VND5004A-E
VND5004ASP30-E
Double 4mΩ high- side driver with analog current sense
for automotive applications
Datasheet - production data
– Thermal shut down
– Self limiting of fast thermal transients
– Protection against loss of ground and loss
of VCC
– Reverse battery protection with self switch
on of the PowerMOS
– Electrostatic discharge protection
PQFN - 12x12 Power lead-less
MultiPowerSO-30
Applications
Features
• All types of resistive, inductive and capacitive
loads
• Suitable for power management applications
Max transient supply voltage
VCC
41V
Operating voltage range
VCC
4.5 to 27V
Max On-State resistance (per ch.)
RON
4 mΩ
Current limitation (typ)
ILIMH
100A
Off state supply current
IS
2 μA(1)
1. Typical value with all loads connected
Description
The VND5004ATR-E and VND5004ASP30-E are
devices made using STMicroelectronics VIPower
technology. They are intended for driving resistive
or inductive loads with one side connected to
ground. Active VCC pin voltage clamp and load
dump protection circuit protect the devices
against transients on the Vcc pin (see ISO7637
transient compatibility table). These devices
integrate an analog current sense which delivers
a current proportional to the load current
(according to a known ratio) when CS_DIS is
driven low or left open. When CS_DIS is driven
high, the CURRENT SENSE pin is high
impedance. Output current limitation protects the
devices in overload condition. In case of long
duration overload, the devices limit the dissipated
power to a safe level up to thermal shut-down
intervention. Thermal shut-down with automatic
restart allows the device to recover normal
operation as soon as a fault condition disappears.
• General
– Inrush current active management by
power limitation
– Very low stand-by current
– 3.0V CMOS compatible input
– Optimized electromagnetic emission
– Very low electromagnetic susceptibility
– In compliance with the 2002/95/EC
European directive
• Diagnostic functions
– Proportional load current sense
– Current sense disable
– Thermal shutdown indication
• Protection
– Undervoltage shut-down
– Overvoltage clamp
– Load current limitation
Table 1. Devices summary
Order codes
Package
PQFN-12x12 Power lead-less
MultiPowerSO-30
October 2013
This is information on a product in full production.
Tube
VND5004ASP30-E
Tape and Reel
VND5004ATR-E
VND5004ASP30TR-E
DocID13342 Rev 7
Tray
VND5004A-E
-
1/34
www.st.com
Contents
VND5004A-E, VND5004ASP30-E
Contents
1
Block diagram and pin configurations . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
4
5
6
2/34
2.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4
Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.1
MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.2
Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.3
Maximum demagnetization energy (VCC = 13.5 V) . . . . . . . . . . . . . . . . . 19
Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1
MultiPowerSO-30 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.2
PQFN - 12x12 Power lead-less thermal data . . . . . . . . . . . . . . . . . . . . . . 23
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.1
ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.2
MultiPowerSO-30 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.3
PQFN - 12x12 Power lead-less mechanical data . . . . . . . . . . . . . . . . . . . 28
5.4
MultiPowerSO-30 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
5.5
PQFN - 12x12 Power lead-less packing information . . . . . . . . . . . . . . . . 31
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
DocID13342 Rev 7
VND5004A-E, VND5004ASP30-E
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Devices summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Suggested connections for unused and n.c. pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Switching (VCC = 13V; Tj = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Logic input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Protection and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Current sense (8V<VCC<16V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Electrical transient requirements (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Electrical transient requirements (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Electrical transient requirements (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Thermal parameters for MultiPowerSO-30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Thermal parameters for PQFN - 12x12 Power lead-less . . . . . . . . . . . . . . . . . . . . . . . . . . 25
MultiPowerSO-30 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
PQFN - 12x12 Power lead-less mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
DocID13342 Rev 7
3/34
3
List of figures
VND5004A-E, VND5004ASP30-E
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
Figure 37.
