Formosa MS SMD Switching Diode BAS16W/BAV70W/BAW56W/BAV99W/BAL99W List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3.4 Pinning information........................................................................... 5 Marking........................................................................................... 5 Suggested solder pad layout............................................................. 5 Packing information.......................................................................... 6 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 7 High reliability test capabilities...........................................................8 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-221914 2008/02/10 Revised Date - Revision Page. A 8 Formosa MS SMD Switching Diode BAS16W/BAV70W/BAW56W/BAV99W/BAL99W 200mW Surface Mount Switching Diode-70-75V Package outline Features Mechanical data 0.016 (0.40) .056(1.40) .048(1.20) 0.072 (1.80) 0.088 (2.20) 0.026 (0.65) • Fast speed switching. • For general purpose switching application. • High conductance. • Silicon epitaxial planar chip. • Lead-free parts meet RoHS requirments. (B) 0.012 (0.30) SOT-323 (C) (A) 0.054 (1.35) 0.021 (0.53) 0.046 (1.15) 0.017 (0.42) 0.096 (2.40) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOT-323 • Terminals : Solder plated, solderable per 0.040 (1.00) 0.004 (0.10) R 0.05 (0.002) 0.010 (0.25) 0.080 (2.00) 0.032 (0.80) MIL-STD-750, Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.006 gram Dimensions in inches and (millimeters) Maximum ratings (AT T =25 C unless otherwise noted) o A PARAMETER Symbol BAS16W Reverse Voltage VR Forward Current IF Peak Forward Surge Current BAV70W BAW56W BAV99W R èJA O Derate Above 25 C 500 mA 200 mW mW/ OC O 625 O Substrate* , TA = 25 C Total Device Dissipation mA 1.6 Thermal Resistance Junction to Ambient 2 V 215 PD Derate Above 25 OC UNIT 75 200 I FM Board* 1, TA = 25OC Total Device Dissipation FR-5 BAL99W PD C/W mW 300 mW/ OC 2.4 Thermal Resistance Junction to Ambient R èJA Operating Temperature Range Tj -55 ~ +150 o C Storage Temperature Range T STG -65 ~ +175 o C Reverse Breakdown Voltage(I BR = 100uAdc) Reverse Voltage Leakage Current V BR O 417 75 V 70 at VR = 75V 1.0 - - - - at VR = 70V - 2.5 2.5 2.5 2.5 at VR = 25V, TJ =150 OC IR 30.0 60.0 30.0 30.0 30.0 at VR = 75V, TJ =150 OC 50.0 - - - - at VR = 70V, TJ =150 OC - 100.0 50.0 50.0 50.0 2.0 1.5 2.0 1.5 1.5 Diode Capacition(VR = 0V, f = 1.0MHz) Reverse Recovery Time(IF = IR = 10mA,VR = 5.0Vdc, I R(REC) = 1.0mAdc, R L = 100OHM) Forward Voltage at IF = 1.0mAdc at IF = 10mAdc at IF = 50mAdc CD pF 715 855 VF mV 1000 at IF = 150mAdc http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 µAdc nS 6.0 T rr C/W 1250 Page 2 Document ID Issued Date DS-221914 2008/02/10 Revised Date - Revision Page. A 8 Rating and characteristic curves for each diode (BAS16W/BAV70W/BAW56W/BAV99W BAL99W) 820 OHM +10V 2K 100uH 0.1 uF IF tr tp t 0.1 uF t tr 10% DUT 50 OHM OUTPUT PULSE GENERATOR 50 OHM INPUT SAMPLING OSCILLOSCOPE 90% IR(REC)=1 mA VR OUTPUT PULSE (IF=IR=10mA;measured at iR(REC)=1mA) Notes : 1. A2.0 Kohm variable resistor adjusted for a forward Current (IF) of 10mA. 2. Input pulse is adjusted so IR(peak) is equal to 10 mA. 3. tp >> trr. Recovery Time Equivalent Test Circuit FIG.1-TYPICAL FORWARD FIG.2 - LEAKAGE CURRENT CHARACTERISTICS 10 10 T A = 150OC IA, REVERSE CURRENT,(mA) IF, FORWARD CURRENT,(mA) 100 TA = 85OC TA = 25OC 1.0 TA = -40OC 1.0 T A = 125OC 0.1 T A = 85 O C T A = 55 O C 0.01 T A = 25 O C 0.1 .2 0.001 0 .4 .8 1.2 1.6 10 20 30 40 50 VR, REVERSE VOLTAGE (V) 2.0 VF, FORWARD VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date