STPSC10H065 650 V power Schottky silicon carbide diode Datasheet - production data Description $ The SiC diode is an ultrahigh performance power Schottky diode. It is manufactured using a silicon carbide substrate. The wide band gap material allows the design of a Schottky diode structure with a 650 V rating. Due to the Schottky construction, no recovery is shown at turn-off and ringing patterns are negligible. The minimal capacitive turn-off behavior is independent of temperature. . . . $ . $ . . $ 1& Especially suited for use in PFC applications, this ST SiC diode will boost the performance in hard switching conditions. Its high forward surge capability ensures a good robustness during transient phases. $ 1& Table 1. Device summary Features • No reverse recovery charge in application current range • Switching behavior independent of temperature Symbol Value IF(AV) 10 A VRRM 650 V Tj (max) 175 °C • Dedicated to PFC applications • High forward surge capability • Insulated package TO-220AC Ins: – Insulated voltage: 2500 V rms – Typical package capacitance: 7 pF July 2015 This is information on a product in full production. DocID023604 Rev 5 1/14 www.st.com Characteristics 1 STPSC10H065 Characteristics Table 2. Absolute ratings (limiting values at 25 °C unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current TO-220AC, DPAK, Average forward current IF(AV) D2 PAK, Tc = 135 °C (1) Value Unit 650 V 22 A 10 A 90 80 470 A 41 A -55 to +175 °C -40 to +175 °C , DC TO-220AC Ins, Tc = 85 °C(1), DC tp = 10 ms sinusoidal, Tc = 25 °C Surge non repetitive tp = 10 ms sinusoidal, Tc = 125 °C forward current tp = 10 µs square, Tc = 25 °C IFSM TO-220AC, DPAK, D2PAK, Tc = 135 °C(1), Tj = 175 °C, δ = 0.1 IFRM Repetitive peak forward current Tstg Storage temperature range Tj Operating junction TO-220AC Ins, Tc = 85 °C(1), Tj = 175 °C, δ = 0.1 temperature(2) 1. Value based on Rth(j-c) max. 2. dPtot --------------dTj 1 - condition to avoid thermal runaway for a diode on its own heatsink < ------------------------Rth (j – a ) Table 3. Thermal resistance Symbol Rth(j-c) Parameter Typ. value Max. value TO-220AC, DPAK, D2PAK 1.25 1.5 TO-220AC Ins 2.1 3.5 Junction to case Unit °C/W Table 4. Static electrical characteristics Symbol Parameter IR (1) Reverse leakage current VF (2) Forward voltage drop Tests conditions Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C VR = VRRM IF = 10 A Min. Typ. Max. - 9 100 - 85 425 - 1.56 1.75 - 1.98 2.5 µA V 1. tp = 10 ms, δ < 2% 2. tp = 500 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 1.35 x IF(AV) + 0.115 x IF2(RMS) 2/14 DocID023604 Rev 5 Unit STPSC10H065 Characteristics Table 5. Dynamic electrical characteristics Symbol Q cj(1) Parameter Test conditions Total capacitive charge Total capacitance Cj Typ. Unit VR = 400 V, 28.5 nC VR = 0 V, Tc = 25 °C, F = 1 MHz 480 VR = 400 V, Tc = 25 °C, F = 1 MHz 48 1. Most accurate value for the capacitive charge: pF VOUT Qcj = ∫0 cj(vR).dvR Figure 1. Forward voltage drop versus forward Figure 2. Forward voltage drop versus forward current (typical values, low level) current (typical values, high level) 20 IF(A) 18 IF(A) 100 Pulse test : tp=500µs Pulse test : tp=500µs 90 16 80 Ta=25 °C 14 12 70 Ta=150 °C Ta=100 °C 10 60 8 40 6 30 4 20 2 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Ta=150 °C Ta=175 °C VF (V) 0 3.5 Figure 3. Reverse leakage current versus reverse voltage applied (typical values) 1.E+03 Ta=100 °C 10 VF (V) 0 Ta=25 °C 50 Ta=175 °C IR(µA) 0 1 2 3 4 5 6 7 8 Figure 4. Peak forward current versus case temperature (TO-220AC, DPAK, D²PAK) 80 I M (A) T d = 0.1 70 IM Tj=175 °C 1.E+02 d =tp/T 60 50 Tj=150 °C 1.E+01 tp d = 0.3 40 d = 0.5 1.E+00 30 20 1.E-01 Tj=25 °C 1.E-02 0 50 d = 0.7 d=1 VR(V) 100 150 200 250 300 350 400 450 500 550 600 650 10 TC(°C) 0 0 DocID023604 Rev 5 25 50 75 100 125 150 175 3/14 14 Characteristics STPSC10H065 Figure 5. Peak forward current versus case temperature (TO-220AC Ins) Figure 6. Junction capacitance versus reverse voltage applied (typical values) I M (A) 70 Cj (pF) 500 T d = 0.1 60 IM F=1 MHz VOSC=30 mVRMS Tj=25 °C 450 d =tp/T 400 tp 50 350 300 40 250 d = 0.3 30 200 d = 0.5 150 20 100 10 d=1 50 d = 0.7 TC(°C) 0 0 25 50 75 100 125 150 0.1 175 Figure 7. