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DS90UB913Q-Q1, DS90UB914Q-Q1
SNLS420D – JULY 2012 – REVISED JULY 2015
DS90UB91xQ-Q1 10- to 100-MHz, 10- and 12-Bit DC-Balanced FPD-Link III Serializer and
Deserializer With Bidirectional Control Channel
1 Features
2 Applications
•
•
•
•
1
•
•
•
•
•
•
•
•
•
•
•
•
•
•
10-MHz to 100-MHz Input Pixel Clock Support
Single Differential Pair Interconnect
Programmable Data Payload:
– 10-bit Payload up to 100 MHz
– 12-bit Payload up to 75 MHz
Continuous Low Latency Bidirectional Control
Interface Channel With I2C Support at 400 kHz
2:1 Multiplexer to Choose Between Two Input
Imagers
Embedded Clock With DC-Balanced Coding to
Support AC-Coupled Interconnects
Capable of Driving up to 25 Meters Shielded
Twisted-Pair
Receive Equalizer Automatically Adapts for
Changes in Cable Loss
Four Dedicated General-Purpose Input/Output
Pins (GPIO) Available on Both Serializer and
Deserializer
LOCK Output Reporting Pin and AT-SPEED BIST
Diagnosis Feature to Validate Link Integrity
1.8-V, 2.8-V or 3.3-V Compatible Parallel Inputs
on Serializer
Single Power Supply at 1.8 V
ISO 10605 and IEC 61000-4-2 ESD Compliant
Automotive-Grade Product: AEC-Q100 Grade 2
Qualified
Temperature Range −40°C to +105°C
Small Serializer Footprint (5 mm × 5 mm)
EMI/EMC Mitigation on Deserializer
– Programmable Spread Spectrum (SSCG)
Outputs
– Receiver Staggered Outputs
•
Front- or Rear-View Camera for Collision
Mitigation
Surround View for Parking Assistance
3 Description
The DS90UB91xQ-Q1 chipset offers an FPD-Link III
interface with a high-speed forward channel and a
bidirectional control channel for data transmission
over a single differential pair. The DS90UB91xQ-Q1
chipsets incorporate differential signaling on both the
high-speed forward channel and bidirectional control
channel data paths. The serializer and deserializer
pair is targeted for connections between imagers and
video processors in an electronic control unit (ECU).
This chipset is ideally suited for driving video data
that requires up to 12-bit pixel depth plus two
synchronization signals along with bidirectional
control channel bus.
There is a multiplexer at the deserializer to choose
between two input imagers. The deserializer can
have only one active input imager. The primary video
transport converts 10- and 12-bit data over a single
high-speed serial stream, along with a separate low
latency bidirectional control channel transport that
accepts control information from an I2C port and is
independent of video blanking period.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
DS90UB913Q-Q1
WQFN (32)
5.00 mm × 5.00 mm
DS90UB914Q-Q1
WQFN (48)
7.00 mm × 7.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Circuit
Parallel
Data In
10 or 12
Parallel
Data Out
10 or 12
FPD-Link III
2
Megapixel
Imager/Sensor
HSYNC,
VSYNC
2
DS90UB913Q
Bidirectional
Control Channel
4
GPO
2
Bidirectional
Control Bus
DS90UB914Q
Serializer
HSYNC,
VSYNC
4
DSP, FPGA/
µ-Processor/
ECU
GPIO
2
Deserializer
Bidirectional
Control Bus
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DS90UB913Q-Q1, DS90UB914Q-Q1
SNLS420D – JULY 2012 – REVISED JULY 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Description continued ...........................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
4
9
8.1
8.2
8.3
8.4
8.5
8.6
Absolute Maximum Ratings ...................................... 9
ESD Ratings.............................................................. 9
Recommended Operating Conditions....................... 9
Thermal Information ................................................ 10
Electrical Characteristics ........................................ 10
Timing Requirements: Recommended for Serializer
PCLK ....................................................................... 14
8.7 AC Timing Specifications (SCL, SDA) - I2C
Compliant ................................................................. 15
8.8 Bidirectional Control Bus DC Timing Specifications
(SCL, SDA) - I2C Compliant..................................... 15
8.9 Switching Characteristics: Serializer ....................... 16
8.10 Switching Characteristics: Deserializer................. 17
8.11 Typical Characteristics .......................................... 19
9
Parameter Measurement Information ................ 20
9.1 AC Timing Diagrams and Test Circuits................... 20
10 Detailed Description ........................................... 25
10.1
10.2
10.3
10.4
10.5
Overview ...............................................................
Functional Block Diagram .....................................
Feature Description...............................................
Device Functional Modes......................................
Register Maps .......................................................
25
25
26
33
41
11 Application and Implementation........................ 56
11.1 Applications Information........................................ 56
11.2 Typical Application ................................................ 56
12 Power Supply Recommendations ..................... 60
13 Layout................................................................... 60
13.1 Layout Guidelines ................................................. 60
13.2 Layout Example .................................................... 61
14 Device and Documentation Support ................. 63
14.1
14.2
14.3
14.4
14.5
14.6
Documentation Support .......................................
Related Links ........................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
63
63
63
63
63
63
15 Mechanical, Packaging, and Orderable
Information ........................................................... 63
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (January 2014) to Revision D
Page
•
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
•
Updated datasheet to new TI layout....................................................................................................................................... 1
•
Added text and graphic to Power Up Requirements ........................................................................................................... 39
Changes from Revision B (April 2013) to Revision C
Page
•
Changed "PCLK from imager mode" value in DS90UB913Q Serializer MODE Resistor Value table from 0 kΩ to 100
kΩ ......................................................................................................................................................................................... 35
•
Changed Falling to Rising in RRFB...................................................................................................................................... 47
•
Changed Rising to Falling in RRFB...................................................................................................................................... 47
Changes from Revision A (April 2013) to Revision B
•
2
Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 61
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Product Folder Links: DS90UB913Q-Q1 DS90UB914Q-Q1
DS90UB913Q-Q1, DS90UB914Q-Q1
www.ti.com
SNLS420D – JULY 2012 – REVISED JULY 2015
5 Description continued
Using TI’s embedded-clock technology allows transparent full-duplex communication over a single differential
pair, carrying asymmetrical bidirectional control channel information in both directions. This single serial stream
simplifies transferring a wide data bus over PCB traces and cable by eliminating the skew problems between
parallel data and clock paths. This significantly saves system cost by narrowing paths, which reduces PCB
layers, cable width, connector size and pins. In addition, the deserializer inputs provide adaptive equalization to
compensate for loss from the media over longer distances. Internal DC-balanced encoding and decoding is used
to support AC-coupled interconnects. The Serializer is offered in a 32-pin WQFN package and the deserializer is
offered in a 48-pin WQFN package.
6 Device Comparison Table
PART NUMBER
FPD-III FUNCTION
PACKAGE
TRANSMISSION MEDIA
PCLK FREQUENCY
DS90UB913Q-Q1
Serializer
32-Pin RTV (WQFN)
STP
10 to 100 MHz
DS90UB913A-Q1
Serializer
32-Pin RTV (WQFN)
Coax or STP
25 to 100 MHz
DS90UB914Q-Q1
Deserializer
48-Pin RHS (WQFN)
STP
10 to 100 MHz
DS90UB914A-Q1
Deserializer
48-Pin RHS (WQFN)
Coax or STP
25 to 100 MHz
Copyright © 2012–2015, Texas Instruments Incorporated
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3
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SNLS420D – JULY 2012 – REVISED JULY 2015
www.ti.com
7 Pin Configuration and Functions
DIN[1]
21
20
16
GPO[1]
DIN[6]
26
15
GPO[0]
DIN[7]
27
14
VDDCML
VDDD
28
13
DOUT+
DIN[8]
29
12
DOUT-
DIN[9]
11
VDDT
10
VDDPLL
9
17
30
18
31
VDDIO
19
GPO[2]/
CLKOUT
DIN[2]
22
GPO[3]/
CLKIN
DIN[3]
23
DIN[0]
DIN[4]
24
25
DIN[5]
RTV Package
32-Pin WQFN
Top View
PDB
DS90UB913Q
Serializer
2
3
4
5
6
7
PCLK
SCL
SDA
ID[x]
RES
8
MODE
1
VSYNC
DIN[11]
HSYNC
32
DIN[10]
DAP = GND
DS90UB913Q-Q1 Serializer Pin Functions
PIN
NAME
I/O
NO.
DESCRIPTION
LVCMOS PARALLEL INTERFACE
19, 20, 21,
22, 23, 24,
26, 27, 29,
30, 31, 32
Inputs,
LVCMOS
with pulldown
Parallel data inputs
HSYNC
1
Inputs,
LVCMOS
with pulldown
Horizontal SYNC input
PCLK
3
Input, LVCMOS
with pulldown
VSYNC
2
Inputs,
LVCMOS
with pulldown
DIN[0:11]
4
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Pixel clock input pin
Strobe edge set by TRFB control register.
Vertical SYNC input
Copyright © 2012–2015, Texas Instruments Incorporated
Product Folder Links: DS90UB913Q-Q1 DS90UB914Q-Q1
DS90UB913Q-Q1, DS90UB914Q-Q1
www.ti.com
SNLS420D – JULY 2012 – REVISED JULY 2015
DS90UB913Q-Q1 Serializer Pin Functions (continued)
PIN
NAME
I/O
DESCRIPTION
Output,
LVCMOS
General-purpose output pins can be configured as outputs; used to control and respond
to various commands. GPO[0:1] can be configured to be the outputs for input signals
coming from GPIO[0:1] pins on the deserializer or can be configured to be outputs of
the local register on the serializer.
Output,
LVCMOS
GPO2 pin can be configured to be the output for input signal coming from the GPIO2
pin on the deserializer or can be configured to be the output of the local register on the
serializer. It can also be configured to be the output clock pin when the DS90UB913QQ1 device is used in the External Oscillator mode. See Applications Information for a
detailed description of the DS90UB91xQ-Q1 chipsets working with the external
oscillator.
Input/Output,
LVCMOS
GPO3 can be configured to be the output for input signals coming from the GPIO3 pin
on the deserializer or can be configured to be the output of the local register setting on
the serializer. It can also be configured to be the input clock pin when the
DS90UB913Q-Q1 serializer is working with an external oscillator. See Applications
Information section for a detailed description of the DS90UB91xQ-Q1 chipsets working
with an external oscillator.
NO.
GENERAL-PURPOSE OUTPUT (GPO)
GPO[1:0]
GPO[2]/
CLKOUT
GPO[3]/
CLKIN
16, 15
17
18
BIDIRECTIONAL CONTROL BUS - I2C COMPATIBLE
SCL
4
Input/Output,
Open-Drain
Clock line for the bidirectional control bus communication
SCL requires an external pullup resistor to VDDIO.
SDA
5
Input/Output,
Open-Drain
Data line for the bidirectional control bus communication
SDA requires an external pullup resistor to VDDIO.
MODE
8
Input, LVCMOS
with pulldown
ID[x]
6
Input, analog
Device mode select
Resistor to Ground and 10-kΩ pullup to 1.8-V rail. MODE pin on the serializer can be
used to select whether the system is running off the PCLK from the imager or an
external oscillator. See details in Table 3.
Device ID address select
The ID[x] pin on the serializer is used to assign the I2C device address. Resistor to
Ground and 10-kΩ pullup to 1.8-V rail. See Table 1.
CONTROL AND CONFIGURATION
PDB
9
Input, LVCMOS
with pulldown
RES
7
Input, LVCMOS
with pulldown
Power down Mode Input Pin
PDB = H, serializer is enabled and is ON.
PDB = L, Serailizer is in power-down mode. When the serializer is in power-down, the
PLL is shutdown, and IDD is minimized. Programmed control register data are NOT
retained and reset to default values
Reserved
This pin MUST be tied LOW.
FPD-Link III INTERFACE
DOUT+
13
Input/Output,
CML
Noninverting differential output, bidirectional control channel input. The interconnect
must be AC-coupled with a 100-nF capacitor.
DOUT–
12
Input/Output,
CML
Inverting differential output, bidirectional control channel input. The interconnect must be
AC-coupled with a 100-nF capacitor.
POWER AND GROUND
VDDPLL
10
Power, Analog
PLL Power, 1.8 V ±5%
VDDT
11
Power, Analog
Tx Analog Power, 1.8 V ±5%
VDDCML
14
Power, Analog
CML and bidirectional channel driver power, 1.8 V ±5%
VDDD
28
Power, Digital
Digital power, 1.8 V ±5%
VDDIO
25
Power, Digital
Power for I/O stage. The single-ended inputs and SDA, SCL are powered from VDDIO.
VDDIO can be connected to a 1.8 V ±5% or 2.8 V ±10% or 3.3 V ±10%
DAP
Ground, DAP
DAP must be grounded. DAP is the large metal contact at the bottom side, located at
the center of the WQFN package. Connected to the ground plane (GND) with at least 9
vias.
VSS
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SNLS420D – JULY 2012 – REVISED JULY 2015
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MODE
37
CMLOUTP
38
VDDR
IDx[0]
IDx[1]
RIN1-
RIN1+
VDDCML1
PDB
VDDIO1
GPIO[0]
GPIO[1]
GPIO[2]
GPIO[3]
36
35
34
33
32
31
30
29
28
27
26
25
RHS Package
48-Pin WQFN
Top View
24
DAP = GND
ROUT[0]
23
ROUT[1]
39
22
ROUT[2]
40
21
ROUT[3]
RIN0+
41
20
VDDIO2
RIN0-
42
19
ROUT[4]
18
ROUT[5]
CMLOUTN
VDDCML0
DS90UB914Q
Deserializer
RES
43
RES
44
17
VDDD
VDDPLL
45
16
ROUT[6]
12
ROUT[10]
9
VSYNC
11
8
PCLK
10
7
VDDIO3
HSYNC
6
ROUT[11]
5
OEN
BISTEN
ROUT[9]
4
13
OSS_SEL
48
3
LOCK
VDDSSCG
ROUT[8]
2
ROUT[7]
14
SCL
15
47
1
46
SDA
SEL
PASS
DS90UB914Q-Q1 Deserializer Pin Functions
PIN
NAME
I/O
NO.
DESCRIPTION
LVCMOS PARALLEL INTERFACE
11, 12, 13,
14, 15, 16,
18, 19, 21,
22, 23, 24
Outputs,
LVCMOS
Parallel data outputs
HSYNC
10
Output,
LVCMOS
Horizontal SYNC output
PCLK
8
Output,
LVCMOS
Pixel clock output pin
Strobe edge set by RRFB control register
VSYNC
9
Output,
LVCMOS
Vertical SYNC output
ROUT[11:0]
GENERAL-PURPOSE INPUT/OUTPUT (GPIO)
GPIO[1:0]
GPIO[3:2]
6
27, 28
Digital
Input/Output,
LVCMOS
General-purpose input/output pins can be used to control and respond to various
commands. They may be configured to be the input signals for the corresponding
GPOs on the serializer or they may be configured to be outputs to follow local
register settings.
25, 26
Digital
Input/Output
LVCMOS
General-purpose input/output pins GPO[2:3] can be configured to be input signals
for GPOs on the serializer. In addition they can also be configured to be outputs
to follow the local register settings. When the SerDes chipsets are working with
an external oscillator, these pins can be configured only to be outputs to follow
the local register settings.
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SNLS420D – JULY 2012 – REVISED JULY 2015
DS90UB914Q-Q1 Deserializer Pin Functions (continued)
PIN
NAME
NO.
I/O
DESCRIPTION
BIDIRECTIONAL CONTROL BUS - I2C COMPATIBLE
SCL
2
Input/Output,
Open-Drain
Clock line for the bidirectional control bus communication
SCL requires an external pullup resistor to VDDIO.
SDA
1
Input/Output,
Open-Drain
Data line for bidirectional control bus communication
SDA requires an external pullup resistor to VDDIO.
MODE
IDx[0:1]
37
35, 34
Device mode select pin
Resistor-to-Ground and 10-kΩ pullup to 1.8-V rail. The MODE pin on the
deserializer can be used to configure the serializer and deserializer to work in
different input PCLK range. See details in Table 8.
12-bit low-frequency mode (10- to 50-MHz operation):
In this mode, the serializer and deserializer can accept up to 12 bits DATA+2
SYNC. Input PCLK range is from 10 MHz to 50 MHz.
Input, LVCMOS
12-bit high-frequency mode (15- to 75-MHz operation): In this mode, the
with pullup
serializer and deserializer can accept up to 12 bits DATA + 2 SYNC. Input PCLK
range is from 15 MHz to 75 MHz.
10-bit mode (20- to 100-MHz operation):
In this mode, the serializer and deserializer can accept up to 10 bits DATA + 2
SYNC. Input PCLK frequency can range from 20 MHz to 100 MHz.
Refer to Table 4 in the Applications Information section on how to configure the
MODE pin on the deserializer.
Input, analog
The IDx[0] and IDx[1] pins on the deserializer are used to assign the I2C device
address. Resistor-to-Ground and 10-kΩ pullup to 1.8-V rail. See Table 2
Input pin to select the slave device address.
Input is connect to external resistor divider to set programmable Device ID
address.
CONTROL AND CONFIGURATION
Power-down mode input pin
PDB = H, deserializer is enabled and is ON.
Input, LVCMOS
PDB = L, deserializer is in sleep (power-down mode). When the deserializer is in
with pulldown
sleep, programmed control register data are NOT retained and reset to default
values.
PDB
30
LOCK
48
Output,
LVCMOS
BISTEN
6
Input
LVCMOS with
pulldown
PASS
47
Output,
LVCOMS
OEN
5
Input
LVCMOS with
pulldown
Output enable input
Refer to Table 5
OSS_SEL
4
Input
LVCMOS with
pulldown
Output sleep state select pin
Refer to Table 5
46
Input
LVCMOS with
pulldown
MUX select line
SEL = L, RIN0± input. This selects input A as the active channel on the
deserializer.
