LTCC Low Temperature Co-fired Ceramics With increasing demands for high density and miniature modules, Kyocera LTCC featuring thick film printing and multi-layer technologies offers the best fit solutions for those market demands. This LTCC is especially suited for telecom devices such as RF power amplifier, antenna switch module, VCO and RF modules including some filter functions with the following characteristics. Features LTCC Structure Surface Conductor(Ag) Via Hole(Ag) Cavity Inner Conductor(Ag) Castellation(Ag) ∗ Ni/Au plate surface finish is available. • High Density Module Miniature modules are realized by inner layer circuitry with fine lines and very small via holes. • Low Circuit Resistance Low circuit impedance is achieved by the use of silver as inner conductor material. • Low Profile Low profile modules can be achieved by the use of cavity and castellation structure. • Higher Reliability in Structure Higher environmental temperature reliability by selecting materials which suitably match thermal expansion coefficient with mounted components. • Improved Electro-magnetic Compatibility Effective for reducing electro-magnetic radiation for its feasibility to build ground or shield in the internal layer. • Suited for High Frequency Circuit For its high dielectric constant of ceramic materials, it is suited for high frequency application where distributed constant circuitry is utilized. • Dust Free Unlike an organic printed circuit board, LTCC ceramic board does not accompany dust which leads to cleaner environment. • Excellent Thermal Conductivity Highly thermal conductive structure is achieved by building heat sink with silver thermal vias in the bare chip assembly area. • Built-in Functions It is possible to embed functions such as BPF, LPF and Balun inside the substrate. Material Characteristics (Ceramics) Parameters Sintered Density Bend Strength Thermal Expansion Thermal Conductivity Volume Fixed Resistance Dielectric Constant Dielectric Loss Angle Moisture Absorption Unit g/cm3 MPa ppm/°C W/mK Ωcm --------% LTCC(JHB62) 3.2 260 6.3 2.5 >1014 7.9(3.2MHz) 0.002(2GHz) <0.1 LTCC(JIB62) 3.5 210 10.7 3.1 >1014 18.7(7GHz) 0.00025(2GHz) <0.1 LTCC(AAB62) 3.2 220 10.7 3.9 >1014 9.4(9GHz) 0.0005(3.2GHz) <0.1 LTCC(ACB62) 3.25 400 8.5 4.2 >1014 9.4(9GHz) 0.0013(2GHz) <0.1 FR-4(Ref.) 3.0 500 20 0.2 ----4.5 0.02 0.1 Material Characteristics (Conductors) Parameters Materials Surface Conductor Inner Conductor Cavity Castellation Insulation Resistance Surface Finish Unit ----- Resistivity mΩ/sq Bondability Materials gf ----- Resistivity mΩ/sq Conductor Materials Conductor Materials Between Lines Between Laiers Plating --------Ω Ω ----- LTCC(JHB62) LTCC(JIB62) LTCC(AAB62) LTCC(ACB62) Remarks Ag, Ag/Pt Ag, Ag/Pt Ag Ag ≤2.5 ≤2.5 ≤2.5 ≤2.5 Standard Specification High Conductivity Specification ≤1.5 ≤1.5 ≤1.5 ≤1.5 >10 >10 >10 >10 Au Wire φ27µm Ag, Ag/Pt Ag, Ag/Pt Ag Ag ≤2.5 ≤2.5 ≤2.5 ≤2.5 Standard Specification High Conductivity Specification ≤1.5 ≤1.5 ≤1.5 ≤1.5 Ag, Ag/Pt Ag, Ag/Pt Ag Ag Ag/Pt Ag/Pt Ag/Pt ---->1012 >1012 >1012 >1012 >1012 >1012 >1012 >1012 ∗ Ni+Au ----Ni+Au Ni+Au ∗ Surface without plating is also available