CPL-WB-00D3 Wide band directional coupler with ISO port Features ■ 50 Ω nominal input / output impedance ■ Wide operating frequency range (824 MHz to 2170 MHz) ■ Low Insertion Loss (< 0.2 dB) ■ 34 dB typical coupling factor ■ High directivity (typical 25 dB) ■ High ESD robustness (IEC 61000-4-2 Level 4) ■ Flip-Chip package ■ Small footprint: 1300 x 1000 µm Figure 1. Benefits ■ Very low profile (< 690 µm) ■ Lead-free package ■ High RF performance ■ RF module size reduction Pin configuration (top view) 3 2 RFOUT GND 1 RFIN A ATN. ATN. B ISO GND CPLD Applications ■ Quad band power amplifier module ■ Quad band front end module Description ■ GSM / WCDMA mobile phone The CPL-WB-00D3 is a wide band directional coupler designed to measure RF antenna output power in GSM / WCDMA / TD-SCDMA applications. This CPL has been customized for wide band operating frequencies (EGSM and CELL, PCS, DCS, TD-SCDMA, WCDMA Band I) with less than 0.2 dB insertion losses in the transmit bandwidth (824 MHz to 2170 MHz). The CPL-WB-00D3 has been designed using STMicroelectronics IPD (integrated passive device) technology on non conductive glass substrate to optimize RF performance. The device is delivered 100% tested in tape and reel. April 2011 Doc ID 018753 Rev 1 1/8 www.st.com 8 Characteristics CPL-WB-00D3 1 Characteristics Table 1. Absolute maximum rating (limiting values) Value Symbol Parameter Unit Min. PIN Typ. Input Power RFIN Max. 35 ESD ratings IEC 61000-4-2 (C = 150 pF, R = 330 Ω, 10 shots with both polarities and each condition, cumulative method) VESD (IEC) ISO and CPLD pins connected to ground: RFIN, RFOUT, air discharge RFIN, RFOUT, contact discharge VESD (HBM) Human body model, JESD22-A114F, all I/O dBm kV kV ±15 ±8 2 kV VESD (MM) Machine model, JESD22-A115-A, all I/O 100 V VESD (CDM) Charge device model, JESD22-C101-C, all I/O 500 V TOP Table 2. Operating temperature -30 +85 ºC Electrical characteristics (Tamb = 25 °C) - impedances Value Symbol Parameter Unit Min. Typ. Max. Nominal output impedance 50 Ω Nominal input impedance 50 Ω ZCPLD Nominal coupling impedance 50 Ω ZOUT Nominal ISO impedance 50 Ω ZOUT ZIN Table 3. Electrical characteristics (Tamb = 25 °C) - RF performance Value Symbol Parameter Test condition Unit Min. 2/8 Typ. Max. f Frequency range (bandwidth) IL Insertion loss in bandwidth From 824 MHz to 2170 MHz RL Return loss in bandwidth From 824 MHz to 2170 MHz 15 Coupling factor (including attenuator) From 824 MHz to 915 MHz 35 39 dB CPLD From 1710 MHz to 2025 MHz 28 33 dB 0.5 dB 824 Ripple Coupling ripple in individual band (824 to 849 MHz) (880 to 915 MHz) (1710 to 1785 MHz) (1850 to 1910 MHz) (1880 to 2025 MHz) (1920 to 1980 MHz) DIR Coupler directivity From 824 MHz to 2025 MHz Doc ID 018753 Rev 1 0.1 20 2170 MHz 0.2 dB dB 25 dB CPL-WB-00D3 1.1 Characteristics RF measurement (on reference evaluation board) Measurements done on reference evaluation board under 50 Ω, de-embedding at CPL-WB-00D3 bumps. Figure 2. Insertion loss dB -0.0 -0.05 -0.1 -0.15 -0.2 -0.25 F (MHz) -0.3 Figure 3. 824 959 1093 1228 1362 1497 1632 1766 1901 2035 2170 Coupling and isolation -26 dB -28 -30 -32 -34 -36 -38 -40 7.0E8 Figure 4. F (Hz) 9.0E8 1.1E9 1.3E9 1.5E9 1.7E9 1.9E9 2.1E9 2.3E9 2.5E9 Directivity 34 32 30 28 26 24 22 20 F (Hz) 18 8.0E8 1.0E9 1.2E9 1.4E9 1.6E9 Doc ID 018753 Rev 1 1.8E9 2.0E9 2.2E9 3/8 Reference evaluation board 2 Reference evaluation board Figure 5. 4/8 CPL-WB-00D3 CPW lines (W = 127 µm with gap to gnd = 100 µm) on top layer + GND on layer 2 ● Material: 4 layers FR4 with solder mask on top and bottom layer ● Substrate thickness: 0.8 mm ● Line lengths: 14.3 mm ● TRL cal kit available Doc ID 018753 Rev 1 CPL-WB-00D3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 6. Package dimensions (bump side) 630 µm ± 60 µm 255 µm 1.3 mm ± 50µm 595 µm 450 µm 3 Package information 1.0 mm ± 50 µm Figure 7. Footprint Figure 8. Marking Dot, ST logo = ECOPACK status xx = marking z = manufacturing location yww = datecode (y = year ww = week) Copper pad Diameter: 220 µm recommended, 260 µm max Solder stencil opening: 220 µm Solder mask opening : 320 µm recommendation Doc ID 018753 Rev 1 x x z y ww 5/8 Package information Figure 9. CPL-WB-00D3 Flip Chip tape and reel specifications Dot identifying Pin A1 location 2.0 Ø 1.55 4.0 8.0 3.5 1.4 1.75 0.22 ST ST ST xxz yww xxz yww xxz yww 1.1 4.0 0.71 All dimensions are typical values in mm Note: User direction of unreeling More information is available in the application note: AN1235: “Flip Chip: package description and recommendations for use” 6/8 Doc ID 018753 Rev 1 CPL-WB-00D3 4 Ordering information Ordering information Table 4. 5 Ordering information Order code Marking Base qty Delivery mode CPL-WB-00D3 RX 5000 Tape and reel Revision history Table 5. Document revision history Date Revision 21-Apr-2010 1 Changes Initial release. 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