STPS2045C Power Schottky rectifier Datasheet − production data Features • Very small conduction losses $ . • Negligible switching losses $ • Extremely fast switching . 72)3$% $ $ . $ $ 72$% • Avalanche rated . ,ð3$. $ . $ • Insulated package: TO-220FPAB – Insulating voltage = 2000 VRMS sine – Capacitance = 12 pF Description $ 'ð3$. $ Table 1. Device summary Symbol Value IF(AV) 2 x 10 A VRRM 45 V Tj(max) 175 °C VF(typ) 0.57 V August 2015 This is information on a product in full production. Dual center tap Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters. Packaged either in TO-220AB, TO-220FPAB, I2PAK, or D2PAK, this device is especially intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. DocID3506 Rev 9 1/14 www.st.com 14 Characteristics 1 STPS2045C Characteristics Table 2. Absolute ratings (limiting values, per diode) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) Forward rms current 30 A IF(AV) IFSM PARM (1) Average forward current δ = 0.5 TO-220AB D2PAK I2PAK Tc = 155 °C TO220FPAB Tc = 125 °C A Per device 20 tp = 10 ms sinusoidal 180 A Repetitive peak avalanche power Tj = 125 °C, tp = 10 µs 280 W tp < 10 µs, Tj < 125 °C, IAR < 7.7 A 60 V -65 to + 175 °C 175 °C VASM(2) Maximum single-pulse peak avalanche voltage Tj 10 Surge non repetitive forward current VARM(2) Maximum repetitive peak avalanche voltage Tstg Per diode Storage temperature range Maximum operating junction temperature(3) 1. For pulse time duration deratings, please refer to Figure 3. More details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the STMicroelectronics Application notes AN1768, “Admissible avalanche power of Schottky diodes” and AN2025, “Converter improvement using Schottky rectifier avalanche specification”. 2. See Figure 9 1 dPtot < Rth(j-a) dTj 3. condition to avoid thermal runaway for a diode on its own heatsink Table 3. Thermal resistances parameters Symbol Rth(j-c) Parameter Value TO-220AB / D2PAK / I2PAK Per diode Total 2.2 1.4 TO-220FPAB Per diode Total 4.5 3.5 Junction to case °C/W TO-220AB / D2PAK / I2PAK R th(c) Coupling 0.4 Coupling TO-220FPAB When the diodes 1 and 2 are used simultaneously: Tj(diode 1) = P(diode1) x Rth(j-c)(per diode) + P(diode2) x Rth(c) 2/14 Unit DocID3506 Rev 9 °C/W 2.5 STPS2045C Characteristics Table 4. Static electrical characteristics (per diode) Symbol IR(1) Test conditions Min. Tj = 25 °C Reverse leakage current Tj = 125 °C IF = 10 A Tj = 25 °C Forward voltage drop Max. Unit 100 μA 7 15 mA 0.5 0.57 VR = VRRM Tj = 125 °C VF(1) Typ. V 0.84 IF = 20 A Tj = 125 °C 0.65 0.72 1. Pulse test: tp = 380 μs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.015 IF2(RMS) Figure 1. Average forward power dissipation versus average forward current (per diode) Figure 2. Average forward current versus ambient temperature (δ = 0.5, per diode) PF(AV)(W) IF(AV)(A) 8 δ = 0.1 δ = 0.05 7 12 δ = 0.2 δ = 0.5 TO-220AB D²PAK Rth(j-a)=Rth(j-c) 10 6 TO-220FPAB 8 δ=1 5 Rth(j-a)=15°C/W 4 6 3 4 T T 2 2 1 IF(AV)(A) δ=tp/T 0 0 1 2 3 4 5 6 7 8 9 δ=tp/T tp 10 11 12 0 Figure 3. Normalized avalanche power deratings versus pulse duration Tamb(°C) 25 50 75 100 125 150 175 Figure 4. Reverse leakage current versus reverse voltage applied (typical values, per diode) 3$50W33$50V tp 0 IR(µA) 5E+4 Tj=150°C 1E+4 Tj=125°C Tj=100°C 1E+3 Tj=75°C 1E+2 Tj=50°C 1E+1 Tj=25°C 1E+0 W3V VR(V) 1E-1 0 DocID3506 Rev 9 5 10 15 20 25 30 35 40 45 3/14 Characteristics STPS2045C Figure 5. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration (TO-220FPAB) Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 2 2 (TO-220AB, D PAK, I PAK) 0.8 0.8 0.6 0.6 δ = 0.5 0.4 δ = 0.5 0.4 T T δ = 0.2 0.2 δ = 0.2 0.2 δ = 0.1 δ = 0.1 tp(s) Single pulse δ=tp/T 0.0 1E-4 1E-3 1E-2 tp tp(s) Single pulse 1E-1 1E+0 Figure 7. Junction capacitance versus reverse voltage applied (typical values, per diode) 1E-3 1E-2 1E-1 tp 1E+0 1E+1 Figure 8. Forward voltage drop versus forward current (maximum values, per diode) IFM(A) C(pF) 100.0 1000 Tj=125°C (typical values) F=1MHz VOSC=30mVRMS Tj=25°C 500 10.0 Tj=125°C Tj=25°C 1.0 200 VR(V) VFM(V) 100 0.1 1 2 5 10 20 50 0.0 Figure 9. Reverse safe operating area (tp < 10 µs and Tj < 125 °C) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Figure 10. Thermal resistance junction to ambient versus copper surface under tab Rth(j-a)(°C/W) ,DUP$ 80 (Epoxy printed circuit board, copper thickness: 35 µm) 2 (D PAK) 70 60 