FSV340FP / FSV360FP
Surface Mount Schottky Barrier Rectifier
Features
SOD-123HE
• Low Forward Voltage Drop:
- FSV340FP: 0.52 V Maximum at 3 A, TA = 25°C
- FSV360FP: 0.65 V Maximum at 3 A, TA = 25°C
• Larger Cathode Pad for Improved Power Dissipation
• Ultra Thin Profile - Maximum Height of 1.0 mm
• High Surge Capacity
• UL Flammability 94V-0 Classification
• MSL 1
• RoHS Compliant / Green Mold Compound
• Industrial Device Qualified per AEC-Q101 Standards.
* see authorized use policy
Band Indicates Cathode
1
2
Cathode
Anode
Ordering Information
Part Number
Top Mark
Package
Packing Method
FSV340FP
FC
SOD-123HE
Tape and Reel
FSV360FP
FD
SOD-123HE
Tape and Reel
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
Value
FSV340FP
FSV360FP
40
60
Unit
VRRM
Recurrent Peak Reverse Voltage
VRMS
RMS Reverse Voltage
28
42
V
DC Blocking Voltage
40
60
V
VR
IF(AV)
IFSM
TJ
TSTG
V
Average Forward Current at TL = 75°C
3
A
Peak Forward Surge Current: 8.3 ms Single Half Sine-Wave
Superimposed on Rated Load (JEDEC Method)
80
A
Operating Junction Temperature Range
-55 to +150
°C
Storage Temperature Range
-55 to +150
°C
© 2015 Fairchild Semiconductor Corporation
FSV340FP / FSV360FP Rev. 1.1
www.fairchildsemi.com
FSV340FP / FSV360FP — Surface Mount Schottky Barrier Rectifier
August 2015
Values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
Value
ψJL
Typical Thermal Characteristics, Junction-to-Lead
RθJA
Typical Thermal Resistance, Junction-to-Ambient
(2)
Unit
10
°C/W
140
°C/W
Note:
1. Per JESD51-3 recommended thermal test board. Device mounted on FR-4 PCB, board size = 76.2 mm x 114.3 mm.
2. Thermocouple soldered at cathode lead.
Electrical Characteristics
Values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
VF
Forward Voltage
IR
Reverse Current
Trr
Reverse Recovery Time
© 2015 Fairchild Semiconductor Corporation
FSV340FP / FSV360FP Rev. 1.1
Conditions
Min.
Typ.
Max.
FSV340FP
0.52
FSV360FP
0.65
VR = 40 V
FSV340FP
160
VR = 60 V
FSV360FP
100
IF = 0.5 A, IR = 1 A,
Irr = 0.25 A
FSV340FP
12.37
FSV360FP
10.62
IF = 3 A
Unit
V
μA
ns
www.fairchildsemi.com
2
FSV340FP / FSV360FP — Surface Mount Schottky Barrier Rectifier
Thermal Characteristics(1)
10000
10000
100 C
o
o
100
REVERSE CURRENT, m A
REVERSE CURRENT, m A
100 C
1000
1000
75 C
o
10
25 C
o
1
FS V340FP
0.1
100
10
20
30
o
10
25 C
o
1
FSV360FP
0.1
0
75 C
40
0
10
Figure 1. Typical Reverse Characteristics
40
50
60
70
80
90
Figure 2. Typical Reverse Characteristics
100
100
FORWARD CURRENT, AMPERES
FORWARD CURRENT, AMPERES
30
REVERSE VOLTAGE, VOLTS
REVERSE VOLTAGE, VOLTS
125 oC
o
100 C
10
1.0
75 oC
o
25 C
0.1
20
0.2
0.3
0.4
0.5
FSV340FP
0.6
0.7
FORWARD VOLTAGE, VOLTS
100 C
1.0
o
75 C
o
25 C
0.2
0.3
0.4
0.5
FSV360FP
0.6
0.7
0.8
FORWARD VOLTAGE, VOLTS
Figure 3. Typical Reverse Characteristics
© 2015 Fairchild Semiconductor Corporation
FSV340FP / FSV360FP Rev. 1.1
o
0.1
0.8
o
125 C
10
Figure 4. Typical Forward Characteristics
www.fairchildsemi.com
3
FSV340FP / FSV360FP — Surface Mount Schottky Barrier Rectifier
Typical Performance Characteristics
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LONGPAD IS CATHODE
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Figure 5. 2-LEAD, SOD123HE, NON JEDEC, FLAT LEAD, EXPOSED DAP
© 2015 Fairchild Semiconductor Corporation
FSV340FP / FSV360FP Rev. 1.1
www.fairchildsemi.com
4
FSV340FP / FSV360FP — Surface Mount Schottky Barrier Rectifier
Physical Dimensions
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Advance Information
Formative / In Design
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
Definition
Datasheet contains the design specifications for product development. Specifications may change
in any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I76
© Fairchild Semiconductor Corporation
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