SEL = H, RIN1± input. This selects input B as the active channel on the
deserializer.
SEL
Copyright © 2012–2015, Texas Instruments Incorporated
LOCK status output pin
LOCK = H, PLL is Locked, outputs are active
LOCK = L, PLL is unlocked, ROUT and PCLK output states are controlled by
OSS_SEL control register. May be used as link status.
BIST enable pin
BISTEN=H, BIST mode enabled
BISTEN=L, BIST mode is disabled
PASS output pin for BIST mode.
PASS = H, ERROR FREE transmission
PASS = L, one or more errors were detected in the received payload.
See Built-In Self Test section for more information. Leave open if unused. Route
to test point (pad) recommended.
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SNLS420D – JULY 2012 – REVISED JULY 2015
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DS90UB914Q-Q1 Deserializer Pin Functions (continued)
PIN
NAME
I/O
NO.
DESCRIPTION
FPD-LINK III INTERFACE
RIN0+
41
Input/Output,
CML
Noninverting differential input, bidirectional control channel. The IO must be AC
coupled with a 100-nF capacitor
RIN0-
42
Input/Output,
CML
Inverting differential input, bidirectional control channel. The IO must be AC
coupled with a 100-nF capacitor
RIN1+
32
Input/Output,
CML
Noninverting differential input, bidirectional control channel. The IO must be AC
coupled with a 100-nF capacitor
RIN1-
33
Input/Output,
CML
Inverting differential input, bidirectional control channel. The IO must be AC
coupled with a 100-nF capacitor
RES
43, 44
—
Reserved; This pin must always be tied low.
CMLOUTP/N
38, 39
—
Route to test point or leave open if unused
POWER AND GROUND
VDDIO1/2/3
29, 20, 7
Power, Digital
LVCMOS I/O buffer power, The single-ended outputs and control input are
powered from VDDIO. VDDIO can be connected to a 1.8 V ±5% or 3.3 V ±10%
VDDD
17
Power, Digital
Digital core power, 1.8 V ±5%
VDDSSCG
3
Power, Analog
SSCG PLL power, 1.8 V ±5%
VDDR
36
Power, Analog
RX analog power, 1.8 V ±5%
40, 31
Power, Analog
CML and bidirectional control channel drive power, 1.8 V±5%
45
Power, Analog
PLL Power, 1.8 V ±5%
DAP
Ground, DAP
DAP must be grounded. DAP is the large metal contact at the bottom side,
located at the center of the WQFN package. Connected to the ground plane
(GND) with at least 16 vias.
VDDCML0/1
VDDPLL
VSS
8
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SNLS420D – JULY 2012 – REVISED JULY 2015
8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2) (3)
MIN
MAX
UNIT
Supply voltage – VDDn (1.8 V)
−0.3
2.5
V
Supply voltage – VDDIO
−0.3
4.0
V
LVCMOS input voltage
−0.3
VDDIO + 0.3
V
CML driver I/O voltage (VDD)
−0.3
VDD + 0.3
V
CML receiver I/O voltage (VDD)
−0.3
VDD + 0.3
V
150
°C
1/θJA above
+25°
°C/W
Junction temperature
Maximum package power dissipation capacity package
Air discharge (DOUT+, DOUT–, RIN+, RIN–)
−25
25
kV
Contact discharge (DOUT+, DOUT–, RIN+, RIN–)
−7
7
kV
Storage temperature Tstg
−65
150
°C
(1)
(2)
(3)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
For soldering specifications: see product folder at www.ti.com and SNOA549.
8.2 ESD Ratings
VALUE
Human body model (HBM), per AEC Q100-002 (1)
±8000
Charged-device model (CDM), per AEC Q100-011
±1000
Machine model (MM)
V(ESD)
Electrostatic
discharge
IEC 61000-4-2 (2)
ISO10605 (3) (4)
(1)
(2)
(3)
(4)
UNIT
±250
≥±25 000
Air Discharge (DOUT+, DOUT-, RIN+, RIN-)
V
≥±7000
Contact Discharge (DOUT+, DOUT-, RIN+, RIN-)
≥±15 000
Air Discharge
≥±8000
Contact Discharge
AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
RD = 330 Ω, CS = 150 pF
RD = 330 Ω, CS = 150 / 330 pF
RD = 2 KΩ, CS = 150 / 330 pF
8.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Supply voltage (VDDn)
1.71
1.8
1.89
V
LVCMOS supply voltage (VDDIO) OR
1.71
1.8
1.89
LVCMOS supply voltage (VDDIO) OR
3.0
3.3
3.6
2.52
2.8
3.08
LVCMOS supply voltage (VDDIO) only serializer
Supply noise (1)
VDDn (1.8 V)
25
VDDIO (1.8 V)
25
VDDIO (3.3 V)
Operating free-air temperature (TA)
(1)
mVp-p
50
–40
PCLK clock frequency
V
25
10
105
°C
100
MHz
Supply noise testing was done with minimum capacitors (as shown on Figure 49 and Figure 48) on the PCB. A sinusoidal signal is AC
coupled to the VDDn (1.8-V) supply with amplitude = 25 mVp-p measured at the device VDDn pins. Bit error rate testing of input to the
serializer and output of the deserializer with 10 meter cable shows no error when the noise frequency on the serializer is less than
1 MHz. The deserializer on the other hand shows no error when the noise frequency is less than 750 kHz.
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8.4 Thermal Information
THERMAL METRIC (1)
DS90UB913Q-Q1
DS90UB914Q-Q1
RTV (WQFN)
RHS (WQFN)
32 PINS
48 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
38.4
26.9
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
6.9
4.4
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
8.5 Electrical Characteristics
over recommended operating supply and temperature ranges unless otherwise specified. (1)
PARAMETER
TEST CONDITIONS
MIN
(2) (3)
TYP
MAX
UNIT
LVCMOS DC SPECIFICATIONS 3.3V I/O (SERIALIZER INPUTS, DESERIALIZER OUTPUTS, GPI, GPO, CONTROL INPUTS AND
OUTPUTS)
VIH
High level input
voltage
VIN = 3 V to 3.6 V
2
VIN
V
VIL
Low level input
voltage
VIN = 3 V to 3.6 V
GND
0.8
V
IIN
Input current
VIN = 0 V or 3.6 V, VIN = 3 V to 3.6 V
20
µA
VOH
High level output
voltage
VDDIO = 3 V to 3.6 V, IOH = −4 mA
2.4
VDDIO
V
VOL
Low level output
voltage
VDDIO = 3 V to 3.6 V, IOL = +4 mA
GND
0.4
V
IOS
Output short circuit
current
VOUT = 0 V
TRI-STATE output
current
PDB = 0 V,
VOUT = 0 V or VDD
IOZ
−20
±1
Serializer
GPO outputs
–15
Deserializer LVCMOS
outputs
–35
LVCMOS outputs
mA
–20
20
µA
LVCMOS DC SPECIFICATIONS 1.8V I/O (SERIALIZER INPUTS, DESERIALIZER OUTPUTS, GPI, GPO, CONTROL INPUTS AND
OUTPUTS)
VIH
High level input
voltage
VIN = 1.71 V to 1.89 V
0.65 VIN
VIN
VIL
Low level input
voltage
VIN = 1.71 V to 1.89 V
GND
0.35 VIN
IIN
Input current
VIN = 0 V or 1.89 V, VIN = 1.71 V to 1.89 V
VOH
High level output
voltage
VDDIO = 1.71 V to 1.89 V, IOH = −4 mA
VOL
Low level output
voltage
VDDIO = 1.71 V to 1.89
V
IOL = 4 mA
IOS
Output short circuit
current
VOUT = 0 V
TRI-STATE output
current
PDB = 0 V,
VOUT = 0 V or VDD
IOZ
(1)
(2)
(3)
10
V
Deserializer LVCMOS
outputs
–20
±1
20
µA
VDDIO –
0.45
VDDIO
V
GND
0.45
V
Serializer
GPO outputs
–11
Deserializer LVCMOS
outputs
–17
LVCMOS outputs
mA
–20
20
µA
The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not ensured.
Current into device pins is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to ground
except VOD, ΔVOD, VTH and VTL which are differential voltages.
Typical values represent most likely parametric norms at 1.8 V or 3.3 V, TA = 25°C, and at the Recommended Operation Conditions at
the time of product characterization and are not specified.
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SNLS420D – JULY 2012 – REVISED JULY 2015
Electrical Characteristics (continued)
over recommended operating supply and temperature ranges unless otherwise specified.(1) (2) (3)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
LVCMOS DC SPECIFICATIONS 2.8-V I/O (SERIALIZER INPUTS, GPI, GPO, CONTROL INPUTS AND OUTPUTS)
VIH
High level input
voltage
VIN = 2.52 V to 3.08 V
0.7 VIN
VIN
VIL
Low level input
voltage
VIN = 2.52 V to 3.08 V
GND
0.3 VIN
IIN
Input current
VIN = 0 V or 3.08 V, VIN = 2.52 V to 3.08 V
VOH
High level output
voltage
VDDIO = 2.52 V to 3.08 V, IOH = −4 mA
VOL
Low level output
voltage
VDDIO =2.52 V to 3.08
V
IOL = 4 mA
IOS
Output short circuit
current
VOUT = 0 V
TRI-STATE output
current
PDB = 0 V,
VOUT = 0 V or VDD
IOZ
V
Deserializer LVCMOS
outputs
−20
±1
20
µA
VDDIO – 0.4
VDDIO
V
GND
0.4
V
Serializer
GPO outputs
−11
Deserializer LVCMOS
outputs
−20
LVCMOS outputs
mA
−20
20
µA
340
412
mV
1
50
mV
CML DRIVER DC SPECIFICATIONS (DOUT+, DOUT–)
|VOD|
Output differential
voltage
RL = 100 Ω (see Figure 9)
ΔVOD
Output differential
voltage unbalance
RL = 100 Ω
VOS
Output differential
offset voltage
RL = 100 Ω (see Figure 9)
ΔVOS
Offset voltage
unbalance
RL = 100 Ω
IOS
Output short
circuit current
DOUT± = 0 V
RT
Differential internal
termination
resistance
Differential across DOUT+ and DOUT–
268
VDD – VOD/2
1
V
50
–26
mV
mA
80
100
120
Ω
−20
1
20
µA
80
100
120
Ω
CML RECEIVER DC SPECIFICATIONS (RIN0+, RIN0–, RIN1+, RIN1– )
IIN
Input current
VIN = VDD or 0 V, VDD = 1.89 V
RT
Differential internal
termination
resistance
Differential across RIN+ and RIN-
CML RECEIVER AC SPECIFICATIONS (RIN0+, RIN0–, RIN1+, RIN1– )
|Vswing|
Minimum allowable
swing for 1010
pattern (4)
Line rate = 1.4 Gbps (see Figure 11)
135
mV
CML MONITOR OUTPUT DRIVER SPECIFICATIONS (CMLOUTP, CMLOUTN)
Ew
Differential output
eye opening
EH
Differential output
eye height
(4)
RL = 100 Ω
Jitter frequency > f / 40 (see Figure 20)
0.45
UI
200
mV
Specification is ensured by characterization and is not tested in production.
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Electrical Characteristics (continued)
over recommended operating supply and temperature ranges unless otherwise specified.(1) (2) (3)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
VDDn = 1.89 V
VDDIO = 3.6 V
f = 100 MHz,
10-bit mode
default registers
61
80
VDDn = 1.89 V
VDDIO = 3.6 V
f = 75 MHz,
12-bit high-frequency
mode
default registers
61
80
VDDn = 1.89 V
VDDIO = 3.6 V
f = 50 MHz,
12-bit low-frequency
mode
default registers
61
VDDn = 1.89 V
VDDIO = 3.6 V
f = 100 MHz,
10-bit mode
default registers
54
VDDn = 1.89 V
VDDIO = 3.6 V
f = 75 MHz,
12-bit high-frequency
mode
default registers
54
VDD = 1.89 V
VDDIO = 3.6 V
f = 50 MHz,
12-bit low-frequency
mode
default registers
54
VDDIO = 1.89 V
f = 75 MHz,
12-bit high-freq mode
default registers
1.5
UNIT
SERIALIZER AND DESERIALIZER SUPPLY CURRENT *DIGITAL, PLL, AND ANALOG VDD
RL = 100 Ω
WORST CASE pattern
(see Figure 6)
IDDT
Serializer (TX)
VDDn supply current
(includes load
current)
RL = 100 Ω
RANDOM PRBS-7
pattern
IDDIOT
IDDTZ
IDDIOTZ
12
Serializer (TX)
VDDIO supply
current (includes
load current)
RL = 100 Ω
WORST CASE pattern
(see Figure 6)
Serializer (TX)
supply current
power-down
PDB = 0 V; all other
LVCMOS inputs = 0 V
Serializer (TX)
VDDIO supply
current power-down
PDB = 0 V; All other
LVCMOS Inputs = 0 V
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mA
mA
80
mA
3
mA
VDDIO = 3.6 V
f = 75 MHz,
12-bit high-frequency
mode default registers
5
8
VDDIO = 1.89 V
Default registers
300
900
µA
VDDIO = 3.6 V
Default registers
300
900
µA
VDDIO = 1.89 V
Default registers
15
100
µA
VDDIO = 3.6 V
Default registers
15
100
µA
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SNLS420D – JULY 2012 – REVISED JULY 2015
Electrical Characteristics (continued)
over recommended operating supply and temperature ranges unless otherwise specified.(1) (2) (3)
PARAMETER
TEST CONDITIONS
VDDIO = 1.89 V
CL = 8 pF
WORST CASE pattern
VDDIO = 1.89 V
CL=8pF
Random pattern
VDDIO = 3.6 V
CL = 8 pF
WORST CASE pattern
VDDIO = 3.6 V
CL = 8 pF
Random pattern
IDDIOR
Deserializer (RX)
total supply current
(includes load
current)
VDDIO = 1.89 V
CL = 4 pF
WORST CASE pattern
VDDIO = 1.89 V
CL = 4 pF
Random pattern
VDDIO = 3.6 V
CL = 4 pF
WORST CASE pattern
VDDIO = 3.6 V
CL = 4 pF
Random pattern
Copyright © 2012–2015, Texas Instruments Incorporated
MIN
TYP
MAX
f = 100 MHz, 10-bit
mode
22
42
f = 75 MHz, 12-bit highfreq mode
19
39
f = 50 MHz, 12-bit lowfreq mode
21
32
f = 100 MHz, 10–bit
mode
15
f = 75 MHz, 12-bit highfreq mode
12
f = 50 MHz, 12-bit lowfreq mode
14
f = 100 MHz, 10-bit
mode
42
55
f = 75 MHz, 12-bit highfreq mode
37
50
f = 50 MHz, 12-bit lowfreq mode
25
38
f = 100 MHz, 10-bit
mode
35
f = 75 MHz, 12-bit highfreq mode
30
f = 50 MHz, 12-bit lowfreq mode
18
f = 100 MHz, 10-bit
mode
15
f = 75 MHz, 12-bit highfreq mode
11
f = 50 MHz, 12-bit lowfreq mode
16
f = 100 MHz, 10-bit
mode
8
f = 75 MHz, 12-bit highfreq mode
4
f = 50 MHz, 12-bit lowfreq mode
9
f = 100 MHz, 10-bit
mode
36
f = 75 MHz, 12-bit highfreq mode
29
f = 50 MHz, 12-bit lowfreq mode
20
f = 100 MHz, 10-bit
mode
29
f = 75 MHz, 12-bit highfreq mode
22
f = 50 MHz, 12-bit lowfreq mode
13
UNIT
mA
mA
mA
mA
mA
mA
mA
mA
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Electrical Characteristics (continued)
over recommended operating supply and temperature ranges unless otherwise specified.(1) (2) (3)
PARAMETER
TEST CONDITIONS
TYP
MAX
f = 100 MHz,
10-bit mode
64
110
f = 75 MHz,
12-bit high-frequency
mode
67
114
f = 50 MHz,
12-bit low-frequency
mode
63
96
f = 100 MHz,
10-bit mode
57
f = 75 MHz, 12–bit
high-frequency mode
60
f = 50 MHz, 12-bit
low-frequency mode
56
PBB = 0 V, all other
LVCMOS Inputs=0 V
VDDIO = 1.89 V
Default registers
42
400
PBB = 0 V, all other
LVCMOS Inputs=0 V
VDDIO = 3.6 V
Default registers
42
400
VDDn = 1.89 V
CL = 4 pF
WORST CASE pattern
IDDR
Deserializer (RX)
VDDn supply current
(includes load
current)
VDDn = 1.89 V
CL = 4 pF
Random pattern
IDDRZ
IDDIORZ
Deserializer (RX)
supply current
power-down
Deserializer (RX)
VDD supply current
power-down
PDB = 0 V, all other
LVCMOS Inputs = 0 V
MIN
UNIT
mA
µA
VDDIO = 1.89 V
8
40
360
800
MIN
NOM
MAX
10
T
50
13.33
T
66.66
20
T
100
VDDIO = 3.6 V
µA
8.6 Timing Requirements: Recommended for Serializer PCLK
over recommended operating supply and temperature ranges unless otherwise specified. (1)
TEST CONDITIONS
PIN/FREQ
10-bit mode
tTCP
Transmit clock period
12-bit high-frequency
mode
12-bit low-frequency
mode
UNIT
ns
tTCIH
Transmit clock
input high time
0.4T
0.5T
0.6T
ns
tTCIL
Transmit clock
input low time
0.4T
0.5T
0.6T
ns
20 MHz–100 MHz,
10-bit mode
0.5T
2.5T
0.3T
15 MHz to 75 MHz, 12-bit
high-frequency mode
0.5T
2.5T
0.3T
10 MHz to 50 MHz, 12-bit
low-frequency mode
0.5T
2.5T
0.3T
tCLKT
PCLK input transition
time (Figure 12)
ns
tJIT0
PCLK input jitter
(PCLK from imager
mode)
Refer to jitter freq > f / 40
f = 10 to 100 MHz
0.1T
ns
tJIT1
PCLK input jitter (external
Refer to jitter freq > f / 40
oscillator mode)
f = 10 to 100 MHz
1T
ns
tJIT2
External oscillator jitter
0.1
UI
(1)
14
Recommended input timing requirements are input specifications and not tested in production.