4/34
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Configuration diagram (not in scale) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Off state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
On state resistance vs. Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
On state resistance vs. VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Turn-On voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
ILIMH vs. Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Turn-Off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
CS_DIS high level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
CS_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
CS_DIS low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Maximum turn off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
MultiPowerSO-30 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Rthj-amb Vs. PCB copper area in open box free air condition (one channel ON) . . . . . . . 20
MultiPowerSO-30 thermal impedance junction ambient single pulse (one channel ON) . . 21
Thermal fitting model of a double channel HSD in MultiPowerSO-30 . . . . . . . . . . . . . . . . 21
12x12 Power lead-less package PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Rthj-amb Vs. PCB copper area in open box free air condition (one channel ON) . . . . . . . 23
PQFN - 12x12 Power lead-less package thermal impedance junction ambient single pulse
(one channel ON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Thermal fitting model of a double channel HSD in PQFN - 12x12 Power lead-less . . . . . 24
MultiPowerSO-30 outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
PQFN - 12x12 Power lead-less outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
MultiPowerSO-30 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
MultiPowerSO-30 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
PQFN - 12x12 Power lead-less tray shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . 31
PQFN - 12x12 Power lead-less tape and reel shipment (suffix “TR”). . . . . . . . . . . . . . . . . 32
DocID13342 Rev 7
VND5004A-E, VND5004ASP30-E
1
Block diagram and pin configurations
Block diagram and pin configurations
Figure 1. Block diagram
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Table 2. Pin functions
Name
VCC
OUTPUT1,2
GND
INPUT1,2
Function
Battery connection
Power output
Ground connection
Voltage controlled input pin with hysteresis, CMOS compatible. Controls
output switch state
CURRENT SENSE1,2 Analog current sense pin, delivers a current proportional to the load current
CS_DIS
Active high CMOS compatible pin, to disable the current sense pins
DocID13342 Rev 7
5/34
33
Block diagram and pin configurations
VND5004A-E, VND5004ASP30-E
Figure 2. Configuration diagram (not in scale)
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Table 3. Suggested connections for unused and n.c. pins
Connection /
Pin
Current
Sense
N.C.
Output
Input
CS_DIS
For test
only
Floating
N.R.(1)
X
X
X
X
X
To ground
Through 1kΩ
resistor
X
N.R.
Through 10kΩ
resistor
Through 10kΩ
resistor
N.R.
1. Not recommended.
6/34
DocID13342 Rev 7
VND5004A-E, VND5004ASP30-E
2
Electrical specifications
Electrical specifications
Figure 3. Current and voltage conventions
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2.1
Absolute maximum ratings
Stressing the device above the ratings listed in the “Absolute maximum ratings” tables may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to the conditions in this section for extended
periods may affect device reliability. Refer also to the STMicroelectronics SURE Program
and other relevant quality documents.
Table 4. Absolute maximum ratings
Symbol
Value
Unit
DC supply voltage
27
V
Transient supply voltage (T<400ms, Rload>0.5Ω)
41
V
-VCC
Reverse DC supply voltage
16
V
IOUT
DC output current
Internally limited
A
- IOUT
Reverse DC output current
70
A
DC input current
-1 to 10
mA
DC current sense disable input current
-1 to 10
mA
Vcc-41
+Vcc
V
V
VCC
VCCPK
IIN
ICSD
Parameter
VCSENSE Current sense maximum voltage (Vcc>0V)
EMAX
Maximum switching energy (single pulse)
(L=0.3mH; RL=0Ω; Vbat=13.5V; Tjstart=150ºC; IOUT = IlimL(Typ.) )
342
mJ
VESD
Electrostatic discharge (Human Body Model: R=1.5kΩ;
C=100pF)
2000
V
VESD
Charge device model (CDM-AEC-Q100-011)
750
V
DocID13342 Rev 7
7/34
33
Electrical specifications
VND5004A-E, VND5004ASP30-E
Table 4. Absolute maximum ratings (continued)
Symbol
Tj
TSTG
2.2
Parameter
Value
Unit
Junction operating temperature
-40 to 150
°C
Storage temperature
-55 to 150
°C
Thermal data
Table 5. Thermal data
Value
Symbol
Parameter
Unit
MultiPowerSO-30
12x12 PLLP
Rthj-case
Thermal resistance junction-case (MAX)
(with one channel ON)
0.35
0.35
°C/W
Rthj-amb
Thermal resistance junction-ambient (MAX)
58(1)
39(2)
