Chip Schottky Barrier Rectifier Formosa MS FM140-MH1 THRU FM1200-MH1 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision Page. DS-121614 2013/12/17 - A 7 Chip Schottky Barrier Rectifiers Formosa MS FM140-MH1 THRU FM1200-MH1 1.0A Surface Mount Schottky Barrier Rectifiers - 40V-200V Features Package outline • Batch process design, excellent power dissipation offers • • • • • • • • • better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Low power loss, high efficiency. High current capability, l ow forward voltage drop. High surge capability. Guardring for overvoltage protection. Ultra high-speed switching. Silicon epitaxial planar chip, metal silicon junction. Lead-free parts meet environmental standards of MIL-STD-19500 /228 Suffix "-H" indicates Halogen free parts, ex. FM140-MH1-H. SOD-123H1 0.146(3.7) 0.130(3.3) 0.071(1.8) 0.056(1.4) 0.012(0.3) Typ. 0.004(0.1) Typ. Mechanical data • • • Epoxy : UL94-V0 rated flame retardant 0.040(1.0) 0.024(0.6) Case : Molded plastic, SOD-123H1 Terminals :Plated terminals, solderable per MIL-STD-750, 0.031(0.8) Typ. 0.031(0.8) Typ. Method 2026 • • • Polarity : Indicated by cathode band Dimensions in inches and (millimeters) Mounting Position : Any Weight : Approximated 0.0103 gram Maximum ratings and Electrical Characteristics (AT PARAMETER o T A=25 C unless otherwise noted) SYMBOLS FM140-MH1 FM160-MH1 FM1100-MH1 FM1150-MH1 FM1200-MH1 UNITS Maximum repetitive peak reverse voltage VRRM 40 60 100 150 200 Volts Maximum RMS voltage VRMS 28 42 70 105 140 Volts Maximum DC blocking voltage VDC 40 60 100 150 200 Volts Maximum average forward rectified current Peak forward surge current 8.3ms single half sine-wave (JEDEC Method) Maximum instantaneous forward voltage at IF=1.0A Maximum DC reverse current at rated DC blocking voltage TJ =25 °C TJ =100 °C Typical junction capacitance (Note 1) Typical thermal resistance junction to ambient Typical thermal resistance junction to case IO 1.0 Amps IFSM 30 Amps VF 0.50 0.70 0.85 0.92 0.90 Volts IR 0.5 10 mA CJ 120 pF RθJA RθJC 80 40 °C / W °C / W -55 to +150 °C -55 to +150 °C Operating junction temperature range TJ Storage temperature range TSTG -55 to +125 Notes 1: Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 Document ID Issued Date Revised Date Revision Page. DS-121614 2013/12/17 - A 7 Rating and characteristic curves (FM140-MH1 THRU FM1200-MH1) FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE FIG.2-TYPICAL FORWARD 50 1.0 1~ FM 12 00 -M H1 0 20 40 60 80 100 120 140 160 180 200 LEAD TEMPERATURE,(°C) PEAK FORWARD SURGE CURRENT,(A) FIG.3-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT V MH 1 0 3.0 40 0- MH 0.2 V 16 0- 0.4 10 60 FM 14 0.6 INSTANTANEOUS FORWARD CURRENT,(A) 0.8 FM AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 1.2 V 00 ~2 0 15 TJ=25 C Pulse Width 300us 1% Duty Cycle 0.1 8.3ms Single Half TJ=25 C Sine Wave .01 JEDEC method .1 .3 .5 .7 .9 1.1 1.3 1.5 FORWARD VOLTAGE,(V) FIG.5 - TYPICAL REVERSE CHARACTERISTICS 100 40V 60V~200V NUMBER OF CYCLES AT 60Hz 10 REVERSE LEAKAGE CURRENT, (mA) FIG.4-TYPICAL JUNCTION CAPACITANCE 350 JUNCTION CAPACITANCE,(pF) 0V 10 1.0 300 250 200 150 100 1.0 TJ=100°C 0.1 TJ=25°C 0.01 50 0 .01 .05 .1 .5 1 5 10 50 100 REVERSE VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 0.001 0 20 40 60 80 100 PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) Page 3 Document ID Issued Date Revised Date Revision Page. DS-121614 2013/12/17 - A 7 Chip Schottky Barrier Rectifier Formosa MS FM140-MH1 THRU FM1200-MH1 Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code FM140-MH1 FM160-MH1 FM1100-MH1 FM1150-MH1 FM1200-MH1 14 16 10 115 120 Suggested solder pad layout C A B Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 PACKAGE A B C SOD-123H1 0.071 (1.80) 0.051 (1.30) 0.067 (1.70) Page 4 Document ID Issued Date Revised Date Revision Page. DS-121614 2013/12/17 - A 7 Chip Schottky Barrier Rectifier Formosa MS FM140-MH1 THRU FM1200-MH1 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-123H1 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.00 3.85 1.10 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision Page. DS-121614 2013/12/17 - A 7 Chip Schottky Barrier Rectifier Formosa MS FM140-MH1 THRU FM1200-MH1 Reel packing PACKAGE REEL SIZE SOD-123H1 7" COMPONENT SPACING REEL (pcs) (m/m) 4.0 3,000 BOX (pcs) 30,000 INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (m/m) (m/m) (m/m) (pcs) (kg) 183*183*123 178 382*262*387 240,000 8.5 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) o 150 C o 200 C 60~120sec Tsmax to T L -Ramp-upRate o <3 C /sec Time maintained above: -Temperature(T L ) -Time(t L ) o 217 C 60~260sec o o 255 C- 0/ + 5 C Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 C /sec o o Time 25 C to Peak Temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 <6minutes Page 6 Document ID Issued Date Revised Date Revision Page. DS-121614 2013/12/17 - A 7 Chip Schottky Barrier Rectifier Formosa MS FM140-MH1 THRU FM1200-MH1 High reliability test capabilities Item Test Conditions Reference O MIL-STD-750D METHOD-2031 O MIL-STD-202F METHOD-208 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16" ± 1/32" 2. Solderability at 245 ± 5 C for 5 sec. 3. High Temperature Reverse Bias V R=80% rate at T J=125 C for 168 hrs. 4. Forward Operation Life Rated average rectifier current at T A=25 C for 500hrs. MIL-STD-750D METHOD-1038 O MIL-STD-750D METHOD-1027 O O 5. Intermittent Operation Life 6. Pressure Cooker T A = 25 C, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 JESD22-A102 O 15P SIG at T A=121 C for 4 hrs. O MIL-STD-750D METHOD-1051 O 7. Temperature Cycling -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Forward Surge 8.3ms single half sine-wave , one surge. 9. Humidity at T A=85 C , RH=85% for 1000hrs. 10. High Temperature Storage Life at 175 C for 1000 hrs. MIL-STD-750D METHOD-4066-2 MIL-STD-750D METHOD-1021 O http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1031 O Page 7 Document ID Issued Date Revised Date Revision Page. DS-121614 2013/12/17 - A 7