ROHM BD9873CP-V5

Single-chip Type with Built-in FET Switching Regulator Series
Simple Step-down
Switching Regulators
with Built-in Power MOSFET
BD9873CP-V5,BD9874CP-V5
No.09027EAT39
● Description
The BD9873,74CP-V5 single-channel step-down switching regulator incorporates a Pch MOSFET capable,
as well as circuitry that eliminates the need for external compensation – only a diode, coil, and ceramic capacitor are required –
reducing board size significantly.
●Features
1) Maximum switching current : 1.5A, 3.0A
2) Built-in Pch FET ensures high efficiency
3) Output voltage adjustable via external resistors
4) High switching frequency : 110kHz (fixed)
5) Soft start time : 4ms (fixed)
6) Over current and thermal shutdown protection circuits built in
7) ON/OFF control via STBY pin
●Applications
TVs, printers, DVD players, projectors, gaming devices, PCs, car audio/navigation systems, ETCs, communication equipment, AV
products, office equipment, industrial devices, and more.
●Absolute Maximum Ratings(Ta=25℃)
Parameter
Symbol
Ratings
Unit
Supply Voltage(VCC-GND)
Vcc
36
V
STBY-GND
VSTBY
36
V
OUT-GND
VOUT
36
V
INV-GND
VINV
5
V
1.5(*1) BD9873
A
3.0(*1) BD9874
A
Maximum Switching Current
Power Dissipation
Operating Temperature
Iout
Pd
2000(*2)
mW
Storage Temperature
Topr
-40~+85
℃
Supply Voltage(VCC-GND)
Tstg
-55~+150
℃
(*1) Do not exceed Pd, ASO.
(*2) Derated at 16mW/℃ over Ta=25℃
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1/12
2009.07 - Rev.A
Technical Note
BD9873CP-V5,BD9874CP-V5
●Operating Conditions(Ta=-40~+85℃)
Parameter
Symbol
Input Voltage
VCC
Limit
TYP
MAX
8.0
-
35.0
V
-
0.8×
(VCC-Io×
Ron)
V
Vo
Output Voltage
Unit
MIN
1.0
Conditions
●Electrical Characteristics(Unless otherwise noted, Ta=25℃,Vcc=12V,Vo=5V,STBY=3V)
Parameter
Symbol
Efficiency
Switching Frequency
Unit
Conditions
MIN
TYP
MAX
-
1.0
1.5
Ω
BD9873
-
0.5
1.0
Ω
BD9874
η
80
88
-
%
Io=0.5A
fosc
99
110
121
kHz
Ron
Output ON Resistance
Limit
Vcc=20V,
Load Regulation
5
40
mV
Io=0.5~1.5A
BD9873
ΔVOLOAD
Vcc=20V,
-
5
40
mV
Io=1.0~3.0A
BD9874
Line Regulation
Vcc=10~30V,
Io=1.0A
-
5
25
mV
1.6
-
-
A
BD9873
3.2
-
-
A
BD9874
VINV
0.985
1.00
1.015
V
IINV
-
1
2
μA
ON
VSTBYON
2.0
-
VCC
V
OFF
VSTBYOFF
-0.3
-
0.3
V
Istby
5
15
30
μA
STBY=3V
Circuit Current
Icc
-
5
12
mA
INV=2V
Stand-by Current
Ist
-
0
5
μA
STBY=0V
Soft Start Time
Tss
-
4
20
ms
STBY=0→3V
ΔVOLINE
Over Current Protection
Iocp
Limit
Over Current Protection
Limit
INV Pin Input Current
STBY
Pin
Threshold
Voltage
STBYPin Input Current
VINV=1.0V
This product is not designed to be resistant to radiation.
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2/12
2009.07 - Rev.A
Technical Note
BD9873CP-V5,BD9874CP-V5
●Block Diagram
VCC
1
VREF
PWM COMP
DRIVER
OSC
STBY
5
STBY
CTL
LOGIC
OUT
2
OCP
TSD
INV
Error AMP
4
SS
3
GND
Fig.1
●Package Dimensions
3.2±0.1
+0.3
-0.1
4.5±0.1
+0.2
Pin No.
Pin Name
Function
1
VCC
Input Power
Supply Pin
2
OUT
Internal Pch FET
Drain Pin
3
GND
Ground
4
INV
Output Voltage
Feedback Pin
5
STBY
2.8 -0.1
4.92±0.2
1.0±0.2
(1.0)
BD987X
13.60
16.92
15.2 -0.2
12.0±0.2
8.0±0.2
+0.4
10.0
●Pin Description
Lot No.
