STMICROELECTRONICS CPL-WB-01D3

CPL-WB-01D3
Wide-band directional coupler with ISO port
Features
■
50 Ω nominal input / output impedance
■
Wide operating frequency range
(824 MHz to 2170 MHz)
■
Low insertion loss (< 0.2 dB)
■
26 dB coupling factor
■
High directivity
■
High ESD robustness
(IEC 61000-4-2 Level 4)
■
Flip-Chip package
■
Small footprint
Flip-Chip package 6 bumps
Figure 1.
Benefits
■
Very low profile
■
Lead-free package
■
High RF performance
■
RF module size reduction
Pin configuration (top view)
3
2
1
RFOUT
GND
RFIN
A
B
ISO
GND
CPLD
Applications
■
Quad-band power amplifier module
■
Quad-band front end module
Description
■
GSM / WCDMA mobile phone
The CPL-WB-01D3 is a wide-band directional
coupler designed to measure RF antenna output
power in GSM / WCDMA / TD-SCDMA
applications. This CPL has been customized for
wide band operating frequencies (EGSM and
CELL, PCS, DCS, TD-SCDMA, WCDMA Band I)
with less than 0.2 dB insertion losses in the
transmit bandwidth (824 MHz to 2170 MHz).
The CPL-WB-01D3 has been designed using
STMicroelectronics IPD (integrated passive
device) technology on non-conductive glass
substrate to optimize RF performance. The device
is delivered 100% tested in tape and reel.
February 2012
Doc ID 019036 Rev 3
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www.st.com
10
Characteristics
CPL-WB-01D3
1
Characteristics
Table 1.
Absolute maximum rating (limiting values)
Value
Symbol
Parameter
Unit
Min.
PIN
Typ.
Input power RFIN
Max.
35
ESD ratings IEC 61000-4-2 (C = 150 pF, R = 330 Ω, 10 shots
with both polarities and each condition, cumulative method)
VESD (IEC)
RFIN, RFOUT, air discharge
RFIN, RFOUT, contact discharge
dBm
±15
±8
kV
kV
2
kV
VESD (MM) Machine model, JESD22-A115-A, All I/O
100
V
VESD (CDM) Charge device model, JESD22-C101-C, All I/O
500
V
VESD (HBM) Human body model, JESD22-A114-B, All I/O
TOP
Table 2.
Operating temperature
-30
+85
ºC
Electrical characteristics (Tamb = 25 °C) - impedances
Value
Symbol
Parameter
Unit
Min.
ZOUT
ZIN
ZCPLD
ZISO
2/10
Typ.
Max.
Nominal output impedance
50
Ω
Nominal input impedance
50
Ω
Nominal coupling impedance
50
Ω
Nominal ISO impedance
50
Ω
Doc ID 019036 Rev 3
CPL-WB-01D3
Table 3.
Characteristics
Electrical characteristics (Tamb = 25 °C) - RF performance
Value
Symbol
Parameter
Test condition
Unit
Min.
Typ.
Max.
Operating temperature
-30
+85
°C
f
Frequency range
(bandwidth)
824
2170
MHz
IL
Insertion loss in bandwidth From 824 MHz to 2170 MHz
0.2
dB
RL
Return loss in bandwidth
TOP
CPLD
0.1
From 824 MHz to 2170 MHz
15
dB
From 824 MHz to 915 MHz
24
26
27
dB
From 1710 MHz to 2025 MHz
18
19
21
dB
0.5
dB
Coupling factor
Ripple
Coupling ripple in
individual band
(824 to 849 MHz) - (880 to 915 MHz)
(1710 to 1785 MHz) - (1850 to 1910 MHz)
(1880 to 2025 MHz) - (1920 to 1980 MHz)
DIR
Coupler directivity
From 824 MHz to 2025 MHz
Doc ID 019036 Rev 3
15
20
dB
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Characteristics
1.1
CPL-WB-01D3
RF measurement
Figure 2.
Insertion loss
IL - dB
0.00
-0.05
-0.10
-0.15
-0.20
F (Hz)
-0.25
8.0E8
Figure 3.
1.0E9
1.2E9
1.4E9
1.6E9
1.8E9
2.0E9
2.2E9
Coupling LB
CPLD_LB, dB
-23
-24
-25
-26
-27
F (Hz)
-28
8.2E8
Figure 4.
8.4E8
8.6E8
8.8E8
9.2E8
9.0E8
Coupling HB
-17
CPLD_HB, dB
-18
-19
-20
-21
F (Hz)
-22
1.70E9
4/10
1.75E9
1.80E9
1.85E9
1.90E9
Doc ID 019036 Rev 3
1.95E9
2.00E9
2.05E9
CPL-WB-01D3
Figure 5.
Characteristics
Return losses
-10
RL - dB
-15
-20
RL_IN
RL_OUT
RL_ISO
RL_CPLD
-25
-30
-35
-40
-45
F (Hz)
-50
0.0
5.0E8
1.0E9
1.5E9
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2.0E9
2.5E9
3.0E9
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PCB layout recommendation
2
PCB layout recommendation
Figure 6.
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CPL-WB-01D3
Typical PCB layout recommendation
●
Material: 4 layers FR4 with solder mask on top and bottom layer
●
Substrate thickness: 0.8 mm
●
50 Ω line access
●
Ground plane must be on PCB layer 1 as shown in Figure 6
Doc ID 019036 Rev 3
CPL-WB-01D3
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 7.
Package dimensions
625 µm
±50 µm
255 µm
1.3 mm ± 45 µm
595 µm
450 µm
3
Package information
UBM: ø 220 µm
1.0 mm ± 45 µm
Figure 8.
Footprint
Figure 9.
Copper pad diameter:
220 µm recommended
260 µm maximum
Marking
Dot, ST logo
ECOPACK grade
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
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x x z
y ww
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Package information
CPL-WB-01D3
Figure 10. Flip Chip tape and reel specifications
Dot identifying Pin A1 location
2.0
Ø 1.55
4.0
8.0
3.5
1.4
1.75
0.22
ST
ST
ST
xxz
yww
xxz
yww
xxz
yww
1.1
4.0
0.73
All dimensions are typical values in mm
Note:
User direction of unreeling
More information is available in the application note:
AN2348: “Flip Chip: package description and recommendations for use”
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CPL-WB-01D3
4
Ordering information
Ordering information
Table 4.
5
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
CPL-WB-01D3
RV
Flip Chip
1.61 mg
5000
Tape and reel
Revision history
Table 5.
Document revision history
Date
Revision
Changes
08-Jul-2011
1
Initial release
12-Sep-2011
2
Updated Figure 2, Figure 3, and Figure 4.
14-Feb-2012
3
Updated Figure 8.
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CPL-WB-01D3
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