TI TPS62232DRYR

TPS62230
TPS62231
TPS62232
www.ti.com ..................................................................................................................................................................................................... SLVS941 – APRIL 2009
3 MHz Ultra Small Step Down Converter in 1x1.5 SON Package
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
3 MHz switch frequency
Up to 94% efficiency
Output Peak Current up to 500mA
Excellent AC and Transient Load Regulation
High PSRR (up to 90dB)
Small External Output Filter Components
1.0µH/ 4.7µF
VIN range from 2.05V to 6V
Optimized Power Save Mode For Low Output
Ripple Voltage
Forced PWM Mode Operation
Typ. 22 µA Quiescent Current
100% Duty Cycle for Lowest Dropout
Small 1 × 1.5 × 0.6mm3 SON Package
12 mm2 Minimum Solution Size
Supports 0.6 mm Maximum Solution Height
Soft Start with typ. 100µs Start Up Time
APPLICATIONS
•
•
•
•
•
•
LDO Replacement
Portable Audio, Portable Media
Cell Phones
Low Power Wireless
Low Power DSP Core Supply
Digital Cameras
VIN
2.05 V - 6 V
VIN
EN
MODE
CIN
2.2 mF
SW
FB
GND
The TPS6223X device family is a high frequency
synchronous step down DC-DC converter optimized
for battery powered portable applications. It supports
up to 500mA output current and allows the use of tiny
and low cost chip inductors and capacitors.
With a wide input voltage range of 2.05V to 6V the
device supports applications powered by Li-Ion
batteries with extended voltage range. The minimum
input voltage of 2.05V allows as well the operation
from Li-primary or two alkaline batteries. Different
fixed output voltage versions are available from 1.2V
to 2.5V.
The TPS6223X series features switch frequency up
to 3.8MHz. At medium to heavy loads, the converter
operates in PWM mode and automatically enters
Power Save Mode operation at light load currents to
maintain high efficiency over the entire load current
range.
Because of its excellent PSRR and AC load
regulation performance, the device is also suitable to
replace linear regulators to obtain better power
conversion efficiency.
The Power Save Mode in TPS6223X reduces the
quiescent current consumption down to 22µA during
light load operation. It is optimized to achieve very
low output voltage ripple even with small external
component and features excellent ac load regulation.
L
1/2.2 mH
TPS62231
DESCRIPTION
VOUT
1.8 V
COUT
4.7 mF
For very noise sensitive applications, the device can
be forced to PWM Mode operation over the entire
load range by pulling the MODE pin high. In the
shutdown mode, the current consumption is reduced
to less than 1µA. The TPS6223X is available in a 1 ×
1.5mm2 6 pin SON package.
Total area
L1
12mm²
V IN
C1
C2
GND
V OUT
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
TPS62230
TPS62231
TPS62232
SLVS941 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
OUTPUT VOLTAGE (2)
PACKAGE
DESIGNATOR
ORDERING
PACKAGE
MARKING
TPS62230
2.5 V
DRY
TPS62230DRY
GV
TPS62231
1.8 V
DRY
TPS62231DRY
GW
TPS62232
1.2 V
DRY
TPS62232DRY
GX
TPS6223-1.0 (3)
1.0 V
DRY
TPS6223-1.3 (3)
1.3 V
DRY
TPS6223-1.5 (3)
1.5 V
DRY
TPS6223-2.0 (3)
2.0 V
DRY
TPS6223-2.1 (3)
2.1 V
DRY
PART NUMBER (1)
TA
–40°C to 85°C
TPS6223-2.25
2.25 V
DRY
TPS6223-2.3 (3)
2.3 V
DRY
TPS6223-2.7 (3)
2.7 V
DRY
(3)
2.9 V
DRY
TPS6223-3.0 (3)
3.0 V
DRY
TPS6223-2.9
(1)
(2)
(3)
(3)
The DRY package is available in tape on reel. Add R suffix to order quantities of 3000 parts per reel, T suffix for 250 parts per reel.
Contact TI for other fixed output voltage options
Device status is product preview, contact TI for more details
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
VI
(1)
VALUE
UNIT
Voltage at VIN and SW Pin (2)
–0.3 to 7
V
Voltage at EN, MODE Pin (2)
–0.3 to VIN +0.3, ≤7
V
–0.3 to 3.6
V
internally limited
A
Voltage at FB Pin
(2)
Peak output current
ESD rating (3)
HBM Human body model
2
CDM Charge device model
1
Machine model
kV
200
Power dissipation
V
Internally limited
TJ
Maximum operating junction temperature
–40 to 125
°C
Tstg
Storage temperature range
–65 to 150
°C
(1)
(2)
(3)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
DISSIPATION RATINGS (1)
(1)
(2)
2
PACKAGE
RθJA
POWER RATING
FOR TA ≤ 25°C
DERATING FACTOR
ABOVE TA = 25°C
1 × 1.5 SON
234°C/W (2)
420 mW
4.2 mW/°C
Maximum power dissipation is a function of TJ(max), θJA and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = [TJ(max) – TA] /θJA.
This thermal data is measured with high-K board (4 layers board according to JESD51-7 JEDEC standard).
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TPS62230
TPS62231
TPS62232
www.ti.com ..................................................................................................................................................................................................... SLVS941 – APRIL 2009
RECOMMENDED OPERATING CONDITIONS
operating ambient temperature TA = –40 to 85°C (unless otherwise noted) (1)
MIN
Supply voltage VIN (2)
Effective inductance
2.0
VOUT ≤ VIN -1 V (3)
Recommended minimum
supply voltage
500 mA maximum IOUT (4)
350mA maximum IOUT (5)
VOUT ≤ 1.8V
60 mA maximum output current
(5)
(3)
(4)
(5)
6
UNIT
V
µH
µF
4.7
3.0
3.6
2.5
2.7
V
2.05
Operating virtual junction temperature range, TJ
(2)
MAX
2.2
Effective capacitance
(1)
NOM
2.05
–40
125
°C
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the
maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package
in the application (θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max)).
