fastPACK 0 H 2 gen

Standard H-Bridge Module
fastPACK 0 H 2nd gen
Features
-
H-bridge 600V..1200V / 20A..100A
Standard- and high speed IGBT´s or MOS-FET
Ultra low inductive design
Vincotech - Power Flow Through for simple PCB routing
Vincotech - Clip In, the reliable interconnection between PCB, module and
heatsink
Temperature Sensor
Easy paralleling to ½ bridge
Optional capacitors
Copyright by Vincotech
Revision:2
fastPACK0-H
V23990-P62x-Fxx-U-02-14
Module Types
Voltage
Current
600V
600V
30A
30A
high speed IGBT
P623-F04-PM
P623-F14-PM high performance
600 V
600 V
60A
60A
Trench Fieldstop IGBT
P623-F24-PM
P624-F24-PM
P625-F24-PM
600V
600V
600V
50A
75A
100A
Phantom Speed IGBT
P629-F44-PM
P629-F46-PM hyper fast FRED
P629-F54-PM high performance
P629-F56-PM high performance + hyper fast FRED
1200V
1200V
1200V
1200V
25A
25A
25A
25A
with capacitor:
MOS-FET
P722-F64-PM
P722-F74-PM high performance
600V
600V
30A
30A
high speed IGBT
P723-F04-PM
P723-F14-PM high performance
600 V
600 V
60A
60A
Phantom Speed IGBT
P729-F44-PM
P729-F46-PM hyper fast FRED
P729-F54-PM high performance
P729-F56-PM high performance + hyper fast FRED
1200V
1200V
1200V
1200V
25A
25A
25A
25A
part – number V23990MOS-FET
P622-F64-PM
P622-F74-PM high performance
Copyright by Vincotech
Revision:2
fastPACK0-H
V23990-P62x-Fxx-U-02-14
Schematics
P622 modules:
P623, P624, P625, P629 modules:
P722 modules:
P723, P729 modules:
Copyright by Vincotech
Revision:2
fastPACK0-H
V23990-P62x-Fxx-U-02-14
Outline / Pinout
Pin Table
Pin 1
X
0
Y
22,5
2
2,9
22,5
3
8,3
22,5
4
10,8
22,5
5
19,6
22,5
6
22,1
22,5
7
29,1
22,5
8
32
22,5
9
33,5
17,8
10
33,5
15,3
Pin
X
Y
12
33,5
4,7
13
32
0
14
29,1
0
15
22,1
0
16
19,6
0
17
10,8
0
18
8,3
0
19
2,9
0
20
0
0
11
33,5
7,2
Tolerance of p
Copyright by Vincotech
Revision:2
fastPACK0-H
V23990-P62x-Fxx-U-02-14
Handling Instructions
PCB
x The module must be fixed to the PCB by cliping into the adequate holes before pin soldering. For further
details see PCB holes and Mounting in document V23990-P-M111-*-31.
x After fixing all pins must be soldered into the PCB. For an appropriate solderprofile for module pins
soldering see document, Typical heat profile for wave soldering on page 4 of V23990-P-M111-*-31.
x During assembly, at a max. module temperature of 25°C, the pins should not be drawn or pushed over ±0.2
mm or loaded with higher force than 35N.
x At a maximum substrate-temperature of 100°C the load of the pin should not exceed ±5N.
x Vibration stress on pin is not allowed
heatsink
x the heatsink surface must be clean and particleless.
x the flatness must be < 0.05 mm for 100 mm continuous.
x the surface roughness should be less than: RZ 0.01mm.
thermal conduction material:
x OPTION 1: thermal paste Homogeneous applying of the thermal conductive paste over the whole module
bottom with a thickness of max. 0.05 mm.
x OPTION 2: thermal foil
A thermal foil with a aluminium core layer and two outer layer made of phase change material should be
used. The total thichness of the foil has to be less then 0,08mm / 0,003 inch. Thicker foils could cause
braking of the ceramic substrate and will increase the thermal resistance.
Recommended foil type: Kunze Folien KU-ALC5 or ALF5
Recommended foil dimensions:
fastening screws to the heatsink if plain washer is used:
x Tighten both screws with the half torque first.
x Tighten both screws with max. torque second (if it is possible, tighten after 3 hours again).
Flat washer DIN 125 or DIN 433, Screw M4 DIN 7985.
fastening screws to the heatsink if plain washer is used together with a spring lock washer
(recommended mounting):
x Tighten both screws with max. torque.
Flat washer DIN 125 or DIN 433, Spring washer DIN127 or DIN 128, Screw M4 DIN 7985.
Torque instructions for the heatsink:
x Mounting torque Ma =2.0-2.2Nm
Copyright by Vincotech
Revision:2
fastPACK0-H
V23990-P62x-Fxx-U-02-14
PCB holes
Copyright by Vincotech
Revision:2
fastPACK0-H
V23990-P62x-Fxx-U-02-14
Mounting
1. Insert the module pins
into the PCB
2. Press one short side of
the module gently as
shown in figure 1.a. and
1.b. until two clips of
that side are locked
3. Press the other side to
lock the remaining two
clips as shown in fig
2.a. and 2.b.
4. Module in place on
PCB fig 3.a. and 3.b
Vincotech does not recommend the use of its products for other applications. Especially it is not recommended to use the
modules in life support applications where such use may directly threaten life or injure due to device failure or malfunction.
We reserve the right to make changes of the product at any time without notice, in order to supply the best possible product.
Copyright by Vincotech
Revision:2