ROHM BU92747KV

1/4
Structure
Silicon Monolithic Integrated Circuit
Product Name
IrDA Controller LSI built-in Ir remote control
Model name
BU92747KV
Outer Dimension
Figure 1 Outer Dimensions
Features
・Data transfer speed (bps)
IrDA SIR: 2.4kbps, 9.6kbps, 19.2kbps, 38.4kbps, 57.6kbps and 115.2kbps
IrDA MIR: 0.576Mbps, 1.152Mbps
IrDA FIR: 4Mbps
IrSimple
・Interface
16-bit data bus , Address A0-3
・Built-in 2560 × 2byte FIFO buffer (for transmission and reception)
・Accessible as a memory device connected to the bus
・Power down mode setting possible for transmission and reception
・Input clock of 48MHz for external input clock and crystal input clock
・Ir remote control function
Serial 2-lines SDA, and SCL
*This LSI chip is not subject to radiation-proof design.
●Absolute Maximum Rating
Ta=25°C unless otherwise stated
Item
Symbol
Minimum
Maximum
Unit
2.5
4.5
4.5
VIO1, 2+0.3
900
85
125
V
V
V
V
mW
°C
°C
*1
Supply voltage
VDD
-0.3
Interface supply voltage1*1
VIO1
-0.3
*1
Interface supply voltage2
VIO2
-0.3
Input voltage*1
VIN
-0.3
Power dissipation*2
Pd
Operating temperature range
TOPR
-40
Storage temperature range
TSTG
-55
*1 It applies to all pins based on the GND pin.
*2 Reduced by 9.0mW for each increase in Ta of 1℃ over 25℃
(mounted on 70.0mm × 70.0mm × 1.6mm Glass-epoxy PCB)
●Operation Range
Item
Symbol
Minimum
Standard
Supply voltage
VDD
1.62
1.8
Interface supply voltage1
VIO1
1.62
1.8
Interface supply voltage2*3
VIO2
1.62
1.8
*3 VIO2 is connected with XIN/CLK48M, XOUT, PWDN, NIRQ and RESET.
Status of this document
The Japanese version of this document is the formal specification.
A customer may use this translation version only for a reference to help reading the formal version.
If there are any differences in translation version of this document, formal version takes priority.
REV. A
Maximum
1.98
3.6
3.6
Unit
V
V
V
2/4
●Electrical Characteristics (DC Characteristics)
Ta=25°C, VDD=1.8V, VIO1=1.8V, VIO2=1.8V and GND=0V unless otherwise stated
Standard value
Item
Symbol
Unit
MIN
TYP
MAX
Dissipation current 1
IDD1
0.1
10
µA
Dissipation current 2
IDD2
10
30
mA
Digital high-level input voltage
VIH
0.75 × VIO
V
Digital low-level input voltage
VIL
0.25 × VIO
V
10
µA
Digital high-level input current
IIH
100
µA
Digital low-level input current
IIL
10
µA
Digital high-level output voltage
VOH
VIO-0.6
-
-
V
Digital low-level output voltage
VOL
-
-
0.6
V
Remarks
For input with no output load = 0V
For XIN = 48MHz
Input voltage level 1.8V
Input voltage level 1.8V
TEST1-3
Input voltage level GND
INTR, D0-15, IrDAPWDOWN,
IrTX, IrRC, NIRQ, CTLA
IOH=-1mA
INTR, D0-15, IrDAPWDOWN,
IrTX, IrRC, SDA, NIRQ, CTLA
IOL=1mA
●Pin Description
Pin name
I/O
Condition
of after
reset
IrRX
EXTIR
I
I
-
IrTX
O
L
D0-15
A0-3
I/O
I
Input
-
CS
I
-
RD
WR
I
I
-
INTR
O
H
RESET
I
-
PWDN
I
-
IrRC
O
L
CTLA
SCL
SDA
O
I
I/O
L
Input
NIRQ
O
H
XIN/CLK48M
I
O
I
-
O
H
-
-
XOUT
TEST1-3
IrDA
PWDOWN
VDD
VIO1
VIO2
GND
Pin Function
IrDA Receive Input Pin
Signal Input Pin in SM2="H" (Input Signal is outputted to IrTX or IrRC)
IrDA and remote control Transmission Output Pin
Transmission IrDA when RC_EN= "L"
Transmission remote control when RC_EN="H", RC_MODE="H"
Data I/O Pin
Address Input Pin
Chip Select Pin. Low (L) Active
The read/write signal goes “Active” in a Low period.
Read Signal Input Pin. Low (L) Active
Write Signal Input Pin. Low (L) Active
CPU Interrupt Request Output Pin (IrDA controller)
The signal goes “Low” when an interrupt condition takes place.
