DIP2450-01D3 2 G / 5 G WLAN diplexer Datasheet − production data Features ■ Low insertion loss in pass band ■ High attenuation levels ■ High rejection of out-of-band frequencies ■ Small footprint: <1.4 mm2 Benefits ■ Very low profile (<600 µm after reflow) ■ High Q, low loss ■ High RF performance ■ Tight tolerance ■ Bill of materials and area reduction Flip Chip package 4 bumps Figure 1. Applications ■ WLAN ■ Bluetooth ■ Mobile phone application ■ Wireless networking Pin configuration (bump view) 1 2 5G 2G A ANT GND B Description This diplexer targets the use of dual band 2.4 GHz and 5 GHz. The DIP2450-01D3 is a diplexer dedicated to the WLAN/BT application. It is designed using STMicroelectronics IPD (integrated passive device) technology on non conductive glass substrate to optimize RF performance. June 2012 This is information on a product in full production. Doc ID 023193 Rev 1 1/10 www.st.com 10 Characteristics DIP2450-01D3 1 Characteristics Table 1. Absolute rating (limiting values) Value Symbol Parameter Unit Min. PAV VESD antenna and 2G ports TOP Table 2. Typ. Average power Max. 27 ESD ratings: MIL STD883C (HBM:C = 100 pF, R = 1.5 kΩ, air discharge) Charged device model (CDM) Machine model (MM: C = 200 pF, R = 25 Ω, L = 500 nH) 400 500 100 Operating temperature range -40 dBm V +85 ºC Electrical characteristics and RF performance (Tamb = 25 °C) Value Symbol Parameter Test condition Unit Min. Typ. Max. Pass band 2 G band pass 2400 2483.5 MHz 5 G band pass 4900 5850 MHz f Z Nominal impedance Return loss Ω 50 All ports -17 dB S21 2 G to antenna insertion loss 2400 to 2483.5 MHz 0.6 0.7 dB S31 5 G to antenna insertion loss 4900 to 5850 MHz 0.6 0.7 dB Attenuation S21 2 G to antenna attenuation 4900 to 5850 MHz 20 dB S31 5 G to antenna attenuation 2400 to 2483.5 MHz 18 dB Out of band attenuation S21 S31 2/10 2 G to antenna attenuation 5 G to antenna attenuation 5850 to 7000 MHz 15 7000 to 9500 MHz 9 9800 to 10500 MHz 16 9800 to 11650 MHz 11 Doc ID 023193 Rev 1 dB dB DIP2450-01D3 Characteristics 1.1 Measured performance Figure 2. 2 G and 5 G forward transmission (Tamb = 25 °C) 0 S21 and S31 (dB) Figure 3. 0 2 G, 5 G and antenna reflection coefficient (Tamb = 25 °C) S11, S22 and S33 (dB) -5 -10 -10 -20 -15 -30 S21 (2 G ≥ ANT) S31 (5 G ≥ ANT) S11 (ANT) S22 (2 G) S33 (5 G) -20 -40 -25 -50 -30 F (GHz) -60 0 2 Figure 4. -0.40 4 6 10 8 12 2 G insertion loss (Tamb = 25 °C) 0 Figure 5. S21(dB) -10 -0.45 -20 -0.50 -30 -0.55 -40 -0.60 -50 -0.65 -60 F (GHz) -0.70 2.40 2.42 Figure 6. -0 F (GHz) -35 2.44 2.46 2.48 2 4 6 10 8 2 G attenuation in 5 G band (Tamb = 25 °C) S21(dB) F (GHz) -70 4.9 2.50 2 G attenuation in high frequency band (Tamb = 25 °C) S21(dB) 12 Figure 7. 