RX Modules

LTCC
Low Temperature Co-fired Ceramics
With increasing demands for high density and miniature modules, Kyocera LTCC featuring
thick film printing and multi-layer technologies offers the best fit solutions for those market
demands.
This LTCC is especially suited for telecom devices such as RF power amplifier, antenna
switch module, VCO and RF modules including some filter functions with the following
characteristics.
Features
LTCC Structure
Surface Conductor(Ag)
Via Hole(Ag)
Cavity
Inner Conductor(Ag)
Castellation(Ag)
∗ Ni/Au plate surface finish is available.
• High Density Module
Miniature modules are realized by inner layer circuitry with fine lines and very small via
holes.
• Low Circuit Resistance
Low circuit impedance is achieved by the use of silver as inner conductor material.
• Low Profile
Low profile modules can be achieved by the use of cavity and castellation structure.
• Higher Reliability in Structure
Higher environmental temperature reliability by selecting materials which suitably match
thermal expansion coefficient with mounted components.
• Improved Electro-magnetic Compatibility
Effective for reducing electro-magnetic radiation for its feasibility to build ground or shield in
the internal layer.
• Suited for High Frequency Circuit
For its high dielectric constant of ceramic materials, it is suited for high frequency application
where distributed constant circuitry is utilized.
• Dust Free
Unlike an organic printed circuit board, LTCC ceramic board does not accompany dust
which leads to cleaner environment.
• Excellent Thermal Conductivity
Highly thermal conductive structure is achieved by building heat sink with silver thermal vias
in the bare chip assembly area.
• Built-in Functions
It is possible to embed functions such as BPF, LPF and Balun inside the substrate.
Material Characteristics (Ceramics)
Parameters
Sintered Density
Bend Strength
Thermal Expansion
Thermal Conductivity
Volume Fixed Resistance
Dielectric Constant
Dielectric Loss Angle
Moisture Absorption
Unit
g/cm3
MPa
ppm/°C
W/mK
Ωcm
--------%
LTCC(JHB62)
3.2
260
6.3
2.5
>1014
7.9(3.2MHz)
0.002(2GHz)
<0.1
LTCC(JIB62)
3.5
210
10.7
3.1
>1014
18.7(7GHz)
0.00025(2GHz)
<0.1
LTCC(AAB62)
3.2
220
10.7
3.9
>1014
9.4(9GHz)
0.0005(3.2GHz)
<0.1
LTCC(ACB62)
3.25
400
8.5
4.2
>1014
9.4(9GHz)
0.0013(2GHz)
<0.1
FR-4(Ref.)
3.0
500
20
0.2
----4.5
0.02
0.1
Material Characteristics (Conductors)
Parameters
Materials
Surface
Conductor
Inner
Conductor
Cavity
Castellation
Insulation
Resistance
Surface Finish
Unit
-----
Resistivity
mΩ/sq
Bondability
Materials
gf
-----
Resistivity
mΩ/sq
Conductor Materials
Conductor Materials
Between Lines
Between Laiers
Plating
--------Ω
Ω
-----
LTCC(JHB62) LTCC(JIB62) LTCC(AAB62) LTCC(ACB62)
Remarks
Ag, Ag/Pt
Ag, Ag/Pt
Ag
Ag
≤2.5
≤2.5
≤2.5
≤2.5
Standard Specification
High Conductivity Specification
≤1.5
≤1.5
≤1.5
≤1.5
>10
>10
>10
>10
Au Wire φ27µm
Ag, Ag/Pt
Ag, Ag/Pt
Ag
Ag
≤2.5
≤2.5
≤2.5
≤2.5
Standard Specification
High Conductivity Specification
≤1.5
≤1.5
≤1.5
≤1.5
Ag, Ag/Pt
Ag, Ag/Pt
Ag
Ag
Ag/Pt
Ag/Pt
Ag/Pt
---->1012
>1012
>1012
>1012
>1012
>1012
>1012
>1012
∗ Ni+Au
----Ni+Au
Ni+Au
∗ Surface without plating is also available