CYStech Electronics Corp. 8Amp. Superfast High Voltage Rectifiers MSR0860AJ3 Features • 175℃ operating junction temperature • Low leakage current • Superfast recovery time • Low switching loss, high efficiency • High forward surge capability • Pb-free lead plating and halogen-free package Spec. No. : C191J3 Issued Date : 2013.12.12 Revised Date : 2013.12.20 Page No. : 1/6 IF(AV) VRRM IFSM trr Tj VF(Max) 8A 600V 125A 25ns 175°C 2.2V Mechanical Data • Case: TO-252 molded plastic • Mounting Position: Any • Terminals: Pure tin plated, solderable per J-STD-002 and JESD22-B102 • Epoxy: UL 94V-0 rate flame retardant • Polarity : As marked. Equivalent Circuit MSR0860AJ3 Outline TO-252(DPAK) A MSR0860AJ3 K A CYStek Product Specification Spec. No. : C191J3 Issued Date : 2013.12.12 Revised Date : 2013.12.20 Page No. : 2/6 CYStech Electronics Corp. Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. resistive or inductive load. Single phase, half wave, 60Hz, For capacitive load, derate current by 20%.) Parameter Maximum Recurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage TC=25°C Maximum instantaneous forward voltage at IF=8A TC=125°C Maximum Average forward rectified current @ TC=100℃ Non-repetitive peak forward surge current @ 8.3ms single half sine wave superimposed on rated load (JEDEC method) VR=600 V, TC=25℃ Maximum instantaneous reverse current at VR=600 V, TC=125℃ Maximum reverse IF=1A, VR=30V, dIF/dt=100A/μs recovery time Typical junction capacitance @ f=1MHz and applied 4V reverse voltage Storage temperature range Operating junction temperature range Symbol VRRM VRMS VDC Min. Typ. Max. 600 420 600 2.2 2 Units V V V IF(AV) 8 A IFSM 125 A IR 25 500 μA 25 ns 1.8 1.5 VF trr 16 CJ 18 Tstg TJ V pF -65 -65 +175 +175 ℃ ℃ Thermal Data Parameter Maximum Thermal Resistance, Junction-to-case Maximum Thermal Resistance, Junction-to-ambient Maximum Thermal Resistance, Junction-to-ambient Note : Symbol Rth,j-c (Note 1) (Note 2) Rth,j-a Value 4 50 110 Unit °C/W 1. When device mounted on 1 in²FR-4 board with 2 oz. copper, in a still air environment with TA=25°C. 2. When mounted on the minimum pad size recommended (PCB mount). Ordering Information Device MSR0860AJ3-0-T3-G Package TO-252 (Pb-free lead plating and halogen-free package) Shipping 2500 pcs / Tape & Reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T3 : 2500 pcs / tape & reel, 13” reel Product rank, zero for no rank products Product name MSR0860AJ3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C191J3 Issued Date : 2013.12.12 Revised Date : 2013.12.20 Page No. : 3/6 Typical Characteristics Forward Current Derating Curve Forward Current vs Forward Voltage 10000 8 Instantaneous Forward Current---IF (mA) Average Forward Current---I F(AV)(A) 9 7 6 5 4 3 2 1 resistive or inductive load Tj=125℃ 1000 Tj=75°C 100 Tj=25℃ 10 Pulse width=300μs, 1% Duty cycle 1 0 0 25 50 75 100 125 150 175 0 200 Case Temperature---TC(℃) 0.8 1.2 1.6 Forward Voltage---VF(V) 2 2.4 Junction Capacitance vs Reverse Voltage Reverse Leakage Current vs Reverse Voltage 100 100 Tj=125℃ 10 1 Junction Capacitance---C J(pF) Reverse Leakage Current---I R (μA) 0.4 Tj=75℃ 0.1 Tj=25℃ 0.01 10 Tj=25℃, f=1.0MHz 1 0.001 0 100 200 300 400 500 600 Reverse Voltage---VR (V) 0.1 1 10 100 Reverse Voltage---VR (V) Recommended soldering footprint MSR0860AJ3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C191J3 Issued Date : 2013.12.12 Revised Date : 2013.12.20 Page No. : 4/6 Reel Dimension Carrier Tape Dimension MSR0860AJ3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C191J3 Issued Date : 2013.12.12 Revised Date : 2013.12.20 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. MSR0860AJ3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C191J3 Issued Date : 2013.12.12 Revised Date : 2013.12.20 Page No. : 6/6 TO-252 Dimension Marking: MSR 0860A Style: Pin 3-Lead TO-252 Plastic Surface Mount Package CYStek Package Code: J3 1.Anode 2.Cathode 3.Anode *: Typical Inches Min. Max. 0.087 0.094 0.000 0.005 0.039 0.048 0.026 0.034 0.026 0.034 0.018 0.023 0.018 0.023 0.256 0.264 0.201 0.215 0.236 0.244 DIM A A1 B b b1 C C1 D D1 E Millimeters Min. Max. 2.200 2.400 0.000 0.127 0.990 1.210 0.660 0.860 0.660 0.860 0.460 0.580 0.460 0.580 6.500 6.700 5.100 5.460 6.000 6.200 DIM e e1 H K L L1 L2 L3 P V Inches Min. Max. 0.086 0.094 0.172 0.188 0.163 REF 0.190 REF 0.386 0.409 0.114 REF 0.055 0.067 0.024 0.039 0.030 REF 0.211 REF Millimeters Min. Max. 2.186 2.386 4.372 4.772 4.140 REF 4.830 REF 9.800 10.400 2.900 REF 1.400 1.700 0.600 1.000 0.750 REF 5.350 REF Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead : Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MSR0860AJ3 CYStek Product Specification