The minimum required supply voltage for startup is 2.05 V. The part is functional down to the falling UVL (Under Voltage Lockout)
threshold.
For a voltage difference between minimum VIN and VOUT of ≥ 1 V
Typical value applies for TA = 25°C, maximum value applies for TA = 70°C with TJ ≤ 125°C, PCB layout needs to support proper thermal
performance.
Typical value applies for TA = 25°C, maximum value applies for TA = 85°C with TJ ≤ 125°C, PCB layout needs to support proper thermal
performance.
Copyright © 2009, Texas Instruments Incorporated
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TPS62230
TPS62231
TPS62232
SLVS941 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS
VIN = 3.6V, VOUT = 1.8V, EN = VIN, MODE = GND, TA = –40°C to 85°C (1) typical values are at TA = 25°C (unless otherwise
noted), CIN = 2.2µF, L = 2.2µH, COUT = 4.7µF, see parameter measurement information
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
6
V
IOUT = 0mA. PFM mode enabled (Mode = 0)
device not switching
22
40
µA
IOUT = 0mA. PFM mode enabled (Mode = 0)
device switching, VIN = 3.6V, VOUT = 1.2V
25
µA
3
mA
SUPPLY
VIN
Input voltage range
IQ
(2)
2.05
Operating quiescent current
IOUT = 0 mA. Switching with no load
(MODE/DATA = VIN), PWM operation,
VOUT = 1.8V, L = 2.2µH
ISD
Shutdown current
VUVLO
Undervoltage lockout threshold
EN = GND (3)
0.1
1
µA
Falling
1.8
1.9
V
Rising
1.9
2.05
V
0.8
1
V
ENABLE, MODE THRESHOLD
VIH
Threshold for detecting high EN, MODE 2.05 V ≤ VIN ≤ 6V , rising edge
TH
VIL TH HYS
Threshold for detecting low EN, MODE
2.05 V ≤ VIN ≤ 6V , falling edge
IIN
Input bias Current, EN, MODE
EN, MODE = GND or VIN = 3.6V
0.4
0.6
V
µA
0.01
0.5
600
850
350
480
690
850
1050
mA
550
840
1220
mA
POWER SWITCH
RDS(ON)
ILIMF
High side MOSFET on-resistance
Low Side MOSFET on-resistance
Forward current limit MOSFET
high-side
VIN = 3.6V, TJmax = 85°C; RDS(ON) max value
VIN = 3.6V, open loop
Forward current limit MOSFET low side
TSD
mΩ
Thermal shutdown
Increasing junction temperature
150
°C
Thermal shutdown hysteresis
Decreasing junction temperature
20
°C
135
ns
40
ns
0.70
V
CONTROLLER
TONmin
Minimum ON time
TOFFmin
Minimum OFF time
VIN 3.6V, VOUT = 1.8V, Mode = high, IOUT = 0 mA
OUTPUT
VREF
Internal Reference Voltage
VOUT
Output voltage accuracy (4)
VIN = 3.6V, Mode = GND, device operating in PFM
Mode, IOUT = 0mA
VIN = 3.6V, MODE = VIN,
IOUT = 0 mA
0%
TA = 25°C
–2.0%
TA = –40°C to 85°C
–2.5%
2.0%
2.5%
DC output voltage load regulation
PWM operation, Mode = VIN = 3.6V, VOUT = 1.8 V
DC output voltage line regulation
IOUT = 0 mA, Mode = VIN, 2.05V ≤ VIN ≤ 6V
tStart
Start-up Time
Time from active EN to VOUT = 1.8V, VIN = 3.6V,
10Ω load
100
ILK_SW
Leakage current into SW pin
VIN = VOUT = VSW = 3.6 V, EN = GND (5)
0.1
(1)
(2)
(3)
(4)
(5)
4
0.001
%/mA
0
%/V
µs
0.5
µA
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the
maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the
part/package in the application (θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max)).
The minimum required supply voltage for startup is 2.05V. The part is functional down to the falling UVL (Under Voltage Lockout)
threshold
Shutdown current into VIN pin, includes internal leakage
VIN = VO + 1.0 V
The internal resistor divider network is disconnected from FB pin.
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62230 TPS62231 TPS62232
TPS62230
TPS62231
TPS62232
www.ti.com ..................................................................................................................................................................................................... SLVS941 – APRIL 2009
DRY PACKAGE
(TOP VIEW)
MODE 1
6
FB
SW 2
5 EN
VIN 3
4
GND
PIN FUNCTIONS
PIN
NAME
NO
I/O
DESCRIPTION
VIN
3
PWR
VIN power supply pin.
GND
4
PWR
GND supply pin
EN
5
IN
SW
2
OUT
FB
6
IN
Feedback Pin for the internal regulation loop. Connect this pin directly to the output capacitor.
MODE
1
IN
MODE pin = high forces the device to operate in PWM mode. Mode = low enables the Power Save Mode
with automatic transition from PFM (Pulse frequency mode) to PWM (pulse width modulation) mode.
This is the enable pin of the device. Pulling this pin to low forces the device into shutdown mode. Pulling
this pin to high enables the device. This pin must be terminated.