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SNLS420D – JULY 2012 – REVISED JULY 2015
AC Timing Specifications (SCL, SDA) - I2C Compliant
8.7
over recommended supply and temperature ranges unless otherwise specified. (See Figure 5)
TEST CONDITIONS
MIN
NOM
MAX
UNIT
RECOMMENDED INPUT TIMING REQUIREMENTS
Standard mode
>0
100
Fast mode
>0
400
Standard mode
4.7
Fast mode
1.3
Standard mode
4.0
Fast mode
0.6
fSCL
SCL clock frequency
tLOW
SCL low period
tHIGH
SCL high period
tHD:STA
Hold time for a start or a
repeated start condition
Standard mode
Fast mode
0.6
tSU:STA
Setup time for a start or a
repeated start condition
Standard mode
4.7
Fast mode
0.6
tHD:DAT
Data hold time
tSU:DAT
Data setup time
tSU:STO
Setup time for STOP
condition
Standard mode
Fast mode
0.6
tBUF
Bus free time between
stop and start
Standard mode
4.7
Fast mode
1.3
tr
SCL and SDA rise time
tf
SCL and SDA fall time
kHz
µs
µs
4
µs
µs
Standard mode
0
3.45
Fast mode
0
900
Standard mode
250
Fast mode
100
µs
ns
4
µs
µs
Standard mode
1000
Fast mode
300
Standard mode
300
Fast mode
300
ns
ns
Bidirectional Control Bus DC Timing Specifications (SCL, SDA) - I2C Compliant
8.8
over recommended supply and temperature ranges unless otherwise specified (1)
TEST CONDITIONS
MIN
NOM
MAX
UNIT
VDDIO
V
RECOMMENDED INPUT TIMING REQUIREMENTS
VIH
Input high level
SDA and SCL
0.7 × VDDIO
VIL
Input low level
SDA and SCL
GND
VHY
Input hysteresis
VOL
Output low level
SDA, IOL = 0.5 mA
IIN
Input current
SDA or SCL, VIN = VDDOP OR GND
tR
SDA rise time-READ
ns
SDA fall time-READ
SDA, RPU = 10 kΩ, Cb ≤ 400 pF (see
Figure 5)
430
tF
20
ns
tSU;DAT
See Figure 5
560
ns
tHD;DAT
See Figure 5
615
ns
0.3 × VDDIO
>50
0
0.4
V
−10
10
µA
tSP
CIN
(1)
V
mV
SDA or SCL
50
ns
<5
pF
Specification is ensured by design.
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8.9 Switching Characteristics: Serializer
over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tLHT
CML low-to-high transition
RL = 100 Ω (see Figure 7)
time
150
330
ps
tHLT
CML high-to-low transition
RL = 100 Ω (see Figure 7)
time
150
330
ps
tDIS
Data input setup to PCLK
tDIH
Data input hold from
PCLK
Serializer data inputs (see Figure 13)
tPLD
Serializer PLL lock time
RL = 100 Ω (1)
tSD
Serializer delay
(2)
2
ns
2
ns
(2)
, (see Figure 14)
RT = 100 Ω, 10-bit mode
Register 0x03h b[0] (TRFB = 1) (see
Figure 15)
32.5T
RT = 100 Ω, 12-bit mode
Register 0x03h b[0] (TRFB = 1) (see
Figure 15)
11.75T
1
2
38T
44T
ms
ns
13T
15T
tJIND
Serializer output
deterministic jitter
Serializer output intrinsic deterministic jitter.
Measured (cycle-cycle) with PRBS-7 test
pattern (3) (4)
0.13
UI
tJINR
Serializer output
random jitter
Serializer output intrinsic random jitter (cyclecycle). Alternating-1,0 pattern. (3) (4)
0.04
UI
tJINT
Peak-to-peak serializer
output jitter
Serializer output peak-to-peak jitter includes
deterministic jitter, random jitter, and jitter
transfer from serializer input. Measured
(cycle-cycle) with PRBS-7 test pattern. (3) (4)
0.396
UI
λSTXBW
δSTX
δSTXf
(1)
(2)
(3)
(4)
(5)
16
Serializer jitter
transfer function –3-dB
bandwidth (5)
Serializer jitter
transfer function
(peaking) (5)
Serializer jitter
transfer function
(peaking frequency) (5)
PCLK = 100 MHz
10-bit mode. Default registers
2.2
PCLK = 75 MHz
12-bit high-frequency mode. Default registers
2.2
PCLK = 50 MHz
12-bit low-frequency mode. Default registers
2.2
PCLK = 100 MHz
10-bit mode. Default Registers
1.06
PCLK = 75 MHz
12-bit high-frequency mode. Default registers
1.09
PCLK = 50 MHz
12-bit low-frequency mode. Default registers
1.16
PCLK = 100 MHz
10-bit mode. Default registers
400
PCLK = 75 MHz
12-bit high-frequency mode. Default registers
500
PCLK = 50 MHz
12-bit low-frequency mode. Default registers
600
MHz
dB
kHz
tPLD and tDDLT is the time required by the serializer and deserializer to obtain lock when exiting power-down state with an active PCLK
Specification is ensured by design.
Typical values represent most likely parametric norms at 1.8 V or 3.3 V, TA = 25°C, and at the recommended operation conditions at the
time of product characterization and are not specified.
UI – Unit Interval is equivalent to one ideal serialized data bit width. The UI scales with PCLK frequency.
Specification is ensured by characterization and is not tested in production.
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SNLS420D – JULY 2012 – REVISED JULY 2015
8.10 Switching Characteristics: Deserializer
over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER
TEST CONDITIONS
PIN/FREQ
10-bit mode
Receiver output
clock period
tRCP
12-bit high-frequency
mode
PCLK (see
Figure 19)
12-bit low-frequency
mode
10-bit mode
tPDC
PCLK duty cycle
12-bit high-frequency
mode
PCLK
12-bit low-frequency
mode
tCLH
LVCMOS low-to-high
transition time
tCHL
LVCMOS high-to-low
transition time
tCLH
LVCMOS low-to-high
transition time
tCHL
LVCMOS high-to-low
transition time
tROS
ROUT setup data to
PCLK
tROH
ROUT hold data to PCLK
tDD
Deserializer delay
tDDLT
tRCJ
tDPJ
(1)
(2)
Deserializer data lock
time
Receiver clock jitter
Deserializer period jitter
VDDIO: 1.71 V to 1.89 V or
3.0 V to 3.6 V,
CL = 8 pF (lumped load)
PCLK
Default registers
(see Figure 17) (1)
VDDIO: 1.71 V to 1.89 V or
3.0 V to 3.6 V,
ROUT[11:0], HS,
CL = 8 pF (lumped load)
VS
Default registers
(1)
(see Figure 17)
VDDIO: 1.71 V to 1.89 V or
3.0 V to 3.6 V,
ROUT[11:0], HS,
CL = 8 pF (lumped load)
VS
Default registers (see
Figure 19)
Default registers
Register 0x03h b[0]
(RRFB = 1)
(see Figure 18) (1)
With Adaptive
Equalization (see
Figure 16)
PCLK
SSCG[3:0] = OFF (1)
PCLK
SSCG[3:0] = OFF (1)
(2)
MIN
TYP
MAX
10
50
13.33
66.66
10
100
UNIT
ns
45%
50%
55%
40%
50%
60%
40%
50%
60%
1.3
2
2.8
ns
1.3
2
2.8
ns
1
2.5
4
ns
1
2.5
4
ns
0.38T
0.5T
ns
0.38T
0.5T
ns
10-bit mode
154T
158T
12-bit lowfrequency mode
109T
112T
12-bit highfrequency mode
73T
75T
10-bit mode
15
22
12-bit lowfrequency mode
15
22
12-bit highfrequency mode
15
22
10-bit mode
PCLK = 100 MHz
20
30
12-bit lowfrequency mode
PCLK = 50 MHz
22
35
12-bit highfrequency mode
PCLK = 75 MHz
45
90
10-bit mode
PCLK = 100 MHz
170
815
12-bit lowfrequency mode
PCLK= 50 MHz
180
330
12-bit highfrequency mode
PCLK= 75 MHz
300
515
ns
ms
ps
ps
Specification is ensured by characterization and is not tested in production.
tDPJ is the maximum amount the period is allowed to deviate measured over 30,000 samples.
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Switching Characteristics: Deserializer (continued)
over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER
tDCCJ
fdev
fmod
(3)
18
Deserializer cycle-tocycle clock jitter
TEST CONDITIONS
PCLK
SSCG[3:0] = OFF (1)
Spread spectrum clocking
LVCMOS output bus
deviation frequency
SSC[3:0] = ON (see
Spread spectrum clocking Figure 24) (1)
modulation frequency
(3)
PIN/FREQ
MIN
TYP
MAX
10-bit mode
PCLK = 100 MHz
440
1760
12-bit lowfrequency mode
PCLK = 50 MHz
460
730
12-bit highfrequency mode
PCLK = 75 MHz
565
985
10 MHz–100 MHz
±0.5 to
±1.5%
10 MHz–100 MHz
5 to 50
UNIT
ps
kHz
tDCCJ is the maximum amount of jitter between adjacent clock cycles measured over 30,000 samples.
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8.11 Typical Characteristics
4
0.65
2
JITTER AMPLITUDE (UI)
JITTER TRANSFER (dB)
0
-2
-4
-6
-8
-10
-12
-14
0.60
0.55
0.50
- 16
- 18
1.0E+04
1.0E+05
1.0E+06
0.45
1E+04
1.0E+07
1E+05
1E+06
1E+07
MODULATION FREQUENCY ( Hz)
JITTER FREQUENCY (Hz)
Figure 1. Typical Serializer Jitter Transfer Function
at 100 MHz
Figure 2. Typical Deserializer Input Jitter Tolerance Curve
at 1.4-Gbps Line Rate
18
25
16
EFFECTIVE GAIN (dB)
EQUALIZER GAIN (dB)
20
14
12
10
8
6
15
914 Equalizer Gain (dB)
VOD-Vswing Loss
10
Allowable Interconnect
Loss
5
4
0
100
2
0
100
200
300
400
500
600
700
SERIAL LINE FREQUENCY (MHz)
200
300
400
500
600
700
SERIAL LINE FREQUENCY (MHz)
Figure 3. Maximum Equalizer Gain vs. Line Frequency
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Figure 4. Adaptive Equalizer – Interconnect Loss
Compensation
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9 Parameter Measurement Information
9.1 AC Timing Diagrams and Test Circuits
SDA
tf
tHD;STA
tLOW
tr
tBUF
tr
tf
SCL
tSU;STA
tHD;STA
tHIGH
tSU;STO
tSU;DAT
tHD;DAT
START
STOP
REPEATED
START
START
Figure 5. Bidirectional Control Bus Timing
Signal Pattern
Device Pin Name
T
PCLK
(RFB = H)
DIN/ROUT
Figure 6. Worst Case Test Pattern
80%
Vdiff
80%
20%
Vdiff = 0V
20%
tLHT
tHLT
Vdiff = (DOUT+) - (DOUT-)
Figure 7. Serializer CML Output Load and Transition Times
DOUT+
100 nF
50:
ZDiff = 100:
SCOPE
BW 8 4.0 GHz
100:
50:
DOUT-
100 nF
10/12,
HS,VS
DIN
PARALLEL-TO-SERIAL
Figure 8. Serializer CML Output Load and Transition Times
DOUT+
RL
DOUT-
PCLK
Figure 9. Serializer VOD Diagram
20
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AC Timing Diagrams and Test Circuits (continued)
Single Ended
| VOS
DOUTV
V
OD
V
OD+
OD-
DOUT+
Differential
V
OD+
0V
(DOUT+)-(DOUT-)
V
OD-
Figure 10. Serializer VOD Diagram
RIN-
Single Ended
Vswing-
Vswing+
RIN+
0V
Differential
Vswing+
(RIN+)-(RIN-)
0V
Vswing-
Figure 11. Differential Vswing Diagram
80%
VDD
80%
tTCP
PCLK
20%
20%
tCLKT
0V
PCLK
VDDIO/2
VDDIO/2
VDDIO/2
tCLKT
tDIS
tDIH
VDDIO
DINn VDDIO/2
Setup
Hold
VDDIO/2
0V
Figure 12. Serializer Input Clock Transition Times
PDB
Figure 13. Serializer Set-Up and Hold Times
VDDIO/2
PCLK
tPLD
DOUT±
TRI-STATE
Output Active
TRI-STATE
Figure 14. Serializer PLL Lock Time
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SYMBOL N+2
| |
SYMBOL N+1
| |
SYMBOL N
| |
DIN
| |
AC Timing Diagrams and Test Circuits (continued)
SYMBOL N+3
tSD
VDDIO/2
SYMBOL N-3
SYMBOL N-2
SYMBOL N-1
| |
| |
| |
DOUT+-
SYMBOL N
| |
SYMBOL N-4
| |
|
|
|
|
PCLK
0V
Figure 15. Serializer Delay
PDB
VDDIO/2
| |
tDDLT
RIN±
LOCK
TRI-STATE
|
VDDIO/2
Figure 16. Deserializer Data Lock Time
80%
80%
Deserializer
20%
8 pF
lumped
20%
tCLH
tCHL
SYMBOL N + 3
| |
0V
SYMBOL N + 3
| |
SYMBOL N + 2
| |
RIN±
SYMBOL N + 1
| |
SYMBOL N
| |
Figure 17. Deserializer LVCMOS Output Load and Transition Times
tDD
PCLK
SYMBOL N - 1
| ||
SYMBOL N - 2
| ||
SYMBOL N - 3
| ||
| ||
| ||
ROUTn
VDDIO/2
SYMBOL N
SYMBOL N+1
Figure 18. Deserializer Delay
tRCP
PCLK
VDDIO
1/2 VDDIO
1/2 VDDIO
0V
VDDIO
ROUT[n],
VS, HS
1/2 VDDIO
1/2 VDDIO
0V
tROS
tROH
Figure 19. Deserializer Output Set-Up and Hold Times
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AC Timing Diagrams and Test Circuits (continued)
Ew
VOD (+)
EH
0V
EH
VOD (-)
tBIT (1 UI)
Figure 20. CML Output Driver
PDB= H
OEN
VIH
VIL
VIH
OSS_SEL
VIL
RIN
(Diff.)
'RQ¶W&DUH
tSEH
tONS
LOCK
tSES
TRI-STATE
TRI-STATE
PASS
LOW
tONH
ACTIVE
HIGH
ROUT[0:11],
HS, VS
TRI-STATE
LOW
PCLK
(RFB = L)
TRI-STATE
LOW
TRI-STATE
LOW
HIGH
HIGH
ACTIVE
ACTIVE
LOW
TRI-STATE
LOW
TRI-STATE
Figure 21. Output State (Set-Up and Hold) Times
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AC Timing Diagrams and Test Circuits (continued)
4
0.65
2
JITTER AMPLITUDE (UI)
JITTER TRANSFER (dB)
0
-2
-4
-6
-8
-10
-12
0.60
0.55
0.50
-14
- 16
- 18
1.0E+04
1.0E+05
1.0E+06
0.45
1E+04
1.0E+07
1E+05
1E+06
1E+07
JITTER FREQUENCY (Hz)
MODULATION FREQUENCY ( Hz)
Figure 22. Typical Serializer Jitter Transfer
Function at 100 MHz
Figure 23. Typical Deserializer Input Jitter
Tolerance Curve at 1.4-Gbps Line Rate
Frequency
fdev (max)
FPCLK+
fdev
FPCLK
fdev (min)
FPCLK-
Time
1 / fmod
Figure 24. Spread Spectrum Clock Output Profile
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10 Detailed Description
10.1 Overview
The DS90UB91xQ-Q1 FPD-Link III chipsets are intended to link megapixel camera imagers and video
processors in ECUs. The serializer and deserializer chipset can operate from 10-MHz to 100-MHz pixel clock
frequency. The DS90UB913Q-Q1 device transforms a 10- and 12-bit wide parallel LVCMOS data bus along with
a bidirectional control channel control bus into a single high-speed differential pair. The high-speed serial bit
stream contains an embedded clock and DC-balanced information which enhances signal quality to support AC
coupling. The DS90UB914Q-Q1 device receives the single serial data stream and converts it back into a 10- and
12-bit wide parallel data bus together with the control channel data bus. The DS90UB91xQ-Q1 chipsets can
accept up to:
• 12 bits of DATA+2 bits SYNC for an input PCLK range of 10 MHz-50 MHz in the 12-bit low-frequency mode
• 12 bits DATA + 2 SYNC bits for an input PCLK range of 15 MHz to 75 MHz in the 12-bit high-frequency mode
• 10 bits DATA + 2 SYNC bits for an input PCLK range of 20 MHz to 100 MHz in the 10-bit mode.
The DS90UB914Q-Q1 chipset has a 2:1 multiplexer that allows customers to select between two serializer
inputs. The control channel function of the DS90UB91xQ-Q1 chipset provides bidirectional communication
between the image sensor and ECUs. The integrated bidirectional control channel transfers data bidirectionally
over the same differential pair used for video data interface. This interface offers advantages over other chipsets
by eliminating the need for additional wires for programming and control. The bidirectional control channel bus is
controlled through an I2C port. The bidirectional control channel offers asymmetrical communication and is not
dependent on video blanking intervals.
The DS90UB91xQ-Q1 chipset offer customers the choice to work with different clocking schemes. The
DS90UB91xQ-Q1 chipsets can use an external oscillator as the reference clock source for the PLL or PCLK from
the imager as primary reference clock to the PLL.
