Migration Note - Eon Silicon Solution Inc.

Eon Silicon Solution Inc.
Migration Note
EON Flash EN29LV160A to EN29LV160B
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
1
Rev. A, Issue Date: 2009/ 04/22
©2005 Eon Silicon Solution Inc. www.ession.com
Eon Silicon Solution Inc.
1. INTRODUCTION
The application note introduces how to implement a system design from EON
EN29LV160A Flash to Eon EN29LV160B Flash.
2. GENERAL FUNCTION COMPARISON TABLE:
The following table is major features of these two devices.
Features
Process
voltage range
Pin to Pin
Access time
Secured Silicon
Sector region
EN29LV160A
0.18um
EN29LV160B
0.13um
2.7 ~ 3.6
2.7 ~ 3.6
Compatible (for 48 TSOP)
Compatible (for 48 TFBGA)
70ns
Compatible (for 48 TSOP)
Compatible (for 48 TFBGA)
70ns
None
None
8K Byte x 2 sectors /16K Byte X
1 sector / 32K Byte X1 sector /
64K Byte X 31 sectors
boot sectors at Top or Bottom
Byte/Word mode
Yes
VID and VHH
10.5V - 11.5V
Max
CFI Compliant
Yes
Erase
Yes
Suspend/Resume
Sector
Architecture
Minimum
endurance cycle
Package
8K Byte x 2 sectors /16K Byte X
1 sector / 32K Byte X1 sector /
64K Byte X 31 sectors
boot sectors at Top or Bottom
Yes
10.5V - 11.5V
Yes
Yes
100K
100K
48-pin 12mm x 20mm TSOP
48 ball 6mm x 8mm TFBGA
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
48-pin 12mm x 20mm TSOP
48 ball 6mm x 8mm TFBGA
2
Rev. A, Issue Date: 2009/ 04/22
©2005 Eon Silicon Solution Inc. www.ession.com
Eon Silicon Solution Inc.
3. HARDWARE CONSIDERATIONS
3.1 ICC comparison
Current
EN29LV160B
EN29LV160A
Unit
Typ
Max
Typ
Max
Read ICC1
9
16
9
16
mA
Write ICC2
20
30
20
30
mA
Standby ICC3
1
5.0
1
5.0
A
3.2 Max VID comparison
EN29LV160A & EN29LV160B VID range is the same. (10.5V~11.5V)
4. SOFTWARE CONSIDERATIONS
There is no difference in Manufacture ID, Device ID, and Autoselect functions for
EN29LV160B and EN29LV160A.
4.1 Manufacturer, Device Identification and Autoselect Information
For EN29LV160A autoselect mode table
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
3
Rev. A, Issue Date: 2009/ 04/22
©2005 Eon Silicon Solution Inc. www.ession.com
Eon Silicon Solution Inc.
For EN29LV160B autoselect mode table
5. PERFORMANCE DIFFERENCES
5.1 Power-on and Reset Timings
EN29LV160B EN29LV160A
Parameter
Description
tVCS
Vcc Setup Time
RESET# Pulse Width (During Embedded
Algorithms)
RESET# Pulse Width (NOT During
Embedded Algorithms)
Reset# High Time Before Read
RY/BY# Recovery Time ( to CE#, OE#
go low)
RY/BY# Recovery Time ( to WE# go low)
Reset# Pin Low (During Embedded
Algorithms) to Read or Write
Reset# Pin Low (NOT During Embedded
Algorithms) to Read or Write
tRP1
tRP2
tRH
tRB1
tRB2
tREADY1
tREADY2
50µs
50µs
10us
500ns
500ns
500ns
50ns
50ns
0ns
0ns
50ns
None*
20µs
20µs
500ns
500ns
Note*: There is no clear description in datasheet.
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
4
Rev. A, Issue Date: 2009/ 04/22
©2005 Eon Silicon Solution Inc. www.ession.com
Eon Silicon Solution Inc.
5.2 ERASE AND PROGRAM PERFORMANCE
The erase time is improved greatly in EN29LV160B. This is the major different between
EN29LV160A and EN29LV160B.
EN29LV160B
EN29LV160A
Typ
Max
Typ
Max
0.1
2
0.5
10
Sec
Chip Erase Time
4
35
17.5
None*
Sec
Byte Programming Time
8
200
8
200
µS
Word Programming Time
8
200
8
200
µS
Byte
16.8
50.4
16.8
50.4
Sec
Word
8.4
25.2
8.4
25.2
Sec
Parameter
Sector Erase Time
Chip Programming
Time
Unit
Note*: There is no clear description in datasheet.
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
5
Rev. A, Issue Date: 2009/ 04/22
©2005 Eon Silicon Solution Inc. www.ession.com
Eon Silicon Solution Inc.
Revisions List
Revision No Description
Date
A
2009/4/22
Initial Release
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
6
Rev. A, Issue Date: 2009/ 04/22
©2005 Eon Silicon Solution Inc. www.ession.com