DS-221914 2008/02/10 Revised Date - Revision Page. A 8 Rating and characteristic curves for each diode (BAS16W/BAV70W/BAW56W/BAV99W BAL99W) FIG.3 - DIODE CAPACITANCE (BAS16W) FIG.4 - DIODE CAPACITANCE (BAV70W) 1.00 CD, DIODE CAPACITANCE,(pF) CD, DIODE CAPACITANCE,(pF) 0.68 0.64 0.60 0.56 0.52 0.90 0.80 0.70 0.60 0 2 4 6 8 0 2 VF, FORWARD VOLTAGE,(V) FIG.5 - DIODE CAPACITANCE (BAW56W) 6 8 FIG.6 - DIODE CAPACITANCE (BAV99W) 0.68 CD, DIODE CAPACITANCE,(pF) 1.75 CD, DIODE CAPACITANCE,(pF) 4 VF, FORWARD VOLTAGE,(V) 1.50 1.25 1.00 0.75 0.64 0.60 0.56 0.52 0 2 4 6 8 VF, FORWARD VOLTAGE,(V) 0 2 4 6 8 VF, FORWARD VOLTAGE,(V) FIG.5 - DIODE CAPACITANCE (BAL99W) CD, DIODE CAPACITANCE,(pF) 4.00 3.00 2.00 1.00 0 0 2 4 6 8 VF, FORWARD VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date DS-221914 2008/02/10 Revised Date - Revision Page. A 8 Formosa MS SMD Switching Diode BAS16W/BAV70W/BAW56W/BAV99W/BAL99W Pinning information Type number Symbol Marking code A BAS16W B A6 C A BAV70W B A4, JA C A BAW56W B A1, JC C A BAV99W B A7, JG C C A BAL99W B A7, JF C Suggested solder pad layout SOT-323 0.025(0.65) 0.025(0.65) 0.063(1.6) 0.031(0.80) 0.075(1.90) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-221914 2008/02/10 Revised Date - Revision Page. A 8 Formosa MS SMD Switching Diode BAS16W/BAV70W/BAW56W/BAV99W/BAL99W Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOT-323 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.36 2.40 1.20 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date DS-221914 2008/02/10 Revised Date - Revision Page. A 8 Formosa MS SMD Switching Diode BAS16W/BAV70W/BAW56W/BAV99W/BAL99W Reel packing PACKAGE REEL SIZE SOT-323 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 3000 4.0 30,000 195*195*150 178 CARTON SIZE (m/m) APPROX. GROSS WEIGHT (kg) CARTON (pcs) 460*400*420 15.0 360,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=10 oC~35 oC Humidity=65%±15% 2.Reflow soldering of surface-mount devices Critical Zone T L to T P tt P TP Ramp-up TL tt L Temperature T smax T smin TS tt s Preheat 25 Ramp-down T t25 oC to Peak Wave Soldering IR Reflow Time 3.Flow (wave)soldering (solder dipping) Profile Feature Soldering Condition Average ramp-up rate(T L to TP ) <3oC/sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 100oC 150oC 60~120sec Tsmax to TL -Ramp-upRate <3oC/sec Time maintained above: -Temperature(TL ) -Time(tL ) 183oC 60~150sec 255oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(tP ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 <6minutes to Peak Temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date DS-221914 2008/02/10 Revised Date - Revision Page. A 8 Formosa MS SMD Switching Diode BAS16W/BAV70W/BAW56W/BAV99W/BAL99W High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260±5 C for 10±2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T A=150 OC for 168 hrs. MIL-STD-750D METHOD-1026 4. Forward Operation Life Rated average rectifier current at T=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker 15P SIG at TA=121 OC for 4 hrs. 7. Temperature Cycling -55 OC to +125OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 9. Forward Surge 10. Humidity 11. High Temperature Storage Life 12. Solvent Resistance http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-1056 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-4066-2 8.3ms single half sine-wave superimposed on rated load, one surge. at TA=65 OC, RH=98% for 1000hrs. MIL-STD-750D METHOD-1038 at 175OC for 1000 hrs. MIL-STD-750D METHOD-1031 Dip into Freon at 25OC for 1 min. MIL-STD-202F METHOD-215 Page 8 Document ID Issued Date DS-221914 2008/02/10 Revised Date - Revision Page. A 8