10.2 Functional Block Diagram
RIN0+ RT
RT
DOUTPCLK
PLL
RIN0-
2:1
GPO[3:0]
Output Latch
DOUT+
Decoder
RT
Deserializer
RT
Adaptive Eq.
Serializer
4
Encoder
DIN
HSYNC
VSYNC
Input Latch
10 or
12
10
or
12
ROUT
HSYNC
VSYNC
4
GPIO[3:0]
RIN1+
Clock
Gen
PCLK
LOCK
Clock
Gen
CDR
PASS
RIN1-
Encoder
Encoder
ID[x]
MODE
SEL
Decoder
SCL
FIFO
SDA
I2C Controller
OEN
MODE
DS90UB913Q - SERIALIZER
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I2C
Controller
Timing and
Control
PDB
BISTEN
FIFO
Timing and
Control
Decoder
PDB
SDA
SCL
IDx[0]
IDx[1]
DS90UB914Q - DESERIALIZER
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10.3 Feature Description
10.3.1 Serial Frame Format
The high-speed forward channel is composed of 28 bits of data containing video data, sync signals, I2C and
parity bits. This data payload is optimized for signal transmission over an AC-coupled link. Data is randomized,
balanced and scrambled. The 28-bit frame structure changes in the 12-bit low-frequency mode, 12-bit high
frequency mode and the 10-bit mode internally and is seamless to the customer. The bidirectional control
channel data is transferred over the single serial link along with the high-speed forward data. This architecture
provides a full duplex low-speed forward and backward path across the serial link together with a high-speed
forward channel without the dependence on the video blanking phase.
10.3.2 Line Rate Calculations for the DS90UB91xQ
The DS90UB913Q-Q1 device divides the clock internally by divide-by-1 in the 12-bit low-frequency mode, by
divide-by-2 in the 10-bit mode and by divide-by-1.5 in the 12-bit high-frequency mode. Conversely, the
DS90UB914Q-Q1 multiplies the recovered serial clock to generate the proper pixel clock output frequency. Thus
the maximum line rate in the three different modes remains 1.4 Gbps. The following are the formulae used to
calculate the maximum line rate in the different modes.
• For 12-bit low-frequency mode, Line rate = fPCLK × 28; that is, fPCLK= 50 MHz, line rate = 50 × 28 = 1.4 Gbps
• For 10-bit mode, Line rate = fPCLK / 2 × 28; that is, fPCLK= 100 MHz, line rate = (100 / 2) × 28 = 1.4 Gbps
• For the 12-bit high-frequency mode, Line rate = fPCLK × (2 / 3) × 28; that is, fPCLK= 75 MHz, line rate = (75) ×
(2 / 3) × 28 = 1.4 Gbps
10.3.3 Deserializer Multiplexer Input
The DS90UB914Q-Q1 offers a 2:1 multiplexer that can be used to select which camera is used as the input.
Figure 25 shows the operation of the 2:1 multiplexer in the deserializer. The selection of the camera can be pin
controlled as well as register controlled. Both the deserializer inputs cannot be enabled at the same time. If the
Serializer A is selected as the active serializer, the back-channel for Deserializer A turns ON and vice versa. To
switch between the two cameras, first the Serializer B has to be selected using the SEL pin/register on the
deserializer. After that the back channel driver for Deserializer B has to be enabled using the register in the
deserializer.
Serializer A
DS90UB913Q
Camera A
DATA
PCLK
DATA
PCLK
2
I C
Serializer B
DS90UB913Q
Camera B
GPIO
GPIO
FSYNC
CMOS
Image
Sensor
DS90UB914Q
2:1
CMOS
Image
Sensor
FSYNC
2
I C
Deserializer A
ECU
Module
DATA
PCLK
GPIO
FSYNC
2
I C
PC
Serializer B
Figure 25. Using the Multiplexer on the Deserializer to Enable a Two-Camera System
26
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Feature Description (continued)
10.3.4 Error Detection
The chipset provides error detection operations for validating data integrity in long distance transmission and
reception. The data error detection function offers users flexibility and usability of performing bit-by-bit data
transmission error checking. The error detection operating modes support data validation of the following signals:
• Bidirectional control channel data across the serial link
• Parallel video/sync data across the serial link
The chipset provides one parity bit on the forward channel and 4 CRC bits on the back channel for error
detection purposes. The DS90UB91xQ-Q1 chipset checks the forward and back channel serial links for errors
and stores the number of detected errors in two 8-bit registers in the serializer and the deserializer respectively.
To check parity errors on the forward-channel, monitor registers 0x1A and 0x1B on the deserializer. If there is a
loss of LOCK, then the counters on registers 0x1A and 0x1B are reset.
NOTE
Whenever there is a parity error on the forward channel, the PASS pin will go low.
To check CRC errors on the back-channel, monitor registers 0x0A and 0x0B on the serializer.
10.3.5 Description of Bidirectional Control Bus and I2C Modes
SDA Line
Register
Address
Slave
Address
7-bit Address
S
Stop
Bus Activity:
Master
Start
The I2C-compatible interface allows programming of the DS90UB913Q-Q1, DS90UB914Q-Q1, or an external
remote device (such as image sensor) through the bidirectional control channel. Register programming
transactions to/from the DS90UB913xQ-Q1 chipset are employed through the clock (SCL) and data (SDA) lines.
These two signals have open-drain I/Os and both lines must be pulled up to VDDIO by an external resistor.
Pullup resistors or current sources are required on the SCL and SDA busses to pull them high when they are not
being driven low. A logic LOW is transmitted by driving the output low. Logic HIGH is transmitted by releasing the
output and allowing it to be pulled up externally. The appropriate pullup resistor values will depend upon the total
bus capacitance and operating speed. The DS90UB91xQ-Q1 I2C bus data rate supports up to 400 kbps
according to I2C fast mode specifications.
Data
P
0
A
C
K
A
C
K
A
C
K
Bus Activity:
Slave
S
Register
Address
Slave
Address
7-bit Address
S
0
A
C
K
Bus Activity:
Slave
N
A
C
K
Slave
Address
7-bit Address
A
C
K
Stop
SDA Line
Start
Bus Activity:
Master
Start
Figure 26. Write Byte
P
1
A
C
K
Data
Figure 27. Read Byte
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Feature Description (continued)
SDA
1
2
6
MSB
R/W
Direction
Bit
Acknowledge
from the Device
7-bit Slave Address
SCL
ACK
LSB
MSB
7
8
9
LSB
N/ACK
Data Byte
*Acknowledge
or Not-ACK
1
8
2
Repeated for the Lower Data Byte
and Additional Data Transfers
START
9
STOP
Figure 28. Basic Operation
SDA
SCL
S
P
STOP condition
START condition, or
START repeat condition
Figure 29. Start and Stop Conditions
10.3.6 Slave Clock Stretching
The I2C-compatible interface allows programming of the DS90UB913Q-Q1, DS90UB914Q-Q1, or an external
remote device (such as image sensor) through the bidirectional control.
NOTE
To communicate and synchronize with remote devices on the I2C bus through the
bidirectional control channel/MCU, the chipset utilizes bus clock stretching (holding the
SCL line low) during data transmission where the I2C slave pulls the SCL line low on the
9th clock of every I2C transfer (before the ACK signal).
The slave device will not control the clock and only stretches it until the remote peripheral has responded. The
I2C master must support clock stretching to operate with the DS90UB91xQ-Q1 chipset.
10.3.7 I2C Pass-Through
I2C pass-through provides an alternative means to independently address slave devices. The mode enables or
disables I2C bidirectional control channel communication to the remote I2C bus. This option is used to determine
whether or not an I2C instruction is to be transferred over to the remote I2C device. When enabled, the I2C bus
traffic will continue to pass through, I2C commands will be excluded to the remote I2C device. The pass-through
function also provides access and communication to only specific devices on the remote bus.
See Figure 30 for an example of this function.
If master controller transmits I2C transaction for address 0xA0, the SER A with I2C pass-through enabled will
transfer I2C commands to remote Camera A. The SER B with I2C pass-through disabled, any I2C commands will
be bypassed on the I2C bus to Camera B.
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Feature Description (continued)
DS90UB913Q
CMOS
Image
Sensor
DS90UB914Q
DIN[11:0]
,HS,VS
PCLK
ROUT[11:0],
HS,VS,
PCLK
2
SDA
SCL
Camera A
Slave ID: (0xA0)
I C
SER A: I2C _MASTER
I2C_PASS_THRU Enabled
DS90UB913Q
CMOS
Image
Sensor
SDA
SCL
2
I C
DES A: I2C_SLAVE
DS90UB914Q
DIN[11:0]
,HS,VS
PCLK
SDA
SCL
Camera B
Slave ID: (0xA0)
ECU
Module
ROUT[11:0],
HS,VS,
PCLK
2
SDA
SCL
2
I C
I C
SER B: I2C_MASTER
I2C_PASS_THRU Disabled
PC
Master
DES B: I2C_SLAVE
Figure 30. I2C Pass-Through
10.3.8 ID[x] Address Decoder on the Serializer
The ID[x] pin on the serializer is used to decode and set the physical slave address of the serializer (I2C only) to
allow up to five devices on the bus connected to the serializer using only a single pin. The pin sets one of the 5
possible addresses for each serializer device. The pin must be pulled to VDD (1.8 V, not VDDIO) with a 10-kΩ
resistor and a pulldown resistor (RID) of the recommended value to set the physical device address. The
recommended maximum resistor tolerance is 1%.
1.8V
10k
VDDIO
ID[x]
RPU
HOST
RPU
RID
DS90UB913Q
SCL
SCL
SDA
SDA
To other Devices
Figure 31. ID[x] Address Decoder on the Serializer
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Table 1. ID[x] Resistor Value for DS90UB913Q-Q1 Serializer
ID[x] Resistor Value — DS90UB913Q-Q1 Serializer
Resistor RID0 Ω
(1% Tolerance)
Address 7'b
Address 8'b 0 appended
(WRITE)
0k
0x58
0xB0
2k
0x59
0xB2
4.7 k
0x5A
0xB4
8.2 k
0x5B
0xB6
14 k
0x5C
0xB8
100 k
0x5D
0xBA
10.3.9 ID[x] Address Decoder on the Deserializer
The IDx[0] and IDx[1] pins on the deserializer are used to decode and set the physical slave address of the
deserializer (I2C only) to allow up to 16 devices on the bus using only two pins. The pins set one of 16 possible
addresses for each deserializer device. As there will be more deserializer devices connected on the same board
than serializers, more I2C device addresses have been defined for the DS90UB914Q-Q1 deserializer than the
DSDS90UB913Q-Q1 serializer. The pins must be pulled to VDD (1.8 V, not VDDIO) with a 10-kΩ resistor and
two pulldown resistors (RID0 and RID1) of the recommended value to set the physical device address. The
recommended maximum resistor tolerance is 1%.
1.8V
1.8V
10k
10k
RID1
RID0
VDDIO
IDx[0]
RPU
IDx[1]
RPU
HOST
DS90UB914Q
SCL
SCL
SDA
SDA
To other
Devices
Figure 32. ID[x[ Address Decoder on the Deserializer
Table 2. Resistor Values for IDx[0] and IDx[1] on DS90UB914Q-Q1 Deserializer
ID[X] RESISTOR VALUE — DS90UB913Q SERIALIZER
30
RESISTOR RID1 Ω
(1%TOLERANCE)
RESISTOR RID0 Ω
(1%TOLERANCE)
ADDRESS 7'b
ADDRESS 8'b 0 APPENDED
(WRITE)
0k
0k
0x60
0xC0
0k
3k
0x61
0xC2
0k
11 k
0x62
0xC4
0k
100 k
0x63
0xC6
3k
0k
0x64
0xC8
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Table 2. Resistor Values for IDx[0] and IDx[1] on DS90UB914Q-Q1 Deserializer (continued)
ID[X] RESISTOR VALUE — DS90UB913Q SERIALIZER
3k
3k
0x65
0xCA
3k
11 k
0x66
0XCC
3k
100 k
0x67
0XCE
11 k
0k
0x68
0XD0
11 k
3k
0x69
0XD2
11 k
11 k
0x6A
0XD4
11 k
100 k
0x6B
0XD6
100 k
0k
0x6C
0XD8
100 k
3k
0x6D
0XDA
100 k
11 k
0x6E
0XDC
100 k
100 k
0x6F
0XDE
10.3.10 Programmable Controller
An integrated I2C slave controller is embedded in the DS90UB913Q-Q1 serializer as well as the DS90UB914QQ1 deserializer. It must be used to configure the extra features embedded within the programmable registers or it
can be used to control the set of programmable GPIOs.
10.3.11 Synchronizing Multiple Cameras
For applications requiring multiple cameras for frame-synchronization, TI recommends to utilize the GeneralPurpose Input/Output (GPIO) pins to transmit control signals to synchronize multiple cameras together. To
synchronize the cameras properly, the system controller needs to provide a field sync output (such as a vertical
or frame sync signal) and the cameras must be set to accept an auxiliary sync input. The vertical synchronize
signal corresponds to the start and end of a frame and the start and end of a field.
NOTE
this form of synchronization timing relationship has a non-deterministic latency. After the
control data is reconstructed from the bidirectional control channel, there will be a time
variation of the GPIO signals arriving at the different target devices (between the parallel
links). The maximum latency delta (t1) of the GPIO data transmitted across multiple links
is 25 µs.
NOTE
The user must verify that the timing variations between the different links are within their
system and timing specifications.
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See Figure 33 for an example of synchronizing multiple cameras.
The maximum time (t1) between the rising edge of GPIO (that is, sync signal) arriving at Camera A and Camera
B is 25 µs.
DS90UB913Q
Camera A
CMOS
Image
Sensor
DS90UB914Q
DATA
PCLK
DATA
PCLK
2
I C
Serializer A
FSYNC
FSO
GPIO
GPO
FSIN
FSYNC
2
I C
Deserializer A
ECU
Module
Camera B
CMOS
Image
Sensor
DS90UB913Q
DS90UB914Q
DATA
PCLK
DATA
PCLK
2
I C
Serializer B
FSYNC
FSO
GPIO
GPO
FSIN
FSYNC
2
PC
I C
Deserializer B
Figure 33. Synchronizing Multiple Cameras
DES A
GPIO[n] Input
SER B
GPIO[n] Output
|
SER A
GPIO[n] Output
|
DES B
GPIO[n] Input
t1
Figure 34. GPIO Delta Latency
10.3.12 General-Purpose I/O (GPIO) Descriptions
There are 4 GPOs on the serializer and 4 GPIOs on the deserializer when the DS90UB91xQ-Q1 chipsets are run
off the pixel clock from the imager as the reference clock source. The GPOs on the serializer can be configured
as outputs for the input signals that are fed into the deserializer GPIOs. In addition, the GPOs on the serializer
can behave as outputs of the local register on the serializer. The GPIOs on the deserializer can be configured to
be the input signals feeding the output of the GPOs on the serializer. In addition the GPIOs on the deserializer
can be configured to behave as outputs of the local register on the deserializer. If the DS90UB91xQ-Q1 chipsets
are run off the external oscillator source as the reference clock, then GPO3 on the serializer is automatically
configured to be the input for the external clock and GPIO2 on the deserializer is configured to be the output of
the divide-by-2 clock which is fed into the imager as its reference clock. In this case, the GPIO2 and GPIO3 on
the deserializer can only behave as outputs of the local register on the deserializer. The GPIO maximum
switching rate is up to 66 kHz when configured for communication between deserializer GPIO to serializer GPO.
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10.3.13 LVCMOS VDDIO Option
1.8-V, 2.8-V, and 3.3-V serializer inputs and 1.8-V and 3.3-V deserializer outputs are user configurable to provide
compatibility with 1.8-V, 2.8-V and 3.3-V system interfaces.
10.3.14 Deserializer – Adaptive Input Equalization (AEQ)
The receiver inputs provide an adaptive input equalization filter in order to compensate for loss from the media.
The level of equalization can also be manually selected through register controls. The fully-adaptive equalizer
output can be seen using the CMLOUTP/CMLOUTN pins in the deserializer.
18
EQUALIZER GAIN (dB)
16
14
12
10
8
6
4
2
0
100
200
300
400
500
600
700
SERIAL LINE FREQUENCY (MHz)
Figure 35. Maximum Equalizer Gain vs. Line Frequency
10.3.15 EMI Reduction
10.3.15.1 Deserializer Staggered Output
The receiver staggers output switching to provide a random distribution of transitions within a defined window.
Outputs transitions are distributed randomly. This minimizes the number of outputs switching simultaneously and
helps to reduce supply noise. In addition it spreads the noise spectrum out reducing overall EMI.
10.3.15.2 Spread Spectrum Clock Generation (SSCG) on the Deserializer
The DS90UB914Q-Q1 parallel data and clock outputs have programmable SSCG ranges from 10 MHz to 100
MHz. The modulation rate and modulation frequency variation of output spread is controlled through the SSC
control registers on the DS90UB914Q-Q1 device. SSC profiles can be generated using bits [3:0] in register 0x02
in the deserializer.
10.4 Device Functional Modes
10.4.1 DS90UB91xQ-Q1 Operation With External Oscillator as Reference Clock
In some applications, the pixel clock that comes from the imager can have jitter which exceeds the tolerance of
the DS90UB91xQ-Q1 chipsets. In this case, the DS90UB913Q-Q1 device should be operated by using an
external clock source as the reference clock for the DS90UB91xQ-Q1 chipsets. This is the recommended
operating mode. The external oscillator clock output goes through a divide-by-2 circuit in the DS90UB913Q-Q1
serializer and this divided clock output is used as the reference clock for the imager. The output data and pixel
clock from the imager are then fed into the DS90UB913Q-Q1 device. Figure 36 shows the operation of the
DS90UB1xQ-Q1 chipsets while using an external automotive grade oscillator.
