TPS62560, TPS62561, TPS62562 (Rev. C)

TPS62560, TPS62561
TPS62562
www.ti.com
SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
2.25-MHz, 600-mA Step-Down Converter in TSOT and 2 × 2 × 0.8-mm QFN Package
Check for Samples: TPS62560, TPS62561, TPS62562
FEATURES
DESCRIPTION
•
•
•
•
•
•
•
The TPS62560 device is a high efficiency
synchronous step down converter, optimized for
battery powered portable applications. It provides up
to 1000-mA output current from batteries, such as
single Li-Ion or other common chemistry AA and AAA
cells.
1
•
Output Current up to 600 mA
VIN Range from 2.5 V to 5.5 V
Output Voltage Accuracy in PWM Mode ±2.5%
Typical 15-μA Quiescent Current
100% Duty Cycle for Lowest Dropout
Soft Start
Available in a Small TSOT, and
2 mm × 2 mm × 0.8 mm QFN Package
For Improved Features Set, see TPS62260
APPLICATIONS
•
•
•
PDAs, Pocket PCs, Portable Media Players
Low-Power DSP Supply
POL Applications
With an input voltage range of 2.5 V to 5.5 V, the
device is targeted to power a large variety of portable
handheld equipment or POL applications.
The TPS62560 family operates at 2.25-MHz fixed
switching frequency and enters a Power Save Mode
operation at light load currents to maintain a high
efficiency over the entire load current range.
The Power Save Mode is optimized for low output
voltage ripple. For low noise applications, the device
can be forced into fixed frequency PWM mode by
pulling the MODE pin high. In the shutdown mode the
current consumption is reduced to less than 1 µA.
The TPS62560 allows the use of small inductors and
capacitors to achieve a small solution size.
TPS62560 and TPS62562 are available in a 2-mm ×
2-mm, 6-terminal QFN package, whereas the
TPS62561 is available in a 5-terminal TSOT23
package.
100
90 V = 2.7 V
IN
VIN = 2.5 V to 5.5 V
VIN
CIN
L
2.2 mH
SW
R1
EN
4.7 mF
GND
MODE
FB
R2
C1
22 pF
Up to 600 mA
VOUT
COUT
10 mF
h – Efficiency – %
80 VIN = 3 V
TPS62560DRV
VIN = 3.6 V
70
VIN = 4.5 V
60
50
40
VOUT = 1.8 V
MODE = GND
L = 2.2 mH
DCR 110 mR
30
20
10
0
0.01
0.1
1
10
100
IOUT – Output Current – mA
1000
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008–2009, Texas Instruments Incorporated
TPS62560, TPS62561
TPS62562
SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
TA
PART
NUMBER (1)
OUTPUT
VOLTAGE (2)
PACKAGE (3)
–40°C to 85°C
TPS62560
Adjustable
QFN 2×2-6
DRV
TPS62560DRV
CEY
–40°C to 85°C
TPS62561
Adjustable
TSOT-23-5
DDC
TPS62561DDC
CVO
–40°C to 85°C
TPS62562
1.8-V fixed
QFN 2×2-6
DRV
TPS62562DRV
NXT
(1)
(2)
(3)
PACKAGE
DESIGNATOR
ORDERING
PACKAGE
MARKING
The DRV (2-mm x 2-mm 6-terminal QFN) and the DDC (TSOT-23-5) packages are available in tape on reel. Add R suffix to order
quantities of 3000 parts per reel and T suffix to order quantities with 250 parts per reel.
Contact TI for other fixed-output-voltage options.
For the most-current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
VALUE
Input voltage range (2)
UNIT
–0.3 to 7
–0.3 to VIN +0.3, ≤ 7
Voltage range at EN, MODE
Voltage on SW
V
–0.3 to 7
Peak output current
ESD rating (3)
Internally limited
HBM human-body model
2
CDM charged-device model
1
Machine model
A
kV
200
V
TJ
Maximum operating junction
temperature
–40 to 125
°C
Tstg
Storage temperature range
–65 to 150
°C
(1)
(2)
(3)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to the network ground terminal.
The human-body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each terminal. The machine model is a 200-pF
capacitor discharged directly into each terminal.