This is the switch pin and is connected to the internal MOSFET switches. Connect the inductor to this
terminal
FUNCTIONAL BLOCK DIAGRAM
VIN
Bandgap
VREF
0.70 V
Undervoltage
Lockout
Current
Limit Comparator
Limit
High Side
MODE
MODE
PMOS
Softstart
VIN
Min. On Time
FB
EN
Min. OFF Time
Control
Logic
Gate Driver
Anti
Shoot-Through
VREF
NMOS
FB
Integrated
Feed Back
Network
SW
Limit
Low Side
Error
Comparator
Thermal
Shutdown
Zero/Negative
Current Limit Comparator
EN
GND
Copyright © 2009, Texas Instruments Incorporated
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TPS62230
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SLVS941 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com
PARAMETER MEASUREMENT INFORMATION
VIN = 2.05 V to 6 V
TPS6223X
VIN
CIN
EN
2.2 mF
MODE
L = 1/2.2 mH
VOUT
SW
FB
COUT
GND
4.7 mF
CIN: Murata GRM155R60J225ME15D 2.2 mF 0402 size
COUT: Murata GRM188R60J475ME 4.7 mF 0603 size, VOUT >= 1.8 V
COUT: Taiyo Yuden AMK105BJ475MV 4.7 mF 0402 size, VOUT = 1.2 V
l: Murata LQM2HPN1R0MJ0
1 mH, LQM2HPN2R2MJ0 2.2 mH,
3
size 2.5x2.0x1.2mm
6
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TPS62230
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TPS62232
www.ti.com ..................................................................................................................................................................................................... SLVS941 – APRIL 2009
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
η
Efficiency
vs Load current
VO
Output voltage
vs Output current
8, 9, 10, 11, 12, 13
Switching frequency
vs Output current
14, 15, 16, 17, 18, 19,
20
IQ
Quiescent current
vs Ambient temperature
21
ISD
Shutdown current
vs Ambient temperature
22
PMOS Static drain-source on-state
resistance
vs Supply voltage and ambient temperature
23
NMOS Static drain-source on-state
resistance
vs Supply voltage and ambient temperature
24
Power supply rejection ratio
vs Frequency
25
rDS(ON)
PSRR
1, 2, 3, 4, 5, 6, 7
Typical operation
26, 27, 28
Line transient response
PFM
29
PWM
30
Mode transition PFM / forced PWM
31
AC - load regulation performance
32, 33, 34
Load transient response
35, 36, 37, 38
Start-up
39, 40
–
–
100
100
VIN = 3.6 V
80
60
VIN = 2.9 V
70
VIN = 5 V
50
40
30
20
10
0
0.1
VIN = 3.6 V
80
VIN = 4.2 V
Efficiency -%
Efficiency -%
70
VIN = 2.9 V
90
90
VIN = 4.2 V
60
VIN = 5 V
50
40
30
MODE = GND,
VOUT = 2.5V,
L = 2.2 mH (LQM2HPN2R2MJ0)
COUT = 4.7 mF
20
MODE = VIN,
VOUT = 2.5 V,
10
L = 2.2 mH (LQM2HPN2R2MJ0)
COUT = 4.7 mF
0
1
10
100
IO - Output Current - mA
1000
Figure 1. Efficiency PFM/PWM Mode 2.5V Output Voltage
Copyright © 2009, Texas Instruments Incorporated
1
10
100
IO - Output Current - mA
1000
Figure 2. Efficiency Forced PWM Mode 2.5V Output
Voltage
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100
100
VIN = 2.3 V
90
90
80
80
VIN = 3.3 V
60
VIN = 4.2 V
50
VIN = 5 V
40
30
20
MODE = GND,
VOUT = 1.8 V,
10
L = 2.2 mH (MIPSA25202R2),
COUT = 4.7 mF
0
0.1
VIN = 3.3 V
60
VIN = 4.2 V
40
VIN = 5 V
30
20
MODE = VIN,
VOUT = 1.8 V,
10
L = 2.2 mH (MIPSA25202R2),
COUT = 4.7 mF
0
1
10
100
IO - Output Current - mA
1
1000
10
100
IO - Output Current - mA
1000
Figure 4. Efficiency Forced PWM Mode 1.8V Output
voltage
100
100
VIN = 2.3 V
90
90
VIN = 2.3 V
80
80
70
VIN = 2.7 V
70
VIN = 3.6 V
60
Efficiency -%
Efficiency -%
VIN = 3.6 V
50
Figure 3. Efficiency PFM/PWM MODE 1.8V Output Voltage
VIN = 4.2 V
50
VIN = 5 V
40
30
VIN = 2.7 V
60
VIN = 3.6 V
VIN = 4.2 V
50
VIN = 5 V
40
30
20
MODE = GND,
VOUT = 1.2 V,
10
L = 2.2 mH MIPSZ2012 2R2 (2012 size),
COUT = 4.7 mF
0
0.1
20
MODE = VIN,
VOUT = 1.2 V,
10
L = 2.2 mH MIPSZ2012 2R2 (2012 size),
COUT = 4.7 mF
0
1
10
100
IO - Output Current - mA
1000
Figure 5. Efficiency PFM/PWM Mode 1.2V Output voltage
8
VIN = 2.7 V
70
VIN = 3.6 V
Efficiency -%
Efficiency -%
70
VIN = 2.7 V
VIN = 2.3 V
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1
10
100
IO - Output Current - mA
1000
Figure 6. Efficiency Forced PWM Mode 1.2V Output
Voltage
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62230 TPS62231 TPS62232
TPS62230
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TPS62232
www.ti.com ..................................................................................................................................................................................................... SLVS941 – APRIL 2009
2.575
90
MODE = VIN,
VOUT = 2.5 V,
85
Efficiency -%
80
MIPSD1R0
L = 1 mH 0805
(2x1.25x1mm3)
75
MIPSA25202R2
L = 2.2 mH
(2.5x2x1.2mm3)
LQM2HPN1R0MJ0
L = 1 mH
(2.5x2x1.2mm3)
MIPSZ2012D2R2
L = 2.2 mH 0805
(2x1.25x1mm3)
70
VO - Output Voltage (DC) - V
2.55
65
LQM21PN2R2
L = 2.2 mH 0805
(2x1.25x0.55mm3)
60
MODE = GND,
CIN = 2.2 mF (0402),
COUT = 4.7 mF (0402),
VOUT = 1.8 V,
VIN = 3.6 V
