MDS22 THRU MDS210

Formosa MS
SMD Schottky Bridge Rectifier
MDS22 THRU MDS210
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241661
2009/08/10
2011/08/22
C
7
Formosa MS
SMD Schottky Bridge Rectifier
MDS22 THRU MDS210
2.0A Surface Mount Schottky
Barrier Bridge Rectifiers-20-100V
Package outline
TO-269AA (MDS)
Features
• Schottky barrier chips in TO-269AA bridge.
• Metal semiconductor junction with guard ring.
• Silicon epitaxial planar chips.
• Very low forward drop down voltage.
• For use in low voltage, high efficiency inverters,
+
.165(4.2)
.150(3.8)
~
free
wheeling, and polarity protection applications.
.008(0.2)
MAX
~
.275(7.0)
.031(0.8)
.019(0.5)
• Lead-free parts meet RoHS requirments.
• UL recognized file # E321971
• Suffix "-H" indicates Halogen free parts, ex. MDS22-H.
MAX
.043(1.1)
.027(0.7)
.193(4.9)
.177(4.5)
.106(2.7)
.090(2.3)
Mechanical data
.106(2.7)
.090(2.3)
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, TO-269AA (MDS)
• Terminals : Solder plated, solderable per
Dimensions in inches and (millimeters)
MIL-STD-750, Method 2026
• Polarity : marked on body
• Mounting Position : Any
• Weight : Approximated 0.13 gram
Maximum ratings and Electrical Characteristics (AT
PARAMETER
T A=25 oC unless otherwise noted)
CONDITIONS
Average Forward rectified current
2.0x2.0”(5.0x5.0mm) copper pad, See Fig.1
Peak Forward surge current
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
V R = V RRM T J = 25 OC
Reverse current
V R = V RRM T J = 100 OC
Thermal resistance
Diode junction capacitance
UNIT
I AV
2.0
A
I FSM
50
A
TYP.
0.5
IR
RθJA
75
RθJL
20
f=1MHz and applied 4V DC reverse voltage
CJ
150
*1
V RRM
(V)
V RMS*2
(V)
*3
VR
(V)
MDS22
20
14
20
MDS24
40
28
40
MDS26
60
42
60
MDS28
80
56
80
MDS210
100
70
100
*4
VF
(V)
0.50
Operating
temperature
T J, ( OC)
-55 to +125
0.70
0.85
-55 to +150
Page 2
mA
20
Junction to lead
T STG
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
MIN.
Junction to ambient
Storage temperature
SYMBOLS
MAX.
Symbol
O
C/W
pF
O
+175
-65
C
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage
@I F =2.0A per element
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241661
2009/08/10
2011/08/22
C
7
Average Forward Current (A)
Fig.1 - Forward Current Derating Curve
2.4
2.0
1.6
MDS22 - MDS24
1.2
MDS26- MDS210
0.8
0.4
0
25
50
75
100
125
150
Peak Forward Surge Current (A)
Rating and characteristic curves (MDS22 THRU MDS210)
175
Fig. 2 - Maximum Non-Repetitive Peak
Forward Surge Current
100
10
T J = 25° C
8.3m s single half sine-wave
(JEDEC Method)
1
1
10
10
pulse width =300µs
1% duty cycle, T j =25°C
MDS22 - MDS24
MDS26
0.1
MDS28 - MDS210
0.01
0
0.2
0.4
0.6
0.8
Fig. 4A - Typical Reverse Characteristics
100
MDS22 - MDS26
T J =125°C
T J =100°C
10
T J =75°C
1.0
0.1
T J =25°C
0.01
0.001
0
1.0
20
40
60
80
100
120
140
Instantaneous Forward Voltage (Volts)
Percent of Rated Peak Reverse Voltage ( %)
Fig. 5 - Typical Junction Capacitance
Fig. 4B - Typical Reverse Characteristics
1000
Junction Capacitance (pF)
Instantaneous Reverse Current (mA)
Fig. 3 - Typical Instantaneour Forward
Characteristics
1.0
100
Number of Cycles at 60 Hz
100
T J =25°C
f=1.0MHz
10
0.1
1.0
10
100
Instantaneous Reverse Current (µA)
Instantaneous Forward Current (A)
Lead Temperature (°C)
MDS28 -MDS210
T J =150°C
1000