DISSIPATION RATINGS
PACKAGE
RθJA
POWER RATING FOR TA ≤ 25°C
DERATING FACTOR ABOVE TA = 25°C
DRV
76°C/W
1300 mW
13 mW/°C
DDC
250°C/W
400 mW
4 mW/°C
RECOMMENDED OPERATING CONDITIONS
MIN
VIN
Supply voltage
NOM
MAX
2.5
5.5
UNIT
V
Output voltage range for adjustable voltage
0.85
VIN
V
TA
Operating ambient temperature
–40
85
°C
TJ
Operating junction temperature
–40
125
°C
2
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Product Folder Link(s): TPS62560 TPS62561 TPS62562
TPS62560, TPS62561
TPS62562
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SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
ELECTRICAL CHARACTERISTICS
Over full operating ambient temperature range, typical values are at TA = 25°C. Unless otherwise noted, specifications apply
for condition VIN = EN = 3.6 V. External components CIN = 4.7 μF 0603, COUT = 10 μF 0603, L = 2.2 μH; see the Parameter
Measurement Information section.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY
VIN
Input voltage range
IOUT
Output current
2.5
VIN 2.5 V to 5.5 V
IOUT = 0 mA, PFM mode enabled
(MODE = GND), device not switching
IQ
Operating quiescent current
ISD
Shutdown current
UVLO
Undervoltage lockout threshold
5.5
V
600
mA
15
μA
IOUT = 0 mA, PFM mode enabled
(MODE = GND), device switching, VOUT = 1.8 V,
See (1)
18.5
IOUT = 0 mA, switching with no load
(MODE = VIN), PWM operation, VOUT = 1.8 V,
VIN = 3 V
3.8
mA
EN = GND
0.5
μA
Falling
1.85
Rising
1.95
V
ENABLE, MODE
VIH
High-level input voltage, EN,
MODE
2 V ≤ VIN ≤ 5.5 V
1
VIN
V
VIL
Low-level input voltage, EN,
MODE
2 V ≤ VIN ≤ 5.5 V
0
0.4
V
IIN
Input bias current, EN, MODE
EN, MODE = GND or VIN
0.01
1
μA
252
492
194
391
1
1.2
POWER SWITCH
RDS(on)
ILIMF
TSD
High side MOSFET on-resistance
Low side MOSFET on-resistance
VIN = VGS = 3.6 V, TA = 25°C
Forward current limit, high and low
VIN = VGS = 3.6 V
side MOSFET
0.8
Thermal shutdown
Increasing junction temperature
140
Thermal-shutdown hysteresis
Decreasing junction temperature
20
mΩ
A
°C
OSCILLATOR
fSW
2 V ≤ VIN ≤ 5.5 V
Oscillator frequency
2.25
MHz
OUTPUT
VOUT
Adjustable-output voltage range
VOUT
TPS62562 fixed output voltage
Vref
Reference voltage
0.85
VIN ≥ 1.8 V
Feedback voltage, PWM mode
MODE = VIN, PWM operation, for
fixed-output-voltage versions VFB = VOUT,
2.5 V ≤ VIN ≤ 5.5 V, 0 mA ≤ IOUT ≤ 600 mA
Feedback voltage, PFM mode
MODE = GND, device in PFM mode, voltage
positioning active (1)
Load regulation
PWM mode
tStart Up
Start-up time
Time from active EN to reach 95% of VOUT
nominal
tRamp
VOUT ramp-up time
Time to ramp from 5% to 95% of VOUT
Ilkg
Leakage current into SW terminal
VIN = 3.6 V, VIN = VOUT = VSW, EN = GND
VFB
(1)
(2)
(3)
(2)
–2.5%
VIN
V
600
mV
0%
2.5%
1%
–1
%/A
500
μs
μs
250
(3)
V
1.8
0.5
1
μA
In PFM mode, the internal reference voltage is set to typ. 1.01 × Vref. See the Parameter Measurement Information section.
For VIN = VOUT + 0.6 V
In fixed-output-voltage versions, the internal resistor divider network is disconnected from the FB terminal.
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62560 TPS62561 TPS62562
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TPS62562
SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
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PIN ASSIGNMENTS
DDC PACKAGE
TSOT23-5
(TOP VIEW)
VIN
1
5
DRV PACKAGE
SON-6
(TOP VIEW)
SW
SW
MODE
GND
6
GND
2 Thermal 5
Pad
VIN
3
EN
2
FB
EN
1
3
4
4
FB
Figure 1.
PIN FUNCTIONS
PIN
No.
QFN-6
No.
TSOT23-5
I/O
DESCRIPTION
EN
4
3
I
This is the enable terminal of the device. Pulling this terminal to low forces the device
into shutdown mode. Pulling this terminal to high enables the device. This terminal must
be terminated.
FB
3
4
I
Feedback terminal for the internal regulation loop. Connect the external resistor divider
to this terminal. In the fixed-output-voltage option, connect this terminal directly to the
output capacitor.
GND
6
2
—
NAME
GND supply terminal
MODE
2
—
I
This terminal is only available as an QFN package option. MODE terminal = high forces
the device to operate in the fixed-frequency PWM mode. MODE terminal = low enables
the power-save mode with automatic transition from PFM mode to fixed-frequency PWM
mode.
SW
1
5
O
This is the switch terminal and is connected to the internal MOSFET switches. Connect
the external inductor between this terminal and the output capacitor.
VIN
5
1
—
VIN power-supply terminal
4
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Product Folder Link(s): TPS62560 TPS62561 TPS62562
TPS62560, TPS62561
TPS62562
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SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
FUNCTIONAL BLOCK DIAGRAM
VIN
CurrentLimit Comparator
Thermal
Shutdown
VIN
Undervoltage
Lockout 1.8 V
Limit
High Side
EN
PFM Comparator
+1% Voltage positioning
Reference
0.6 V VREF
FB
VREF +1%
Only in 2x2SON
MODE
MODE
Softstart
VOUT RAMP
CONTROL
Error Amplifier
Control
Stage
Gate Driver
AntiShoot-Through
SW1
VREF
Integrator
FB
FB
PWM
Comp.
Zero-Pole
Amp.
