CPL-WB-02D3 Wide-band, directional coupler with integrated 50 ohm loaded isolated port Datasheet − production data Features ■ 50 Ω nominal input / output impedance ■ Wide operating frequency range (2400 MHz to 5850 MHz) ■ Low insertion loss ■ Coupling factor: – 18 dB at 2.4 GHz – 12 dB at 5 GHz Flip Chip (5 bumps) ■ High ESD robustness ■ Packaged in Flip Chip ■ Package thickness: < 595 µm after reflow ■ Small footprint Figure 1. Pin configuration (bump view) 1 2 3 RFIN GND RFOUT Benefits ■ Very low profile ■ Lead-free package ■ High RF performance ■ RF module size reduction A 50 Ω B CPLD GND Applications ■ Quad-band power amplifier module Description ■ Quad-band front end module ■ WLAN The CPL-WB-02D3 is a wide-band directional coupler designed to measure RF antenna output power. This CPL has been customized for wide band operating frequencies (2G/5G WLAN) with low insertion losses in the transmit bandwidth (2400 MHz to 5850 MHz). The CPL-WB-02D3 has been designed using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance. The device is delivered 100% tested in tape and reel. June 2012 This is information on a product in full production. Doc ID 023286 Rev 1 1/7 www.st.com 7 Characteristics CPL-WB-02D3 1 Characteristics Table 1. Absolute maximum rating (limiting values) Value Symbol Parameter Unit Min. PIN Typ. Max. Input power RFIN 25 VESD (HBM) Human body model, JESD22-A114-B, All I/O dBm 2 kV VESD (MM) Machine model, JESD22-A115-A, All I/O 100 V VESD (CDM) Charge device model, JESD22-C101-C, All I/O 500 V TOP Table 2. Operating temperature -30 +85 ºC Electrical characteristics (Tamb = 25 °C) - impedances Value Symbol Parameter Unit Min. ZOUT ZIN ZCPLD Table 3. Typ. Max. Nominal output impedance 50 Ω Nominal input impedance 50 Ω Nominal coupling impedance 50 Ω Electrical characteristics (Tamb = 25 °C) - RF performance Value Symbol Parameter Test condition Unit Min. TOP f Frequency range (bandwidth) IL Insertion loss in bandwidth RL Return loss in bandwidth (IN, OUT pins) CPLD 2/7 Operating temperature Typ. Max. -30 +85 °C 2400 5850 MHz From 2400 MHz to 2500 MHz 0.2 dB From 4900 MHz to 5850 MHz 0.5 From 2400 MHz to 5850 MHz 15 dB From 2400 MHz to 2500 MHz 17 18 19 dB From 4900 MHz to 5850 MHz 11 12 13 dB Coupling factor Doc ID 023286 Rev 1 CPL-WB-02D3 2 PCB recommendation PCB recommendation Figure 2. Recommended land pattern OUT GND Layer 1 IN Pads Ø220 µm Aperture 130 µm GND Doc ID 023286 Rev 1 CPL 3/7 Package information 3 CPL-WB-02D3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 3. Package dimensions 625 µm ±50 µm 1.35 mm ± 45 µm 255 µm 450 µm 580 µm UBM: ø 220 µm 200 µm 1.00 mm ± 45 µm Figure 4. Footprint Figure 5. Copper pad diameter: 220 µm recommended 260 µm maximum Dot, ST logo ECOPACK grade xx = marking z = manufacturing location yww = datecode (y = year ww = week) Solder mask opening: 300 µm minimum Solder stencil opening: 220 µm recommended 4/7 Marking Doc ID 023286 Rev 1 x x z y ww CPL-WB-02D3 Package information Figure 6. Tape and reel specifications Dot identifying Pin A1 location 2.0 Ø 1.55 4.0 8.0 3.5 1.45 1.75 0.22 ST ST ST xxz yww xxz yww xxz yww 1.09 4.0 0.71 All dimensions are typical values in mm Note: User direction of unreeling More information is available in the STMicroelectronics Application note: AN2348, “IPAD™ 400 µm Flip Chip: package description and recommendations for use” AN1751: “EMI Filters: recommendations and measurements” Doc ID 023286 Rev 1 5/7 Ordering information 4 Ordering information Table 4. 5 Ordering information Order code Marking Package Weight Base qty Delivery mode CPL-WB-02D3 SE Flip Chip 1.59 mg 5000 Tape and reel Revision history Table 5. 6/7 CPL-WB-02D3 Document revision history Date Revision 18-Jun-2012 1 Changes Initial release Doc ID 023286 Rev 1 CPL-WB-02D3 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2012 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 023286 Rev 1 7/7