SOT-523 Plastic-Encapsulate MOSFETS

WILLAS
FM120-M+
THRU
2SK3019TT1
FM1200-M+
SOT-523 Plastic-Encapsulate MOSFETS
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V
SOD-123+ PACKAGE
Pb Free Product
Package outline
N-channel
MOSFET
Features
FEATURES
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
SOD-123H
z
Low on-resistance
• Low profile surface mounted application in order to
SOT-523
optimize
board space.
z
Fast switching
speed
0.146(3.7)
• Low power loss, high efficiency.
0.130(3.3)
z
Low voltage drive makes this device ideal for portable equipment
• High current capability, low forward voltage drop.
z • High
Easily
designed
drive circuits
surge
capability.
1
Guardring
for
overvoltage
protection.
•
1. GATE
z
Easy to parallel
• Ultra high-speed switching.
2. SOURCE
z
Pb-Free package is available
• Silicon epitaxial planar chip, metal silicon junction.
3. DRAIN
RoHS product
for packing
code suffix
”G” of
parts meet
environmental
standards
• Lead-free
0.012(0.3) Typ.
0.071(1.8)
0.056(1.4)
MIL-STD-19500
/228
Halogen free product
for packing code suffix “H”
• RoHS product for packing code suffix "G"
Halogen free product for packing code suffix "H"
Equivalent circuit
Mechanical data
Marking: KN
• Epoxy : UL94-V0 rated flame retardant
MOSFET
RATINGS
Molded plastic,
SOD-123H(Ta = 25°C unless otherwise noted)
• Case : MAXIMUM
0.031(0.8) Typ.
,
Units
Symbol
Parameter
Value
• Terminals :Plated terminals, solderable per MIL-STD-750
Method 2026
VDS
30
Drain-Source Voltage
• Polarity : Indicated by cathode band
Gate-Source Voltage
VGSS
• Mounting Position : Any
Continuous Drain Current
ID
• Weight : Approximated 0.011 gram
Thermal Resistance, Junction-to-Ambient
RθJA
Power Dissipation
RATINGS
V
0.1
A
VRRM
VRMS
Symbol
Maximum DC Blocking Voltage
VDC
Off Characteristics
Maximum Average Forward Rectified Current
℃ /W
0.15
W
150
℃
℃
-55~+150
IO
20
30
21
Test14Condition
20
30
Drain-Source Breakdown Voltage
VDS Zero Gate Voltage Drain Current
IDSSIFSM VDS =30V,VGS = 0V
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
Gate
–Source
leakage
current
Typical
Thermal
Resistance
(Note
2)
VGS(th)CJ
TJ
Operating Temperature Range
Storage Temperature Range
TSTG
Drain-Source On-Resistance
RDS(on)
CHARACTERISTICS
Forward Transconductance
Maximum Forward Voltage at 1.0A DC
VF
@T A=125℃ Ciss
Capacitance
50
60
80
10
100
115
150
120
200
Volts
28
35
70
Max
105
Units
Volts
50
56
Typ
140
40
42
Min
200
Volts
Reverse Transfer Capacitance
80
100
1.0
VGS = 0V, ID = 10µA
30 40
120
0.8
-55 to +125
Amps
- 65 to +175
VGS =2.5V,ID =1mA
1
µA
Amps
±1
µA
℃/W
1.5
V
PF
8
Ω
13
Ω
-55 to +150
VGS = 4V, ID = 10mA
150
V
30
VDS = 3V, ID =100µA
VDS =3V, ID = 10mA
0.50
0.70
20
0.85
mS
0.9
0.5
IR
10
℃
℃
pF
9
pF
Crss
4
pF
td(on)
15
ns
VGS =5V, VDD =5V,
35
ns
ID =10mA, Rg=10Ω, RL=500Ω,
80
ns
80
ns
Coss
VDS =5V,VGS =0V,f =1MHz
0.92
Volts
13
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
2- Thermal Resistance From Junction to Ambient
60
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
gFS
Dynamic
Characteristics*
Maximum
Average
Reverse Current at @T A=25℃
Rated
DC Blocking
Voltage
Input
Capacitance
40
IGSSRΘJA VGS =±20V, V DS = 0V
Typical
Junction
Capacitance
(Note 1)
Gate
Threshold
Voltage
Output
NOTES:
Dimensions in inches and (millimeters)
ELECTRICAL CHARACTERISTICS12(Ta=25℃
13 unless
14 otherwise
15
16specified)
18
Maximum
RMS Voltage
Parameter
±20
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
Maximum Recurrent Peak Reverse Voltage
V
833
Ratings at 25℃ ambient temperature unless otherwise specified.