1 2
3
0.82±0.1
0.92
1.444
1.778
3
1
2
5
4
ON/OFF Control
Pin
0.42 ±0.1
1.58
(2.85)
4.12
5
4
TO220CP-V5(Unit:mm)
Fig.2
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© 2009 ROHM Co., Ltd. All rights reserved.
3/12
2009.07 - Rev.A
Technical Note
BD9873CP-V5,BD9874CP-V5
●Block Function Explanations
・ VREF
Generates the regulated voltage from Vcc input, compensated for temperature.
・
OSC
Generates the triangular wave oscillation frequency (900kHz) using an internal resistors and capacitor. Used for PWM
comparator input.
・
Error AMP
This block, via the INV pin, detects the resistor-divided output voltage, compares this with the reference voltage, then
amplifies and outputs the difference.
・
PWM COMP
Outputs PWM signals to the Driver block, which converts the error amp output voltage to PWM form.
DRIVER
This push-pull FET driver powers the internal Pch MOSFET, which accepts direct PWM input.
STBY
Controls ON/OFF operation via the STBY pin. The output is ON when STBY is High.
・
・
・
Thermal Shutdown (TSD)
This circuit protects the IC against thermal runaway and damage due to excessive heat. A thermal sensor detects the
junction temperature and switches the output OFF once the temperature exceeds a threshold value (175°C).
Hysteresis is built in (15°C) in order to prevent malfunctions due to temperature fluctuations.
・
Over Current Protection (OCP)
The OCP circuit detects the voltage difference between Vcc and OUT by measuring the current through the internal
Pch MOSFET and switches the output OFF once the voltage reaches the threshold value. The OCP block is a
self-recovery type (not latch).
・
Soft Start (SS)
This block conducts soft start operations. When STBY is High and the IC starts up the internal capacitor begins
charging. The soft start time is fixed at 5ms.
●Notes for PCB layout
C3:0.47uF
R2:1kΩ
R1:4kΩ
4
INV
STBY 5
L1:100uH
C1:100uF
OUT 2
1 VCC
C2:4.7uF
GND
3
5.0V
D1
C4:680uF
Fig.3
• Place capacitors between Vcc and Ground, and the Schottky diode as close as possible to the IC to reduce noise and
maximize efficiency.
• Connect resistors between INV and Ground, and the output capacitor filter at the same Ground potential in order to stabilize
the output voltage.
(If the patterning is longer or thin, it’s possible to cause ringing or waveform crack.)
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4/12
2009.07 - Rev.A
Technical Note
BD9873CP-V5,BD9874CP-V5
●Reference data BD9873CP-V5
100
VCC=12V
180
5
80
VCC=12V
60
VCC=36V
VCC=8V
50
40
160
140
4
120
Ta=85℃
3
100
2
30
20
Freg [kHz]
70
Vpinvo [V]
効率 [%]
200
6
Ta=25℃
90
Ta=-40℃
10
20
0
0
0
0.5
1
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
1.5
-40
Fig.4
Efficiency-Load Current
0
20
80
100
10
OUT=5V
7
5.1
60
Fig.6
Switching Frequency-Temperature
8
VCC=12V
40
Ta [℃]
Fig.5
Over Current Protection
5.15
STB=3V
9
8
6
7
5.05
Ta=85℃
5
4
ICC [mA]
5
Ta=25℃
3
4.95
5
3
1
0
0.5
1
1.5
Ta=-40℃
2
Ta=-40℃
4.85
Ta=25℃
4
Ta=85℃
2
Ta=-40℃
4.9
Ta=85℃
6
PINVO [V]
Ta=25℃
PINVO [V]
-20
Ipinvo [A]
IOUT [A]
1
0
0
0
5
10
IOUT [A]
15
20
25
30
5
35
10
15
Fig.8
Output voltage-Supply voltage
3
20
25
30
35
VCC [V]
VCC [V]
Fig.7
Output voltage- Load Current
Fig.9
Circuit current-Supply voltage
Iout=No Load
1.1
200
VCC=12V
OUT=5V
VCC=12V
1.08
2.5