Limit
Low Side
RI 1
RI3
RI..N
Int. Resistor
Network
CurrentLimit Comparator
2.25-MHz
Oscillator
Sawtooth
Generator
GND
GND
PARAMETER MEASUREMENT INFORMATION
TPS62560DRV
VIN
CIN
4.7 mF
MODE
VOUT
SW
R1
EN
GND
L
2.2 mH
C1
22 pF
FB
COUT
10 mF
R2
L:
LPS3015, 2.2 mH, 110 mW
CIN: GRM188R60J475K, 4.7 mF, Murata, 0603 size
COUT: GRM188R60J106M, 10 mF, Murata, 0603 size
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62560 TPS62561 TPS62562
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TPS62560, TPS62561
TPS62562
SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
www.ti.com
TYPICAL CHARACTERISTICS
Table 1. Table of Graphs
FIGURE
η
Efficiency
Typical Operation
Mode Transition
vs Output Current, VOUT = 1.8 V, Power Save Mode, MODE = GND
Figure 2
vs Output Current, VOUT = 1.8 V, PWM Mode, MODE = VIN
Figure 3
vs Output Current, VOUT = 3.3 V, PWM Mode, MODE = VIN
Figure 4
vs Output Current, VOUT = 3.3 V, Power Save Mode, MODE = GND
Figure 5
vs Output Current, MODE = VIN
Figure 6
vs Output Current, MODE = GND
Figure 7
PWM Mode, VOUT = 1.8 V
Figure 8
MODE Terminal Transition From PFM to Forced PWM Mode at Light
Load
Figure 9
MODE Terminal Transition From Forced PWM to PFM Mode at Light
Load
Figure 10
Start-up Timing
Load Transient
Line Transient
Typical Operation
Quiescent Current
Static Drain-Source On-State
Resistance
6
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Figure 11
Forced PWM Mode, VOUT = 1.5 V, 50 mA to 200 mA
Figure 12
Forced PWM Mode, VOUT = 1.5 V, 200 mA to 400 mA
Figure 13
Forced PFM Mode to PWM Mode, VOUT = 1.5 V, 150 μA to 400 mA
Figure 14
Forced PWM Mode to PFM Mode, VOUT = 1.5 V, 400 mA to 150 μA
Figure 15
PFM Mode, VOUT = 1.5 V, 1.5 mA to 50 mA
Figure 16
PFM Mode, VOUT = 1.5 V, 50 mA to 1.5 mA
Figure 17
PFM Mode to PWM Mode, VOUT = 1.8 V, 50 mA to 250 mA
Figure 18
PFM Mode to PWM Mode, VOUT = 1.5 V, 50 mA to 400 mA
Figure 19
PWM Mode to PFM Mode, VOUT = 1.5 V, 400 mA to 50 mA
Figure 20
PFM Mode, VOUT = 1.8 V, 50 mA
Figure 21
PFM Mode, VOUT = 1.8 V, 250 mA
Figure 22
PFM Mode, VOUT Ripple, VOUT = 1.8 V, 10 mA, L = 2.2 μH, COUT = 10 μF
Figure 23
PFM Mode, VOUT Ripple, VOUT = 1.8 V, 10 mA, L = 4.7 μH, COUT = 10 μF
Figure 24
vs Input Voltage, (TA = 85°C, TA = 25°C, TA = –40°C)
Figure 25
vs Input Voltage, (TA = 85°C, TA = 25°C, TA = –40°C), High-Side
Switching
Figure 26
vs Input Voltage, (TA = 85°C, TA = 25°C, TA = –40°C), Low-Side
Switching
Figure 27
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62560 TPS62561 TPS62562
TPS62560, TPS62561
TPS62562
www.ti.com
SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
EFFICIENCY (Power Save Mode)
vs
OUTPUT CURRENT
EFFICIENCY (Forced PWM Mode)
vs
OUTPUT CURRENT
100
100
90
90
VIN = 2.7 V
80
VIN = 2.7 V
VIN = 3.6 V
70
h – Efficiency – %
h – Efficiency – %
80 V = 3 V
IN
VIN = 4.5 V
60
50
40
30
10
0
0.01
VIN = 3 V
60
VIN = 3.6 V
VIN = 4.5 V
50
40
30
VOUT = 1.8 V
MODE = GND
L = 2.2 mH
DCR 110 mR
20
70
VOUT = 1.8 V
MODE = VIN
L = 2.2 mH
20
10
0
0.1
1
10
100
1000
1
10
100
IOUT – Output Current – mA
IOUT – Output Current – mA
1000
G003
G002
Figure 2.
Figure 3.
EFFICIENCY (Forced PWM Mode)
vs
OUTPUT CURRENT
EFFICIENCY (Power Save Mode)
vs
OUTPUT CURRENT
100
100
VIN = 4.2 V
90
80
90
VIN = 5 V
h – Efficiency – %
h – Efficiency – %
70
VIN = 4.5 V
50
40
VOUT = 3.3 V
MODE = VIN
L = 2.2 mH
DCR 110 mW
COUT = 10 mF 0603
30
20
10
VIN = 5 V
10
100
IOUT – Output Current – mA
70
VIN = 4.5 V
60
50
40
VOUT = 3.3 V
MODE = GND
L = 2.2 mH
DCR = 110 mH
COUT = 10 mF 0603
30
20
10
0
1
VIN = 3.6 V
80
VIN = 3.6 V
60
VIN = 4.2 V
1000
0
0.01
0.1
1
10
100
1000
IOUT – Output Current – mA
Figure 4.
Figure 5.
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EFFICIENCY (Forced PWM Mode)
vs
OUTPUT CURRENT
EFFICIENCY
vs
OUTPUT CURRENT
100
100
90
90
VIN = 2.7 V
80
80
60
h − Efficiency − %
h − Efficiency − %
VIN = 4.5 V
70
VIN = 4.5 V
50
VIN = 3.6 V
40
VOUT = 1.2 V
MODE = VIN
L = 2 mH
MIPSA2520
COUT = 10 mF 0603
30
20
10
10
100
VIN = 3.6 V
60
50
VIN = 2.7 V
40
30
VOUT = 1.2 V
MODE = GND
L = 2 mH
MIPSA2520
COUT = 10 mF 0603
20
10
0
1
70
1000
0
0.01
0.1
IOUT − Output Current − mA
1
10
100
G005
G004
Figure 6.