Reset Input Pin. Low (L) Active
The signal causes the internal register settings, etc. to be initialized.
Power Down Mode Setting. Low (L) Active
When set to Low (L), this signal causes the wait status and sets the low
dissipation current mode. After the power down mode is removed,
RESET=L must set to Low until crystal clock oscillation becomes stable
(about 2 or 3 ms). After that RESET must set to High.
Take it into consideration that this period depends on the crystal in use.
Remote control transmission Output pin
Transmission remote control when RC_EN= "H", RC_MODE= "L"
Control Signal Output Pin
Serial clock
Serial data I/O Pin
CPU Interrupt Request Output Pin (Ir remote control)
The signal goes “Low” when an interrupt condition takes place.
Crystal IN / External CLK Input
Crystal OUT (N.C when external input clock is used)
Test pins (These pins must be GND during normal operation.)
IrDA module control signal output pin
These pins must be OPEN for IrDA modules having no power-down pin.
Power supply pin
Interface power supply voltage1
Interface power supply voltage2
Ground pin
REV. A
Circuit
Diagram
B
B
A
C
B
B
B
B
A
B
B
A
A
F
G
A
E
E
D
A
-
3/4
●Equivalent Circuit Diagram
PWDN
XIN
A
B
D
C
XOUT
E
F
G
●Outer Dimensions
Figure1 Outer Dimensions(VQFP48)
U92747KV
Lot No.
(unit : mm)
Pin No.
Pin Name
Pin No.
Pin Name
Pin No.
Pin Name
Pin No.
Pin Name
1
2
3
4
5
6
7
8
9
10
11
12
PWDN
RESET
NIRQ
VIO2
TEST2
A3
VIO1
TEST1
A2
A1
D11
VDD
13
14
15
16
17
18
19
20
21
22
23
24
GND
D5
A0
D4
D10
D9
D3
D15
D2
D8
D1
D7
25
26
27
28
29
30
31
32
33
34
35
36
D0
D6
D14
D12
D13
INTR
CS
TEST3
RD
VIO1
WR
VDD
37
38
39
40
41
42
43
44
45
46
47
48
GND
IrRX
EXTIR
IrTX
REV. A
IrDAPWDOWN
CTLA
IrRC
(NC)
SCL
SDA
XOUT
XIN
4/4
●Notes for use
(1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range
may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open
mode) when such damage is suffered. A physical safety measure such as a fuse should be implemented when
use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated.
(2) Mutual impedance
Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance
as small as possible .Use a capacitor to keep ripple to a minimum.
(3) GND potential
Ensure a minimum GND pin potential in all operating conditions.
(4) Short circuit mode between terminals and wrong mounting
In order to mount the IC on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous
mounting can destroy the IC. Furthermore, if a short circuit occurs due to foreign matters entering between
terminals or between the terminal and the power supply or the GND terminal, the IC can destroy
(5) Setting of heat
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
(6) Actions in strong magnetic field
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to
malfunction.
(7) Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground
patterns, placing a single ground point at the application's reference point so that the pattern wiring
resistance and voltage variations caused by large currents do not cause variations in the small signal ground
voltage. Be careful not to change the GND wiring pattern of any external components, either.
(8) When power is first supplied the CMOS IC, it is possible that the internal logic may be unstable and rush current
may flow instantaneously.
Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and
routing of connections.
(9) For ICs with more than one power, it is possible than rush current many flow instantaneously due to the internal
powering sequence and delays.
Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and
routing of wiring.
REV. A
Appendix
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM
CO.,LTD.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you
wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM
upon request.
Examples of application circuits, circuit constants and any other information contained herein illustrate the
standard usage and operations of the Products. The peripheral conditions must be taken into account when
designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document. However, should
you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and examples of
application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or
exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility
whatsoever for any dispute arising from the use of such technical information.
The Products specified in this document are intended to be used with general-use electronic equipment or
devices (such as audio visual equipment, office-automation equipment, communication devices, electronic
appliances and amusement devices).
The Products are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or
malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard against the
possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as
derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your
use of any Product outside of the prescribed scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or system
which requires an extremely high level of reliability the failure or malfunction of which may result in a direct
threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment,
aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no
responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended
to be used for any such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may be controlled under
the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact your nearest sales office.
ROHM Customer Support System
www.rohm.com
Copyright © 2008 ROHM CO.,LTD.
THE AMERICAS / EUROPE / ASIA / JAPAN
Contact us : [email protected] rohm.co. jp
21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan
TEL : +81-75-311-2121
FAX : +81-75-315-0172
Appendix1-Rev3.0