5.1 5.3 5.5 5.7 5.9 2 G return loss (Tamb = 25 °C) S22(dB) -10 -10 -15 -20 -30 -20 -40 -25 -50 F (GHz) -60 5 6 7 8 9 10 11 F (GHz) -30 12 2.40 Doc ID 023193 Rev 1 2.42 2.44 2.46 2.48 2.50 3/10 Characteristics Figure 8. DIP2450-01D3 Antenna return loss in 2 G band (Tamb = 25 °C) Figure 9. S11(dB) -10 -10 -15 -15 -20 -20 -25 -25 F (GHz) -30 2.40 2.42 2.44 2.46 2.48 -10 -0.45 -20 -0.50 -30 -0.55 -40 -0.60 -50 -0.65 -60 F (GHz) 5.1 5.3 5.5 5.7 5.3 5.5 5.7 5.9 S31(dB) F (GHz) -70 5.9 Figure 12. 5 G attenuation in high frequency band (Tamb = 25 °C) -0 5.1 Figure 11. 5 G attenuation in 2 G band (Tamb = 25 °C) S31(dB) 4.9 F (GHz) 4.9 2.50 -0.70 S11(dB) -30 Figure 10. 5 G insertion loss (Tamb = 25 °C) -0.40 Antenna return loss in 5 G band (Tamb = 25 °C) S31(dB) 2.40 2.42 2.44 2.46 2.48 2.50 Figure 13. 5 G return loss (Tamb = 25 °C) -10 S33(dB) -10 -15 -20 -30 -20 -40 -25 -50 F (GHz) -60 5 4/10 6 7 8 9 10 11 F (GHz) -30 12 4.9 Doc ID 023193 Rev 1 5.1 5.3 5.5 5.7 5.9 DIP2450-01D3 Characteristics Figure 14. 2 G to 5 G isolation (Tamb = 25 °C) 0 S23 (dB) Figure 15. 2 G to 5 G isolation in 2 G band (Tamb = 25 °C) -15 S23(dB) -5 -20 -10 -15 -20 -25 -25 -30 -30 -35 -40 -25 -45 F (GHz) -50 F (GHz) -40 0 2 4 6 8 10 12 2.40 2.42 2.44 2.46 2.48 2.50 Figure 16. 2 G to 5 G isolation in 5 G band (Tamb = 25 °C) S23(dB) -15 -20 -25 -30 -25 F (GHz) -40 4.9 5.1 5.3 5.5 Doc ID 023193 Rev 1 5.7 5.9 5/10 Application information 2 DIP2450-01D3 Application information Figure 17. Application schematic 5GHz Tx WLAN Diplexer 2GHz Tx 5GHz Rx 2GHz Rx BT Balun BT TX BT RX Figure 18. PCB recommendation 2G 5G ANT Pad diameter: 220 µm, distance from ground: 100 µm 6/10 Doc ID 023193 Rev 1 DIP2450-01D3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 19. Package dimensions 725 µm Ø255 µm ±40 µm 2G 5G GND ANT 630 µm ±60 µm 625 µm 1.25 mm ±50 µm 3 Package information 200 µm 1.1 mm ±50 µm Figure 20. Footprint Figure 21. Marking Copper pad diameter: 220 µm recommended 260 µm maximum Dot, ST logo ECOPACK status xx = marking z = manufacturing location yww = datecode (y = year ww = week) Solder mask opening: 300 µm minimum Solder stencil opening: 220 µm recommended Doc ID 023193 Rev 1 x x z y ww 7/10 Package information DIP2450-01D3 Figure 22. Flip Chip tape and reel specifications Ø 1.50 ± 0.10 4.0 ± 0.1 1.75 ± 0.1 2.0 ± 0.05 0.71 ± 0.05 All dimensions in mm 8/10 3.5 ±- 0.05 1.35± 0.05 8.0 +0.3 -0.10 0.20 ± 0.02 1.20 ± 0.05 4.0 ± 0.1 User direction of unreeling Doc ID 023193 Rev 1 DIP2450-01D3 4 Ordering information Ordering information Table 3. 5 Ordering information Order code Marking Package Weight Base qty Delivery mode DIP2450-01D3 SA Flip Chip 1.88 mg 5000 Tape and reel (7”) Revision history Table 4. Document revision history Date Revision 27-June-2012 1 Changes Initial release Doc ID 023193 Rev 1 9/10 DIP2450-01D3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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