55
50
0.1
1
10
100
IO - Output Current - mA
L = 1 mH,
COUT = 4.7 mF,
TA = 25°C
2.5
VIN = 4.2 V
VIN = 3.6 V
2.5
VIN = 4.2 V
VIN = 5 V
2.475
2.425
0.1
1000
VIN = 5 V
VIN = 3.3 V
VIN = 3.6 V
2.475
1
10
100
IO - Output Current - mA
1000
Figure 8. 2.5V Output Voltage Accuracy forced PWM Mode
1.854
MODE = GND,
VOUT = 1.8 V,
1.836
VO - Output Voltage (DC) - V
VO - Output Voltage (DC) - V
2.525
VIN = 3.3 V
2.45
Figure 7. Comparison Efficiency vs Inductor Value and
Size
2.575
MODE = GND,
VOUT = 2.5 V,
2.55
2.525
L = 1 mH,
COUT = 4.7 mF,
TA = 25°C
L = 2.2 mH,
COUT = 4.7 mF,
TA = 25°C
1.818
VIN = 3.6 V
VIN = 3.3 V
1.8
VIN = 4.2 V
1.782
VIN = 5 V
1.764
2.45
2.425
0.1
1
10
100
IO - Output Current - mA
1000
Figure 9. 2.5V Output Voltage Accuracy PFM/PWM Mode
Copyright © 2009, Texas Instruments Incorporated
1.746
0.01
0.1
1
10
100
IO - Output Current - mA
1000
Figure 10. 1.8V Output Voltage Accuracy PFM/PWM Mode
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1.854
1.818
MODE = VIN,
VOUT = 1.2 V,
L = 1 mH,
COUT = 4.7 mF,
TA = 25°C
1.224
VIN = 3.3 V
VIN = 3.6 V
1.8
VIN = 5 V
VIN = 4.2 V
1.782
VO - Output Voltage (DC) - V
VO - Output Voltage (DC) - V
1.836
1.236
MODE = VIN,
VOUT = 1.8 V,
1.746
0.1
1
10
100
IO - Output Current - mA
L = 2.2 mH,
COUT = 4.7 mF,
TA = 25°C
1.2
VIN = 4.2 V
1.188
VIN = 5 V
4000
VIN = 5 V
3500
1.2
VIN = 4.2 V
1.188
VIN = 5 V
f - Frequency - kHz
VIN = 3.6 V
VIN = 4.2 V
VIN = 3.6 V
VIN = 3.3 V
2500
2000
1500
1000
VIN = 2.7 V
VIN = 2.3 V
500
0
0.1
1
10
IO - Output Current - mA
100
1000
Figure 13. 1.2V Output Voltage Accuracy PFM/PWM MODE
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1000
Figure 12. 1.2V Output Voltage Accuracy Forced PWM
MODE
1.176
10
1
10
100
IO - Output Current - mA
3000
VIN = 3.3 V
1.212
1.164
0.01
VIN = 3.3 V
VIN = 3.6 V
1.164
0.1
1000
Figure 11. 1.8V Output Voltage Accuracy Forced PWM
MODE
1.236
MODE = GND,
VOUT = 1.2 V,
VO - Output Voltage (DC) - V
1.212
1.176
1.764
1.224
L = 2.2 mH,
COUT = 4.7 mF,
TA = 25°C
0
100
MODE = GND,
VOUT = 1.8 V,
L = 2.2 mH,
COUT = 4.7 mF,
TA = 25°C
200
300
400
IO - Output Current - mA
500
Figure 14. Switching Frequency vs Output Current, 1.8V
Output Voltage MODE = GND
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4000
4000
VIN = 5 V
VIN = 5 V
VIN = 4.2 V
3500
VIN = 4.2 V
VIN = 3.6 V
3500
VIN = 3.6 V
3000
VIN = 3.3 V
f - Frequency - kHz
f - Frequency - kHz
3000
2500
2000
1500
1000
0
VIN = 2.7 V
VIN = 2.3 V
500
0
100
MODE = GND,
VOUT = 1.8 V,
2000
1500
VIN = 2.7 V
0
500
0
4000
MODE = GND,
VOUT = 2.5 V,
VIN = 5 V
MODE = VIN,
VOUT = 2.5 V,
VIN = 4.2 V
L = 2.2 mH,
C
= 4.7 mF,
VIN = 3.3 V OUT
TA = 25°C
3000
VIN = 3.6 V
2000
VIN = 3.3 V
1500
500
VIN = 3.6 V
f - Frequency - kHz
2500
200
300
400
IO - Output Current - mA
VIN = 5 V
3500
L = 2.2 mH,
VIN = 4.2 V COUT = 4.7 mF,
TA = 25°C
3000
100
Figure 16. Switching Frequency vs Output Current, 1.8V
Output Voltage MODE = VIN
4000
3500
MODE = VIN,
VOUT = 1.8 V,
L = 2.2 mH,
COUT = 4.7 mF,
TA = 25°C
VIN = 2.3 V
500
Figure 15. Switching Frequency vs Output Current, 1.8V
Output Voltage MODE = GND
f - Frequency - kHz
2500
1000
L = 1 mH,
COUT = 4.7 mF,
TA = 25°C
200
300
400
IO - Output Current - mA
VIN = 3.3 V
2500
2000
1500
1000
1000
VIN = 3 V
500
0
0
0
100
VIN = 3 V
500
200
300
400
IO - Output Current - mA
500
Figure 17. Switching Frequency vs Output Current, 2.5V
Output Voltage MODE = GND
Copyright © 2009, Texas Instruments Incorporated
0
100
200
300
400
IO - Output Current - mA
500
Figure 18. Switching Frequency vs Output Current, 2.5V
Output Voltage MODE = VIN
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3000
3500
VIN = 5 V
VIN = 5 V
VIN = 4.2 V
3000
2500
VIN = 4.2 V
VIN = 3.3 V
VIN = 3.6 V
VIN = 3.6 V
f - Frequency - kHz
f - Frequency - kHz
2500
VIN = 2.7 V
2000
1500
VIN = 2.3 V
1000
VIN = 2 V
MODE = GND,
VOUT = 1.2 V,
L = 2.2 mH,
COUT = 4.7 mF,
TA = 25°C
500
1500
VIN = 2.3 V
VIN = 2 V
1000
100
200
300
400
IO - Output Current - mA
500
L = 2.2 mH,
COUT = 4.7 mF,
TA = 25°C
0
500
Figure 19. Switching Frequency vs Output Current, 1.2V
Output Voltage MODE = GND
35
TA = 60°C
TA = 25°C
500
TA = 85°C
0.16
25
20
200
300
400
IO - Output Current - mA
0.2
ISD - Shutdown Current - mA
30
100
Figure 20. Switching Frequency vs Output Current, 1.2V
Output Voltage MODE = VIN
0.18
TA = 85°C
VIN = 2.7 V
MODE = VIN,
VOUT = 1.2 V,
0
0
0
IQ - Quiescent Current - mA
VIN = 3.3 V
2000
TA = -40°C
15
0.14
0.12
0.1
0.08
TA = 60°C
TA = 25°C
TA = -40°C
0.06
0.04
0.02
10
0
2
2.5
3
3.5
4
4.5
5
VIN - Input Voltage - V
5.5
6
Figure 21. Quiescent Current IQ vs Ambient Temperature
TA
12
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2
2.5
3
3.5
4
4.5
5
VIN - Input Voltage - V
5.5
6
Figure 22. Shutdown Current ISD vs Ambient Temperature
TA