Temperature
TJ phase halfJunction
Single
wave, 60Hz,
resistive of inductive load.
For T
capacitive
load,
derate
current
by 20%
Storage Temperature
stg
MOSFET
Marking
Code
0.031(0.8) Typ.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
PD
0.040(1.0)
0.024(0.6)
mAmps
Switching Characteristics*
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
2012-06
tr
td(off)
tf
* These parameters have no way to verify.
2012-0
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
2N7002T
2SK3019TT1
THRU
FM1200-M+
SOT-523 Plastic-Encapsulate MOSFETS
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V
SOD-123+ PACKAGE
Typical Characteristics
Package outline
Features
• Batch process design, excellent power dissipation offers
Characteristics
better reverse leakageOutput
current
and thermal resistance.
200
T
=25
℃
3.0V
mounted application in order to
• Low profilea surface4.0V
optimize Pulsed
board space.
3.5V
efficiency.
• Low power loss, high
160
capability, low forward voltage drop.
• High current
• High surge capability.
z • Guardring for overvoltage protection.
120
z • Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction. 2.5V
• Lead-free parts meet environmental standards of
80
MIL-STD-19500
/228
• RoHS product for packing code suffix "G"
Halogen free product for packing code suffix "H"
Transfer Characteristics
SOD-123H
200
VDS=3V
100
2.0V
0.146(3.7)
0.130(3.3)
30
0.071(1.8)
0.056(1.4)
10
0.040(1.0)
0.024(0.6)
GS
1
0.031(0.8)
Typ.
0
1
0.031(0.8) Typ.
3
2
GATE TO SOURCE VOLTAGE
DS
• Polarity : Indicated by cathode band
• Mounting Position : Any RDS(ON) ——
• Weight50: Approximated
0.011 gram
T =25℃
Pulsed
0.012(0.3) Typ.
3
• Epoxy : UL94-V0 rated flame retardant
V =1.5V
• Case : 0Molded plastic, SOD-123H
0
1
2
3
4
,5
• Terminals :Plated terminals,
solderable per MIL-STD-750
DRAIN TO SOURCE VOLTAGE V
(V)
Method 2026
Ta=25℃
(mA)
ID
DRAIN CURRENT
(mA)
ID
DRAIN CURRENT
40
Mechanical
data
Pb Free Product
VGS
Dimensions in inches and (millimeters)
ID
RDS(ON) ——
VGS
15
Ta=25℃
a
Pulsed
Pulsed
30
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
12
RDS(ON)
10
RATINGS
VGS=2.5V
Marking Code
VRRM
12
20
13
30
Maximum RMS Voltage
VRMS
14
21
Maximum DC Blocking Voltage
VDC
20
30
Maximum Average Forward Rectified Current
IO
IFSM
Maximum Recurrent Peak Reverse Voltage
VGS=4V
3
Peak Forward Surge Current 8.3 ms single half sine-wave
1
3
1 load (JEDEC
superimposed on rated
method)
100
CJ
Operating Temperature Range
TJ
15
50
6
28
40
18
80
10
100
115
150
120
200
Volts
42
56
70
105
140
Volts
60
80
100
150
200
Volts
50
3
0
4
1.0
30
Amps
8
12
GATE 40
TO SOURCE VOLTAGE
120
-55 to +125
16
VGS
Amps
20
℃/W
(V)
PF
-55 to +150
IS —— VSD TSTG
Storage Temperature Range
16
60
ID=100mA
35
0
200
Typical Thermal Resistance (Note 2) DRAIN CURRENT ID R(mA)
ΘJA
Typical Junction Capacitance (Note 1)
14
40
ID=50mA
30
10
9
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
ON-RESISTANCE
RDS(ON)
( Ω)
( Ω)
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase half wave, 60Hz, resistive of inductive load.