Figure 7.
TYPICAL OPERATION (PWM Mode)
MODE TERMINAL TRANSITION FROM PFM
TO FORCED PWM MODE AT LIGHT LOAD
VIN 3.6V
VOUT 1.8V, IOUT 150mA
L 2.2mH, COUT 10mF 0603
VOUT 10 mV/Div
1000
IOUT − Output Current − mA
VIN = 3.6 V
VOUT = 1.8 V
IOUT = 10 mA
MODE
2V/Div
SW 2 V/Div
SW
2V/Div
PFM Mode
Forced PWM Mode
ICOIL 200 mA/Div
Icoil
200mA/Div
8
Time Base - 10 ms/Div
Time Base - 1 ms/Div
Figure 8.
Figure 9.
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TPS62562
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SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
MODE TERMINAL TRANSITION FROM PWM
TO PFM MODE AT LIGHT LOAD
MODE
2 V/Div
VIN = 3.6 V
VOUT = 1.8 V
IOUT = 10 mA
SW
2 V/Div
START-UP TIMING
EN 2 V/Div
VIN = 3.6 V
RLoad = 10 Ω
VOUT = 1.8 V
IIN into CIN
MODE = GND
SW 2 V/Div
PFM Mode
Forced PWM Mode
VOUT 2 V/Div
ICOIL
200 mA/Div
IIN 100 mA/Div
Time Base - 100 ms/Div
Time Base - 2.5 ms/Div
Figure 10.
Figure 11.
LOAD TRANSIENT
(Forced PWM Mode)
LOAD TRANSIENT
(Forced PWM Mode)
VIN 3.6 V
VOUT 1.5 V
IOUT 50 mA to 200 mA
MODE = VIN
VOUT 50 mV/Div
VIN 3.6 V
VOUT 1.5 V
IOUT 200 mA to 400 mA
VOUT 50 mV/Div
IOUT 200 mA/Div
400 mA
200 mA
IOUT 200 mA/Div
ICOIL 500 mA/Div
ICOIL 500 mA/Div
Time Base - 20 ms/Div
Time Base - 20 ms/Div
Figure 12.
Figure 13.
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SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
LOAD TRANSIENT
(Forced PFM Mode To PWM Mode)
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LOAD TRANSIENT
(Forced PWM Mode To PFM Mode)
SW 2 V/Div
SW 2 V/Div
VIN 3.6 V
VOUT 1.5 V
IOUT 150 mA to 400 mA
VOUT 50mV/Div
MODE = GND
400 mA
IOUT 500 mA/Div
VIN 3.6 V
VOUT 1.5 V
IOUT 150 mA to 400 mA
MODE = GND
VOUT 50 mV/Div
400 mA
IOUT 500 mA/Div
150 mA
150 mA
ICOIL500 mA/Div
ICOILl 500mA/Div
Time Base – 500 ms/Div
Time Base – 500 ms/Div
Figure 14.
Figure 15.
LOAD TRANSIENT (PFM Mode)
LOAD TRANSIENT (PFM Mode)
SW 2 V/Div
VIN 3.6 V
VOUT 1.5 V
IOUT 1.5 mA to 50 mA
MODE = GND
SW 2 V/Div
VIN 3.6 V
VOUT 1.5 V
IOUT 50 mA to 1.5mA
MODE = GND
VOUT 50 mV/Div
VOUT 50mV/Div
50 mA
50 mA
IOUT 50 mA/Div
IOUT 50 mA/Div
1.5 mA
1.5 mA
ICOIL 500 mA/Div
ICOIL 500 mA/Div
Time Base – 50 ms/Div
Time Base – 50 ms/Div
Figure 16.
10
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Figure 17.
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Product Folder Link(s): TPS62560 TPS62561 TPS62562
TPS62560, TPS62561
TPS62562
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SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
LOAD TRANSIENT
(PFM Mode To PWM Mode)
SW 2 V/Div
LOAD TRANSIENT
(PFM Mode To PWM Mode)
SW 2 V/Div
VIN 3.6 V
VOUT 1.5 V
IOUT 50 mA to 400 mA
MODE = GND
VOUT 50 mV/Div
VIN 3.6 V
VOUT 1.8 V
IOUT 50 mA to 250 mA
MODE = GND
VOUT 50 mV/Div
PWM Mode
PFM Mode
250 mA
400 mA
IOUT 500 mA/Div
IOUT 200 mA/Div
50 mA
50 mA
ICOIL 500 mA/Div
ICOIL 500mA/Div
Time Base – 20 ms/Div
Time Base – 20 ms/Div
Figure 18.
Figure 19.
LOAD TRANSIENT
(PWM Mode To PFM Mode)
LINE TRANSIENT (PFM Mode)
SW 2 V/Div
VIN 3.6V to 4.2V
500 mV/Div
VIN 3.6 V
VOUT 1.5 V
IOUT 50 mA to 400 mA
MODE = GND
VOUT 50 mV/Div
PFM Mode
PWM Mode
400 mA
IOUT 500 mA/Div
50 mA
VOUT = 1.8 V
50 mV/Div
IOUT = 50 mA
MODE = GND
ICOIL 500 mA/Div
Time Base – 20 ms/Div
Figure 20.