°C/W
1. PCB FR4 area 58mmX58mm, PCB thickness 2mm, Cu thickness 35 μm, minimum pad layout.
2. PCB FR4 area 78mmX78mm, PCB thickness 2mm, Cu thickness 35 μm, minimum pad layout.
8/34
DocID13342 Rev 7
VND5004A-E, VND5004ASP30-E
2.3
Electrical specifications
Electrical characteristics
Values specified in this section are for 8V<VCC<24V, -40°C<Tj<150 °C, unless otherwise
stated.
Table 6. Power section
Symbol
Parameter
VCC
Operating supply
voltage
VUSD
VUSDhyst
Test conditions
Min. Typ. Max. Unit
4.5
13
27
V
Undervoltage shutdown
3.5
4.5
V
Undervoltage shut-down
hysteresis
0.5
V
IOUT=15A; Tj=25°C
IOUT=15A; Tj=150°C
IOUT=15A; VCC=5V; Tj=25°C
4
8
6
mΩ
mΩ
mΩ
Rdson in reverse battery
condition
VCC=-13V; IOUT=-15A; Tj=25°C
4
mΩ
VCC clamp voltage
ICC=20 mA; IOUT1,2=0A
46
52
V
IS
Supply current
Off state; VCC=13V; Tj=25°C;
VIN=VOUT=VSENSE=VCSD=0V
On state; VCC=13V; VIN=5V; IOUT=0A
2(2)
3.5
5(2)
6
μA
mA
IL(off)
Off-state output
current(1)
VIN=VOUT=0V; VCC=13V; Tj=25°C
VIN=VOUT=0V; VCC=13V; Tj=125°C
0.01
3
5
μA
Max.
Unit
RON
RON REV
Vclamp
On-state
resistance(1)
41
0
0
1. For each channel.
2. PowerMOS leakage included.
Table 7. Switching (VCC = 13V; Tj = 25°C)
Symbol
Parameter
Test conditions
Min.
Typ.
td(on)
Turn-on delay time
RL=0.87Ω (see Figure 5.)
25
μs
td(off)
Turn-on delay time
RL=0.87Ω (see Figure 5.)
35
μs
(dVOUT/dt)on
Turn-on voltage slope RL=0.87Ω
See
Figure
16.
V/μs
(dVOUT/dt)off
Turn-off voltage slope RL=0.87Ω
See
Figure
18.
V/μs
WON
Switching energy
losses during twon
RL=0.87Ω (see Figure 5.)
5.4
mJ
WOFF
Switching energy
losses during twoff
RL=0.87Ω (see Figure 5.)
2.3
mJ
DocID13342 Rev 7
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33
Electrical specifications
VND5004A-E, VND5004ASP30-E
Table 8. Logic input
Symbol
Parameter
Test conditions
VIL1,2
Input low level voltage
IIL1,2
Low level input current
VIH1,2
Input high level voltage
IIH1,2
High level input current VIN=2.1V
Typ.
Max.
Unit
0.9
V
1
μA
2.1
V
VIN=0.9V
10
Input hysteresis
voltage
VI(hyst)1,2
0.25
VICL1,2
Input clamp voltage
VCSDL
CS_DIS low level
voltage
ICSDL
Low level CS_DIS
current
VCSDH
CS_DIS high level
voltage
ICSDH
High level CS_DIS
current
VCSD(hyst)
CS_DIS hysteresis
voltage
VCSCL
Min.