For capacitive load, derate current by 20%
ON-RESISTANCE
4
(V)
℃
- 65 to +175
℃
200
100
Ta=25℃
CHARACTERISTICS
Pulsed
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
VF
Maximum Forward Voltage at 1.0A DC
IS (mA)
Maximum Average
30 Reverse Current at @T A=25℃
@T A=125℃
NOTES:
SOURCE CURRENT
Rated DC Blocking Voltage
0.50
0.70
0.85
0.5
IR
10
0.9
0.92
Volts
mAmps
10
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
3
2- Thermal Resistance
From Junction to Ambient
1
0.3
2012-06
2012-0
0.1
0.2
0.4
0.6
SOURCE TO DRAIN VOLTAGE
0.8
VSD (V)
1.0
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
THRU
2SK3019TT1
FM1200-M+
SOT-523 Plastic-Encapsulate MOSFETS
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V
SOD-123+ PACKAGE
Pb Free Product
Package outline
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
SOD-123H
Outline Drawing
SOT-523
• Low profile surface mounted application in order to
optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• High surge capability.
• Guardring for overvoltage protection.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Lead-free parts meet environmental standards of
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
0.071(1.8)
0.056(1.4)
MIL-STD-19500 /228
Halogen free product for packing code suffix "H"
Mechanical data
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123H
,
• Terminals :Plated terminals, solderable per MIL-STD-750
.035(0.90)
.028(0.70)
.067(1.70)
.059(1.50)
Method 2026
0.031(0.8) Typ.
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.011 gram
.069(1.75)
.057(1.45)
.004(0.10)MIN.
• RoHS product for packing code suffix "G"
0.040(1.0)
0.024(0.6)
0.031(0.8) Typ.
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase half wave, 60Hz, resistive of inductive load.
For capacitive load, derate current by 20%
.014(0.35)
.008(0.20)
FM140-MH FM150-MH FM160-MH FM180-MH
FM1100-MH FM1150-MH FM1200-MH UNIT
SYMBOL FM120-MH FM130-MH
RATINGS
.010(0.25)
Marking Code
12
13
14
15
16
18
10
115
120
.004(0.10)
.043(1.10)
20
30
40
50
60
80
100
150
200
Maximum Recurrent Peak Reverse Voltage
Volts
VRRM
Volts
14
21
28
35
42
56
70
105
140
.035(0.90)
Maximum RMS Voltage
VRMS
Maximum DC Blocking Voltage
VDC
Maximum Average Forward Rectified Current
IO
IFSM
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
20
RΘJA
Typical Thermal Resistance (Note 2)
Typical Junction Capacitance (Note 1)
CJ
Operating Temperature Range
TJ
.004(0.10)MAX.
Storage Temperature Range
30
40
50
60
80
100
150
1.0
30
40
120
-55 to +125
Volts
200
Amps
Amps
℃/W
PF
-55 to +150
℃
- 65 to +175
TSTG
℃
CHARACTERISTICS
VF
Maximum Average Reverse Current at @T A=25℃
Rated DC Blocking Voltage
@T A=125℃
NOTES:
IR
.014(0.35)
.006(0.15)
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
0.50
.035(0.90)
.028(0.70)
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
Maximum Forward Voltage at 1.0A DC
0.70
0.85
0.5
10
0.9
0.92
Volts
mAmps
2- Thermal Resistance From Junction to Ambient
Dimensions in inches and (millimeters)
2012-06
WILLAS ELECTRONIC
CORP.
Rev.D
2012-0
WILLAS ELECTRONIC CORP.
SOT-523 Plastic-Encapsulate MOSFETS
2SK3019TT1
Ordering Information: Device PN 2SK3019TT1G(1)‐WS Packing Tape&Reel: 3 Kpcs/Reel Note: (1) RoHS product for packing code suffix ”G”;Halogen free product for packing code suffix “H” ***Disclaimer*** WILLAS reserves the right to make changes without notice to any product specification herein, to make corrections, modifications, enhancements or other changes. WILLAS or anyone on its behalf assumes no responsibility or liability for any errors or inaccuracies. Data sheet specifications and its information contained are intended to provide a product description only. "Typical" parameters which may be included on WILLAS data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. WILLAS does not assume any liability arising out of the application or use of any product or circuit. WILLAS products are not designed, intended or authorized for use in medical, life‐saving implant or other applications intended for life‐sustaining or other related applications where a failure or malfunction of component or circuitry may directly or indirectly cause injury or threaten a life without expressed written approval of WILLAS. Customers using or selling WILLAS components for use in such applications do so at their own risk and shall agree to fully indemnify WILLAS Inc and its subsidiaries harmless against all claims, damages and expenditures. 2012-0
WILLAS ELECTRONIC CORP.