1.06
150
1.04
Ta=85℃
Fosc [kHz]
Ta=150℃
1.5
Ta=25℃
1
1.02
OFFSET [V]
2
△VCC_OUT[V]
60
40
Ta=25℃
1
80
100
Ta=25℃
Ta=-40℃
0.96
50
0.94
Ta=-40℃
0.5
1
0.98
0.92
0
0.9
0
0.0
0.5
1.0
1.5
IO[A]
5
10
15
20
25
30
35
-40
-20
0
Fig10
V(VCC-OUT)-Iout
Fig.11
Switching Frequency - Supply
lt
5msec / div
20
40
60
80
100
Ta [℃]
VCC [V]
Fig.12
INV Pin Threshold voltageTemperature
5msec / div
10
STBY
8
VOUT
500mV / div
VOUT
2V / div
ICC(STB) [μA]
5V / div
6
4
2
0
-40
-20
0
20
40
60
80
100
Ta [℃]
Fig.13
Load Response
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Fig.14
Start-up waveform
5/12
Fig.15
ICC(STB)-Ta
2009.07 - Rev.A
Technical Note
BD9873CP-V5,BD9874CP-V5
●Reference data BD9874CP-V5
100
VCC=12V
180
5
80
60
160
VCC=8V
140
4
120
Vpinvo [V]
VCC=12V
VCC=36V
50
40
Freg [kHz]
70
効率 [%]
200
6
Ta=25℃
90
100
3
Ta=85℃
Ta=-40℃
2
30
Ta=25℃
20
60
40
1
10
80
20
0
0
0
0
0.5
1
1.5
2
2.5
3
0
1
2
IOUT [A]
3
4
5
-40
6
Fig.16
Efficiency - Load Current
20
60
80
100
t
10
OUT=5V
7
5.1
40
Fig.18
Switching
T
F
8
VCC=12V
STB=3V
9
8
6
5.05
7
5
PINVO [V]
4
5
4.95
3
Ta=25℃
2
Ta=85℃
4
3
1
0
0
0
0.5
1
1.5
2
2.5
0
3
Ta=-40℃
2
1
4.85
5
10
15
20
25
30
5
35
10
15
Fig.20
Output voltage-Supply voltage
3
20
25
30
35
VCC [V]
VCC [V]
IOUT [A]
Fig.19
Output voltage - Load Current
Ta=85℃
5
Ta=-40℃
Ta=-40℃
4.9
Ta=25℃
6
ICC [mA]
Ta=85℃
Ta=25℃
Fig.21
Circuit current-Supply voltage
Iout= No Load
1.1
200
VCC=12V
OUT=5V
VCC=12V
1.08
2.5
1.06
150
2
1.04
Ta=85℃
Fosc [kHz]
1.5
Ta=25℃
1
OFFSET [V]
1.02
Ta=-40℃
100
Ta=25℃
Ta=-40℃
0.96
50
0.5
0.94
Ta=150℃
0.92
0
0
0.0
0.5
1.0
1.5
2.0
2.5
1
0.98
3.0
IO[A]
0.9
5
10
15
20
25
30
35
-40
-20
0
20
VCC [V]
Fig.22
V(VCC-OUT)-Iout
Fig.23
Switching Frequency - Supply voltage
5msec / div
10
STBY
8
VOUT
500mV / div
60
80
100
Fig.24
INV Pin Threshold voltageTemperature
5msec / div
5V / div
VOUT
40
Ta [℃]
ICC(STB) [μA]
PINVO [V]
0
Ta [℃]
Fig.17
Over Current Protection
5.15
△VCC_OUT[V]
-20
Ipinvo [A]
6
4
2
2V / div
0
-40
-20
0
20
40
60
80
100
Ta [℃]
Fig.25
Load Response
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Fig.26
Start-up waveform
6/12
Fig.27
ICC (STB)-Ta
2009.07 - Rev.A
Technical Note
BD9873CP-V5,BD9874CP-V5
●Application component selection and settings
Inductor L1
A large inductor series impedance will result in deterioration of efficiency. OCP operation greater than 1.6A may cause
inductor overheating, possibly leading to overload or output short.
Note that the current rating for the coil should be higher than IOUT(MAX)+⊿IL.
Iout(MAX): maximum load current
If you flow more than maximum current rating, coil will become overload, and cause magnetic saturation, and those account
for efficiency deterioration. Select from enough current rating of coil which doesn’t over peak current.
⊿IL. =
(VCC-VOUT)
L1
VOUT
×
VCC
×
1
fosc
L1:inductor value, VCC:maximum input voltage, VOUT:output voltage, ⊿IL:coil ripple current value, fosc:oscillation frequency
Schottky Diode D1
Select a Schottky diode having an inter-terminal capacity as small as possible (reverse recovery time as short as possible)
and a forward voltage VF as low as possible. (Noise can be reduced and efficiency improved by reduction of switching
noise and switching loss, as well as reduction of voltage drop loss of forward voltage.)