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Device Functional Modes (continued)
DS90UB913Q
Serializer
FPD Link IIIHigh Speed
Camera Data
DOUT+
10 or 12
Image
Sensor
DATA
HSYNC
DIN[11:0] or
DIN[9:0]
HSYNC,
VSYNC
DOUT-
VSYNC
Pixel Clock
DS90UB914Q
Deserializer
Camera Data
RIN+
RIN-
10 or 12
ROUT[11:0]
or
ROUT[9:0]
HSYNC,
VSYNC
Bi-Directional
Control Channel
PCLK
PCLK
DATA
HSYNC
VSYNC
Pixel Clock
ECU Module
SDA
SDA
SCL
2
SCL
PLL
GPIO[3:0]
GPO[1:0]
GPO[1:0]
SDA
Camera Unit
Reference Clock
(Ext. OSC/2)
4
GPO[3:0]
SCL
Microcontroller
SDA
SCL
GPO3
÷2
GPO2
External
Oscillator
Figure 36. DS90UB91xQ-Q1 Operation in the External Oscillator Mode
When the DS90UB913Q-Q1 device is operated using an external oscillator, the GPO3 pin on the
DS90UB913Q-Q1 is the input pin for the external oscillator. In applications where the DS90UB913Q-Q1 device is
operated from an external oscillator, the divide-by-2 circuit in the DS90UB913Q-Q1 device feeds back the
divided clock output to the imager device through GPO2 pin. The pixel clock to external oscillator ratios needs to
be fixed for the 12-bit high-frequency mode and the 10-bit mode.
NOTE
In the 10-bit mode, the pixel clock frequency divided by the external oscillator frequency
must be 2. In the 12-bit high-frequency mode, the pixel clock frequency divided by the
external oscillator frequency must be 1.5.
For example, if the external oscillator frequency is 48 MHz in the 10-bit mode, the pixel clock frequency of the
imager needs to be twice of the external oscillator frequency, that is, 96 MHz. If the external oscillator frequency
is 48 MHz in the 12-bit high-frequency mode, the pixel clock frequency of the imager needs to be 1.5 times of the
external oscillator frequency, that is, 72 MHz. In this mode, GPO2 and GPO3 on the serializer cannot act as the
output of the input signal coming from GPIO2 or GPIO3 on the deserializer.
10.4.2 DS90UB91xQ-Q1 Operation With Pixel Clock from Imager as Reference Clock
The DS90UB91xQ-Q1 chipsets can be operated by using the pixel clock from the imager as the reference
clock.Figure 37 shows the operation of the DS90UB91xQ-Q1 chipsets using the pixel clock from the imager. If
the DS90UB913Q-Q1 device is operated using the pixel clock from the imager as the reference clock, then the
imager uses an external oscillator as its reference clock. There are 4 GPIOs on the serializer and 4 GPIOs on
the deserializer in this mode.
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Device Functional Modes (continued)
DS90UB914Q
Deserializer
DS90UB913Q
FPD-Link III
Camera Data
Image
Sensor
Camera Data
DOUT+
10 or 12
DIN[11:0] or
DIN[9:0]
FV,LV
YUV
HSYNC
VSYNC
ROUT[11:0]
or
ROUT[9:0]
FV, LV
DOUT-
SDA
SCL
YUV
HSYNC
RIN0-
VSYNC
Bi-Directional
Back Channel
SDA
SCL
10 or 12
RIN0+
PCLK
Pixel Clock
4
GPO[3:0]
GPIO[3:0]
GPO
Pixel Clock
Camera Unit
ECU Module
RIN1+
GPIO
RIN1-
PLL
4
SDA
PCLK
SCL
Microcontroller
SDA
SCL
Ext.
Oscillator
Figure 37. DS90UB91xQ-Q1 Operation in PCLK mode
10.4.3 MODE Pin on Serializer
The mode pin on the serializer can be configured to select if the DS90UB913Q-Q1 device is to be operated from
the external oscillator or the PCLK from the imager. The pin must be pulled to VDD (1.8 V, not VDDIO) with a
10-kΩ resistor and a pulldown resistor (RMODE) of the recommended value to set the modes shown in Figure 38.
The recommended maximum resistor tolerance is 1%.
1.8V
10k
VDDIO
MODE
RPU
RPU
RMODE
DS90UB913Q
HOST
SCL
SCL
SDA
SDA
To other
Devices
Figure 38. MODE Pin Configuration on DS90UB913Q-Q1
Table 3. DS90UB913Q-Q1 Serializer MODE Resistor
Value
MODE SELECT
RMODE RESISTOR VALUE
PCLK from imager mode
100 kΩ
External Oscillator mode
4.7 kΩ
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10.4.4 MODE Pin on Deserializer
The mode pin on the deserializer can be used to configure the device to work in the 12-bit low-frequency mode,
12-bit high frequency mode or the 10-bit mode of operation. Internally, the DS90UB91xQ-Q1 chipset operates in
a divide-by-1 mode in the 12-bit low-frequency mode, divide-by-2 mode in the 10-bit mode and a divide-by-1.5
mode in the 12-bit high-frequency mode. The pin must be pulled to VDD (1.8 V, not VDDIO) with a 10-kΩ resistor
and a pulldown resistor (RMODE) of the recommended value to set the different modes in the deserializer as
mentioned in Table 4. The deserializer automatically configures the serializer to correct mode through the backchannel. The recommended maximum resistor tolerance is 1%
.
1.8V
10k
VDDIO
MODE
RPU
HOST
RPU
RMODE
DS90UB914Q
SCL
SCL
SDA
SDA
To Other
Devices
Figure 39. Mode Pin Configuration on DS90UB914Q-Q1 Deserializer
Table 4. DS90UB914Q-Q1 Deserializer MODE Resistor
Value
DS90UB914Q-Q1 DESERIALIZER MODE RESISTOR VALUE
36
MODE SELECT
RMODE RESISTOR VALUE
12-bit low-frequency mode
10 to 50 MHz PCLK
10 to 12 bit DATA + 2 SYNC
0Ω
12-bit low-frequency mode
15 to 75 MHz PCLK
10 to 12 bit DATA + 2 SYNC
3 kΩ
10-bit mode
20 to 100 MHz PCLK
10 to 10 bit DATA + 2 SYNC
11 kΩ
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10.4.5 Clock-Data Recovery Status Flag (LOCK), Output Enable (OEN) and Output State Select
(OSS_SEL)
When PDB is driven HIGH, the CDR PLL of the deserializer begins locking to the serial input and LOCK is TRISTATE or LOW (depending on the value of the OEN setting). After the DS90UB914Q-Q1 completes its lock
sequence to the input serial data, the LOCK output is driven HIGH, indicating valid data and clock recovered
from the serial input is available on the parallel bus and PCLK outputs. The states of the outputs are based on
the OEN and OSS_SEL setting (Table 3). See Figure 20.
Table 5. Output States
INPUTS
OUTPUTS
SERIAI INPUTS
PDB
OEN
OSS
LOCK
PASS
DATA, GPIO, I2S
CLK
X
0
X
X
1
0
X
Z
Z
Z
Z
0
L or H
L
L
X
1
L
0
1
L or H
Z
Z
Z
Static
1
1
0
L
L
L
L/Osc (Register
Bit Enable)
Static
1
1
1
H
Previous State
L
L
Active
1
1
0
H
L
L
L
Active
1
1
1
H
Valid
Valid
Valid
10.4.6 Multiple Device Addressing
Some applications require multiple camera devices with the same fixed address to be accessed on the same I2C
bus. The DS90UB91xQ-Q1 provides slave ID matching/aliasing to generate different target slave addresses
when connecting more than two identical devices together on the same bus. This allows the slave devices to be
independently addressed. Each device connected to the bus is addressable through a unique ID by programming
of the SLAVE_ID_MATCH register on deserializer. This will remap the SLAVE_ID_MATCH address to the target
SLAVE_ID_INDEX address; up to 8 ID indexes are supported. The ECU Controller must keep track of the list of
I2C peripherals in order to properly address the target device.
See Figure 40 for an example of multiple device addressing.
• ECU is the I2C master and has an I2C master interface
• The I2C interfaces in DES A and DES B are both slave interfaces
• The I2C protocol is bridged from DES A to SER A and from DES B to SER B
• The I2C interfaces in SER A and SER B are both master interfaces
If master controller transmits I2C slave 0xA0, the DES A address 0xC0 will forward the transaction to remote
Camera A. If the controller transmits slave address 0xA4, the DES B 0xC2 will recognize that 0xA4 is mapped to
0xA0 and will be transmitted to the remote Camera B. If controller sends command to address 0xA6, the DES B
0xC2 will forward transaction to slave device 0xA2.
The Slave ID index/match is supported only in the camera mode (SER: MODE pin = L; DES: MODE pin = H).
For Multiple device addressing in display mode (SER: MODE pin = H; DES: MODE pin = L), use the I2C passthrough function.
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Camera A
DS90UB913Q
Slave ID: (0xA0)
CMOS
Image
Sensor
DS90UB914Q
ROUT[11:0],
HS, VS,
PCLK
DIN[11:0]
, HS, VS,
PCLK
SDA
SCL
2
I C
SER A: ID[x](0xB0)
PC/
EEPROM
Slave ID: (0xA2)
Camera B
DS90UB913Q
Slave ID: (0xA0)
DES A: ID[x](0xC0)
SLAVE_ID1_MATCH(0xA0)
SLAVE_ID1_INDEX(0xA0)
SLAVE_ID2_MATCH(0xA2)
SLAVE_ID2_INDEX(0xA2)
SDA
SCL
ROUT[11:0],
HS, VS,
PCLK
2
I C
SER B: ID[x](0xB2)
PC/
EEPROM
ECU
Module
DS90UB914Q
DIN[11:0]
, HS, VS,
PCLK
CMOS
Image
Sensor
SDA
SCL
2
I C
Slave ID: (0xA2)
SDA
SCL
2
I C
DES B: ID[x](0xC2)
SLAVE_ID2_MATCH(0xA4)
SLAVE_ID2_INDEX(0xA0)
SLAVE_ID2_MATCH(0xA6)
SLAVE_ID2_INDEX(0xA2)
PC
Master
Figure 40. Multiple Device Addressing
10.4.7 Powerdown
The SER has a PDB input pin to ENABLE or Powerdown (SLEEP) the device. The modes can be controlled by
the host and is used to disable the Link to save power when the remote device is not operational. In this mode, if
the PDB pin is tied High and the SER will enter SLEEP when the PCLK stops. When the PCLK starts again, the
SER will then lock to the valid input PCLK and transmit the data to the DES. In SLEEP mode, the high-speed
driver outputs are static (High). The DES has a PDB input pin to ENABLE or Powerdown (SLEEP) the device.
This pin can be controlled by the system and is used to disable the DES to save power. An auto mode is also
available. In this mode, the PDB pin is tied High and the DES will enter SLEEP when the serial stream stops.
When the serial stream starts up again, the DES will lock to the input stream and assert the LOCK pin and output
valid data. In SLEEP mode, the Data and PCLK outputs are set by the OSS_SEL configuration.
10.4.8 Pixel Clock Edge Select (TRFB / RRFB)
The TRFB/RRFB selects which edge of the Pixel Clock is used. For the SER, this register determines the edge
that the data is latched on. If TRFB register is 1, data is latched on the Rising edge of the PCLK. If TRFB register
is 0, data is latched on the Falling edge of the PCLK. For the DES, this register determines the edge that the
data is strobed on. If RRFB register is 1, data is strobed on the Rising edge of the PCLK. If RRFB register is 0,
data is strobed on the falling edge of the PCLK.
PCLK
DIN/
ROUT
TRFB/RRFB: 0
TRFB/RRFB: 1
Figure 41. Programmable PCLK Strobe Select
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10.4.9 Power-Up Requirements and PDB Pin
When power is applied, the VDDIO supply needs to reach the expected operating voltage (1.8 V to 3.3 V) before
the other supplies (VDDn) begin to ramp. It is required to delay and release the PDB Signal after VDD (VDDn
and VDDIO) power supplies have settled to the recommended operating voltage. An external RC network can be
connected to the PDB pin to ensure PDB arrives after all the VDD has stabilized.
1.8V OR 3.3V
VDDIO
1.8V
VDD_CORE,
All other 1.8V Supplies
1.8V OR 3.3V
PDB
Figure 42. Power-Up Sequencing
10.4.10 Built-In Self Test
An optional AT-Speed, Built-In Self Test (BIST) feature supports the testing of the high-speed serial link and lowspeed back channel. This is useful in the prototype stage, equipment production, and in-system test and also for
system diagnostics.
10.4.11 BIST Configuration and Status
The chipset can be programmed into BIST mode using either pins or registers. By default BIST configuration is
controlled through pins. BIST can be configured through registers using BIST Control register (0x24). Pin based
configuration is defined as follows:
• BISTEN : Enable the BIST Process
• GPIO0 and GPIO1 : Defines the BIST clock source (PCLK vs. various frequencies of internal OSC
Table 6. BIST Configuration
DESERIALIZER GPIO[0:1]
OSCILLATOR SOURCE
BIST FREQUENCY (MHZ)
00
External PCLK
PCLK or External Oscillator
01
Internal
50
10
Internal
25
11
Internal
12.5
The BIST mode provides various options for source PCLK. Using external pins, GPIO0 and GPIO1 or using
registers, customer can program the BIST mode to use external PCLK or various OSC frequencies. The BIST
status can be monitored real time on PASS pin. For every frame with error(s), PASS pin toggles low for half
PCLK period. If two consecutive frames have errors, PCLK will toggle twice to allow counting of frames with
errors. Once the BIST is done, the PASS pin reflects the pass/fail status of the last BIST run. The status can also
be read through I2C for the number of frames in errors. BIST status on PASS pin remains until it is changed by a
new BIST session or a reset. The BIST status on PASS pin is not maintained till RX loses LOCK after BISTEN is
deassserted. To evaluate BIST in the external oscillator mode, both external oscillator and PCLK need to be
present.
The BIST status on PASS pin is not maintained till RX loses LOCK after BISTEN is deassserted. So for all
practical purposes, the BIST status can be monitored from register 0x25, that is, BIST Error Count on the
DS90UB914Q-Q1 deserializer. To evaluate BIST in the external oscillator mode, both external oscillator and
PCLK need to be present.
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10.4.11.1 Sample BIST Sequence
Step 1. For the DS90UB91xQ-Q1 FPD-Link III chipset, BIST Mode is enabled through the BISTEN pin of
DS90UB914Q-Q1 FPD-Link III deserializer. The desired clock source is selected through the GPIO0 and GPIO1
pins as shown in Table 4.
Step 2. The DS90UB913Q-Q1 serializer is woken up through the back channel if it is not already on. The SSO
pattern on the data pins is send through the FPD-Link III to the deserializer. Once the serializer and deserializer
are in the BIST mode and the deserializer acquires Lock, the PASS pin of the deserializer goes high and BIST
starts checking data stream. If an error in the payload is detected the PASS pin will switch low for one half of the
clock period. During the BIST test, the PASS output can be monitored and counted to determine the payload
error rate.
Step 3. To stop the BIST mode, the deserializer BISTEN pin is set low. The deserializer stops checking the data.
The final test result is not maintained on the PASS pin. To monitor the BIST status, check the BIST Error Count
register, 0x25 on the deserializer.
Step 4. The link returns to normal operation after the deserailzer BISTEN pin is low. Figure 44 shows the
waveform diagram of a typical BIST test for two cases. Case 1 is error free, and Case 2 shows one with multiple
errors. In most cases, it is difficult to generate errors due to the robustness of the link (differential data
transmission, and so forth), thus they may be introduced by greatly extending the cable length, faulting the
interconnect, or by reducing signal condition enhancements (RX equalization).
Normal
Step 1: DES in BIST
BIST
Wait
Step 2: Wait, SER in BIST
BIST
start
Step 3: DES in Normal
Mode - check PASS
BIST
stop
Step 4: DES/SER in Normal
Figure 43. AT-Speed BIST System Flow Diagram
DES Outputs
BISTEN
(DES)
LOCK
PCLK
(RFB = L)
ROUT[0:11],
HS, VS
Case 1 - Pass
SSO
DATA
(internal)
PASS
Prior Result
PASS
PASS
X
X
Case 2 - Fail
X = bit error(s)
DATA
(internal)
X
FAIL
Prior Result
Normal
BIST
Result
Held
BIST Test
BIST Duration
Normal
Figure 44. BIST Timing Diagram
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10.5 Register Maps
Table 7. DS90UB913Q-Q1 Control Registers
ADDR
(HEX)
0x00
0x01
NAME
BITS
FIELD
R/W
DESCRIPTION
7-bit address of serializer; 0x58'h
(0101_1000X'b) default
7:1
DEVICE ID
0
SER ID SEL
0: Device ID is from ID[x]
1: Register I2C Device ID overrides ID[x]
7
RSVD
Reserved
6
RDS
RW
0
Digital Output Drive Strength
1: High Drive Strength
0: Low Drive Strength
5
VDDIO Control
RW
1
Auto Voltage Control
1: Enable
0: Disable
4
VDDIO MODE
RW
1
VDDIOVoltage set
0: 1.8V
1: 3.3V
2
I C Device ID
RW
0x58'h
3
ANAPWDN
RW
0
This register can be set only through local I2C access
1: Analog power-down : Powers Down the analog block
in the serializer
0: No effect
2
RSVD
RW
0
Reserved
1
DIGITAL
RESET1
RW
0
1: Resets the digital block except for register values
values. Does not affect device I2C Bus or Device ID.
This bit is self-clearing.
0: Normal Operation
0
DIGITAL RESET0
RW
1
1: Digital Reset, resets the entire digital block including
all register values.This bit is self-clearing.
0: Normal Operation.
