SMS05C through SMS24C TVS Diode Array For ESD and Latch-Up Protection PROTECTION PRODUCTS Description Features Transient protection for data lines to The SMS series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD and other voltage-induced transient events. Each device will protect up to five lines. They are available with operating voltages of 5V, 12V, 15V and 24V. They are unidirectional devices and may be used on lines where the signal polarities are above ground. TVS diodes are solid-state devices designed specifically for transient suppression. They feature large crosssectional area junctions for conducting high transient currents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage and no device degradation. The SMS series devices may be used to meet the immunity requirements of IEC 61000-4-2, level 4. The low cost SOT23-6L package makes them ideal for use in portable electronics such as cell phones, PDA’s, and notebook computers. IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 24A (8/20µs) Small package for use in portable electronics Protects five I/O lines Working voltages: 5V, 12V, 15V and 24V Low leakage current Low operating and clamping voltages Solid-state silicon avalanche technology Mechanical Characteristics EIAJ SOT23-6L package Molding compound flammability rating: UL 94V-0 Marking : Marking Code Packaging : Tape and Reel per EIA 481 Applications Circuit Diagram Cell phone Handsets and Accessories Microprocessor Based Equipment Personal Digital Assistants (PDA’s) Notebooks, Desktops, and Servers Portable Instrumentation Set Top Box Peripherals MP3 Players Cordless Phones Schematic & PIN Configuration SOT23-6L (Top View) Revision 08/11/04 1 www.semtech.com SMS05C through SMS24C PROTECTION PRODUCTS Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Pp k 300 Watts Peak Forward Voltage (IF=1A, tp=8/20µs) VFP 1.5 V Lead Soldering Temperature TL 260 (10 sec.) °C Operating Temperature TJ -55 to +125 °C TSTG -55 to +150 °C Storage Temperature Electrical Characteristics SMS05C Par ame te r Reverse Stand-Off Voltage Reverse Breakdown Voltage Symbo l Co nditio ns Minimum Typical VRWM Maximum Units 5 V V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C 20 µA Clamp ing Voltage VC IPP = 5A, tp = 8/20µ s 9.8 V Clamp ing Voltage VC IPP = 24A, tp = 8/20µ s 14.5 V Peak Pulse Current IP P tp = 8/20µ s 24 A Junction Cap acitance Cj Between I/O Pins and Ground VR = 0V, f = 1MHz 325 400 pF Symbo l Co nditio ns Typical Maximum Units 12 V 6 V SMS12C Par ame te r Reverse Stand-Off Voltage Minimum VRWM V BR It = 1mA Reverse Leakage Current IR VRWM = 12V, T=25°C 1 µA Clamp ing Voltage VC IPP = 5A, tp = 8/20µ s 19 V Clamp ing Voltage VC IPP = 15A, tp = 8/20µ s 23 V Peak Pulse Current IP P tp = 8/20µ s 15 A Junction Cap acitance Cj Between I/O Pins and Ground VR = 0V, f = 1MHz 150 pF Reverse Breakdown Voltage 2004 Semtech Corp. 2 13.3 V 135 www.semtech.com SMS05C through SMS24C PROTECTION PRODUCTS Electrical Characteristics (Continued) SMS15C Par ame te r Reverse Stand-Off Voltage Reverse Breakdown Voltage Symbo l Co nditio ns Minimum Typical VRWM Maximum Units 15 V V BR It = 1mA Reverse Leakage Current IR VRWM = 15V, T=25°C 1 µA Clamp ing Voltage VC IPP = 5A, tp = 8/20µ s 24 V Clamp ing Voltage VC IPP = 12A, tp = 8/20µ s 29 V Peak Pulse Current IP P tp = 8/20µ s 12 A Junction Cap acitance Cj Between I/O Pins and Ground VR = 0V, f = 1MHz 100 125 pF Symbo l Co nditio ns Typical Maximum Units 24 V 16.7 V SMS24C Par ame te r Reverse Stand-Off