CYStech Electronics Corp. Spec. No. : C469J3 Issued Date : 2009.07.03 Revised Date : Page No. : 1/6 10Amp. Schottky Barrier Rectifiers CSK1040J3 Features • Excellent power dissipation offers better reverse leakage current and thermal resistance • Low profile surface mount application in order to optimize board space • Metal silicon junction, major carrier conduction • 10A total (5A per diode leg) • Guardring for over voltage protection • Low power loss, high efficiency • High surge capability • High current capability, low forward voltage drop • Ultra-high speed switching • Lead-free parts meet environmental standard MIL-STD-19500 /228 Mechanical Data • Case: Molded plastic, TO-252 • Mounting Position: Any • Weight: 0.34 grams approximately • Terminals: Pure tin plated, lead-free, solderable per MIL-STD-750 method 2026 • Epoxy: UL 94V-0 rate flame retardant • Polarity : Indicated by diode symbol Equivalent Circuit CSK1040J3 Outline TO-252 A K A CSK1040J3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C469J3 Issued Date : 2009.07.03 Revised Date : Page No. : 2/6 Maximum Ratings and Electrical Characteristics (Per Diode Leg) (Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, For capacitive load, derate current by 20%.) resistive or inductive load. Parameter Maximum Recurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous forward voltage at IF=5A Per Diode Maximum Average forward rectified current Per Device Non-repetitive peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) Maximum instantaneous reverse current at VR=40V, TA= 25℃ Symbol VRRM VRMS VDC VF IF(AV) IFSM IR VR=40V, TA= 100℃ Maximum Thermal Resistance, Junction-to-case Maximum Thermal Resistance, Junction-to-ambient Storage temperature range Operating junction temperature range RθJC RθJA Tstg TJ Limits 40 28 40 0.55 5 10 Units V V V V 100 A 0.5 20 3 125 -65 ~ +175 -55 ~ +125 A mA °C/W °C/W ℃ ℃ Ordering Information Device CSK1040J3 Package TO-252 (Pb-free) Shipping Marking 3000 pcs / Tape & Reel SK1040 Recommended soldering footprint CSK1040J3 CYStek Product Specification Spec. No. : C469J3 Issued Date : 2009.07.03 Revised Date : Page No. : 3/6 CYStech Electronics Corp. Characteristic Curves Maximum Non-Repetitive Forward Surge Current Forward Current Derating Curve 125 Peak Forward Surge Current---IFSM(A) Average Forward Current---I F(AV) (A) 12 10 8 6 4 2 Tj=25℃, 8.3ms Single Half Sine Wave JEDEC method 100 75 50 25 0 0 0 50 100 CaseTemperature---TC(℃) 1 150 Reverse Leakage Current vs Reverse Voltage Forward Current vs Forward Voltage 100 Reverse Leakage Current---I R(mA) 10 Instantaneous Forward Current---IF(A) 100 10 Number of Cycles at 60Hz 1 0.1 Tj=25℃, Pulse width=300μs, 1% Duty cycle 10 1 Tj=75℃ 0.1 Tj=25°C 0.01 0.01 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 Forward Voltage---VF(V) CSK1040J3 1 0 20 40 60 80 100 120 140 Percent of Rated Peak Reverse Voltage---(%) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C469J3 Issued Date : 2009.07.03 Revised Date : Page No. : 4/6 Reel Dimension Carrier Tape Dimension CSK1040J3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C469J3 Issued Date : 2009.07.03 Revised Date : Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature CSK1040J3 Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. CYStek Product Specification CYStech Electronics Corp. Spec. No. : C469J3 Issued Date : 2009.07.03 Revised Date : Page No. : 6/6 TO-252 Dimension C A Marking: D B SK1040 G F L 3 H E K 2 I 1 J Style: Pin 1.Anode 2.Cathode 3.Anode 3-Lead TO-252 Plastic Surface Mount Package CYStek Package Code: J3 *: Typical Inches Min. Max. 0.0157 0.0236 0.0591 0.0827 0.0157 0.0315 0.0157 0.0236 0.2480 0.2638 0.2283 0.2441 DIM A B C D E F Millimeters Min. Max. 0.40 0.60 1.50 2.10 0.40 0.80 0.40 0.60 6.30 6.70 5.80 6.20 DIM G H I J K L Inches Min. Max. 0.0984 0.1142 *0.0906 0.0315 0.0394 0.0315 0.0394 0.2008 0.2165 0.0315 0.0394 Millimeters Min. Max. 2.50 2.90 *2.30 0.80 1.00 0.80 1.00 5.10 5.50 0.80 1.00 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: KFC; pure tin plated • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CSK1040J3 CYStek Product Specification