IIN=1mA
IIN=-1mA
V
5.5
7
V
V
0.9
V
-0.7
1
μA
2.1
V
VCSD=0.9V
VCSD=2.1V
10
0.25
CS_DIS clamp voltage
ICSD=1mA
ICSD=-1mA
μA
μA
V
5.5
7
V
V
-0.7
Table 9. Protection and diagnostics(1)
Symbol
Parameter
IlimH
Short circuit current
VCC=13V
5V<VCC<24V
IlimL
Short circuit current
during thermal
cycling
VCC=13V; TR<Tj<TTSD
TTSD
Shutdown
temperature
TR
Reset temperature
TRS
Thermal reset of
STATUS
THYST
VDEMAG
Test conditions
Typ.
Max.
Unit
70
100
140
140
A
A
40
150
175
TRS+1
TRS+5
A
200
135
Thermal hysteresis
(TTSD-TR)
Turn-off output
voltage clamp
Min.
IOUT=2A; VIN=0; L=6mH
DocID13342 Rev 7
°C
°C
7
°C
VCC-27 VCC-30 VCC-33
V
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related
diagnostic signals must be used together with a proper software strategy. If the device is subjected to
abnormal conditions, this software must limit the duration and number of activation cycles.
10/34
°C
VND5004A-E, VND5004ASP30-E
Electrical specifications
Table 10. Current sense (8V<VCC<16V)
Symbol
Parameter
Test conditions
Min.
Typ.
Max. Unit
K1
IOUT/ISENSE
IOUT=15A; VSENSE=4V; VCSD=0V;
Tj=-40°C
Tj=25°C...150°C
11530 16000 19340
12730 16000 19270
K2
IOUT/ISENSE
IOUT=30A; VSENSE=4V; VCSD=0V;
Tj=-40°C
Tj=25°C...150°C
13430 16150 17880
14500 16150 17880
ISENSE0
Analog sense
current
IOUT=0A; VSENSE=0V;
VCSD=5V; VIN=0V; Tj=-40°C to 150°C
VCSD=0V; VIN=5V; Tj=-40°C to 150°C
0
0
VSENSE
Max analog sense
output voltage
IOUT=45A; VCSD=0V; RSENSE=3.9kΩ
5
VSENSEH
Analog sense
output voltage in
overtemperature
condition
VCC=13V; RSENSE=3.9kΩ
9
V
ISENSEH
Analog sense
output current in
overtemperature
condition
Vcc=13V; VSENSE=5V
8
mA
Delay response
time from falling
tDSENSE1H
edge of CS_DIS
pin
VSENSE<4V, 5A<Iout<30A
ISENSE=90% of ISENSE max
(see Figure 4.)
50
100
μs
Delay response
time from rising
tDSENSE1L
edge of CS_DIS
pin
VSENSE<4V, 5A<Iout<30A
ISENSE=10% of ISENSE max
(see Figure 4.)
5
20
μs
Delay response
tDSENSE2H time from rising
edge of INPUT pin
VSENSE<4V, 5A<Iout<30A
ISENSE=90% of ISENSE max
(see Figure 4.)
270
600
μs
Delay response
tDSENSE2L time from falling
edge of INPUT pin
VSENSE<4V, 5A<Iout<30A
ISENSE=10% of ISENSE max
(see Figure 4.)
100
250
μs
5
400
μA
μA
V
Figure 4. Current sense delay characteristics
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DocID13342 Rev 7
11/34
33
Electrical specifications
VND5004A-E, VND5004ASP30-E
Table 11. Truth table
INPUTn
OUTPUTn
SENSEn (VCSD=0V)(1)
(see Figure 3.)
Normal operation
L
H
L
H
0
Nominal
Overtemperature
L
H
L
L
0
VSENSEH
Undervoltage
L
H
L
L
0
0
Short circuit to GND
(Rsc ≤ 10 mΩ)
L
H
H
L
L
L
0
0 if Tj < TTSD
VSENSEH if Tj > TTSD
Short circuit to VCC
L
H
H
H
0
< Nominal
Negative output voltage clamp
L
L
0
Conditions
1. If VCSD is high, the SENSE output is at a high impedance. Its potential depends on leakage currents and
the external circuit.