Figure 21.
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LINE TRANSIENT (PWM Mode)
TYPICAL OPERATION (PFM Mode)
VOUT 20 mV/Div
VIN 3.6V to 4.2V
500 mV/Div
SW 2 V/Div
VOUT = 1.8 V
50 mV/Div
IOUT = 250 mA
MODE = GND
ICOIL 200 mA/Div
Time Base – 10 ms/Div
Time Base – 100ms/Div
Figure 22.
Figure 23.
TYPICAL OPERATION (PFM Mode)
QUIESCENT CURRENT
vs
INPUT VOLTAGE
20
VIN 3.6 V; VOUT 1.8 V, IOUT 10 mA,
L = 4.7 mH, COUT = 10 mF 0603,
MODE = GND
VOUT 20 mV/Div
IQ – Quiescent Current – mA
18
SW 2 V/Div
ICOIL 200 mA/Div
MODE == GND,
GND
MODE
EN == VIN,
VIN
EN
Device
Device Not
Not Switching
Switching
o
TTAA == 85
85°C
16
o
C
TTAA = 25 °C
14
12
C
TTAA == –40
-40o°C
10
Time Base – 2 ms/Div
8
8 222
2.5
3
3.5
44
4.5
4.5
55
5.5
5.5
66
V
VIN
InputVoltage
Voltage–−VV
IN–−Input
Figure 24.
12
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Figure 25.
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62560 TPS62561 TPS62562
TPS62560, TPS62561
TPS62562
SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
vs
INPUT VOLTAGE
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
vs
INPUT VOLTAGE
0.8
0.4
High-Side Switching
0.7
0.6
o
TA = 85 C
0.5
TA = 25oC
0.4
0.3
0.2
o
TA = −40 C
0.1
0
2
2.5
3
3.5
4
4.5
5
RDS(on) − Static Drain-Source On-State Resistance − W
RDS(on) − Static Drain-Source On-State Resistance − W
www.ti.com
Low-Side Switching
0.35
0.3
TA = 85oC
0.25
o
TA = 25 C
0.2
0.15
0.1
o
TA = –40 C
0.05
0
2
2.5
3
3.5
4
4.5
5
VIN − Input Voltage − V
VIN − Input Voltage − V
G012
Figure 26.
Figure 27.
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62560 TPS62561 TPS62562
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TPS62560, TPS62561
TPS62562
SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
www.ti.com
DETAILED DESCRIPTION
OPERATION
The TPS62560/62 step-down converters operate with typically 2.25-MHz fixed-frequency pulse-width modulation
(PWM) at moderate to heavy load currents. At light load currents, the converter can automatically enter
power-save mode, and then operates in PFM mode. However, the TPS62561 operates with fixed-frequency
PWM only, also at light load conditions.
During PWM operation, the converter uses a unique fast-response voltage-mode control scheme with
input-voltage feed-forward to achieve good line and load regulation, allowing the use of small ceramic input and
output capacitors. At the beginning of each clock cycle initiated by the clock signal, the high-side MOSFET switch
is turned on. The current flows from the input capacitor via the high-side MOSFET switch through the inductor to
the output capacitor and load. During this phase, the current ramps up until the PWM comparator trips and the
control logic turns off the switch. The current-limit comparator also turns off the switch in case the current limit of
the high-side MOSFET switch is exceeded. After a dead time, which prevents shoot-through current, the low-side
MOSFET rectifier is turned on and the inductor current ramps down. The current flows from the inductor to the
output capacitor and to the load. It returns back to the inductor through the low-side MOSFET rectifier.
The next cycle is initiated by the clock signal again turning off the low-side MOSFET rectifier and turning on the
on the high-side MOSFET switch.
POWER-SAVE MODE
The power-save mode is enabled with the MODE terminal set to the low level. If the load current decreases, the
converter enters the power-save mode of operation automatically. During power-save mode, the converter skips
switching and operates with reduced frequency in PFM mode with a minimum quiescent current to maintain high
efficiency. The converter positions the output voltage typically 1% above the nominal output voltage. This voltage
positioning feature minimizes voltage drops caused by a sudden load step.
The transition from PWM mode to PFM mode occurs once the inductor current in the low-side MOSFET switch
becomes zero, which indicates discontinuous conduction mode.
During the power-save mode, the output voltage is monitored with a PFM comparator. As the output voltage falls
below the PFM comparator threshold of VOUT nominal + 1%, the device starts a PFM current pulse. The
high-side MOSFET switch turns on, and the inductor current ramps up. After the on-time expires, the switch is
turned off and the low-side MOSFET switch is turned on until the inductor current becomes zero.
The converter effectively delivers a current to the output capacitor and the load. If the load is below the delivered
current, the output voltage rises. If the output voltage is equal to or higher than the PFM comparator threshold,
the device stops switching and enters a sleep mode with typical 15-μA current consumption.
If the output voltage is still below the PFM comparator threshold, a sequence of further PFM current pulses is
generated until the PFM comparator threshold is reached. The converter starts switching again once the output
voltage drops below the PFM comparator threshold.
With a fast single-threshold comparator, the output-voltage ripple during PFM-mode operation can be kept small.