Voltage Reverse Breakdown Voltage Minimum VRWM V BR It = 1mA Reverse Leakage Current IR VRWM = 24V, T=25°C 1 µA Clamp ing Voltage VC IPP = 5A, tp = 8/20µ s 40 V Clamp ing Voltage VC IPP = 8A, tp = 8/20µ s 44 V Peak Pulse Current IP P tp = 8/20µ s 8 A Junction Cap acitance Cj Between I/O Pins and Ground VR = 0V, f = 1MHz 75 pF 2004 Semtech Corp. 3 26.7 V 60 www.semtech.com SMS05C through SMS24C PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 110 10 100 % of Rated Power or IPP Peak Pulse Power - Ppk (kW) 90 1 0.1 80 70 60 50 40 30 20 10 0.01 0 0.1 1 10 100 0 1000 25 125 150 45 W aveform Parameters: tr = 8µs td = 20µs 90 80 40 Clamping Voltage - VC (V) 100 Percent of IPP 100 Clamping Voltage vs. Peak Pulse Current 110 e -t 60 50 40 75 Ambient Temperature - TA ( C) Pulse Waveform 70 50 o Pulse Duration - tp (µs) td = I PP /2 30 20 Waveform Parameters: tr = 8µs td = 20µs SMS24C 35 30 SMS15C 25 20 SMS12C 15 SMS05C 10 5 10 0 0 0 5 10 15 20 25 0 30 5 10 15 20 25 30 Peak Pulse Current - IPP (A) T im e (µs) Forward Voltage vs. Forward Current 5 Forward Voltage - VF (V) 4.5 4 3.5 3 2.5 2 1.5 Waveform Parameters: tr = 8µs td = 20µs 1 0.5 0 0 5 10 15 20 25 30 35 40 45 Forward Current - IF (A) 2004 Semtech Corp. 4 www.semtech.com SMS05C through SMS24C PROTECTION PRODUCTS Applications Information Device Connection for Protection of Five Data Lines SMSxxC Circuit Diagram The SMSxxC is designed to protect up to five unidirectional data lines. The device is connected as follows: 1. Unidirectional protection of five I/O lines is achieved by connecting pins 1, 3, 4, 5 and 6 to the data lines. Pin 2 is connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppression of ESD. Protection of Five Unidirectional Lines Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z z z z z z Place the SMSxxC near the input terminals or connectors to restrict transient coupling. Minimize the path length between the SMSxxC and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. 2004 Semtech Corp. 5 www.semtech.com SMS05C through SMS24C PROTECTION PRODUCTS Outline Drawing Drawing - SO-8 Outline A e1 2X E/2 D DIM N EI 1 H H E ccc C 2X N/2 TIPS c GAGE PLANE 2 A A1 A2 b c D E1 E e e1 L L1 N 01 aaa bbb ccc 0.25 L e 01 (L1) B DETAIL A D aaa C A2 SEATING PLANE C A SEE DETAIL A1 bxN bbb A DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .057 .035 .000 .006 .035 .045 .051 .010 .020 .003 .009 .110 .114 .118 .060 .063 .069 .110 BSC .037 BSC .075 BSC .012 .018 .024 (.024) 6 0° 10° .004 .008 .008 1.45 0.90 0.00 0.15 .90 1.15 1.30 0.25 0.50 0.08 0.22 2.80 2.90 3.00 1.50 1.60 1.75 2.80 BSC 0.95 BSC 1.90 BSC 0.30 0.45 0.60 (0.60) 6 0° 10° 0.10 0.20 0.20 SIDE VIEW C A-B D NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Land Pattern X DIM (C) G C G P X Y Z Z Y DIMENSIONS MILLIMETERS INCHES (.098) .055 .037 .024 .043 .141 (2.50) 1.40 0.95 0.60 1.10 3.60 P NOTES: 1. 2004 Semtech Corp. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 6 www.semtech.com SMS05C through SMS24C PROTECTION PRODUCTS Marking Codes Part Number Marking Code SMS05C C05 SMS12C C12 SMS15C C15 SMS24C C24 Note: Pin 1 Identified with a dot. Ordering Information Part Number Working Voltage Qty per Reel R eel Size SMS05C.TC SnPb 3,000 7 Inch SMS12C.TC SnPb 3,000 7 Inch SMS15C.TC SnPb 3,000 7 Inch SMS24C.TC SnPb 3,000 7 Inch SMS05C.TCT Pb Free 3,000 7 Inch SMS12C.TCT Pb Free 3,000 7 Inch SMS15C.TCT Pb Free 3,000 7 Inch SMS24C.TCT Pb Free 3,000 7 Inch Note: (1) No suffix indicates tube pack. 2004 Semtech Corp. 7 www.semtech.com