SKM300GAL12T4 Absolute Maximum Ratings Symbol Conditions Values Unit IGBT VCES IC Tj = 175 °C 1200 V Tc = 25 °C 422 A Tc = 80 °C 324 A 300 A ICnom ICRM SEMITRANS®3 Fast IGBT4 Modules ICRM = 3xICnom 900 A -20 ... 20 V 10 µs -40 ... 175 °C Tc = 25 °C 353 A Tc = 80 °C 264 A 300 A VGES tpsc VCC = 800 V VGE ≤ 15 V VCES ≤ 1200 V Tj = 150 °C Tj Inverse diode IF SKM300GAL12T4 Tj = 175 °C IFnom Features • VCE(sat) with positive temperature coefficient • High short circuit capability, self limiting to 6 x Icnom • Fast & soft inverse CAL diodes • Large clearance (10 mm) and creepage distances (20 mm) • Isolated copper baseplate using DBC Technology (Direct Copper Bonding) IFRM IFRM = 3xIFnom 900 A IFSM tp = 10 ms, sin 180°, Tj = 25 °C 1548 A -40 ... 175 °C Tc = 25 °C 353 A Tc = 80 °C 264 A 300 A Tj Freewheeling diode IF Tj = 175 °C IFnom IFRM IFRM = 3xIFnom 900 A IFSM tp = 10 ms, sin 180°, Tj = 25 °C 1548 A -40 ... 175 °C Tj Typical Applications • • • • DC/DC – converter Brake chopper Switched reluctance motor DC – motor Module It(RMS) Tstg Visol AC sinus 50Hz, t = 1 min 500 A -40 ... 125 °C 4000 V Characteristics Remarks Symbol • Case temperature limited to Tc = 125°C max, recomm. Top = -40 ... +150°C, product rel. results valid for Tj = 150° IGBT typ. max. Unit Tj = 25 °C 1.85 2.1 V Tj = 150 °C 2.25 2.45 V VCE0 Tj = 25 °C 0.8 0.9 V Tj = 150 °C 0.7 0.8 V rCE Tj = 25 °C 3.5 4.0 mΩ VCE(sat) Conditions IC = 300 A VGE = 15 V chiplevel VGE = 15 V min. Tj = 150 °C VGE(th) VGE=VCE, IC = 12 mA ICES VGE = 0 V VCE = 1200 V Cies Coes Cres VCE = 25 V VGE = 0 V QG VGE = - 8 V...+ 15 V RGint Tj = 25 °C Tj = 25 °C 5 5.2 5.5 mΩ 5.8 6.5 V 0.1 0.3 mA Tj = 150 °C mA f = 1 MHz 17.6 nF f = 1 MHz 1.16 nF f = 1 MHz 0.94 nF 1700 nC 2.5 Ω GAL © by SEMIKRON Rev. 2 – 16.06.2009 1 SKM300GAL12T4 Characteristics Symbol Conditions td(on) Eoff VCC = 600 V IC = 300 A VGE = ±15 V RG on = 1.5 Ω RG off = 1.5 Ω di/dton = 7500 A/µs di/dtoff = 3350 A/µs Rth(j-c) per IGBT tr Eon td(off) tf ® SEMITRANS 3 Fast IGBT4 Modules Inverse diode VF = VEC IF = 300 A VGE = 0 V chip VF0 IRRM Features • VCE(sat) with positive temperature coefficient • High short circuit capability, self limiting to 6 x Icnom • Fast & soft inverse CAL diodes • Large clearance (10 mm) and creepage distances (20 mm) • Isolated copper baseplate using DBC Technology (Direct Copper Bonding) Qrr Err Rth(j-c) • • • • DC/DC – converter Brake chopper Switched reluctance motor DC – motor Qrr Err Rth(j-c) Unit Tj = 150 °C 44 ns Tj = 150 °C 27 mJ Tj = 150 °C 450 ns Tj = 150 °C 90 ns Tj = 150 °C 29 mJ ns 0.11 K/W 2.49 V Tj = 150 °C 2.11 2.42 V Tj = 25 °C 1.3 1.5 V Tj = 150 °C 0.9 1.1 V Tj = 25 °C 2.9 3.3 mΩ Tj = 150 °C 4.0 4.4 mΩ IF = 300 A Tj = 150 °C di/dtoff = 7300 A/µs T = 150 °C j VGE = ±15 V T j = 150 °C VCC = 600 V per diode 345 A 54 µC 23 mJ rF IRRM max. 200 2.17 Freewheeling diode VF = VEC IF = 300 A VGE = 0 V chip VF0 Typical Applications typ. Tj = 25 °C rF SKM300GAL12T4 min. Tj = 150 °C 0.17 K/W Tj = 25 °C 2.17 2.49 V Tj = 150 °C 2.11 2.42 V Tj = 25 °C 1.3 1.5 V Tj = 150 °C 0.9 1.1 V Tj = 25 °C 2.9 3.3 mΩ 4.0 4.4 mΩ Tj = 150 °C IF = 300 A Tj = 150 °C di/dtoff = 7300 A/µs T = 150 °C j VGE = ±15 V T j = 150 °C VCC = 600 V per Diode 345 A 54 µC 23 mJ 0.17 K/W Module Remarks • Case temperature limited to Tc = 125°C max, recomm. Top = -40 ... +150°C, product rel. results valid for Tj = 150° LCE RCC'+EE' 15 terminal-chip Rth(c-s) per module Ms to heat sink M6 Mt 20 nH TC = 25 °C 0.25 mΩ TC = 125 °C 0.5 mΩ 0.02 to terminals M6 0.038 K/W 3 5 Nm 2.5 5 Nm Nm w 325 g GAL 2 Rev. 2 – 16.06.2009 © by SEMIKRON SKM300GAL12T4 Fig. 1: Typ. output characteristic, inclusive RCC'+ EE' Fig. 2: Rated current vs. temperature IC = f (TC) Fig. 3: Typ. turn-on /-off energy = f (IC) Fig. 4: Typ. turn-on /-off energy = f (RG) Fig. 5: Typ. transfer characteristic Fig. 6: Typ. gate charge characteristic © by SEMIKRON Rev. 2 – 16.06.2009 3 SKM300GAL12T4 Fig. 7: Typ. switching times vs. IC Fig. 8: Typ. switching times vs. gate resistor RG Fig. 9: Transient thermal impedance Fig. 10: CAL diode forward characteristic Fig. 11: CAL diode peak reverse recovery current Fig. 12: Typ. CAL diode peak reverse recovery charge 4 Rev. 2 – 16.06.2009 © by SEMIKRON SKM300GAL12T4 Semitrans 3 GAL This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX. This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee expressed or implied is made regarding delivery, performance or suitability. © by SEMIKRON Rev. 2 – 16.06.2009 5