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, DPAK and D²PAK) 1.0 VR(V) 0 Zth(j-c)/Rth(j-c) 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 IFSM (A) t p (s) 0.0 1.E-04 Figure 9. Non-repetitive peak surge forward current versus pulse duration (sinusoidal waveform) 1.E+03 1000.0 Single pulse 0.1 tp(s) 0.0 1.E-05 100.0 Zth(j-c)/Rth(j-c) 0.2 Single pulse 0.1 10.0 Figure 8. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC Ins) 1.0 0.2 1.0 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 10. Total capacitive charges versus reverse voltage applied (typical values) 32 Qcj (nC) 28 Ta=25 °C 24 20 Ta=125 °C 1.E+02 16 12 8 4 VR (V) tp(s) 1.E+01 1.E-05 4/14 0 1.E-04 1.E-03 1.E-02 0 DocID023604 Rev 5 50 100 150 200 250 300 350 400 STPSC10H065 2 Package information Package information • Epoxy meets UL94, V0 • Recommended torque value: 0.55 N·m • Maximum torque value: 0.7 N·m • Cooling method: conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at:www.st.com. ECOPACK® is an ST trademark. 2.1 TO-220AC package information Figure 11. TO-220AC package outline A H2 ØI C L5 L7 L6 L2 F1 D L9 L4 F M E G DocID023604 Rev 5 5/14 14 Package information STPSC10H065 Table 6. TO-220AC package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. I 6/14 Inches 2.6 typ. 3.75 0.102 typ. 3.85 DocID023604 Rev 5 0.147 0.151 STPSC10H065 2.2 Package information TO-220AC ins package information Figure 12. TO-220AC Ins package outline C B ØI b2 L F A I4 c2 a1 l2 a2 M b1 c1 e DocID023604 Rev 5 7/14 14 Package information STPSC10H065 Table 7. TO-220AC Ins package mechanical data Dimensions Ref. Millimeters Min. A 15.20 a1 Max. Min. 15.90 0.598 3.75 Typ. Max. 0.625 0.147 a2 13.00 14.00 0.511 0.551 B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 C 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 4.80 5.40 0.189 0.212 F 6.20 6.60 0.244 0.259 ØI 3.75 3.85 0.147 0.151 I4 15.80 16.80 0.622 L 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 M 8/14 Typ. Inches 16.40 2.60 DocID023604 Rev 5 0.646 0.102 0.661 STPSC10H065 2.3 Package information DPAK package information Figure 13. DPAK package outline E A b4 c2 E1 L2 D D1 D R H L4 A1 b e e1 R c A2 L 0.25 L1 V2 Gauge plane DocID023604 Rev 5 9/14 14 Package information STPSC10H065 Table 8. DPAK package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 5.20 5.40 0.204 0.212 c 0.45 0.60 0.017 0.023 c2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 D1 E 5.10 6.40 0.201 6.60 0.251 0.259 E1 4.70 0.185 e 2.28 0.090 e1 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 L 1.00 1.50 0.039 0.059 L1 2.80 0.11 L2 0.80 0.032 L4 0.60 R V2 1.00 0.023 0.039 0.2 0° 0.008 8° 0° 8° Figure 14. Footprint (dimensions in mm) 10.7 6.1 2.8 4.572 6.3 B A 1.5 This footprint ensures insultation up to 630 V rms (according to IEC 664-1) The device must be positioned within 0.05 A B 10/14 DocID023604 Rev 5 STPSC10H065 2.4 Package information D²PAK package information Figure 15. D2PAK package outline A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm DocID023604 Rev 5 11/14 14 Package information STPSC10H065 Table 9. D2PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 A 4.40 A1 2.49 2.69 0.098 0.106 A1 2.49 A2 0.03 0.23 0.001 0.009 A2 0.03 B 0.70 0.93 0.027 0.037 B 0.70 B2 1.14 1.70 0.045 0.067 B2 1.14 C 0.45 0.60 0.017 0.024 C 0.45 C2 1.23 1.36 0.048 0.054 C2 1.23 D 8.95 9.35 0.352 0.368 D 8.95 E 10.00 10.40 0.393 0.409 E 10.00 G 4.88 5.28 0.192 0.208 G 4.88 L 15.00 15.85 0.590 0.624 L 15.00 L2 1.27 1.40 0.050 0.055 L2 1.27 L3 1.40 1.75 0.055 0.069 L3 1.40 M 2.40 3.20 0.094 0.126 M 2.40 R V2 0.40 0.016 0° 8° 0° 8° Figure 16. Footprint (dimensions in mm) 16.90 10.30 5.08 1.30 8.90 12/14 DocID023604 Rev 5 3.70 STPSC10H065 3 Ordering information Ordering information Table 10. Ordering information 4 Order code Marking Package Weight Base qty Delivery mode STPSC10H065D STPSC10H065D TO-220AC 1.86 g 50 Tube STPSC10H065DI STPSC 10H065DI TO-220AC Ins STPSC10H065G-TR STPSC10H065G STPSC10H065B-TR PSC10 H065 2.12 g 50 Tube D2 PAK 1.48 g 1000 Tape and reel DPAK 0.32 g 2500 Tape and reel Revision history Table 11. Document revision history Date Revision Changes 31-Aug-2012 1 First issue. 10-Oct-2012 2 Added Max. value to Table 3. 07-Nov-2013 3 Updated Figure 1, Figure 2, Figure 13, Figure 14 and Table 8. 07-Jan-2014 4 Added TO-220AC Ins package. 22-Jul-2015 5 Updated Table 10 and reformatted to current standard. DocID023604 Rev 5 13/14 14 STPSC10H065 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved 14/14 DocID023604 Rev 5