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2
PMOS
1.8
TA = 85°C
TA = 60°C
1.6
1.4
TA = 25°C
1.2
TA = -40°C
1
0.8
0.6
0.4
0.2
0
2
2.5
3
3.5
4
4.5
5
VIN - Input Voltage - V
5.5
6
Figure 23. PMOS RDSON vs Supply Voltage VIN and
Ambient Temperature TA
PSRR - Power Supply Rejection Ratio - dB
100
80
70
60
50
40
0.6
TA = 60°C
0.5
TA = 25°C
TA = -40°C
0.4
0.3
0.2
0.1
0
2
2.5
3
3.5
4
4.5
5
VIN - Input Voltage - V
5.5
6
Figure 24. NMOS RDSON vs Supply Voltage VIN and
Ambient Temperature TA
VIN = 3.6V
COUT = 4.7 mF
L = 1 mH
MODE = GND
IOUT = 10 mA
VIN = 3.6 V,
VOUT = 1.8 V,
20
NMOS
TA = 85°C
VOUT = 2.5V
20 mV/Div
IOUT = 50 mA,
MODE = 1,
PFM/PWM
IOUT = 150 mA,
PWM Mode
30
0.7
SW
2 V/div
IOUT = 50 mA,
MODE = 0,
forced PWM
90
rDS(ON) - Static Drain-Source On-State Resistance - W
rDS(ON) - Static Drain-Source On-State Resistance - W
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IL
200 mA/Div
CIN = 2.2 mF,
COUT = 4.7 mF,
10
L = 2.2 mH
0
10
100
1k
10k
f - Frequency - kHz
100k
Figure 25. TPS62231 1.8V PSRR
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1M
t - Time - 1 ms/div
Figure 26. PFM Mode Operation IOUT = 10mA
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VIN = 3.6 V
VOUT = 2.5V
20 mV/div
COUT = 4.7 mF
SW
2 V/div
MODE = GND
IOUT = 10 mA
L = 2.2 mH
VOUT = 2.5 V
20 mV/div
VIN = 3.6 V
COUT = 4.7 mF
L = 1 mH
SW
2 V/div
IL
200 mA/div
IL
200 mA/div
t - Time - 500 ns/div
t - Time - 1 ms/div
Figure 27. PFM Mode Operation IOUT = 10mA
Figure 28. Forced PWM Mode Operation IOUT = 10mA
VIN = 3.6 V to 4.2 V
200 mV/div
VIN = 3.6 V to 4.2 V
200 mV/div
COUT = 4.7 mF
VOUT = 1.8 V
20 mV/div
L = 2.2 mH
MODE = GND
IOUT = 50 mA
t - Time - 10 ms/div
Figure 29. Line Transient Response PFM Mode
14
MODE = VIN
IOUT = 10 mA
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COUT = 4.7 mF
VOUT = 1.8 V
20 mV/div
L = 2.2 mH
MODE = VIN
IOUT = 50 mA
t - Time - 100 ms/div
Figure 30. Line Transient Response PWM Mode
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MODE: 0 V to 3.6 V
2 V/div
PFM Mode Operation
Forced PWM
Mode Operation
VSW
2 V/div
VIN = 3.6 V,
VIN = 3.6 V
VOUT = 2.5 V
50 mV/div
COUT = 4.7 mF
L = 2.2 mH
MODE = GND
IOUT = 5 mA to 200 mA
sinusoidal
100 mA/div
COUT = 4.7 mF
ICOIL
200 mA/div
L = 1 mH
IOUT = 10 mA
IL
200 mA/div
VOUT = 1.8 V
20 mV/div
t - Time - 1 ms/div
Figure 31. Mode Transition PFM / Forced PWM Mode
t - Time - 5 ms/div
Figure 32. AC – Load Regulation Performance 2.5V VOUT
PFM Mode
VIN = 3.6 V
VOUT = 2.5 V
50 mV/div
COUT = 4.7 mF
VOUT = 1.8 V
50 mV/div
L = 2.2 mH
MODE = GND
VIN = 3.6 V
COUT = 4.7 mF
IOUT = 5mA to 200mA
sinusoidal
100mA/Div
L = 2.2 mH
MODE = VIN
IOUT = 5 mA to 150 mA, 50 kHz
sinusoidal 100 mA/div
IL
200 mA/div
IL
200 mA/div
t - Time - 5 ms/div
Figure 33. AC – Load Regulation Performance 2.5V VOUT
PWM Mode
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t - Time - 4 ms/div
Figure 34. AC – Load Regulation Performance 1.8V VOUT
PFM Mode
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VOUT = 2.5 V
50 mV/div
VOUT = 2.5 V
50 mV/div
VIN = 3.6 V
VIN = 3.6 V
COUT = 4.7 mF
IOUT = 5 mA to 200 mA
100 mA/div
L = 1 mH
MODE = GND
IOUT = 5 mA to 200 mA
100 mA/div
IL
200 mA/div
L = 1 mH
MODE = VIN
IL
200 mA/div
t - Time - 5 ms/div
Figure 35. Load Transient Response 5mA to 200mA PFM
to PWM Mode, VOUT 2.5V
t - Time - 5 ms/div
Figure 36. Load Transient Response 5mA to 200mA,
Forced PWM Mode, VOUT 2.5V
VIN = 3.6 V
COUT = 4.7 mF
VOUT = 1.8 V
50 mV/div
L = 2.2 mH
MODE = GND
VIN = 3.6 V
IL
200 mA/div
COUT = 4.7 mF
VOUT = 1.8 V
50 mV/div
L = 2.2 mH
MODE = VIN
IOUT = 5 mA to 150 mA
100 mA/div
I OUT = 5 mA to 150 mA
100 mA/div
IL
200 mA/div
t - Time - 10 ms/div
Figure 37. Load Transient Response 5mA to 150mA, PFM
to PWM Mode, VOUT 1.8V
16
COUT = 4.7 mF
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t - Time - 10 ms/div
Figure 38. Load Transient Response 5mA to 150mA,
Forced PWM Mode, VOUT 1.8V
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EN 2 V/div
EN
2 V/div
SW
2 V/div
VOUT Pre Bias = 1V
VOUT = 1.8 V
1 V/div
VIN = 3.6 V
VOUT = 0 V to 2.5 V
1 V/div
COUT = 4.7 mF
L = 1 mH
MODE = GND
Load = 20 R
SW 5 V/div
VIN = 3.6 V
COUT = 4.7 mF
IIN
50 mA/div
L = 2.2 mH
MODE = GND
IOUT = 0 mA
IL
200 mA/div
t - Time - 20 ms/div
Figure 39. Start Up into 20Ω Load, VOUT 2.5V
Time Base - 20 ms/div
Figure 40. Startup in 1V Pre-biased Output
DETAILED DESCRIPTION
The TPS6223X synchronous step down converter family includes a unique hysteric PWM controller scheme
which enables switch frequencies over 3MHz, excellent transient and ac load regulation as well as operation with
tiny and cost competitive external components.
The controller topology supports forced PWM Mode as well as Power Save Mode operation. Power Save Mode
