MSR0860AJ3

CYStech Electronics Corp.
8Amp. Superfast High Voltage Rectifiers
MSR0860AJ3
Features
• 175℃ operating junction temperature
• Low leakage current
• Superfast recovery time
• Low switching loss, high efficiency
• High forward surge capability
• Pb-free lead plating and halogen-free package
Spec. No. : C191J3
Issued Date : 2013.12.12
Revised Date : 2013.12.20
Page No. : 1/6
IF(AV)
VRRM
IFSM
trr
Tj
VF(Max)
8A
600V
125A
25ns
175°C
2.2V
Mechanical Data
• Case: TO-252 molded plastic
• Mounting Position: Any
• Terminals: Pure tin plated, solderable per J-STD-002 and JESD22-B102
• Epoxy: UL 94V-0 rate flame retardant
• Polarity : As marked.
Equivalent Circuit
MSR0860AJ3
Outline
TO-252(DPAK)
A
MSR0860AJ3
K A
CYStek Product Specification
Spec. No. : C191J3
Issued Date : 2013.12.12
Revised Date : 2013.12.20
Page No. : 2/6
CYStech Electronics Corp.
Maximum Ratings and Electrical Characteristics
(Rating at 25°C ambient temperature unless otherwise specified.
resistive or inductive load.
Single phase, half wave, 60Hz,
For capacitive load, derate current by 20%.)
Parameter
Maximum Recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
TC=25°C
Maximum instantaneous
forward voltage at IF=8A
TC=125°C
Maximum Average forward rectified current @
TC=100℃
Non-repetitive peak forward surge current @
8.3ms single half sine wave superimposed on
rated load (JEDEC method)
VR=600 V, TC=25℃
Maximum instantaneous
reverse current at
VR=600 V, TC=125℃
Maximum reverse
IF=1A, VR=30V,
dIF/dt=100A/μs
recovery time
Typical junction capacitance @ f=1MHz and applied
4V reverse voltage
Storage temperature range
Operating junction temperature range
Symbol
VRRM
VRMS
VDC
Min.
Typ.
Max.
600
420
600
2.2
2
Units
V
V
V
IF(AV)
8
A
IFSM
125
A
IR
25
500
μA
25
ns
1.8
1.5
VF
trr
16
CJ
18
Tstg
TJ
V
pF
-65
-65
+175
+175
℃
℃
Thermal Data
Parameter
Maximum Thermal Resistance, Junction-to-case
Maximum Thermal Resistance, Junction-to-ambient
Maximum Thermal Resistance, Junction-to-ambient
Note :
Symbol
Rth,j-c
(Note 1)
(Note 2)
Rth,j-a
Value
4
50
110
Unit
°C/W
1. When device mounted on 1 in²FR-4 board with 2 oz. copper, in a still air environment with TA=25°C.
2. When mounted on the minimum pad size recommended (PCB mount).
Ordering Information
Device
MSR0860AJ3-0-T3-G
Package
TO-252
(Pb-free lead plating and halogen-free package)
Shipping
2500 pcs / Tape & Reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T3 : 2500 pcs / tape & reel, 13” reel
Product rank, zero for no rank products
Product name
MSR0860AJ3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C191J3
Issued Date : 2013.12.12
Revised Date : 2013.12.20
Page No. : 3/6
Typical Characteristics
Forward Current Derating Curve
Forward Current vs Forward Voltage
10000
8
Instantaneous Forward Current---IF (mA)
Average Forward Current---I F(AV)(A)
9
7
6
5
4
3
2
1
resistive or inductive load
Tj=125℃
1000
Tj=75°C
100
Tj=25℃
10
Pulse width=300μs,
1% Duty cycle
1
0
0
25
50
75
100
125
150
175
0
200
Case Temperature---TC(℃)
0.8
1.2
1.6
Forward Voltage---VF(V)
2
2.4
Junction Capacitance vs Reverse Voltage
Reverse Leakage Current vs Reverse Voltage
100
100
Tj=125℃
10
1
Junction Capacitance---C J(pF)
Reverse Leakage Current---I R (μA)
0.4
Tj=75℃
0.1
Tj=25℃
0.01
10
Tj=25℃, f=1.0MHz
1
0.001
0
100
200
300
400
500
600
Reverse Voltage---VR (V)
0.1
1
10
100
Reverse Voltage---VR (V)
Recommended soldering footprint
MSR0860AJ3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C191J3
Issued Date : 2013.12.12
Revised Date : 2013.12.20
Page No. : 4/6
Reel Dimension
Carrier Tape Dimension
MSR0860AJ3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C191J3
Issued Date : 2013.12.12
Revised Date : 2013.12.20
Page No. : 5/6
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak
temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
10-30 seconds
20-40 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
MSR0860AJ3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C191J3
Issued Date : 2013.12.12
Revised Date : 2013.12.20
Page No. : 6/6
TO-252 Dimension
Marking:
MSR
0860A
Style: Pin
3-Lead TO-252 Plastic Surface Mount Package
CYStek Package Code: J3
1.Anode
2.Cathode
3.Anode
*: Typical
Inches
Min.
Max.
0.087
0.094
0.000
0.005
0.039
0.048
0.026
0.034
0.026
0.034
0.018
0.023
0.018
0.023
0.256
0.264
0.201
0.215
0.236
0.244
DIM
A
A1
B
b
b1
C
C1
D
D1
E
Millimeters
Min.
Max.
2.200
2.400
0.000
0.127
0.990
1.210
0.660
0.860
0.660
0.860
0.460
0.580
0.460
0.580
6.500
6.700
5.100
5.460
6.000
6.200
DIM
e
e1
H
K
L
L1
L2
L3
P
V
Inches
Min.
Max.
0.086
0.094
0.172
0.188
0.163
REF
0.190
REF
0.386
0.409
0.114
REF
0.055
0.067
0.024
0.039
0.030 REF
0.211 REF
Millimeters
Min.
Max.
2.186
2.386
4.372
4.772
4.140
REF
4.830
REF
9.800
10.400
2.900
REF
1.400
1.700
0.600
1.000
0.750
REF
5.350 REF
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead : Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MSR0860AJ3
CYStek Product Specification