Formosa MS

SMD PNP Transistor
Formosa MS
FMBT3906
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Electrical characteristics................................................................... 3
Switching time equivalent test circuits................................................ 4
Rating and characteristic curves........................................................ 4~6
Pinning information........................................................................... 7
Marking........................................................................................... 7
Suggested solder pad layout............................................................. 7
Packing information.......................................................................... 8
Reel packing.................................................................................... 9
Suggested thermal profiles for soldering processes............................. 9
High reliability test capabilities.......................................................... 10
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FAX:886-2-22696141
Document ID
Page 1
DS-231113
Issued Date
Revised Date
Revision
Page.
2008/02/10
2012/01/11
F
10
SMD PNP Transistor
Formosa MS
FMBT3906
200mA Silicon PNP Epitaxial Planar
Transistor
Features
Package outline
• High collector-emitterbreakdien voltage.
(BV CEO -40V Min.@I C=-1.0mA)
SOT-23
0.020 (0.50)
(B)
0.012 (0.30)
0.045 (1.15)
.084(2.10)
.068(1.70)
(C)
(A)
0.063 (1.60)
0.027 (0.67)
0.013 (0.32)
0.047 (1.20)
0.108 (2.75)
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SOT-23
• Terminals : Solder plated, solderable per
0.007 (0.18)
0.083 (2.10)
0.051 (1.30)
0.003 (0.09)
•
0.120 (3.04)
•
•
0.110 (2.80)
•
stauration voltage, is designed for general purpose
amflifier and switching applications at collector current.
As complementary type, the NPN transistor FMBT3904 is
recommended
Capable of 225mW power dissipation.
Lead-free parts for green partner, exceeds environmental
standards of MIL-STD-19500 /228
Suffix "-H" dinicates Halogen-free part, ex.FMBT3906-H.
0.034 (0.85)
• S mall load switch transistor with high gain and low
0.035 (0.89)
MIL-STD-750, Method 2026
• Mounting Position : Any
• Weight : Approximated 0.008 gram
Dimensions in inches and (millimeters)
Maximum ratings (AT T =25 C unless otherwise noted)
o
A
PARAMETER
CONDITIONS
Symbol
MIN.
TYP.
MAX. UNIT
Collector-Base voltage
V CBO
-40
V
Collector-Emitter voltage
V CEO
-40
V
Emitter-Base voltage
V EBO
-5.0
V
IC
-200
mA
PD
225
mW
1.8
mW/ OC
Collector current
Total device dissipation FR-5 board
(Note 1)
O
T A = 25 C
O
Derate above 25 C
Thermal resistance(Note 1)
Junction to ambient
R θJA
Thermal resistance(Note 1)
Junction to case
Total device dissipation alumina
substrate(Note 2)
T A = 25 C
Thermal resistance(Note 2)
Junction to ambient
R θJA
Junction to case
R θJC
Thermal resistance(Note 2)
O
556
O
C/W
R θJC
300
O
C/W
PD
300
mW
2.4
mW/ OC
O
Derate above 25 C
Operating junction temperature range
TJ
Storage temperature range
T STG
-55
-55
417
O
C/W
225
O
C/W
+150
o
C
+150
o
C
Note 1: FR-5 = 1.0 X 0.75 X0.062 in.
2: Alumina = 0.4 X 0.3 X 0.024 in. 99.5% alumina.
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TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 2
DS-231113
Issued Date
Revised Date
Revision
Page.
2008/02/10
2012/01/11
F
10
SMD PNP Transistor
Formosa MS
FMBT3906
Electrical characteristics (AT T =25 C unless otherwise noted)
o
A
Off characteristics
PARAMETER
Symbol
MIN.
Collector-Base breakdown voltage
I C = -10uA, I E = 0
V (BR)CBO
-40
V
Collector-Emitter breakdown voltage(3)
CONDITIONS
TYP.
MAX. UNIT
I C = -1mA, I B = 0
V (BR)CEO
-40
V
Emitter-Base breakdown voltage
I E = -10uA, I C = 0
V (BR)EBO
-5.0
V
Base cutoff current
V CE = -30V, V EB = -3.0V
I BL
-50
nA
Collector cutoff current
V CE = -30V, V EB = -3.0V
I CEX
-50
nA
On characteristics(3)
PARAMETER
CONDITIONS
Symbol
I c = -10mA, V CE = -1.0V
Collector-Emitter saturation voltage(3)
h FE
100
I c = -50mA, V CE = -1.0V
60
I c = -100mA, V CE = -1.0V
30
I c = -10mA, I B = -1.0mA
TYP.
300
-0.25
V CE(sat)
I c = -10mA, I B = -1.0mA
-
V
-0.40
I c = -50mA, I B = -5.0mA
Base-Emitter saturation voltage(3)
MAX. UNIT
80
I c = -1.0mA, V CE = -1.0V
DC current gain
MIN.
60
I c = -0.1mA, V CE = -1.0V
V BE(sat)
-0.65
-0.85
V
-0.95
I c = -50mA, I B = -5.0mA
3.Pulse test : pukse width < 300us, duty cycle < 2.0%.