operation reduces the quiescent current consumption down to 22µA and ensures high conversion efficiency at
light loads by skipping switch pulses.
In forced PWM Mode, the device operates on a quasi fixed frequency, avoids pulse skipping and allows therefore
easy filtering of the switch noise by external filter components.
The TPS6223X devices offer fixed output voltage options featuring smallest solution size by using only three
external components.
The internal switch current limit of typical 850mA supports output currents of up to 500mA, depending on the
operating condition.
A significant advantage of TPS6223X compared to other hysteretic PWM controller topologies is its excellent DC
and AC load regulation capability in combination with low output voltage ripple over the entire load range which
makes this part well suited for audio and RF applications.
OPERATION
Once the output voltage falls below the threshold of the error comparator a switch pulse is initiated and the high
side switch is turned on. It remains turned on until a minimum on time of TONmin expires and the output voltage
trips the threshold of the error comparator or the inductor current reaches the high side switch current limit. Once
the high side switch turns off, the low side switch rectifier is turned on and the inductor current ramps down until
the high side switch turns on again or the inductor current reaches zero.
In forced PWM Mode operation negative inductor current is allowed to enable continuous conduction mode even
at no load condition.
POWER SAVE MODE
Connecting the MODE pin to GND enables the automatic PWM and power-save mode operation. The converter
operates in quasi fixed frequency PWM mode at moderate to heavy loads and in the PFM (Pulse Frequency
Modulation) mode during light loads, which maintains high efficiency over a wide load current range.
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In PFM Mode the device starts to skip switch pulses and generates only single pulses with an on time of TONmin.
The PFM Mode frequency depends on the load current and the external inductor and output capacitor values.
The PFM Mode of TPS6223X is optimized for low output voltage ripple if small and tiny external components are
used. Even at low output currents, the PFM frequency is above the audible noise spectrum and makes this
operation mode suitable for audio applications.
The on time TONmin can be estimated to:
V
TONmin = OUT ´ 260 ns
VIN
(1)
Therefore the peak inductor current in PFM mode is approximately:
(V - VOUT )
´ TONmin
ILPFMpeak = IN
L
(2)
With
TON: High side switch on time [ns]
VIN: Input voltage [V]
VOUT: Output voltage [V]
L : Inductance [µH]
ILPFMpeak : PFM inductor peak current [mA]
FORCED PWM MODE
Pulling the MODE pin high forces the converter to operate in a continuous conduction PWM mode even at light
load currents. The advantage is that the converter operates with a quasi fixed frequency that allows simple
filtering of the switching frequency for noise-sensitive applications. In this mode, the efficiency is lower compared
to the power-save mode during light loads.
For additional flexibility, it is possible to switch from power-save mode to forced PWM mode during operation.
This allows efficient power management by adjusting the operation of the converter to the specific system
requirements.
100% DUTY CYCLE LOW DROPOUT OPERATION
The device starts to enter 100% duty cycle mode once the input voltage comes close to the nominal output
voltage. In order to maintain the output voltage, the High Side switch is turned on 100% for one or more cycles.
With further decreasing VIN the High Side MOSFET switch is turned on completely. In this case the converter
offers a low input-to-output voltage difference. This is particularly useful in battery-powered applications to
achieve longest operation time by taking full advantage of the whole battery voltage range.
The minimum input voltage to maintain regulation depends on the load current and output voltage, and can be
calculated as:
Vinmin = Voutmax + Ioutmax ´ (RDSonmax + RL )
(3)
With:
Ioutmax = maximum output current plus inductor ripple current
RDSonmax = maximum P-channel switch RDSon.
RL = DC resistance of the inductor
Voutmax = nominal output voltage plus maximum output voltage tolerance
UNDER-VOLTAGE LOCKOUT
The under voltage lockout circuit prevents the device from misoperation at low input voltages. It prevents the
converter from turning on the switch or rectifier MOSFET under undefined conditions. The TPS6223X devices
have a UVLO threshold set to 1.8V (typical). Fully functional operation is permitted for input voltage down to the
falling UVLO threshold level. The converter starts operation again once the input voltage trips the rising UVLO
threshold level.