Diode should be selected on the basis of maximum current rating in forward direction, voltage rating in reverse direction,
and power dissipation of diode.
・The maximum current rating is higher than the combined maximum load current and coil ripple current (⊿IL).
・The reverse voltage rating is higher than the VIN value.
・Power dissipation for the selected diode must be within the rated level.
The power dissipation of the diode is expressed by the following formula:
Pdi=Iout(MAX)×Vf×(1-VOUT/VCC)
Iout(MAX): maximum load current,
Vf: forward voltage, VOUT: output voltage, VCC: input voltage
Output Capacitor C4
A suitable output capacitor should satisfy the following formula for ESR:
ESR≦⊿VL/⊿IL
⊿VL : permissible ripple voltage, ⊿IL : coil ripple current
Another factor that must be considered is the permissible ripple current. Select a capacitor with sufficient margin, governed
by the following formula:
IRMS =⊿IL/2√3
IRMS: effective value of ripple current to the output capacitor, ⊿IL : coil ripple current
The output capacitor is one of the important parts for system stability, and when some capacitor is selected, expected
characteristics cannot be provided, depending on ambient temperature, output voltage setting condition, etc.
Fully confirm ESR, temperature characteristics, DC, and bias characteristics before evaluation.
Intput Capacitor C1,C2
The input capacitor is the source of current flow to the coil via the built-in Pch FET when the FET is ON. When selecting
the input capacitor sufficient margin must be provided to accommodate capacitor voltage and permissible ripple current.
The expression below defines the effective value of the ripple current to the input capacitor. It should be used in
determining the suitability of the capacitor in providing sufficient margin for the permissible ripple current.
IRMS=IOUT×√(1-VOUT / VCC)×VOUT / VCC
IRMS : effective value of the ripple current to the input capacitor
IOUT : output load current, VOUT: output voltage, VCC: input voltage
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7/12
2009.07 - Rev.A
Technical Note
BD9873CP-V5,BD9874CP-V5
Capacitor C3
C3 is for compensating the stability of application frequency characteristics.
When C3 is not available, overshoot or undershoot is possible in starting or in rapid change of load.
Be sure to insert 0.47 μF.
Resistor R1,R2
These resistors determine the output voltage:
VOUT=1.0V×(1 + R1/R2)
Select resistors less than 10kΩ.
BD9873CP-V5
<Recommended Components (Example)>
Inductor
Schottky Diode
Capacitor
L1=100uH : RCR1616(SUMIDA)
D1=RB050LA-40(ROHM)
C1=100uF : Al electric capacitor
C2=4.7uF
: Laminated ceramic capacitor
C3=0.47μF : Laminated ceramic capacitor
C4=680μF : Al electric capacitor
BD9874CP-V5
<Recommended Components (Example)>
Inductor
Schottky Diode
Capacitor
L1=RCR1616(SUMIDA)
D1=RB050LA-40(ROHM)
C1=100uF : Al electric capacitor
C2=4.7uF : Laminated ceramic capacitor
C3=0.47μF : Laminated ceramic capacitor
C4=680μF : Al electric capacitor
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8/12
2009.07 - Rev.A
Technical Note
BD9873CP-V5,BD9874CP-V5
●Power Dissipation
15
(1) No heat sink
POWER DISSIPATION : Pd [W]
(2) Aluminum heat sink
50×50×2(mm3)
(3) 11.0W
(3) Aluminum heat sink
10
100×100×2(mm3)
(2) 6.5W
5
(1) 2.0W
0
0
25
50
75
100
125
AMBIENT TEMPERATURE : Ta[C]
AMBIENT TEMPERATURE : Ta[℃]
150
Fig.28
●Tj (tip junction temperature) calculating method
It is impossible to measure the tip junction temperature Tj outside the IC, but it can be calculated by the formula shown below.
Calculation method of tip junction temperature Tj
Tj=(W×θj-c)+Tc
W
θj-c
:Power consumed by IC (calculated by the formula below)
:Thermal resistance from the tip to the back of the package
12.5 ºC/W for TO220 package
Tc
:IC surface temperature (to be measured by thermocouple, etc.)