The PFM pulse is time controlled, which allows modifying the charge transferred to the output capacitor by the
value of the inductor. The resulting PFM output-voltage ripple and PFM frequency depend primarily on the size of
the output capacitor and the inductor value. Increasing output capacitor values and inductor values minimizes the
output ripple. The PFM frequency decreases with smaller inductor values and increases with larger values.
The PFM mode is left and PWM mode entered in case the output current can no longer be supported in PFM
mode. The power-save mode can be disabled by setting the MODE terminal to high. The converter then operates
in the fixed-frequency PWM mode.
Dynamic Voltage Positioning
This feature reduces the voltage under/overshoots at load steps from light to heavy load and vice versa. It is
active in power-save mode and regulates the output voltage 1% higher than the nominal value. This provides
more headroom for both the voltage drop at a load step, and the voltage increase at a load throw-off.
14
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Product Folder Link(s): TPS62560 TPS62561 TPS62562
TPS62560, TPS62561
TPS62562
www.ti.com
SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
Output voltage
Voltage Positioning
Vout +1%
PFM Comparator
threshold
Light load
PFM Mode
Vout (PWM)
moderate to heavy load
PWM Mode
Figure 28. Power Save Mode Operation With Automatic Mode Transition
100% Duty-Cycle Low-Dropout Operation
The device starts to enter 100% duty-cycle mode once the input voltage comes close to the nominal output
voltage. In order to maintain the output voltage, the high-side MOSFET switch is turned on 100% for one or more
cycles.
With further decreasing VIN, the high-side MOSFET switch is turned on completely. In this case, the converter
offers a low input-to-output voltage difference. This is particularly useful in battery-powered applications to
achieve longest operation time by taking full advantage of the whole battery-voltage range.
The minimum input voltage to maintain regulation depends on the load current and output voltage, and can be
calculated as:
VINmin = VOUTmax + IOUTmax × (RDS(on)max + RL)
with:
IOUTmax = maximum output current plus inductor ripple current
RDS(on)max = maximum P-channel switch RDS(on)
RL = dc resistance of the inductor
VOUTmax = nominal output voltage plus maximum output voltage tolerance
Undervoltage Lockout
The undervoltage lockout circuit prevents the device from malfunctioning at low input voltages and from
excessive discharge of the battery and disables the output stage of the converter. The undervoltage lockout
threshold is typically 1.85 V with falling VIN.
MODE SELECTION
The MODE terminal allows mode selection between forced-PWM mode and power-save mode.
Connecting this terminal to GND enables the power-save mode with automatic transition between PWM and
PFM modes. Pulling the MODE terminal high forces the converter to operate in fixed-frequency PWM mode even
at light load currents. This allows simple filtering of the switching frequency for noise-sensitive applications. In
this mode, the efficiency is lower compared to the power-save mode during light loads.
The state of the MODE terminal can be changed during operation to allow efficient power management by
adjusting the operation mode of the converter to the specific system requirements.
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62560 TPS62561 TPS62562
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TPS62560, TPS62561
TPS62562
SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
www.ti.com
ENABLE
The device is enabled by setting the EN terminal to high. During the start-up time tStart Up, the internal circuits are
settled and the soft-start circuit is activated. The EN input can be used to control power sequencing in a system
with various dc/dc converters. The EN terminal can be connected to the output of another converter, to drive the
EN terminal high to achieve a sequencing of the given supply rails. With EN = GND, the device enters shutdown
mode, in which all internal circuits are disabled. In fixed-output-voltage versions, the internal resistor divider
network is then disconnected from the FB terminal.
SOFT START
The TPS62560 has an internal soft-start circuit that controls the ramp-up of the output voltage. The output
voltage ramps up from 5% to 95% of its nominal value typically within 250 μs. This limits the inrush current into
the converter during ramp-up and prevents possible input voltage drops when a battery or high-impedance power
source is used. The soft-start circuit is enabled within the start-up time tStart Up.
SHORT-CIRCUIT PROTECTION
The high-side and low-side MOSFET switches are short-circuit protected with maximum switch current = ILIMF.
The current in the switches is monitored by current-limit comparators. Once the current in the high-side MOSFET
switch exceeds the threshold of its current-limit comparator, it turns off and the low-side MOSFET switch is
activated to ramp down the current in the inductor and high-side MOSFET switch. The high-side MOSFET switch
can only turn on again after the current in the low-side MOSFET switch has decreased below the threshold of its
current-limit comparator.
THERMAL SHUTDOWN
As soon as the junction temperature, TJ, exceeds 140°C (typical), the device goes into thermal shutdown. In this
mode, the high-side and low-side MOSFETs are turned off. The device continues its operation when the junction
temperature falls below the thermal shutdown hysteresis.
16
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Product Folder Link(s): TPS62560 TPS62561 TPS62562
TPS62560, TPS62561
TPS62562
www.ti.com
SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
APPLICATION INFORMATION
TPS62560DRV
VIN = 2.5 V to 5.5 V
VIN
CIN
4.7 mF
VOUT = 1.2 V
SW
R1
360 kW
EN
GND
L1
2.2 mH
C1
22 pF
COUT
10 mF
FB
R2
360 kW
MODE
S0364_01
Figure 29. TPS62560 Adjustable 1.2-V Output
TPS62560DRV
VIN = 2.5 V to 5.5 V
VIN
CIN
4.7 mF
VOUT = 1.5 V
Up to 600 mA
SW
R1
540 kW
EN
GND
L1
2.2 mH
C1
22 pF
COUT
10 mF
FB
R2
360 kW
MODE
S0365-01
Figure 30. TPS62560 Adjustable 1.5-V Output
TPS62562DRV
VIN = 2 V to 6 V
VIN
CIN
4.7 mF
L1
2.2 mH
SW
COUT
10 mF
EN
GND
VOUT = 1.8 V
Up to 600 mA
FB
MODE
S0366-01
Figure 31. TPS62562 Fixed 1.8-V Output
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62560 TPS62561 TPS62562
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TPS62562
SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
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OUTPUT VOLTAGE SETTING
For adjustable output voltage versions, the output voltage can be calculated as:
æ R ö
VOUT = VREF ´ ç 1+ 1 ÷
è R2 ø with an internal reference voltage VREF, typically 0.6 V.