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SOFT START
The TPS6223X has an internal soft-start circuit that controls the ramp up of the output voltage and limits the
inrush current during start-up. This limits input voltage drops when a battery or a high-impedance power source
is connected to the input of the converter.
The soft-start system generates a monotonic ramp up of the output voltage and reaches the nominal output
voltage typically 100µs after EN pin was pulled high.
Should the output voltage not have reached its target value by this time, such as in the case of heavy load, the
converter then operates in a current limit mode set by its switch current limits.
TPS6223X is able to start into a pre-biased output capacitor. The converter starts with the applied bias voltage
and ramps the output voltage to its nominal value.
ENABLE / SHUTDOWN
The device starts operation when EN is set high and starts up with the soft start as previously described. For
proper operation, the EN pin must be terminated and must not be left floating.
Pulling the EN pin low forces the device into shutdown, with a shutdown quiescent current of typically 0.1µA. In
this mode, the P and N-channel MOSFETs are turned off, the internal resistor feedback divider is disconnected,
and the entire internal-control circuitry is switched off.
The EN input can be used to control power sequencing in a system with various DC/DC converters. The EN pin
can be connected to the output of another converter, to drive the EN pin high and getting a sequencing of supply
rails.
SHORT-CIRCUIT PROTECTION
The TPS6223X integrates a High Side and Low Side MOSFET current limit to protect the device against heavy
load or short circuit. The current in the switches is monitored by current limit comparators. When the current in
the P-channel MOSFET reaches its current limit, the P-channel MOSFET is turned off and the N-channel
MOSFET is turned on to ramp down the current in the inductor. The High Side MOSFET switch can only turn on
again, once the current in the Low Side MOSFET switch has decreased below the threshold of its current limit
comparator.
THERMAL SHUTDOWN
As soon as the junction temperature, TJ, exceeds 150°C (typical) the device goes into thermal shutdown. In this
mode, the High Side and Low Side MOSFETs are turned-off. The device continues its operation when the
junction temperature falls below the thermal shutdown hysteresis.
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APPLICATION INFORMATION
VIN
L
1/2.2 mH
TPS62230
2.7 V - 6 V
VIN
EN
MODE
CIN
2.2 mF
SW
FB
GND
VOUT
2.5 V
COUT
4.7 mF
Figure 41. TPS62230 2.5V Output
VIN
2.05 V - 6 V
L
1/2.2 mH
TPS62231
SW
FB
VIN
EN
CIN
2.2 mF
MODE
GND
VOUT
1.8 V
COUT
4.7 mF
Figure 42. TPS62231 1.8V Output
VIN
2.05 V - 6 V
L
1/2.2 mH
TPS62232
VIN
EN
CIN
2.2 mF
MODE
SW
FB
GND
VOUT
1.2 V
COUT
4.7 mF
Figure 43. TPS62232 1.2V Output
OUTPUT FILTER DESIGN (INDUCTOR AND OUTPUT CAPACITOR)
The TPS6223X is optimized to operate with effective inductance values in the range of 0.7µH to 4.3µH and with
effective output capacitance in the range of 2.0µF to 15µF. The internal compensation is optimized to operate
with an output filter of L = 1.0µH/2.2µH and COUT = 4.7µF. Larger or smaller inductor/capacitor values can be
used to optimize the performance of the device for specific operation conditions. For more details, see the
CHECKING LOOP STABILITY section.
INDUCTOR SELECTION
The inductor value affects its peak-to-peak ripple current, the PWM-to-PFM transition point, the output voltage
ripple and the efficiency. The selected inductor has to be rated for its dc resistance and saturation current. The
inductor ripple current (ΔIL) decreases with higher inductance and increases with higher VIN or VOUT. Equation 4
calculates the maximum inductor current under static load conditions. The saturation current of the inductor
should be rated higher than the maximum inductor current as calculated with Equation 5. This is recommended
because during heavy load transient the inductor current will rise above the calculated value.
Vout
1Vin
D IL = Vout ´
L ´ ¦
(4)
ILmax = Ioutmax +
DIL
2
(5)
With:
f = Switching Frequency
L = Inductor Value
ΔIL= Peak to Peak inductor ripple current
ILmax = Maximum Inductor current
20
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In high-frequency converter applications, the efficiency is essentially affected by the inductor AC resistance (i.e.,
quality factor) and to a smaller extent by the inductor DCR value. To achieve high efficiency operation, care
should be taken in selecting inductors featuring a quality factor above 25 at the switching frequency. Increasing
the inductor value produces lower RMS currents, but degrades transient response. For a given physical inductor
size, increased inductance usually results in an inductor with lower saturation current.
The total losses of the coil consist of both the losses in the DC resistance, R(DC), and the following
frequency-dependent components:
• The losses in the core material (magnetic hysteresis loss, especially at high switching frequencies)
• Additional losses in the conductor from the skin effect (current displacement at high frequencies)
• Magnetic field losses of the neighboring windings (proximity effect)
• Radiation losses
The following inductor series from different suppliers have been used with the TPS6223X converters.
Table 1. List of inductors
INDUCTANCE
[µH]
DIMENSIONS
[mm3]
INDUCTOR TYPE
SUPPLIER
1.0/2.2
2.5 × 2.0 × 1.2
LQM2HPN1R0MJ0
Murata
2.2
2.0 × 1.2 × 0.55
LQM21PN2R2
Murata
1.0/2.2
2.0 × 1.2 × 1.0
MIPSZ2012
FDK
1.0/2.2
2.0 × 2.5 × 1.2
MIPSA2520
FDK
1.0/2.2
2.0 × 1.2 × 1.0
KSLI2012 series
Hitachi Metal
OUTPUT CAPACITOR SELECTION
The unique hysteric PWM control scheme of the TPS62230 allows the use of tiny ceramic capacitors. Ceramic
capacitors with low ESR values have the lowest output voltage ripple and are recommended. The output
capacitor requires either an X7R or X5R dielectric. Y5V and Z5U dielectric capacitors, aside from their wide
variation in capacitance over temperature, become resistive at high frequencies.