Power and Reset
0x02
0x03
DEFAULT
RESERVED
General
Configuration
7
RX CRC Checker
Enable
RW
1
Back-channel CRC Checker Enable
1:Enabled
0:Disabled
6
TX Parity Generator
Enable
RW
1
Forward channel Parity Generator Enable
1: Enable
0: Disable
5
CRC Error Reset
RW
0
Clear CRC Error Counters.
This bit is NOT self-clearing.
1: Clear Counters
0: Normal Operation
0
Automatically Acknowledge I2C Remote Write
The mode works when the system is LOCKed.
1: Enable: When enabled, I2C writes to the deserializer
(or any remote I2C Slave, if I2C PASS ALL is enabled)
are immediately acknowledged without waiting for the
deserializer to acknowledge the write. The accesses are
then re-mapped to address specified in 0x06.
0: Disable
4
I2C Remote Write
Auto Acknowledge
RW
3
I2C Pass All
RW
0
1: Enable Forward Control Channel pass-through of all
I2C accesses to I2C Slave IDs that do not match the
Serializer I2C Slave ID. The I2C accesses are then
remapped to address specified in register 0x06.
0: Enable Forward Control Channel pass-through only of
I2C accesses to I2C Slave IDs matching either the
remote Deserializer Slave ID or the remote Slave ID.
2
I2C PASSTHROUGH
RW
1
I2C Pass-Through Mode
0: Pass-Through Disabled
1: Pass-Through Enabled
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Register Maps (continued)
Table 7. DS90UB913Q-Q1 Control Registers (continued)
ADDR
(HEX)
NAME
BITS
1
0x03
FIELD
OV_CLK2PLL
R/W
RW
RW
7
RSVD
RW
0
Reserved
6
RSVD
RW
0
Reserved.
RW
0
Allows overriding mode select bits coming from backchannel
1: Overrides MODE select bits
0: Does not override MODE select bits
RESERVED
Mode Select
5
MODE_OVERRIDE
4
MODE_UP To DATE
R
0
Indicates that the status of mode select from deserializer
is up to date
3
Pin_MODE_12–bit
High Frequency
R
0
1: 12-bit high-frequency mode is selected.
0: 12-bit high-frequency mode is not selected.
2
Pin_MODE_10–bit
mode
R
0
1: 10-bit mode is selected.
0: 10-bit mode is not selected.
DESAlias
7:1
0
SlaveID
7:1
0
42
RSVD
Reserved
Desializer Device ID
RW
0x00
7-bit Deserializer Device ID configures the I2C Slave ID
of the remote deserializer. A value of 0 in this field
disables I2C access to the remote deserializer. This field
is automatically configured by the Bidirectional Control
Channel once RX Lock has been detected. Software
may overwrite this value, but should also assert the
FREEZE DEVICE ID bit to prevent overwriting by the
Bidirectional Control Channel.
Freeze Device ID
RW
0
1: Prevents auto-loading of the Deserializer Device ID by
the bidirectional control channel. The ID will be frozen at
the value written.
0: Update
0
7-bit Remote Deserializer Device Alias ID Configures the
decoder for detecting transactions designated for an I2C
deserializer device. The transaction will be remapped to
the address specified in the DES ID register.
A value of 0 in this field disables access to the remote
I2C Slave.
DES ID
0
0x08
1
Pixel Clock Edge Select
1: Parallel Interface Data is strobed on the Rising Clock
Edge.
0: Parallel Interface Data is strobed on the Falling Clock
Edge.
TRFB
7:1
0x07
0
0
1:0
0x06
DESCRIPTION
1:Enabled : When enabled this registers overrides the
clock to PLL mode (External Oscillator mode or Direct
PCLK mode) defined through MODE pin and allows
selection through register 0x35 in the serializer
0: Disabled : When disabled, Clock to PLL mode
(External Oscillator mode or Direct PCLK mode) is
defined through MODE pin on the serializer.
General
Configuration
0x04
0x05
DEFAULT
Deserializer ALIAS ID
RW
RSVD
Reserved
SLAVE ID
7-bit Remote Slave Device ID Configures the physical
I2C address of the remote I2C Slave device attached to
the remote deserializer. If an I2C transaction is
addressed to the Slave Alias ID, the transaction will be
remapped to this address before passing the transaction
across the Bidirectional Control Channel to the
deserializer. A value of 0 in this field disables access to
the remote I2C slave.
RSVD
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0x00
Reserved
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SNLS420D – JULY 2012 – REVISED JULY 2015
Register Maps (continued)
Table 7. DS90UB913Q-Q1 Control Registers (continued)
ADDR
(HEX)
0x09
NAME
SlaveAlias
BITS
7:1
0
FIELD
SLAVE ALIAS ID
R/W
RW
DEFAULT
DESCRIPTION
0x00
7-bit Remote Slave Device Alias ID Configures the
decoder for detecting transactions designated for an I2C
Slave device attached to the remote deserializer. The
transaction will be remapped to the address specified in
the Slave ID register. A value of 0 in this field disables
access to the remote I2C Slave.
RSVD
Reserved
0x0A
CRC Errors
7:0
CRC Error Byte 0
R
0
Number of back-channel CRC errors during normal
operation. Least Significant byte
0x0B
CRC Errors
7:0
CRC Error Byte 1
R
0
Number of back-channel CRC errors during normal
operation. Most Significant byte
7:5
Rev-ID
R
0
Revision ID
0x00: Production
4
RX Lock Detect
R
0
1: RX LOCKED
0: RX not LOCKED
3
BIST CRC Error
Status
R
0
1: CRC errors in BIST mode
0: No CRC errors in BIST mode
2
PCLK Detect
R
0
1: Valid PCLK detected
0: Valid PCLK not detected
0
1: CRC error is detected during communication with
deserializer.
This bit is cleared upon loss of link or assertion of CRC
ERROR RESET in register 0x04.
0: No effect
R
0
1: Cable link detected
0: Cable link not detected
This includes any of the following faults
— Cable Open
— + and - shorted
— Short to GND
— Short to battery
RW
0
Local GPIO Output Value This value is output on the
GPIO pin when the GPIO function is enabled, the local
GPIO direction is Output, and remote GPIO control is
disabled.
0x0C
General Status
1
0x0D
GPO[0]
and GPO[1]
Configuration
DES Error
R
0
LINK Detect
7
GPO1 Output Value
6
GPO1 Remote
Enable
RW
1
Remote GPIO Control
1: Enable GPIO control from remote deserializer. The
GPIO pin needs to be an output, and the value is
received from the remote deserializer.
0: Disable GPIO control from remote deserializer.
5
GPO1 Direction
RW
0
1: Input
0: Output
4
GPO0 Enable
RW
1
1: GPIO enable
0: Tri-state
0
Local GPIO Output Value This value is output on the
GPIO pin when the GPIO function is enabled, the local
GPIO direction is Output, and remote GPIO control is
disabled.
3
GPO0 Output Value
RW
2
GPO0 Remote
Enable
RW
1
Remote GPIO Control
1: Enable GPIO control from remote deserializer. The
GPIO pin needs to be an output, and the value is
received from the remote deserializer.
0: Disable GPIO control from remote deserializer.
1
GPO0 Direction
RW
0
1: Input
0: Output
0
GPO0 Enable
RW
1
1: GPIO enable
0: Tri-state
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Register Maps (continued)
Table 7. DS90UB913Q-Q1 Control Registers (continued)
ADDR
(HEX)
0x0E
NAME
GPO[2]
and GPO[3]
Configuration
BITS
DEFAULT
DESCRIPTION
0
RW
0
Remote GPIO Control
1: Enable GPIO control from remote deserializer. The
GPIO pin needs to be an output, and the value is
received from the remote deserializer.
0: Disable GPIO control from remote deserializer.
GPO3 Direction
RW
1
1: Input
0: Output
4
GPO3 Enable
RW
1
1: GPIO enable
0: Tri-state
3
GPO2 Output Value
RW
0
Local GPIO Output Value This value is output on the
GPIO pin when the GPIO function is enabled, the local
GPIO direction is Output, and remote GPIO control is
disabled.
2
GPO2 Remote
Enable
RW
1
Remote GPIO Control
1: Enable GPIO control from remote deserializer. The
GPIO pin needs to be an output, and the value is
received from the remote deserializer.
0: Disable GPIO control from remote deserializer.
1
GPO2 Direction
RW
0
1: Input
0: Output
0
GPO2 Enable
RW
1
1: GPIO enable
0: Tri-state
7
GPO3 Output Value
6
GPO3 Remote
Enable
5
4:3
2
RW
RSVD
Reserved
SDA Output Delay
00
SDA Output Delay This field configures output delay on
the SDA output. Setting this value will increase output
delay in units of 50 ns. Nominal output delay values for
SCL to SDA are:
00 : 350 ns
01: 400 ns
10: 450 ns
11: 500 ns
0
Disable Remote Writes to Local Registers Setting this bit
to a 1 will prevent remote writes to local device registers
from across the control channel. This prevents writes to
the serializer registers from an I2C master attached to
the deserializer. Setting this bit does not affect remote
access to I2C slaves at the serializer.
0
Speed up I2C Bus Watchdog Timer
1: Watchdog Timer expires after approximately 50
microseconds
0: Watchdog Timer expires after approximately 1
second.
0
1. Disable I2C Bus Watchdog Timer When the I2C
Watchdog Timer may be used to detect when the I2C
bus is free or hung up following an invalid termination of
a transaction. If SDA is high and no signaling occurs for
approximately 1 second, the I2C bus will assumed to be
free. If SDA is low and no signaling occurs, the device
will attempt to clear the bus by driving 9 clocks on SCL
0: No effect
Local Write Disable
RW
RW
I2C Master Config
1
0
44
R/W
Local GPIO Output Value This value is output on the
GPIO pin when the GPIO function is enabled, the local
GPIO direction is Output, and remote GPIO control is
disabled.
7:5
0x0F
FIELD
I2C Bus Timer
Speed up
I2C Bus Timer
Disable
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RW
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SNLS420D – JULY 2012 – REVISED JULY 2015
Register Maps (continued)
Table 7. DS90UB913Q-Q1 Control Registers (continued)
ADDR
(HEX)
NAME
BITS
7
0x10
0x11
2
FIELD
R/W
DEFAULT
RSVD
Reserved
6:4
SDA Hold Time
RW
0x1
Internal SDA Hold Time. This field configures the amount
of internal hold time provided for the SDA input relative
to the SCL input. Units are 50 ns.
3:0
I2C Filter Depth
RW
0x7
I2C Glitch Filter Depth This field configures the maximum
width of glitch pulses on the SCL and SDA inputs that
will be rejected. Units are 10 ns.
0x82
I2C Master SCL High Time This field configures the high
pulse width of the SCL output when the serializer is the
Master on the local I2C bus. Units are 50 ns for the
nominal oscillator clock frequency. The default value is
set to provide a minimum (4µs + 1µs of rise time for
cases where rise time is very fast) SCL high time with
the internal oscillator clock running at 26MHz rather than
the nominal 20 MHz.
I2C SCL Low Time This field configures the low pulse
width of the SCL output when the serializer is the Master
on the local I2C bus. This value is also used as the SDA
setup time by the I2C Slave for providing data prior to
releasing SCL during accesses over the Bidirectional
Control Channel. Units are 50 ns for the nominal
oscillator clock frequency. The default value is set to
provide a minimum (4.7 µs + 0.3 µs of fall time for cases
where fall time is very fast) SCL low time with the
internal oscillator clock running at 26 MHz rather than
the nominal 20 MHz.
I C Control
SCL High Time
DESCRIPTION
7:0
SCL High Time
RW
0x12
SCL LOW Time
7:0
SCL Low Time
RW
0x82
0x13
General-Purpose
Control
7:0
GPCR[7:0]
RW
0
7:3
RSVD
Reserved
2:1
Clock Source
RW
0x0
Allows choosing different OSC clock frequencies for
forward channel frame.
OSC Clock Frequency in Functional Mode when OSC
mode is selected or when the selected clock source is
not present, for example, missing PCLK/ External
Oscillator. See Table 9 for oscillator clock frequencies
when PCLK/ External Clock is missing.
0
BIST Enable
RW
0
0x14
BIST Control
0x15 0x1D
0x1E
BIST Control:
1: Enable BIST mode
0: Disable BIST mode
RESERVED
7:1
BCC Watchdog Timer
RW
0x7F
The watchdog timer allows termination of a control
channel transaction if it fails to complete within a
programmed amount of time. This field sets the
Bidirectional Control Channel Watchdog Timeout value
in units of 2ms. This field should not be set to 0.
0
BCC Watchdog Timer
Disable
RW
0
Disable Bidirectional Control Channel Watchdog Timer
1: Disables BCC Watchdog Timer operation
0: Enables BCC Watchdog Timer operation
BCC Watchdog
Control
0x1F0x29
0x2A
1: High
0: Low
RESERVED
CRC Errors
7:0
BIST Mode CRC
Errors Count
Copyright © 2012–2015, Texas Instruments Incorporated
R
0
Number of CRC Errors in the back channel when in
BIST mode
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Register Maps (continued)
Table 7. DS90UB913Q-Q1 Control Registers (continued)
ADDR
(HEX)
NAME
BITS
FIELD
R/W
0x2B 0x34
DESCRIPTION
RESERVED
7:4
0x35
DEFAULT
PLL Clock
Overwrite
RSVD
Reserved
3
PIN_LOCK to
External Oscillator
RW
0
Status of mode select pin
1: Indicates External Oscillator mode is selected by
mode-resistor
0: External Oscillator mode is not selected by moderesistor
2
PIN_LOCK to
Oscillator
RW
0
Status of mode select pin
1: Indicates PCLK mode is selected by mode-resistor
0: PCLK mode not selected by mode-resistor
1
LOCK to External
Oscillator
0
Affects only when 0x03[1]=1 (OV_CLK2PLL) and
0x35[0]=0.
1: Routes GPO3 directly to PLL
0: Allows PLL to lock to PCLK"
0
RSVD
RW
Reserved
Table 8. DS90UB914Q-Q1 Control Registers
ADDR
(HEX)
NAME
BITS
7:1
0x00
I2C Device ID
0
7:6
5
4:2
0x01
46
FIELD
R/W
DEFAULT
DEVICE ID
RW
0x60'h
Deserializer ID
Select
RW
0
DESCRIPTION
7-bit address of deserializer;
0x60h
0: Deserializer Device ID is set using address
coming from CAD
1: Register I2C Device ID overrides ID[x]
RSVD
Reserved
ANAPWDN
This register can be set only through local I2C
access
1: Analog power-down : Powers down the
analog block in the serializer
0: No effect
RW
0
RSVD
Reserved
Reset
1
Digital Reset 1
RW
0
Digital Reset Resets the entire digital block
except registers. This bit is self-clearing.
1: Reset
0: No effect
0
Digital Reset 0
RW
0
Digital Reset Resets the entire digital block
including registers. This bit is self-clearing.
1: Reset
0: No effect
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SNLS420D – JULY 2012 – REVISED JULY 2015
Table 8. DS90UB914Q-Q1 Control Registers (continued)
ADDR
(HEX)
0x02
NAME
BITS
0x03
R/W
DEFAULT
DESCRIPTION
7
RSVD
Reserved
6
RSVD
Reserved
5
Auto-Clock
RW
0
1: Output PCLK or OSC clock when not
LOCKED
0: Only PCLK
4
SSCG LFMODE
RW
0
1: Selects 8x mode for 10-18 MHz frequency
range in SSCG
0: SSCG running at 4X mode
SSCG
RW
0
SSCG Select
0000: Normal Operation, SSCG OFF
0001: fmod (kHz) PCLK/2168, fdev ±0.50%
0010: fmod (kHz) PCLK/2168, fdev ±1.00%
0011: fmod (kHz) PCLK/2168, fdev ±1.50%
0100: fmod (kHz) PCLK/2168, fdev ±2.00%
0101: fmod (kHz) PCLK/1300, fdev ±0.50%
0110: fmod (kHz) PCLK/1300, fdev ±1.00%
0111: fmod (kHz) PCLK/1300, fdev ±1.50%
1000: fmod (kHz) PCLK/1300, fdev ±2.00%
1001: fmod (kHz) PCLK/868, fdev ±0.50%
1010: fmod (kHz) PCLK/868, fdev ±1.00%
1011: fmod (kHz) PCLK/868, fdev ±1.50%
1100: fmod (kHz) PCLK/868, fdev ±2.00%
1101: fmod (kHz) PCLK/650, fdev ±0.50%
1110: fmod (kHz) PCLK/650, fdev ±1.00%
1111: fmod (kHz) PCLK/650, fdev ±1.50%
Note: This register should be changed only
after disabling SSCG.
7
RX Parity Checker
Enable
RW
1
Forward-Channel Parity Checker Enable
1: Enable
0: Disable
6
TX CRC Checker
Enable
RW
1
Back-Channel CRC Generator Enable
1: Enable
0: Disable
5
VDDIO Control
RW
1
Auto voltage control
1: Enable (auto-detect mode)
0: Disable
4
VDDIO Mode
RW
0
VDDIO voltage set
1: 3.3 V
0: 1.8 V
3
I2C Passthrough
RW
1
I2C Pass-Through Mode
1: Pass-Through Enabled
0: Pass-Through Disabled
General
Configuration 0
3:0
0x03
FIELD
General
Configuration 1
2
AUTO ACK
RW
0
Automatically Acknowledge I2C Remote Write
When enabled, I2C writes to the deserializer (or
any remote I2C Slave, if I2C PASS ALL is
enabled) are immediately acknowledged
without waiting for the deserializer to
acknowledge the write. The accesses are then
remapped to address specified in 0x06. This
allows I2C bus without LOCK.
1: Enable
0: Disable
1
Parity Error Reset
RW
0
Parity Error Reset, This bit is self-clearing.
1: Parity Error Reset
0: No effect
1
Pixel Clock Edge Select
1: Parallel Interface Data is strobed on the
Rising Clock Edge.
