Formosa MS SMD Schottky Bridge Rectifier MDLS22 THRU MDLS210 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 1 DS-241658 Issued Date 2009/08/10 Revised Date 2010/11/05 Revision B Page. 7 Formosa MS SMD Schottky Bridge Rectifier MDLS22 THRU MDLS210 2.0A Surface Mount Schottky Barrier Bridge Rectifiers-20-100V Package outline LMDS Features • For surface mounted applications. • Low profile package . • Built-in strain relief • Metal to silicon rectifier. majority carrier conduction • Low power loss,high efficiency • For use in low voltage high frequency inverters, free wheeling, and polarity protection applications. • High temperature soldering guaranteed: 260°C /10 seconds at terminals 9 5 • Lead-free parts meet RoHS requirments. • Suffix "-H" indicates Halogen-free part, ex.MDLS22-H. Mechanical data • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, LMDS • Terminals : Solder plated, solderable per Dimensions in inches and (millimeters) MIL-STD-202, Method 208 • Polarity : marked on body • Mounting Position : Any • Weight : Approximated 0.099 gram Maximum ratings and Electrical Characteristics (AT PARAMETER T A=25 oC unless otherwise noted) CONDITIONS Average Forward rectified current 2.0x2.0”(5.0x5.0mm) copper pad, See Fig.1 Peak Forward surge current 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) V R = V RRM T J = 25 OC Reverse current V R = V RRM T J = 100 OC Thermal resistance Diode junction capacitance UNIT IO 2.0 A I FSM 50 A TYP. 0.5 IR RθJA 85 RθJL 20 f=1MHz and applied 4V DC reverse voltage CJ 150 *1 V RRM (V) V RMS*2 (V) MDLS22 20 14 20 MDLS24 40 28 40 MDLS26 60 42 60 MDLS28 80 56 80 MDLS210 100 70 100 *3 VR (V) *4 VF (V) 0.50 Operating temperature T J, ( OC) -55 to +125 mA 20 Junction to lead T STG http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIN. Junction to ambient Storage temperature SYMBOLS MAX. Symbol O C/W pF O +175 -65 C *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage 0.70 -55 to +150 0.85 *4 Maximum forward voltage@I F= 2.0A Document ID Page 2 DS-241658 Issued Date 2009/08/10 Revised Date 2010/11/05 Revision B Page. 7 Average Forward Current (A) Fig.1 - Forward Current Derating Curve 2.4 2.0 1.6 1.2 MDLS22 - MDLS24 MDLS24- MDLS210 0.8 0.4 0 25 50 75 100 125 150 175 Peak Forward Surge Current (A) Rating and characteristic curves (MDLS22 THRU MDLS210) Fig. 2 - Maximum Non-Repetitive Peak Forward Surge Current 100 10 T J =25°C 8.3ms single half sine-wave (JEDEC Method) 1 1 10 10 pulse width =300us 1% duty cycle, T J =25°C MDLS22 - MDLS24 MDLS26 0.1 MDS28 - MDS210 0.01 0 0.2 0.4 0.6 0.8 1.0 100 MDLS22 - MDLS26 T J =125°C 10 T J =100°C T J =75°C 1.0 0.1 T J =25°C 0.01 0.001 0 20 40 60 80 100 120 140 Instantaneous Forward Voltage (Volts) Percent of Rated Peak Reverse Voltage ( %) Fig. 5 - Typical Junction Capacitance Fig. 4B - Typical Reverse Characteristics 1000 Junction Capacitance (pF) Fig. 4A - Typical Reverse Characteristics Instantaneous Reverse Current (mA) Fig. 3 - Typical Instantaneour Forward Characteristics 1.0 100 Number of Cycles at 60 Hz 100 T J =25°C f=1.0MHz 10 0.1 1.0 10 100 Instantaneous Reverse Current (uA) Instantaneous Forward Current (A) Lead Temperature (°C) MDLS28 -MDLS210 T J =150°C 1000 T J =125°C T J =100°C 100 10 T J =25°C 1.0 0.1 0 Reverse Voltage (Volts) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 10000 20 40 60 80 100 Percent of Rated Peak Reverse Voltage ( %) Document ID Page 3 DS-241658 Issued Date 2009/08/10 Revised Date 2010/11/05 Revision B Page. 7 Formosa MS SMD Schottky Bridge Rectifier MDLS22 THRU MDLS210 Pinning information Simplified outline Symbol + ~ ~ - Marking Type number Marking code MDLS22 MDLS24 MDLS26 MDLS28 MDLS210 MDLS22 MDLS24 MDLS26 MDLS28 MDLS210 Suggested solder pad layout A D B C Dimensions in inches and (millimeters) PACKAGE A B C D LMDS 0.024 (0.60) 0.024 (0.60) 0.132 (3.35) 0.193 (4.90) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 4 DS-241658 Issued Date 2009/08/10 Revised Date 2010/11/05 Revision B Page. 7 Formosa MS SMD Schottky Bridge Rectifier MDLS22 THRU MDLS210 Packing information P0 d P1 E F W B A P C D D1 D2 W1 unit:mm Item Symbol Tolerance LMDS Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.05 2.0 min 2.0 min 0.5 0.1 0.05 0.1 0.1 0.05 0.1 0.3 1.0 7.25 5.27 1.60 1.55 330.00 50.00 13.00 1.75 5.50 8.00 4.00 2.00 0.30 12.00 22.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 5 DS-241658 Issued Date 2009/08/10 Revised Date 2010/11/05 Revision B Page. 7 Formosa MS SMD Schottky Bridge Rectifier MDLS22 THRU MDLS210 Reel packing PACKAGE REEL SIZE 13" LMDS REEL (pcs) COMPONENT SPACING (m/m) 3,000 BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 6,000 337*337*37 330 12.0 CARTON SIZE (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) 48,000 14.0 350*330*360 Suggested thermal profiles for soldering processes o o 1.Storage environment: Temperature=5 C ~40 C Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 C/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 o Document ID Page 6 DS-241658 Issued Date 2009/08/10 Revised Date 2010/11/05 Revision B Page. 7 Formosa MS SMD Schottky Bridge Rectifier MDLS22 THRU MDLS210 High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=125 OC for 168 hrs. MIL-STD-750D METHOD-1026 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker JESD22-A102 15P SIG at T A=121 OC for 4 hrs. 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 9. Forward Surge 8.3ms single half sine-wave superimposed on rated load, one surge. MIL-STD-750D METHOD-4066-2 10. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1038 11. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1051 Document ID Page 7 DS-241658 Issued Date 2009/08/10 Revised Date 2010/11/05 Revision B Page. 7