At light load currents the converter operate in Power Save Mode and the output voltage ripple is dependent on
the output capacitor value and the PFM peak inductor current. Higher output capacitor values minimize the
voltage ripple in PFM Mode and tighten DC output accuracy in PFM Mode.
INPUT CAPACITOR SELECTION
Because of the nature of the buck converter having a pulsating input current, a low ESR input capacitor is
required for best input voltage filtering and minimizing the interference with other circuits caused by high input
voltage spikes. For most applications a 2.2µF to 4.7µF ceramic capacitor is recommended. The input capacitor
can be increased without any limit for better input voltage filtering. Because ceramic capacitor loses up to 80% of
its initial capacitance at 5V, it is recommended to use 4.7µF input capacitors for input voltages > 4.5V.
Take care when using only small ceramic input capacitors. When a ceramic capacitor is used at the input and the
power is being supplied through long wires, such as from a wall adapter, a load step at the output or VIN step on
the input can induce ringing at the VIN pin. This ringing can couple to the output and be mistaken as loop
instability or could even damage the part by exceeding the maximum ratings.
Table 2 shows a list of tested input/output capacitors.
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Table 2. List of Capacitor
CAPACITANCE
[µF]
SIZE
CAPACITOR TYPE
SUPPLIER
2.2
0402
GRM155R60J225
Murata
4.7
0402
AMK105BJ475MV
Taiyo Yuden
4.7
0402
GRM155R60J475
Murata
4.7
0402
CL05A475MQ5NRNC
Samsung
4.7
0603
GRM188R60J475
Murata
CHECKING LOOP STABILITY
The first step of circuit and stability evaluation is to look from a steady-state perspective at the following signals:
• Switching node, SW
• Inductor current, IL
• Output ripple voltage, VOUT(AC)
These are the basic signals that need to be measured when evaluating a switching converter. When the
switching waveform shows large duty cycle jitter or the output voltage or inductor current shows oscillations, the
regulation loop may be unstable. This is often a result of board layout and/or L-C combination.
As a next step in the evaluation of the regulation loop, the load transient response is tested. The time between
the application of the load transient and the turn on of the P-channel MOSFET, the output capacitor must supply
all of the current required by the load. VOUT immediately shifts by an amount equal to ΔI(LOAD) x ESR, where ESR
is the effective series resistance of COUT. ΔI(LOAD) begins to charge or discharge CO generating a feedback error
signal used by the regulator to return VOUT to its steady-state value. The results are most easily interpreted when
the device operates in PWM mode.
During this recovery time, VOUT can be monitored for settling time, overshoot or ringing that helps judge the
converter’s stability. Without any ringing, the loop has usually more than 45° of phase margin.
Because the damping factor of the circuitry is directly related to several resistive parameters (e.g., MOSFET
rDS(on)) that are temperature dependant, the loop stability analysis has to be done over the input voltage range,
load current range, and temperature range.
LAYOUT CONSIDERATIONS
As for all switching power supplies, the layout is an important step in the design. Proper function of the device
demands careful attention to PCB layout. Care must be taken in board layout to get the specified performance. If
the layout is not carefully done, the regulator could show poor line and/or load regulation, stability issues as well
as EMI problems. It is critical to provide a low inductance, impedance ground path. Therefore, use wide and
short traces for the main current paths. The input capacitor should be placed as close as possible to the IC pins
as well as the inductor and output capacitor.
Use a common Power GND node and a different node for the Signal GND to minimize the effects of ground
noise. Keep the common path to the GND PIN, which returns the small signal components and the high current
of the output capacitors as short as possible to avoid ground noise. The FB line should be connected to the
output capacitor and routed away from noisy components and traces (e.g. SW line).
22
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62230 TPS62231 TPS62232
TPS62230
TPS62231
TPS62232
www.ti.com ..................................................................................................................................................................................................... SLVS941 – APRIL 2009
L1
V IN
Total area
is less than
12mm²
C1
C2
GND
V OUT
Figure 44. Recommended PCB Layout for TPS6223X
Copyright © 2009, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): TPS62230 TPS62231 TPS62232
23
PACKAGE OPTION ADDENDUM
www.ti.com
6-May-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS62230DRYR
ACTIVE
SON
DRY
6
5000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS62230DRYT
ACTIVE
SON
DRY
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS62231DRYR
ACTIVE
SON
DRY
6
5000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS62231DRYT
ACTIVE
SON
DRY
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS62232DRYR
ACTIVE
SON
DRY
6
5000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS62232DRYT
ACTIVE
SON
DRY
6
250
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-May-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
TPS62230DRYR
SON
DRY
6
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
5000
179.0
8.4
1.2
1.65
0.7
4.0
8.0
Q1
TPS62230DRYT
SON
DRY
6
250
179.0
8.4
1.2
1.65
0.7
4.0
8.0
Q1
TPS62231DRYR
SON
DRY
6
5000
179.0
8.4
1.2
1.65
0.7
4.0
8.0
Q1
TPS62231DRYT
SON
DRY
6
250
179.0
8.4
1.2
1.65
0.7
4.0
8.0
Q1
TPS62232DRYR
SON
DRY
6
5000
179.0
8.4
1.2
1.65
0.7
4.0
8.0
Q1
TPS62232DRYT
SON
DRY
6
250
179.0
8.4
1.2
1.65
0.7
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-May-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS62230DRYR
SON
DRY
6
5000
220.0
205.0
50.0
TPS62230DRYT
SON
DRY
6
250
220.0
205.0
50.0
TPS62231DRYR
SON
DRY
6
5000
220.0
205.0
50.0
TPS62231DRYT
SON
DRY
6
250
220.0
205.0
50.0
TPS62232DRYR
SON
DRY
6
5000
220.0
205.0
50.0
TPS62232DRYT
SON
DRY
6
250
220.0
205.0
50.0
Pack Materials-Page 2
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