to protect high speed data interfaces. They are designed to replace 0201 size multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. This device offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. RClamp®1821Z has a maximum capacitance of only 0.8pF. This allows it to be used on circuits operating in excess of 3GHz without signal attenuation. RClamp1821Z is in a 2-pin SLP0603P2X3B package. It measures 0.6 x 0.3 mm with a nominal height of only 0.25mm. Leads are finished with lead-free NiAu. Each device will protect one line operating at 18 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. ® +/-18kV (Air) per IEC 61000-4-2 Able to withstand over 1000 ESD strikes per IEC 61000-4-2 Level 4 1 pack age Ultra-small 020 0201 package Protects one data or power line Low reverse current: <5nA typical (VR=18V) Working voltage: +/- 18V Low capacitance: 0.8pF Maximum Solid-state silicon-avalanche technology Mechanical Characteristics SLP0603P2X3B package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 0.6 x 0.3 x 0.25 mm Lead Finish: NiAu Marking : Marking code + dot matrix date code Packaging : Tape and Reel Applications Nominal Dimensions Cellular Handsets & Accessories Near Field Communication (NFC) lines RF signal lines FM Antenna Digital Lines USB VBus Schematic 0.62 1 0.32 0.22 0.400 BSC 2 0.250 SLP0603P2X3B (Bottom View) Revision 1/7/2014 1 www.semtech.com RClamp1821Z PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Pp k 85 Watts Maximum Peak Pulse Current (tp = 8/20μs) Ip p 2.5 Amps VESD +/- 18 +/- 15 kV TJ -55 to +125 °C TSTG -55 to +150 °C ESD p er IEC 61000-4-2 (Air)1 ESD p er IEC 61000-4-2 (Contact)1 Op erating Temp erature Storage Temp erature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Minimum Reverse Stand-Off Voltage VRWM Pin 1 to 2 or 2 to 1 Reverse Breakdown Voltage V BR It = 1mA Pin 1 to 2 or 2 to 1 Reverse Leakage Current IR VRWM = 18V, T=25°C Pin 1 to 2 or 2 to 1 Clamping Voltage VC IPP = 2.5A, tp = 8/20μs Pin 1 to 2 or 2 to 1 ESD Clamping Voltage2 VC IPP = 4A, tlp = 0.2/100ns 30 V ESD Clamping Voltage2 VC IPP = 16A, tlp = 0.2/100ns 48 V Dynamic Resistance2, 3 RD tp = 100ns 1.5 Ohms Junction Capacitance Cj VR = 0V, f = 1MHz 0.63 20 Typical Maximum Units 18 V 22 24 V 5 50 nA 34 V 0.8 pF Notes 1)ESD gun return path connected to ESD ground reference plane. 2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A © 2013 Semtech Corporation 2 www.semtech.com RClamp1821Z PROTECTION PRODUCTS Typical Characteristics Clamping Voltage vs. Peak Pulse Current (tp=8/20us) Non-Repetitive Peak Pulse Power vs. Pulse Time 10 35 DR040412-80 O TA = 25 C Clamping Voltage - VC (V) Peak Pulse Power - PPP (kW) 30 1 0.1 25 20 15 10 Waveform Parameters: tr = 8μs td = 20μs 5 0 0.01 0.1 1 10 Pulse Duration - tp (µs) 100 0 1000 0.5 1 Junction Capacitance vs. Reverse Voltage 2 2.5 3 TLP Characteristic 0.70 30 0.60 25 0.50 TLP Current (A) Capacitance - Cj (pF) 1.5 Peak Pulse Current - Ipp (A) 0.40 0.30 0.20 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t 2 = 90ns 20 15 10 5 0.10 f = 1 MHz 0.00 0 0 5 10 15 20 0 10 20 30 Reverse Voltage - VR (V) 50 60 70 80 ESD Clamping (+8kV Contact per IEC 61000-4-2) ESD Clamping (-8kV Contact per IEC 61000-4-2) 170 10 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 40dB attenuator. ESD gun return path connected to ESD ground plane 150 130 -10 -30 110 -50 Voltage (V) Voltage (V) 40 TLP Voltage (V) 90 70 50 -70 -90 -110 30 -130 10 -150 -10 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 40dB attenuator. ESD gun return path connected to ESD ground plane -170 -10 0 10 20 30 40 50 60 70 80 -10 Time (ns) © 2013 Semtech Corporation 0 10 20 30 40 50 60 70 80 Time (ns) 3 www.semtech.com RClamp1821Z PROTECTION PRODUCTS Typical Characteristics Typical Insertion Loss S21 CH1 S21 LOG 6 dB / REF 0 dB 1: - .22370 dB 800 MHz 5 0 dB 12 3 2: - .22970 dB 900 MHz 4 3: - .28610 dB 1.8 GHz -6 dB -12 dB 4: - .52490 dB 2.5 GHz -18 dB 5: - .45760 dB 2.7 GHz -24 dB -30 dB -36 dB -42 dB -48 dB 1 MHz 10 MHz 100 MHz 3 1 GHz GHz STOP 3000. 000000 MHz START . 030 MHz Applications Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The table below provides Semtech's recommended assembly guidelines for mounting this device. The figure at the right details Semtech’s recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufacturing parameters will require some experimentation to get the desired solder application. Assembly Parameter Laser cut, Electro-polished Aper ture shape Rectangular with rounded corners Solder Paste Type Solder Reflow Profile PCB Solder Pad Design PCB Pad Finish © 2013 Semtech Corporation 0.370 0.300 0.088 R ecommendation Solder Stencil Design Solder Stencil Thickness Stencil Opening Land Pad All Dimensions are in mm. Land Pad. Stencil opening Component Recommended Stencil Design 0.100 mm (0.004") Type 4 size sphere or smaller Per JEDEC J-STD-020 N on-Solder mask defined OSP OR N iAu 4 www.semtech.com RClamp1821Z PROTECTION PRODUCTS Outline Drawing - SLP0603P2X3B A B D DIM A A1 b D E e L N aaa bbb E TOP VIEW A DIMENSIONS MILLIMETERS MIN NOM MAX 0.235 0.250 0.265 0.000 0.010 0.050 0.300 0.320 0.340 0.605 0.620 0.675 0.285 0.320 0.355 0.40 BSC 0.18 0.22 0.250 2 0.08 0.10 SEATING PLANE aaa C C A1 e e/2 bxN bbb C A B 2xL BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES ). Land Pattern - SLP0603P2X3B (C) Z G DIM C G X Y Z DIMENSIONS MILLIMETERS (0.425) 0.175 0.270 0.250 0.675 Y X NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2013 Semtech Corporation 5 www.semtech.com RClamp1821Z PROTECTION PRODUCTS Marking Code Ordering Information T Part Number Qty per Reel Reel Size RClamp 1821Z.TN T 10,000 7 Inch Notes: RailClamp and RClamp are trademarks of Semtech Corporation Notes: 1)Dots represent date code matrix and Pin 1 location Carrier Tape Specification Bo Ko Ao Device Orientation in Tape A0 0.40 +/-0.05 mm B0 0.71 +/-0.05 mm K0 0.29 +/-0.05 mm T T T T T Note: All dimensions in mm unless otherwise specified PIN 1 Location (Towards Sprocket Holes) © 2013 Semtech Corporation 6 www.semtech.com RClamp1821Z PROTECTION PRODUCTS Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2013 Semtech Corporation 7 www.semtech.com