50 40 30 20 9DUP9 10 S(cm²) 0 0 4/14 δ=tp/T 0.0 DocID3506 Rev 9 5 10 15 20 25 30 35 40 STPS2045C 2 Package information Package information • Epoxy meets UL94, V0 • Recommended torque value (TO-220AB, TO-220FPAB): 0.55 N·m • Maximum torque value (TO-220AB, TO-220FPAB): 0.7 N·m • Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 D²PAK package information Figure 11. D2PAK package outline A E C2 L1 D H L2 b2 C b e A1 E1 D1 L4 L L3 Gauge plane 0 - 8° This D²PAK above drawing is an illustration provided for information only. D²PAK real shape may slightly differ from this particular example. Nevertheless, this mechanical dimensions specified in the table will remain applicable. DocID3506 Rev 9 5/14 Package information STPS2045C Table 5. D2PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.23 0.000 0.009 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.694 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 - 0.272 - E 10.00 10.55 0.394 0.415 E1 8.10 - 0.319 - e 2.54 typ. 0.100 typ. H 15.00 15.85 0.591 0.624 L 1.90 2.79 0.075 0.110 L1 - 1.65 - 0.065 L2 - 1.78 - 0.070 L3 0.25 typ. L4 4.78 0.010 typ. 5.28 0.188 0.208 Figure 12. D2PAK footprint dimensions (in mm) 16.90 12.20 5.08 2.54 1.60 9.75 6/14 DocID3506 Rev 9 3.50 STPS2045C 2.2 Package information TO-220AB package information Figure 13. TO-220AB package outline A E ∅P Resin gate 0.5 mm max. protrusion(1) F Q H1 D D1 L30 L20 b1 J1 L1 L b e e1 Resin gate 0.5 mm max. protrusion(1) c (1) Resin gate position accepted in each of the two position shown as well as the symmetrical opposites DocID3506 Rev 9 7/14 Package information STPS2045C Table 6. TO-220AB package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.17 0.18 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.045 0.067 c 0.48 0.70 0.019 0.027 D 15.25 15.75 0.60 0.62 D1 8/14 Inches 1.27 typ. 0.05 typ. E 10 10.40 0.39 0.41 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.19 0.20 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.24 0.26 J1 2.40 2.72 0.094 0.107 L 13 14 0.51 0.55 L1 3.50 3.93 0.137 0.154 L20 16.40 typ. 0.64 typ. L30 28.90 typ. 1.13 typ. ∅P 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 DocID3506 Rev 9 STPS2045C 2.3 Package information I²PAK package information Devices in I2PAK with nickel-plated back frame must NOT be mounted by frame soldering like SMDs. Such devices are intended to be through-hole mounted ONLY and in no circumstances shall ST be held liable for any lack of performance or damage arising out of soldering of nickel-plated back frames. Figure 14. I2PAK package outline A E c2 L2 D L1 A1 b1 L b c e e1 DocID3506 Rev 9 9/14 Package information STPS2045C Table 7. I2PAK package mechanical data Dimensions Ref. 10/14 Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 E 10 10.40 0.394 0.409 L 13 14 0.512 0.551 L1 3.50 3.93 0.138 0.155 L2 1.27 1.40 0.050 0.055 DocID3506 Rev 9 STPS2045C 2.4 Package information TO-220FPAB package information Figure 15. TO-220FPAB package outline A B H Dia L6 L2 L7 L3 L5 F1 L4 D F2 F E G1 G DocID3506 Rev 9 11/14 Package information STPS2045C Table 8. TO-220FPAB package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 F2 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L2 12/14 Inches 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 DocID3506 Rev 9 STPS2045C 3 Ordering information Ordering information Table 9. Ordering information Order code Marking Package Weight Base qty Delivery mode STPS2045CT STPS2045CT TO-220AB 2.23 g 50 Tube 1.49 g 50 Tube TO-220FPAB 2.0 g 50 Tube D2PAK 50 Tube 1.48 g 1000 Tape and reel STPS2045CR STPS2045CR STPS2045CFP STPS2045CFP STPS2045CG STPS2045CG STPS2045CG-TR 4 I2 PAK STPS2045CG Revision history Table 10. Document revision history Date Revision Changes 05-Oct-2004 4F 01-Dec-2004 5 Figure 16 (I2PAK Package Mechanical Data): references b1 and b2 changed from 1.17mm to 1.70mm. 05-Feb-2010 6 Updated Table 2 (removed voltage). Updated ECOPACK statement. Updated Table 6.: TO-220AB package mechanical data. 05-Mar-2013 7 Updated Table 3 21-Oct-2014 8 Updated Features, Table 2, Figure 3 and D²PAK package information. Added Figure 9. Removed fig 4,5 and 6 of version 7. 17-Aug-2015 9 Corrected XML fragment and reformatted to current standard. Last update DocID3506 Rev 9 13/14 STPS2045C IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. 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