0: Parallel Interface Data is strobed on the
Falling Clock Edge.
General
Configuration 1
0
RRFB
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www.ti.com
Table 8. DS90UB914Q-Q1 Control Registers (continued)
ADDR
(HEX)
0x04
NAME
EQ Feature
Control 1
BITS
FIELD
7:0
EQ level - when
AEQ bypass is
enabled EQ setting
is provided by this
register
RW
7:1
Remote ID
RW
0x05
0x06
R/W
DEFAULT
0x00
SER ID
0
Freeze Device ID
Serializer Alias ID
SER Alias
0
0x08
Slave ID[0]
7:1
0
0x09
Slave ID[1]
7:1
0
0x0A
Slave ID[2]
7:1
0
0x0B
Slave ID[3]
7:1
0
48
Equalization gain
0x00 = ~0.0 dB
0x01 = ~4.5 dB
0x03 = ~6.5 dB
0x07 = ~7.5 dB
0x0F = ~8.0 dB
0x1F = ~11.0 dB
0x3F = ~12.5 dB
RESERVED
RW
0x0C
0
7:1
0x07
DESCRIPTION
RW
0x00
Remote Serializer ID
Freeze Serializer Device ID Prevent autoloading of the serializer Device ID from the
Forward Channel. The ID will be frozen at the
value written.
7-bit Remote Serializer Device Alias ID
Configures the decoder for detecting
transactions designated for an I2C deserializer
device. The transaction will be remapped to the
address specified in the SER ID register. A
value of 0 in this field disables access to the
remote I2C Slave.
RSVD
Reserved
Slave ID0
7-bit Remote Slave Device ID 0 Configures the
physical I2C address of the remote I2C Slave
device attached to the remote serializer. If an
I2C transaction is addressed to the Slave Alias
ID0, the transaction will be remapped to this
address before passing the transaction across
the Bidirectional Control Channel to the
serializer.
RW
0
RSVD
Reserved
Slave ID1
7-bit Remote Slave Device ID 1 Configures the
physical I2C address of the remote I2C Slave
device attached to the remote serializer. If an
I2C transaction is addressed to the Slave Alias
ID1, the transaction will be remapped to this
address before passing the transaction across
the Bidirectional Control Channel to the
serializer.
RW
0
RSVD
Reserved
Slave ID2
7-bit Remote Slave Device ID 2 Configures the
physical I2C address of the remote I2C Slave
device attached to the remote serializer. If an
I2C transaction is addressed to the Slave Alias
ID2, the transaction will be remapped to this
address before passing the transaction across
the Bidirectional Control Channel to the
serializer.
RW
0x00
RSVD
Reserved
Slave ID3
7-bit Remote Slave Device ID 3 Configures the
physical I2C address of the remote I2C Slave
device attached to the remote serializer. If an
I2C transaction is addressed to the Slave Alias
ID3, the transaction will be remapped to this
address before passing the transaction across
the Bidirectional Control Channel to the
serializer.
RSVD
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RW
0
Reserved
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www.ti.com
SNLS420D – JULY 2012 – REVISED JULY 2015
Table 8. DS90UB914Q-Q1 Control Registers (continued)
ADDR
(HEX)
0x0C
NAME
Slave ID[4]
BITS
7:1
0
0x0D
Slave ID[5]
7:1
0
0x0E
Slave ID[6]
7:1
0
0x0F
Slave ID[7]
7:1
0
0x10
Slave Alias[0]
7:1
0
0x11
Slave Alias[1]
7:1
0
FIELD
Slave ID4
R/W
RW
DEFAULT
DESCRIPTION
0
7-bit Remote Slave Device ID 4 Configures the
physical I2C address of the remote I2C Slave
device attached to the remote serializer. If an
I2C transaction is addressed to the Slave Alias
ID4, the transaction will be remapped to this
address before passing the transaction across
the Bidirectional Control Channel to the
serializer.
RSVD
Reserved
Slave ID5
7-bit Remote Slave Device ID 5 Configures the
physical I2C address of the remote I2C Slave
device attached to the remote serializer. If an
I2C transaction is addressed to the Slave Alias
ID5 , the transaction will be remapped to this
address before passing the transaction across
the Bidirectional Control Channel to the
serializer.
RW
0x00
RSVD
Reserved
Slave ID6
7-bit Remote Slave Device ID 6 Configures the
physical I2C address of the remote I2C Slave
device attached to the remote serializer. If an
I2C transaction is addressed to the Slave Alias
ID6, the transaction will be remapped to this
address before passing the transaction across
the Bidirectional Control Channel to the
serializer.
RW
0
RSVD
Reserved
Slave ID7
7-bit Remote Slave Device ID 7 Configures the
physical I2C address of the remote I2C Slave
device attached to the remote serializer. If an
I2C transaction is addressed to the Slave Alias
ID7, the transaction will be remapped to this
address before passing the transaction across
the Bidirectional Control Channel to the
serializer.
RW
0x00
RSVD
Reserved
Slave Alias ID0
7-bit Remote Slave Device Alias ID 0
Configures the decoder for detecting
transactions designated for an I2C Slave device
attached to the remote serializer. The
transaction will be remapped to the address
specified in the Slave ID0 register. A value of 0
in this field disables access to the remote I2C
Slave.
RW
0x00
RSVD
Reserved
Slave Alias ID1
7-bit Remote Slave Device Alias ID 1
Configures the decoder for detecting
transactions designated for an I2C Slave device
attached to the remote serializer. The
transaction will be remapped to the address
specified in the Slave ID1 register. A value of 0
in this field disables access to the remote I2C
Slave.
RSVD
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RW
0x00
Reserved
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Table 8. DS90UB914Q-Q1 Control Registers (continued)
ADDR
(HEX)
0x12
NAME
Slave Alias[2]
BITS
7:1
0
0x13
Slave Alias[3]
7:1
0
0x14
Slave Alias[4]
7:1
0
0x15
Slave Alias[5]
7:1
0
0x16
Slave Alias[6]
7:1
0
0x17
Slave Alias[7]
7:1
0
0x18
50
Parity Errors
Threshold
7:0
FIELD
Slave Alias ID2
R/W
RW
DEFAULT
DESCRIPTION
0x00
7-bit Remote Slave Device Alias ID 2
Configures the decoder for detecting
transactions designated for an I2C Slave device
attached to the remote serializer. The
transaction will be remapped to the address
specified in the Slave ID2 register. A value of 0
in this field disables access to the remote I2C
Slave.
RSVD
Reserved
Slave Alias ID3
7-bit Remote Slave Device Alias ID 3
Configures the decoder for detecting
transactions designated for an I2C Slave device
attached to the remote serializer. The
transaction will be remapped to the address
specified in the Slave ID3 register. A value of 0
in this field disables access to the remote I2C
Slave.
RW
0x00
RSVD
Reserved
Slave Alias ID4
7-bit Remote Slave Device Alias ID 4
Configures the decoder for detecting
transactions designated for an I2C Slave device
attached to the remote serializer. The
transaction will be remapped to the address
specified in the Slave ID4 register. A value of 0
in this field disables access to the remote I2C
Slave.
RW
0x00
RSVD
Reserved
Slave Alias ID5
7-bit Remote Slave Device Alias ID 5
Configures the decoder for detecting
transactions designated for an I2C Slave device
attached to the remote serializer. The
transaction will be remapped to the address
specified in the Slave ID5 register. A value of 0
in this field disables access to the remote I2C
Slave.
RW
0x00
RSVD
Reserved
Slave Alias ID6
7-bit Remote Slave Device Alias ID 6
Configures the decoder for detecting
transactions designated for an I2C Slave device
attached to the remote serializer. The
transaction will be remapped to the address
specified in the Slave ID6 register. A value of 0
in this field disables access to the remote I2C
Slave.
RW
0x00
RSVD
Reserved
Slave Alias ID7
7-bit Remote Slave Device Alias ID 7
Configures the decoder for detecting
transactions designated for an I2C Slave device
attached to the remote serializer. The
transaction will be remapped to the address
specified in the Slave ID7 register. A value of 0
in this field disables access to the remote I2C
Slave.
RW
0x00
RSVD
Reserved
Parity Error
Threshold Byte 0
Parity errors threshold on the Forward channel
during normal information. This sets the
maximum number of parity errors that can be
counted using register 0x1A.
Least significant Byte.
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RW
0
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SNLS420D – JULY 2012 – REVISED JULY 2015
Table 8. DS90UB914Q-Q1 Control Registers (continued)
ADDR
(HEX)
NAME
0x19
Parity Errors
Threshold
0x1A
0x1B
0x1C
BITS
FIELD
R/W
DEFAULT
DESCRIPTION
7:0
Parity Error
Threshold Byte 1
RW
0
Parity errors threshold on the Forward channel
during normal operation. This sets the
maximum number of parity errors that can be
counted using register 0x1B.
Most significant Byte
Parity Errors
7:0
Parity Error Byte 0
RW
0
Number of parity errors in the Forward channel
during normal operation.
Least significant Byte
Parity Errors
7:0
Parity Error Byte 1
RW
0
Number of parity errors in the Forward channel
during normal operation
Most significant Byte
7:4
Rev-ID
R
0
Revision ID
0x0000: Production
3
RSVD
2
Parity Error
R
1
Signal Detect
R
0
Lock
R
7
GPIO1 Output Vaue
6
RSVD
Reserved
0
General Status
0
0
0
RW
0x1D
0x1D
GPIO[1] and
GPIO[0] Config
5
1: Serial input detected
0: Serial input not detected
Deserializer CDR, PLL's clock to recovered
clock frequency
1: Deserializer locked to recovered clock
0: Deserializer not locked
Local GPIO Output Value This value is the
output on the GPIO pin when the GPIO function
is enabled, the local GPIO direction is Output.
Reserved
GPIO1 Direction
GPIO[1] and
GPIO[0] Config
Parity Error detected
1: Parity Errors detected
0: No Parity Errors
1
RW
Local GPIO Direction
1: Input
0: Output
4
GPIO1 Enable
RW
1
GPIO Function Enable
1: Enable GPIO operation
0: Enable normal operation
3
GPIO0 Output Value
RW
0
Local GPIO Output Value This value is output
on the GPIO pin when the GPIO function is
enabled, the local GPIO direction is Output.
2
RSVD
1
GPIO0 Direction
RW
1
Local GPIO Direction
1: Input
0: Output
0
GPIO0 Enable
RW
1
GPIO Function Enable
1: Enable GPIO operation
0: Enable normal operation
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Table 8. DS90UB914Q-Q1 Control Registers (continued)
ADDR
(HEX)
0x1E
0x1F
NAME
BITS
FIELD
R/W
DEFAULT
DESCRIPTION
7
GPIO3 Output Vaue
RW
0
Local GPIO Output Value This value is the
output on the GPIO pin when the GPIO function
is enabled, the local GPIO direction is Output.
6
RSVD
5
GPIO3 Direction
RW
1
Local GPIO Direction
1: Input
0: Output
4
GPIO3 Enable
RW
1
GPIO Function Enable
1: Enable GPIO operation
0: Enable normal operation
3
GPIO2 Output Value
RW
0
Local GPIO Output Value This value is output
on the GPIO pin when the GPIO function is
enabled, the local GPIO direction is Output.
2
RSVD
1
GPIO2 Direction
RW
1
Local GPIO Direction
1: Input
0: Output
0
GPIO2 Enable
RW
1
GPIO Function Enable
1: Enable GPIO operation
0: Enable normal operation
GPIO[3] and
GPIO[2] Config
Mode and OSS
Select
7
OEN_OSS Override
RW
0
6
OEN Select
RW
0
OEN configuration from register
5
OSS Select
R
0
OSS_SEL configuration from register
4
MODE_OVERRIDE
RW
0
Allows overriding mode select bits coming from
back-channel
1: Overrides MODE select bits
0: Does not override MODE select bits
3
PIN_MODE_12–bit
HF mode
R
0
2
PIN_MODE_10-bit
mode
R
0
0
52
Reserved
Allows overriding OEN and OSS select coming
from Pins
1: Overrides OEN/OSS_SEL selected by pins
0: Does NOT override OEN/OSS_SEL select
by pins
1
0x20
Reserved
MODE_12–bit High
Frequency
MODE_10–bit mode
7:1
BCC Watchdog
timer
0
BCC Watchdog
Timer Disable
RW
RW
RW
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Status of mode select pin
0
Selects 12-bit high-frequency mode. This bit is
automatically updated by the mode settings
from RX unless MODE_OVERRIDE is SET
1: 12-bit high-frequency mode is selected.
0: 12-bit high-frequency mode is not selected.
0
Selects 10-bit mode. This bit is automatically
updated by the mode settings from RX unless
MODE_OVERRIDE is SET
1: Enables 10-bit mode.
0: Disables 10-bit mode.
0
The watchdog timer allows termination of a
control channel transaction if it fails to complete
within a programmed amount of time. This field
sets the Bidirectional Control Channel
Watchdog Timeout value in units of 2ms. This
field should not be set to 0.
0
Disable Bidirectional Control Channel
Watchdog Timer
1: Disables BCC Watchdog Timer operation
0: Enables BCC Watchdog Timer operation
BCC Watchdog
Control
RW
Status of mode select pin
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SNLS420D – JULY 2012 – REVISED JULY 2015
Table 8. DS90UB914Q-Q1 Control Registers (continued)
ADDR
(HEX)
0x21
NAME
I2C Control 1
BITS
FIELD
R/W
DEFAULT
7
I2C pass-through all
RW
0
I2C Pass-Through All Transactions
0: Disabled
1: Enabled
6:4
I2C SDA Hold
RW
0
Internal SDA Hold Time This field configures
the amount of internal hold time provided for
the SDA input relative to the SCL input. Units
are 50ns.
3:0
I2C Filter Depth
RW
0
I2C Glitch Filter Depth This field configures the
maximum width of glitch pulses on the SCL and
SDA inputs that will be rejected. Units are 10ns.
Control Channel Sequence Error Detected This
bit indicates a sequence error has been
detected in forward control channel.
1: If this bit is set, an error may have occurred
in the control channel operation
0: No forward channel errors have been
detected on the control channel
7
Forward Channel
Sequence Error
R
0
6
Clear Sequence
Error
RW
0
5
RSVD
Reserved
SDA Output Delay
0
SDA Output Delay This field configures output
delay on the SDA output. Setting this value will
increase output delay in units of 50 ns. Nominal
output delay values for SCL to SDA are:
00 : 350ns
01: 400ns
10: 450ns
11: 500ns
0
Disable Remote Writes to local registers
Setting this bit to a 1 will prevent remote writes
to local device registers from across the control
channel. This prevents writes to the deserializer
registers from an I2C master attached to the
serializer. Setting this bit does not affect remote
access to I2C slaves at the deserializer.
0
Speed up I2C Bus Watchdog Timer
1: Watchdog Timer expires after approximately
50 µs
0: Watchdog Timer expires after approximately
1 s.
Disable I2C Bus Watchdog Timer When the I2C
Watchdog Timer may be used to detect when
the I2C bus is free or hung up following an
invalid termination of a transaction. If SDA is
high and no signaling occurs for approximately
1 second, the I2C bus will assumed to be free.
If SDA is low and no signaling occurs, the
device will attempt to clear the bus by driving 9
clocks on SCL
4:3
0x22
RW
I2C Control 2
2
Local Write Disable
RW
2
1
General-Purpose
Control
RW
RW
0
7:0
GPCR
RW
0
7:4
RSVD
Reserved
BIST Pin
Configuration
RW
1
Bist Configured through Pin.
1: Bist configured through pin.
0: Bist configured through register bit
"reg_24[0]"
BIST Clock Source
RW
00
BIST Clock Source
See Table 10
BIST Enable
RW
0
BIST Control
1: Enabled
0: Disabled
3
0x24
I C Bus Timer
Speed up
Clears the Sequence Error Detect bit
I2C Bus Timer
Disable
0
0x23
DESCRIPTION
BIST Control
2:1
0
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Scratch Register
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Table 8. DS90UB914Q-Q1 Control Registers (continued)
ADDR
(HEX)
NAME
BITS
0x25
Parity Error Count
7:0
FIELD
BIST Error Count
R/W
DEFAULT
DESCRIPTION
R
0
Number of Forward channel Parity errors in the
BIST mode.
0x26 0x3B
RESERVED
7:2
0x3C
Oscillator output
divider select
1:0
RSVD
Reserved
OSC OUT DIVIDER
SEL
Selects the divider for the OSC clock out on
PCLK when system is not locked and selected
by OEN/OSSSEL 0x02[5]
00: 50M (± 30%)
01: 25M (± 30%)
1X: 12.5M (± 30%)
RW
0x3D 0x3E
RESERVED
7:5
0x3F
CML Output
Enable
4
3:0
0x40
0x41
0x42
SCL High Time
SCL Low Time
7:0
RSVD
CML OUT Enable
Reserved
RW
0x4E
54
1
0: CML Loop-through Driver is powered up
1: CML Loop-through Driver is powered down.
RSVD
Reserved
SCL High Time
0x82
I2C Master SCL High Time This field configures
the high pulse width of the SCL output when
the deserializer is the Master on the local I2C
bus. Units are 50 ns for the nominal oscillator
clock frequency. The default value is set to
provide a minimum (4μs + 0.3μs of rise time for
cases where rise time is very fast) SCL high
time with the internal oscillator clock running at
26MHz rather than the nominal 20MHz.
0x82
I2C SCL Low Time This field configures the low
pulse width of the SCL output when the
deserializer is the Master on the local I2C bus.
This value is also used as the SDA setup time
by the I2C Slave for providing data prior to
releasing SCL during accesses over the
Bidirectional Control Channel. Units are 50 ns
for the nominal oscillator clock frequency. The
default value is set to provide a minimum
(4.7µs + 0.3µs of fall time for cases where fall
time is very fast) SCL low time with the internal
oscillator clock running at 26MHz rather than
the nominal 20MHz.