Calculation method of electric power W consumed by IC
W=Vin×Iin-VOUT×IOUT-VF×IOUT×(1-VOUT/Vin)
Vin
Iin
VOUT
IOUT
VF
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:
:
:
:
:
9/12
Input voltage
Input voltage
Output voltage
Load Current
Forward voltage of Schottky diode
2009.07 - Rev.A
Technical Note
BD9873CP-V5,BD9874CP-V5
●I/O Equivalent Circuit
1Pin,FIN (VCC, GND)
2pin (OUT)
4pin (INV)
5pin (STBY)
VCC
VCC
VCC
STBY
VCC
OUT
INV
GND
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10/12
2009.07 - Rev.A
Technical Note
BD9873CP-V5,BD9874CP-V5
●Operation Notes
1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC
deterioration or damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such
damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a special mode where
the absolute maximum ratings may be exceeded is anticipated.
2) GND potential
Ensure a minimum GND pin potential in all operating conditions. In addition, ensure that no pins other than the GND pin carry
a voltage lower than or equal to the GND pin, including during actual transient phenomena.
3) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Inter-pin shorts and mounting errors
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in
damage to the IC. Shorts between output pins or between output pins and the power supply and GND pin caused by the
presence of a foreign object may result in damage to the IC.
5) Operation in a strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
6) Thermal shutdown circuit (TSD circuit)
This IC incorporates a built-in thermal shutdown circuit (TSD circuit). The TSD circuit is designed only to shut the IC off to
prevent runaway thermal operation. Do not continue to use the IC after operating this circuit or use the IC in an environment
where the operation of the thermal shutdown circuit is assumed.
7) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Ground the IC during assembly steps as an antistatic measure, and
use similar caution when transporting or storing the IC. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process.
8) Common impedance
Power supply and ground wiring should reflect consideration of the need to lower common impedance and minimize ripple as much as
possible (by making wiring as short and thick as possible or rejecting ripple by incorporating inductance and capacitance).
9) Applications with modes that reverse VCC and pin potentials may cause damage to internal IC circuits.
For example, such damage might occur when VCC is shorted with the GND pin while an external capacitor is charged.
It is recommended to insert a diode for preventing back current flow in series with VCC or bypass diodes between VCC and
each pin.
10) IC pin input
This monolithic IC contains P+ isolation and PCB layers between adjacent elements in order to keep them isolated.
P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of parasitic
elements. For example, when a resistor and transistor are connected to pins as shown in following chart,
 the P/N junction functions as a parasitic diode when GND > (Pin A) for the resistor or GND > (Pin B) for the
transistor (NPN).
 Similarly, when GND > (Pin B) for the transistor (NPN), the parasitic diode described above combines with the N layer of
other adjacent elements to operate as a parasitic NPN transistor.
The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result of the IC's
architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC malfunction and damage.
For these reasons, it is necessary to use caution so that the IC is not used in a way that will trigger the operation of parasitic elements,
such as by the application of voltages lower than the GND (PCB) voltage to input and output pins.
Transistor
Resistance
Back current prevention diode
B
~
( PinA )
C
( PinB )
N
VCC
P
N
P
+
P
N
P substrate
P
+
N
+
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© 2009 ROHM Co., Ltd. All rights reserved.
GND
Fig.29
11/12
( PinA )
E
Parasitic diode
Parasitic diode
GND
P
P
N
P substrate
N
Output Pin
Parasitic diode
~
Bypass diode
GND
+
( Pin B )
N
B
C
E
GND
GND
Other adjacent components
Parasitic diode
2009.07 - Rev.A
Technical Note
BD9873CP-V5,BD9874CP-V5
●Part order number
B
D
9
7
8
3
P
―
Package
Type/No.
Part No.
C
CP-V5 : TO220CP-V5
V
5
E
2
Packaging and forming specification
E2 : Embossed tape and reel
TO220CP-V5
4.5±0.1
1.444
13.60
(1.0)
0.82±0.1
0.92
1.778
16.92
+0.2
2.8 -0.1
8.0 ± 0.2
12.0 ± 0.2
4.92 ± 0.2
1.0 ± 0.2
+0.4
15.2 -0.2
+0.3 φ3.2±0.1
10.0 -0.1
0.42±0.1
1.58
(2.85)
4.12
(Unit : mm)
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12/12
2009.07 - Rev.A
Catalog No.08T000A '08.11 ROHM © 1000 NZ
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
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http://www.rohm.com/contact/
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© 2009 ROHM Co., Ltd. All rights reserved.
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