T J =125°C
T J =100°C
100
10
1.0
T J =25°C
0.1
0
Reverse Voltage (Volts)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
10000
20
40
60
80
100
Percent of Rated Peak Reverse Voltage ( %)
Page 3
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241661
2009/08/10
2011/08/22
C
7
Formosa MS
SMD Schottky Bridge Rectifier
MDS22 THRU MDS210
Pinning information
Simplified outline
Symbol
+
+
~
~
-
Marking
Type number
Marking code
MDS22
MDS24
MDS26
MDS28
MDS210
MDS22
MDS24
MDS26
MDS28
MDS210
Suggested solder pad layout
A
D
B
C
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
D
TO-269AA (MDS)
0.023 (0.58)
0.030 (0.76)
0.070 (1.78)
0.226 (5.75)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 4
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241661
2009/08/10
2011/08/22
C
7
Formosa MS
SMD Schottky Bridge Rectifier
MDS22 THRU MDS210
Packing information
P0
d
P1
T
E
F
+
–
W
B
A
P
C
D
D1
D2
W1
unit:mm
Item
Symbol
Tolerance
TO-269AA (MDS)
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
5.00
7.24
3.33
1.50
330.00
50.00
13.00
1.75
5.50
8.00
4.00
2.00
0.30
12.00
18.00
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 5
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241661
2009/08/10
2011/08/22
C
7
Formosa MS
SMD Schottky Bridge Rectifier
MDS22 THRU MDS210
Reel packing
PACKAGE
REEL SIZE
TO-269AA (MDS)
13"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
2,500
8.0
5,000
337*337*37
330
CARTON
SIZE
(m/m)
350*330*360
CARTON
(pcs)
APPROX.
GROSS WEIGHT
(kg)
40,000
11.8
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
150 oC
200 oC
60~120sec
Tsmax to T L
-Ramp-upRate
<3 oC/sec
Time maintained above:
-Temperature(T L )
-Time(t L )
217 oC
60~260sec
255 oC-0/+5 oC
Peak Temperature(T P )
Time within 5 oC of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 oC/sec
Time 25 oC to Peak Temperature
<6minutes
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 6
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241661
2009/08/10
2011/08/22
C
7
Formosa MS
SMD Schottky Bridge Rectifier
MDS22 THRU MDS210
High reliability test capabilities
Item Test
Conditions
Reference
O
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16"±1/32"
MIL-STD-750D
METHOD-2031
2. Solderability
at 245±5 OC for 5 sec.
MIL-STD-202F
METHOD-208
3. High Temperature Reverse Bias
4. Forward Operation Life
5. Intermittent Operation Life
6. Pressure Cooker
V R=80% rate at T J=125 OC for 168 hrs.
MIL-STD-750D
METHOD-1038
Rated average rectifier current at T A=25 OC for 500hrs.
MIL-STD-750D
METHOD-1027
T A = 25 OC, I F = I O
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
15P SIG at T A=121 OC for 4 hrs.
JESD22-A102
MIL-STD-750D
METHOD-1051
7. Temperature Cycling
-55 OC to +125 OC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Thermal Shock
0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles.
9. Forward Surge
8.3ms single half sine-wave superimposed
on rated load, one surge.
10. Humidity
at T A=85 OC, RH=85% for 1000hrs.
MIL-STD-750D
METHOD-1021
11. High Temperature Storage Life
at 175 OC for 1000 hrs.
MIL-STD-750D
METHOD-1031
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 7
MIL-STD-750D
METHOD-1056
MIL-STD-750D
METHOD-4066-2
Document ID
Issued Date
Revised Date
Revision
Page.
DS-241661
2009/08/10
2011/08/22
C
7