product change notice - Eon Silicon Solution Inc.

Eon Silicon Solution Inc.
6F-2, No.30, Tai-Yuan Street, Chu-Pei,
Hsin-Chu, Taiwan
TEL:886-3-5525686 FAX:886-3-5525696
PRODUCT CHANGE NOTICE
PCN No.: PCN09040101
Issued Date: 2009/04/01
Dear Customers,
We appreciate your interest and support in Eon’s flash products.
We continue to do our best to serve you and look forward to
extending our cooperation and long term relationship.
EN29LV320B is our new product with the advanced Flash
technology. It will replace EN29LV320A for mass production in the
near future. The migration note is attached.
The new device shall bring satisfactions and benefits to both of
us. If you have any questions or comments, please feel free to
contact our channel sales.
Effective date: Apr. 15, 2009
Sincerely yours,
William Chen
________________
Deputy Product Manager
Eon Silicon Solution Inc.
Eon Silicon Solution Inc.
Migration Note
Eon Flash EN29LV320A to EN29LV320B
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
1
Rev. A, Issue Date: 2009/ 04/07
©2005 Eon Silicon Solution Inc. www.ession.com
Eon Silicon Solution Inc.
1. INTRODUCTION
The application note introduces how to implement a system design from Eon
EN29LV320A Flash to EN29LV320B Flash.
2. GENERAL FUNCTION COMPARISON TABLE:
The following table is major features of these two devices.
Features
EN29LV320A
EN29LV320B
voltage range
2.7 ~ 3.6
2.7 ~ 3.6
Pin to Pin
Yes
Yes
Access time
70ns and 90ns
70ns
Sector
32Kword x 63 sectors + 4Kword 32Kword x 63 sectors + 4Kword
Architecture
x 8 boot sectors at Top or Bottom x 8 boot sectors at Top or Bottom
CFI
Yes
Yes
Erase
Yes
Yes
Suspend/Resume
Hardware
Protection for
Yes
Yes
Top/Bottom
Sector
OTP sector
None
None
Minimum
endurance cycle
Package
100K
100K
48-pin 12mm x 20mm TSOP
48 ball 6mm x 8mm TFBGA
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
48-pin 12mm x 20mm TSOP
48 ball 6mm x 8mm TFBGA
2
Rev. A, Issue Date: 2009/ 04/07
©2005 Eon Silicon Solution Inc. www.ession.com
Eon Silicon Solution Inc.
3. HARDWARE CONSIDERATIONS
ICC comparison
Current
EN29LV320A
Typ
Read ICC1
EN29LV320B
Unit
Max
Typ
Max
9
16
9
16
mA
Write ICC2
20
30
20
30
mA
Standby ICC3
1
5.0
1
5.0
A
4. SOFTWARE CONSIDERATIONS
There is no difference in Manufacturer ID, Device ID and Autoselect function for
EN29LV320A and EN29LV320B.
Manufacturer, Device Identification and Autoselect Information
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
3
Rev. A, Issue Date: 2009/ 04/07
©2005 Eon Silicon Solution Inc. www.ession.com
Eon Silicon Solution Inc.
5. PERFORMANCE DIFFERENCES
5.1 Power-on and Reset Timings
EN29LV320A EN29LV320B
Parameter
Description
tVCS
Vcc Setup Time
RESET# Pulse Width (During Embedded
Algorithms)
RESET# Pulse Width (NOT During
Embedded Algorithms)
Reset# High Time Before Read
RY/BY# Recovery Time ( to CE#, OE#
go low)
RY/BY# Recovery Time ( to WE# go low)
Reset# Pin Low (During Embedded
Algorithms) to Read or Write
Reset# Pin Low (NOT During Embedded
Algorithms) to Read or Write
tRP1
tRP2
tRH
tRB1
tRB2
tREADY1
tREADY2
50µs
50µs
None*
10µs
500ns
500ns
50ns
50ns
None*
0ns
None*
50ns
20µs
20µs
500ns
500ns
5.2 ERASE AND PROGRAM PERFORMANCE
The erase time is improved greatly in EN29LV320B. This is the major different
between EN29LV320A and EN29LV320B.
EN29LV320A
EN29LV320B
Typ
Max
Typ
Max
Sector Erase Time
0.5
10
0.1
2
Sec
Chip Erase Time
70
None*
8
70
Sec
Byte Programming Time
8
300
8
200
µS
Accelerated
Program Time
7
200
7
200
µS
8
300
8
200
µS
Byte
35
100
33.6
100.8
Sec
Word
17
50
16.8
50.4
Sec
Parameter
Byte/Word
Word Programming Time
Chip Programming
Time
Unit
Note* : There is no description in datasheet.
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
4
Rev. A, Issue Date: 2009/ 04/07
©2005 Eon Silicon Solution Inc. www.ession.com
Eon Silicon Solution Inc.
Revisions List
Revision No Description
Date
A
2009/4/7
Initial Release
This Application Note may be revised by subsequent versions
or modifications due to changes in technical specifications.
5
Rev. A, Issue Date: 2009/ 04/07
©2005 Eon Silicon Solution Inc. www.ession.com