To minimize the current through the feedback divider network, R2 should be 180 kΩ or 360 kΩ. The sum of R1
and R2 should not exceed ~1 MΩ, to keep the network robust against noise. An external feed-forward capacitor,
C1, is required for optimum load transient response. The value of C1 should be in the range between 22 pF and
33 pF.
In case of using the fixed output voltage version (TPS62562), Vout has to be connected to the feedback pin FB.
Route the FB line away from noise sources, such as the inductor or the SW line.
OUTPUT FILTER DESIGN (INDUCTOR AND OUTPUT CAPACITOR)
The TPS62560 is designed to operate with inductors in the range of 1.5 μH to 4.7 μH and with output capacitors
in the range of 4.7 μF to 22 μF. The part is optimized for operation with a 2.2-μH inductor and 10-μF output
capacitor.
Larger or smaller inductor values can be used to optimize the performance of the device for specific operation
conditions. For stable operation, the L and C values of the output filter may not fall below 1 μH effective
inductance and 3.5 μF effective capacitance.
Inductor Selection
The inductor value has a direct effect on the ripple current. The selected inductor must be rated for its dc
resistance and saturation current. The inductor ripple current (ΔIL) decreases with higher inductance and
increases with higher VIN or VOUT.
The inductor selection also impacts the output voltage ripple in PFM mode. Higher inductor values lead to lower
output voltage ripple and higher PFM frequency; lower inductor values lead to a higher output voltage ripple but
lower PFM frequency.
Equation 1 calculates the maximum inductor current in PWM mode under static load conditions. The saturation
current of the inductor should be rated higher than the maximum inductor current as calculated with Equation 2.
This is recommended because during heavy load transients the inductor current rises above the calculated
value.
V
1 * OUT
V
DI L + VOUT
L
I L max + I out max )
IN
f
DI L
(1)
2
(2)
where:
f = Switching frequency (2.25 MHz, typical)
L = Inductor value
ΔIL = Peak-to-peak inductor ripple current
ILmax = Maximum inductor current
Table 2. List of Inductors
18
DIMENSIONS, mm
INDUCTANCE, μH
INDUCTOR TYPE
SUPPLIER
2,5 × 2 × 1 max
2
MIPS2520D2R2
FDK
2,5 × 2 × 1,2 max
2
MIPSA2520D2R2
FDK
2,5 × 2 × 1 max
2.2
KSLI-252010AG2R2
Hitachi Metals
2,5 × 2 × 1,2 max
2.2
LQM2HPN2R2MJ0L
Murata
3 × 3 × 1,5 max
2.2
LPS3015 2R2
Coilcraft
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TPS62562
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SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
A more conservative approach is to select the inductor current rating just for the switch current limit ILIMF of the
converter.
Accepting larger values of ripple current allows the use of lower inductance values, but results in higher output
voltage ripple, greater core losses, and lower output current capability.
The total losses of the coil have a strong impact on the efficiency of the dc/dc conversion and consist of both the
losses in the dc resistance (R(DC)) and the following frequency-dependent components:
• The losses in the core material (magnetic hysteresis loss, especially at high switching frequencies)
• Additional losses in the conductor from the skin effect (current displacement at high frequencies)
• Magnetic field losses of the neighboring windings (proximity effect)
• Radiation losses
Output Capacitor Selection
The advanced fast-response voltage-mode control scheme of the TPS62560 allows the use of tiny ceramic
capacitors. Ceramic capacitors with low ESR values have the lowest output voltage ripple and are
recommended. The output capacitor requires either an X7R or X5R dielectric. Y5V and Z5U dielectric capacitors,
aside from their wide variation in capacitance over temperature, become resistive at high frequencies.
At nominal load current, the device operates in PWM mode, and the RMS ripple current is calculated as:
V
1 - OUT
VIN
1
IRMSCOUT = VOUT ´
´
L´f
2 3
(3)
At nominal load current, the device operates in PWM mode, and the overall output voltage ripple is the sum of
the voltage spike caused by the output capacitor ESR plus the voltage ripple caused by charging and discharging
the output capacitor:
V
1 - OUT
æ
ö
VIN
1
DVOUT = VOUT ´
´ç
+ ESR ÷
L´f
è 8 ´ COUT ´ f
ø
(4)
At light load currents, the converter operates in power-save mode, and the output voltage ripple is dependent on
the output capacitor and inductor values. Larger output capacitor and inductor values minimize the voltage ripple
in PFM mode and tighten dc output accuracy in PFM mode.