Small-signal characteristics
PARAMETER
CONDITIONS
Current-gain-bandwidth product
I C = -10mA, V CE = -20V, f = 100MHz
Output capacitance
V CB = -5.0V, I E = 0, f = 1.0MHz
Input capacitance
Symbol
MIN.
fT
250
TYP.
MAX. UNIT
MHz
C obo
4.5
pF
V EB = -0.5V, I C = 0, f = 1.0MHz
C ibo
1.0
pF
Input impedance
V CE = -10V, I C = -1.0mA, f = 1.0KHz
h ie
2.0
12
kohms
Voltage feeback radio
V CE = -10V, I C = -1.0mA, f = 1.0KHz
h re
0.1
10.0
X 10 -4
Small-signal current gain
V CE = -10V, I C = -1.0mA, f = 1.0KHz
h fe
100
400
-
Output admittance
V CE = -10V, I C = -1.0mA, f = 1.0KHz
h oe
3.0
60
μmhos
Noise figure
V CE = -5.0V, I C = -100uA, Rs = 1.0K ohms, f = 1.0KHZ
NF
4.0
dB
Switching characteristics
PARAMETER
CONDITIONS
Delay time
Rise time
V CC = -3.0V, V BE = 0.5V, I C = -10mA, I B1 = -1.0mA
Storage time
Fall time
V CC = -3.0V, I C =-10mA, I B1 = I B2 = -1.0mA
Symbol
MIN.
TYP.
MAX. UNIT
td
35
tr
35
ts
225
tf
75
ns
5. Pulse Test: Pulse Width <=300μs, Duty cycle <= 2.0%
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Document ID
Page 3
DS-231113
Issued Date
Revised Date
Revision
Page.
2008/02/10
2012/01/11
F
10
Switching time equivalent test circuits
+ 0 . 5V
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Document ID
Page 4
DS-231113
Issued Date
Revised Date
Revision
Page.
2008/02/10
2012/01/11
F
10
NF, NOISE FIGURE ( dB )
NF, NOISE FIGURE ( dB )
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Document ID
Page 5
DS-231113
Issued Date
Revised Date
Revision
Page.
2008/02/10
2012/01/11
F
10
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 6
DS-231113
Issued Date
Revised Date
Revision
Page.
2008/02/10
2012/01/11
F
10
SMD PNP Transistor
Formosa MS
FMBT3906
Pinning information
Pin
Simplified outline
Symbol
C
PinB
PinC
PinE
C
Base
Collector
Emitter
B
E
B
E
Marking
Type number
Marking code
FMBT3906
2A
Suggested solder pad layout
SOT-23
0.037(0.95)
0.037(0.95)
0.079(2.0)
0.035(0.90)
0.031(0.80)
Dimensions in inches and (millimeters)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 7
DS-231113
Issued Date
Revised Date
Revision
Page.
2008/02/10
2012/01/11
F
10
SMD PNP Transistor
Formosa MS
FMBT3906
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SOT-23
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
3.15
2.77
1.22
1.50
178.00
55.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
12.0
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
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TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 8
DS-231113
Issued Date
Revised Date
Revision
Page.
2008/02/10
2012/01/11
F
10
SMD PNP Transistor
Formosa MS
FMBT3906
Reel packing
PACKAGE
SOT-23
REEL SIZE
7"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
3,000
4.0
30,000
183*183*123
178
CARTON
SIZE
(m/m)
CARTON
(pcs)
382*262*387
APPROX.
GROSS WEIGHT
(kg)
11.6
240,000
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%± 25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
o
150 C
o
200 C
60~120sec
Tsmax to T L
-Ramp-upRate
o
<3 C /sec
Time maintained above:
-Temperature(T L )
-Time(t L )
o
217 C
60~260sec
o
o
255 C- 0/ + 5 C
Peak Temperature(T P )
o
Time within 5 C of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 C /sec
o
o
Time 25 C to Peak Temperature
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<6minutes
Document ID
Page 9
DS-231113
Issued Date
Revised Date
Revision
Page.
2008/02/10
2012/01/11
F
10
SMD PNP Transistor
Formosa MS
FMBT3906
High reliability test capabilities
Item Test
Conditions
1. Steady State Operating Life
P D=225mW Test Duration:1000hrs
2. High Temperature Reverse Bias
Tj = 150℃, V CE= 80 % related volage , 1000hrs
3. Temperature Cycle
4. Autoclave
- 55℃( 15min ) to 150℃( 15min ) Air to Air Transition Time < 20sec Test Cycles : 1000cycle
P = 2atm Ta = 121℃ RH = 100 % Test Duration : 96hrs
5. High Temperature Storage Life
Ta= 150℃ Test Duration : 1000hrs
6. Solderability
245℃, 5sec
7. High Temperature High Humidity Reverse
Bias
Ta = 85℃, 85 % RH , V CE= 80 % related volage , 1000hrs
8. Resistance to Soldering Heat
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260℃, 10sec
Document ID
Page 10
DS-231113
Issued Date
Revised Date
Revision
Page.
2008/02/10
2012/01/11
F
10