7:0
SCL Low Time
7:2
RSVD
RW
RW
Reserved
1
Force Back Channel
Error
RW
0
1: This bit introduces multiple errors into Back
channel frame.
0: No effect
0
Force One Back
Channel Error
RW
0
1: This bit introduces ONLY one error into Back
channel frame. Self clearing bit
0: No effect
CRC Force Error
0x43 0x4C
0x4D
0
RESERVED
AEQ Test Mode
Select
EQ Value
7
RSVD
6
AEQ Bypass
5:0
RSVD
7:0
AEQ / Manual Eq
Readback
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Reserved
RW
0
Bypass AEQ and use set manual EQ value
using register 0x04
Reserved
R
0
Read back the adaptive and manual
Equalization value
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SNLS420D – JULY 2012 – REVISED JULY 2015
Table 9. Clock Sources for Forward Channel Frame on the Serializer During Normal Operation
DS90UB913Q
REG 0x14 [2:1]
10-BIT
MODE
12-BIT
HIGH-FREQUENCY MODE
12-BIT
LOW-FREQUENCY MODE
00
50 MHz
37.5 MHz
25 MHz
01
100 MHz
75 MHz
50 MHz
10
50 MHz
37.5 MHz
25 MHz
11
25MHz
18.75 MHz
12.5 MHz
Table 10. BIST Clock Sources
DS90UB914Q
REG 0x24 [2:1]
10-BIT
MODE
12-BIT
HIGH-FREQUENCY MODE
12-BIT
LOW-FREQUENCY MODE
00
PCLK
PCLK
PCLK
01
100 MHz
75 MHz
50 MHz
10
50 MHz
37.5 MHz
25 MHz
11
25MHz
18.75 MHz
12.5 MHz
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11 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
11.1 Applications Information
The serializer and deserializer support only AC-coupled interconnects through an integrated DC-balanced
decoding scheme. External AC-coupling capacitors must be placed in series in the FPD-Link III signal path as
illustrated in Figure 45.
DOUT+
RIN+
DOUT-
RIN-
D
R
Figure 45. AC-Coupled Connection
For high-speed FPD-Link III transmissions, the smallest available package should be used for the AC-coupling
capacitor. This will help minimize degradation of signal quality due to package parasitics. The I/Os require a
100-nF AC-coupling capacitors to the line.
11.2 Typical Application
DS90UB913Q
Serializer
DS90UB914Q
Deserializer
FPD-Link III
Camera Data
DOUT+
10 or 12
Image
Sensor
DATA
HSYNC
DIN[11:0] or
DIN[9:0]
HSYNC,
VSYNC
VSYNC
Pixel Clock
4
PCLK
DOUT-
Camera Data
10 or 12
RIN+
RIN-
ROUT[11:0]
or
ROUT[9:0]
HSYNC,
VSYNC
Bi-Directional
Control Channel
PCLK
GPO[3:0]
GPIO[3:0]
GPO[3:0]
SDA
Camera Unit
SCL
DATA
HSYNC
VSYNC
Pixel Clock
4
GPIO[3:0]
SDA
SDA
SCL
SCL
ECU Module
Microcontroller
SDA
SCL
Figure 46. Application Block Diagram
11.2.1 Design Requirements
11.2.1.1 Transmission Media
The DS90UB91xQ-Q1 chipset is intended to be used in a point-to-point configuration through a shielded twisted
pair cable. The serializer and deserializer provide internal termination to minimize impedance discontinuities. The
interconnect (cable and connectors) should have a differential impedance of 100 Ω. The maximum length of
cable that can be used is dependent on the quality of the cable (gauge, impedance), connector, board
(discontinuities, power plane), the electrical environment (for example, power stability, ground noise, input clock
jitter, PCLK frequency, and so forth). The resulting signal quality at the receiving end of the transmission media
may be assessed by monitoring the differential eye opening of the serial data stream. A differential probe should
be used to measure across the termination resistor at the CMLOUTP/N pins. Figure 20 illustrates the minimum
eye width and eye height that is necessary for bit error free operation.
56
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SNLS420D – JULY 2012 – REVISED JULY 2015
Typical Application (continued)
11.2.1.2 Adaptive Equalizer – Loss Compensation
The adaptive equalizer is designed to compensate for signal degradation due to the differential insertion loss of
the interconnect components. There are limits to the amount of loss that can be compensated – these limits are
defined by the gain curve of the equalizer. In addition, there is an inherent tolerance for loss defined by the delta
between the minimum VDO of the serializer and the input threshold (Vswing) of the deserializer. In order to
determine the maximum cable reach, other factors that affect signal integrity such as jitter, skew, ISI, crosstalk,
and so forth, need to be taken into consideration. Figure 49 illustrates the maximum allowable interconnect loss
with the adaptive equalizer at its maximum gain setting (914 equalizer gain).
11.2.2 Detailed Design Procedure
Figure 47 shows the typical connection of a DS90UB913Q-Q1 serializer.
DS90UB913Q (SER)
VDDIO
VDDIO
C3
1.8V
VDDT
C4
C8
C9
C13
1.8V
DIN0
DIN1
DIN2
DIN3
DIN4
DIN5
DIN6
DIN7
DIN8
DIN9
DIN10
DIN11
HS
VS
PCLK
LVCMOS
Parallel
Bus
1.8V
VDDPLL
C5
C14
C10
FB1
1.8V
VDDCML
C6
C11
C15
C7
C12
FB2
1.8V
VDDD
C1
Serial
FPD-Link III
Interface
DOUT+
DOUTC2
10 k:
MODE
1.8V
RID
10 k:
LVCMOS
Control
Interface
ID[X]
RID
PDB
GPO[0]
GPO[1]
GPO[2]
GPO[3]
GPO
Control
Interface
VDDIO
RPU
I2C
Bus
Interface
RPU
SCL
FB3
SDA
FB4
C16
Optional
Optional
C17
RES
DAP (GND)
NOTE:
C1 - C2 = 0.1 PF (50 WV)
C3 ± C7 = 0.01 PF
C8 - C12 = 0.1 PF
C13 - C14 = 4.7 PF
C15 = 22 PF
C16 - C17 = >100 pF
RPU = 1 k: to 4.7 k:
RID (see ID[x] Resistor Value Table)
FB1 - FB4: Impedance = 1 k: (@ 100 MHz)
low DC resistance (<1:)
The "Optional" components shown are
provisions to provide higher system noise
immunity and will therefore result in higher
performance.
Figure 47. DS90UB913Q-Q1 Typical Connection Diagram — Pin Control
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Typical Application (continued)
Figure 48 shows a typical connection of the DS90UB914Q-Q1 deserializer.
DS90UB914Q (Des)
1.8V
VDDD
C3
C11
C4
C12
C5
C13
VDDIO
VDDIO1
C8
VDDR
C16
C18
VDDIO2
C9
VDDSSCG
VDDIO3
C10
1.8V
VDDPLL
FB1
C6
C14
C17
FB2
C7
C15
C19
1.8V
VDDCML
C1
RIN1+
Serial
FPD-Link II
Interface
RIN1-
C2
RIN0+
C1
RIN0-
C2
1.8V
GPIO[0]
GPIO[1]
GPIO[2]
GPIO[3]
MODE
10 k:
RMODE
ROUT0
ROUT1
ROUT2
ROUT3
ROUT4
ROUT5
ROUT6
LVCMOS
Parallel
Outputs
ROUT7
ROUT8
ROUT9
ROUT10
ROUT11
HS
VS
PCLK
LOCK
PASS
1.8V
10 k:
IDx[0]
RID0
PDB
SEL
OEN
OSS_SEL
BISTEN
1.8V
VDDIO
10 k:
IDx[1]
RPU
I2C
Bus
Interface
RPU
RID1
SCL
FB3
SDA
FB4
C20
C21
Optional
Optional
RES_PIN43
DAP (GND)
NOTE:
C1 - C2 = 0.1 PF (50 WV)
C3 - C10 = 0.01 PF
C11 - C16 = 0.1 PF
C17 - C18 = 4.7 PF
C19 = 22 PF
C20 - C21 = >100 pF
RPU = 1 k: to 4.7 k:
RID (see ID[x] Resistor Value Table)
FB1 - FB4: Impedance = 1 k: (@ 100 MHz)
low DC resistance (<1:)
The "Optional" components shown are
provisions to provide higher system noise
immunity and will therefore result in higher
performance.
Figure 48. DS90UB914Q-Q1 Typical Connection Diagram — Pin Control
58
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SNLS420D – JULY 2012 – REVISED JULY 2015
Typical Application (continued)
11.2.3 Application Curve
25
EFFECTIVE GAIN (dB)
20
15
914 Equalizer Gain (dB)
VOD-Vswing Loss
10
Allowable Interconnect
Loss
5
0
100
200
300
400
500
600
700
SERIAL LINE FREQUENCY (MHz)
Figure 49. Adaptive Equalizer – Interconnect Loss Compensation
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SNLS420D – JULY 2012 – REVISED JULY 2015
www.ti.com
12 Power Supply Recommendations
This device is designed to operate from an input core voltage supply of 1.8 V. Some devices provide separate
power and ground terminals for different portions of the circuit. This is done to isolate switching noise effects
between different sections of the circuit. Separate planes on the PCB are typically not required. Terminal
description tables typically provide guidance on which circuit blocks are connected to which power terminal pairs.
In some cases, an external filter may be used to provide clean power to sensitive circuits such as PLLs.
13 Layout
13.1 Layout Guidelines
Printed-circuit-board layout and stack-up for the serializer and deserializer devices should be designed to provide
low-noise power feed to the device. Good layout practice will also separate high frequency or high-level inputs
and outputs to minimize unwanted stray noise pickup, feedback and interference. Power system performance
may be greatly improved by using thin dielectrics (2 to 4 mils) for power/ground sandwiches. This arrangement
provides plane capacitance for the PCB power system with low-inductance parasitics, which has proven
especially effective at high frequencies, and makes the value and placement of external bypass capacitors less
critical. External bypass capacitors should include both RF ceramic and tantalum electrolytic types. RF capacitors
may use values in the range of 0.01 µF to 0.1 µF. Tantalum capacitors may be in the 2.2-µF to 10-µF range.
Voltage rating of the tantalum capacitors should be at least 5× the power supply voltage being used.
Surface mount capacitors are recommended due to their smaller parasitics. When using multiple capacitors per
supply pin, locate the smaller value closer to the pin. A large bulk capacitor is recommend at the point of power
entry. This is typically in the 50-µF to 100-µF range and will smooth low frequency switching noise. It is
recommended to connect power and ground pins directly to the power and ground planes with bypass capacitors
connected to the plane with a via on both ends of the capacitor. Connecting power or ground pins to an external
bypass capacitor will increase the inductance of the path.
A small body size X7R chip capacitor, such as 0603, is recommended for external bypass. Its small body size
reduces the parasitic inductance of the capacitor. The user must pay attention to the resonance frequency of
these external bypass capacitors, usually in the range of 20 to 30 MHz. To provide effective bypassing, multiple
capacitors are often used to achieve low impedance between the supply rails over the frequency of interest. At
high frequency, it is also a common practice to use two vias from power and ground pins to the planes, reducing
the impedance at high frequency.
Some devices provide separate power for different portions of the circuit. This is done to isolate switching noise
effects between different sections of the circuit. Separate planes on the PCB are typically not required. Pin
description tables typically provide guidance on which circuit blocks are connected to which power pin pairs. In
some cases, an external filter many be used to provide clean power to sensitive circuits such as PLLs.
Use at least a four-layer board with a power and ground plane. Locate LVCMOS signals away from the
differential lines to prevent coupling from the LVCMOS lines to the differential lines. Closely-coupled differential
lines of 100 Ω are typically recommended for differential interconnect. The closely coupled lines help to ensure
that coupled noise will appear as common-mode and thus is rejected by the receivers. The tightly coupled lines
will also radiate less.
Information on the WQFN style package is provided in Texas Instruments' Application Note: AN-1187
(SNOA401).
See AN-1108 (SNLA008) and AN-905 (SNLA035) for full details.
• Use 100-Ω coupled differential pairs
• Use the S, 2S, and 3S rule in spacings
– S = space between the pair
– 2S = space between pairs
– 3S = space to LVCMOS signal
• Minimize the number of Vias
• Use differential connectors when operating above 500Mbps line speed
• Maintain balance of the traces
• Minimize skew within the pair
60
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DS90UB913Q-Q1, DS90UB914Q-Q1
www.ti.com
SNLS420D – JULY 2012 – REVISED JULY 2015
Layout Guidelines (continued)
Additional general guidance can be found in the LVDS Owner’s Manual - available in PDF format from the Texas
Instrument web site at: www.ti.com/lvds
13.2 Layout Example
Stencil parameters such as aperture area ratio and the fabrication process have a significant impact on paste
deposition. Inspection of the stencil prior to placement of the WQFN package is highly recommended to improve
board assembly yields. If the via and aperture openings are not carefully monitored, the solder may flow
unevenly through the DAP. Stencil parameters for aperture opening and via locations are shown in Figure 50.
Figure 50. No Pullback WQFN, Single Row Reference Diagram
Figure 50 and Figure 51 PCB layout examples are derived from the layout design of the DS90UB913Q-Q1
Serializer and DS90UB914Q-Q1 Deserializer Evaluation Kit (SNLU110). These graphics and additional layout
description are used to demonstrate both proper routing and proper solder techniques when designing in the
serializer and deserializer.
Table 11. No Pullback WQFN Stencil Aperture Summary for DS90UB913Q-Q1 and DS90UB914Q-Q1
MKT DWG
PCB I/O PAD
SIZE
(mm)
PCB
PITCH
(mm)
PCB DAP
SIZE
(mm)
STENCIL I/O
APERTURE
(mm)
STENCIL
DAP
APERTURE
(mm)
NUMBER OF
DAP
APERTURE
OPENINGS
GAP
BETWEEN
DAP
APERTURE
(Dim A mm)
32
RTV
0.25 x 0.6
0.5
3.1 x 3.1
0.25 x 0.7
1.4 x 1.4
4
0.2
48
RHS
0.25 x 0.6
0.5
5.1 x 5.1
0.25 x 0.7
1.1 x 1.1
16
0.2
DEVICE
PIN
COUNT
DS90UB913Q-Q1
DS90UB914Q-Q1
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DS90UB913Q-Q1, DS90UB914Q-Q1
SNLS420D – JULY 2012 – REVISED JULY 2015
www.ti.com
Figure 51. 48-Pin WQFN Stencil Example of Via and Opening Placement
62
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DS90UB913Q-Q1, DS90UB914Q-Q1
www.ti.com
SNLS420D – JULY 2012 – REVISED JULY 2015
14 Device and Documentation Support
14.1 Documentation Support
14.1.1 Related Documentation
For related documentation, see the following:
• Absolute Maximum Ratings for Soldering, SNOA549
• AN-1187 Leadless Leadframe Package (LLP), SN0A401
• AN-1108 Channel-Link PCB and Interconnect Design-In Guidelines, SNLA008
• Transmission Line RAPIDESIGNER Operation and Applications Guide, SNLA035
• DS90UB913Q-Q1 Serializer and DS90UB914Q-Q1 Deserializer Evaluation Kit, SNLU110
14.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 12. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
DS90UB913Q-Q1
Click here
Click here
Click here
Click here
Click here
DS90UB914Q-Q1
Click here
Click here
Click here
Click here
Click here
14.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
14.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
14.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
14.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
15 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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63
PACKAGE OPTION ADDENDUM
www.ti.com
11-Jul-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DS90UB913QSQ/NOPB
ACTIVE
WQFN
RTV
32
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 105
UB913SQ
DS90UB913QSQE/NOPB
ACTIVE
WQFN
RTV
32
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 105
UB913SQ
DS90UB913QSQX/NOPB
ACTIVE
WQFN
RTV
32
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 105
UB913SQ
DS90UB914QSQ/NOPB
ACTIVE
WQFN
RHS
48
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 105
UB914QSQ
DS90UB914QSQE/NOPB
ACTIVE
WQFN
RHS
48
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 105
UB914QSQ
DS90UB914QSQX/NOPB
ACTIVE
WQFN
RHS
48
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 105
UB914QSQ
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Jul-2014
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Apr-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
DS90UB913QSQ/NOPB
WQFN
RTV
32
DS90UB913QSQE/NOPB
WQFN
RTV
DS90UB913QSQX/NOPB
WQFN
RTV
DS90UB914QSQ/NOPB
WQFN
DS90UB914QSQE/NOPB
DS90UB914QSQX/NOPB
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1000
178.0
12.4
5.3
5.3
1.3
8.0
12.0
Q1
32
250
178.0
12.4
5.3
5.3
1.3
8.0
12.0
Q1
32
4500
330.0
12.4
5.3
5.3
1.3
8.0
12.0
Q1
RHS
48
1000
330.0
16.4
7.3
7.3
1.3
12.0
16.0
Q1
WQFN
RHS
48
250
178.0
16.4
7.3
7.3
1.3
12.0
16.0
Q1
WQFN
RHS
48
2500
330.0
16.4
7.3
7.3
1.3
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Apr-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS90UB913QSQ/NOPB
WQFN
RTV
32
1000
213.0
191.0
55.0
DS90UB913QSQE/NOPB
WQFN
RTV
32
250
213.0
191.0
55.0
DS90UB913QSQX/NOPB
WQFN
RTV
32
4500
367.0
367.0
35.0
DS90UB914QSQ/NOPB
WQFN
RHS
48
1000
367.0
367.0
38.0
DS90UB914QSQE/NOPB
WQFN
RHS
48
250
213.0
191.0
55.0
DS90UB914QSQX/NOPB
WQFN
RHS
48
2500
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
RHS0048A
SQA48A (Rev B)
www.ti.com
MECHANICAL DATA
RTV0032A
SQA32A (Rev B)
www.ti.com
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