Input Capacitor Selection
An input capacitor is required for best input voltage filtering and minimizing the interference with other circuits
caused by high input voltage spikes. For most applications, a 4.7-μF to 10-μF ceramic capacitor is
recommended. Because a ceramic capacitor loses up to 80% of its initial capacitance at 5 V, it is recommended
that 10-μF input capacitors be used for input voltages > 4.5 V. The input capacitor can be increased without any
limit for better input voltage filtering. Take care when using only small ceramic input capacitors. When a ceramic
capacitor is used at the input and the power is being supplied through long wires, such as from a wall adapter, a
load step at the output or VIN step on the input can induce ringing at the VIN terminal. This ringing can couple to
the output and be mistaken as loop instability or could even damage the part by exceeding the maximum ratings.
Table 3. List of Capacitors
CAPACITANCE
TYPE
SIZE
SUPPLIER
4.7 μF
GRM188R60J475K
0603—1,6 × 0,8 × 0,8 mm
Murata
10 μF
GRM188R60J106M69D
0603—1,6 × 0,8 × 0,8 mm
Murata
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Product Folder Link(s): TPS62560 TPS62561 TPS62562
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TPS62560, TPS62561
TPS62562
SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
www.ti.com
LAYOUT CONSIDERATIONS
Figure 32. Suggested Layout for Fixed-Output-Voltage Options
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TPS62562
www.ti.com
SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
VOUT
R2
GND
C1
R1
COUT
CIN
VIN
L
G
N
D
U
Figure 33. Suggested Layout for Adjustable-Output-Voltage Version
As for all switching power supplies, the layout is an important step in the design. Proper function of the device
demands careful attention to PCB layout. Care must be taken in board layout to get the specified performance. If
the layout is not carefully done, the regulator could show poor line and/or load regulation and stability issues, as
well as EMI problems. It is critical to provide a low-inductance, low-impedance ground path. Therefore, use wide
and short traces for the main current paths. The input capacitor, inductor, and output capacitor should be placed
as close as possible to the IC terminals.
Connect the GND terminal of the device to the thermal-pad land of the PCB and use this pad as a star point. Use
a common power-GND node and a different node for the signal GND to minimize the effects of ground noise.
Connect these ground nodes together to the thermal-pad land (star point) underneath the IC. Keep the common
path to the GND terminal, which returns the small signal components and the high current of the output
capacitors, as short as possible to avoid ground noise. The FB line should be connected directly to the output
capacitor and routed away from noisy components and traces (e.g., the SW line).
Copyright © 2008–2009, Texas Instruments Incorporated
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TPS62560, TPS62561
TPS62562
SLVS815C – JANUARY 2008 – REVISED DECEMBER 2009
www.ti.com
Changes from Original (January 2008) to Revision A
•
Page
Changed at all levels. Revision A is a complete rewrite of this data sheet. ......................................................................... 1
Changes from Revision A (July 2008) to Revision B
•
Page
Added TPS62562 device number. ........................................................................................................................................ 1
Changes from Revision B (March 2009) to Revision C
Page
•
Deleted High Efficiency Step Down Converter ..................................................................................................................... 1
•
Deleted "Wide" from Features bullet ..................................................................................................................................... 1
•
Deleted "for Li-Ion Batteries With Extended Voltage Range" from Features ....................................................................... 1
•
Deleted "Adjustable and Fixed Output-Voltage Options" from Features .............................................................................. 1
•
Deleted "2.25 MHz Fixed Frequency Operation" from Features .......................................................................................... 1
•
Deleted "Power Save Mode at Light Load Currents" from Features .................................................................................... 1
•
Deleted "Voltage Positioning at Light Loads" from Features ................................................................................................ 1
•
Deleted "Allows < 1-mm Solution Height" from Features ..................................................................................................... 1
•
Added reference to TPS62260 ............................................................................................................................................. 1
•
Changed Description to better reflect device capabilities and differences to TPS62260 ..................................................... 1
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
TPS62560DRVR
ACTIVE
SON
DRV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CEY
TPS62560DRVRG4
ACTIVE
SON
DRV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CEY
TPS62560DRVT
ACTIVE
SON
DRV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CEY
TPS62560DRVTG4
ACTIVE
SON
DRV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CEY
TPS62561DDCR
ACTIVE
SOT
DDC
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CVO
TPS62561DDCT
ACTIVE
SOT
DDC
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CVO
TPS62562DRVR
ACTIVE
SON
DRV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
NXT
TPS62562DRVT
ACTIVE
SON
DRV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
NXT
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Oct-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
TPS62560DRVR
SON
DRV
6
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3000
179.0
8.4
2.2
2.2
1.2
4.0
8.0
Q2
TPS62560DRVT
SON
DRV
6
250
179.0
8.4
2.2
2.2
1.2
4.0
8.0
Q2
TPS62561DDCR
SOT
DDC
5
3000
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS62561DDCT
SOT
DDC
5
250
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS62562DRVR
SON
DRV
6
3000
179.0
8.4
2.2
2.2
1.2
4.0
8.0
Q2
TPS62562DRVT
SON
DRV
6
250
179.0
8.4
2.2
2.2
1.2
4.0
8.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Oct-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS62560DRVR
SON
DRV
6
3000
203.0
203.0
35.0
TPS62560DRVT
SON
DRV
6
250
203.0
203.0
35.0
TPS62561DDCR
SOT
DDC
5
3000
203.0
203.0
35.0
TPS62561DDCT
SOT
DDC
5
250
203.0
203.0
35.0
TPS62562DRVR
SON
DRV
6
3000
203.0
203.0
35.0
TPS62562DRVT
SON
DRV
6
250
203.0
203.0
35.0
Pack Materials-Page 2
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