Figure 5. Switching characteristics
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12/34
DocID13342 Rev 7
VND5004A-E, VND5004ASP30-E
Electrical specifications
Table 12. Electrical transient requirements (part 1)
ISO 7637-2:
2004(E)
Test levels(1)
Number of
pulses or
test times
Burst cycle/pulse
repetition time
Delays and
Impedance
Test pulse
III
IV
1
-75 V
-100 V
5000
pulses
0.5 s
5s
2 ms, 10 Ω
2a
+37 V
+50 V
5000
pulses
0.2 s
5s
50 μs, 2 Ω
3a
-100 V
-150 V
1h
90 ms
100 ms
0.1 μs, 50 Ω
3b
+75 V
+100 V
1h
90 ms
100 ms
0.1 μs, 50 Ω
4
-6 V
-7 V
1 pulse
100 ms, 0.01 Ω
5b(2)
+65 V
+87 V
1 pulse
400 ms, 2 Ω
1. The above test levels must be considered referred to VCC = 13.5V except for pulse 5b.
2. Valid in case of external load dump clamp: 40V maximum referred to ground. The protection strategy
allows PowerMOS to be cyclically switched on during load dump, so distributing the load dump energy
along the time and to transfer a part of it to the load.
Table 13. Electrical transient requirements (part 2)
Test level results(1)
ISO 7637-2:
2004(E)
Test pulse
III
IV
1
C
C
2a
C
C
3a
C
C
3b
C
C
4
C
C
5b(2) (3)
C
C
1. The above test levels must be considered referred to VCC = 13.5V except for pulse 5b
2. Valid in case of external load dump clamp: 40V maximum referred to ground. The protection strategy
allows PowerMOS to be cyclically switched on during load dump, so distributing the load dump energy
along the time and to transfer a part of it to the load.
3. Suppressed load dump (pulse 5b) is withstood with a minimum load connected as specified in Table 4.:
Absolute maximum ratings.
Table 14. Electrical transient requirements (part 3)
Class
Contents
C
All functions of the device are performed as designed after exposure to disturbance.
E
One or more functions of the device are not performed as designed after exposure
to disturbance and cannot be returned to proper operation without replacing the
device.
DocID13342 Rev 7
13/34
33
Electrical specifications
VND5004A-E, VND5004ASP30-E
Figure 6. Waveforms
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14/34
DocID13342 Rev 7
VND5004A-E, VND5004ASP30-E
2.4
Electrical specifications
Electrical characteristics curves
Figure 7. Off state output current
Figure 8. High level input current
Iloff (uA)
Iih (uA)
5
6
5.4
4.5
Off State
Vcc=13V
Vin=Vout=0V
4.8
Vin=2.1V
4
4.2
3.5
3.6
3
3
2.5
2.4
2
1.8
1.5
1.2
1
0.6
0.5
0
0
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
Tc (°C)
50
75
100
125
150
175
150
175
Tc (°C)
Figure 9. Input clamp voltage
Figure 10. Input low level
Vicl (V)
Vil (V)
7
2
1.8
6.75
Iin=1mA
1.6
6.5
1.4
6.25
1.2
6
1
0.8
5.75
0.6
5.5
0.4
5.25
0.2
5
0
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
Tc (°C)
50
75
100
125
Tc (°C)
Figure 11. Input high level
Figure 12. Input hysteresis voltage
Vih (V)
Vihyst (V)
4
1
0.9
3.5
0.8
3
0.7
2.5
0.6
2
0.5
0.4
1.5
0.3
1
0.2
0.5
0.1
0
0
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
DocID13342 Rev 7
15/34
33
Electrical specifications
VND5004A-E, VND5004ASP30-E
Figure 13. On state resistance vs. Tcase
Ron (mOhm)
Figure 14. On state resistance vs. VCC
Ron (mOhm)
6
6
5.4
5.4
Iout=15A
Vcc=13V
4.8
4.8
4.2
4.2
3.6
3.6
3
3
2.4
2.4
Tc=150°C
Tc=125°C
Tc=25°C
Tc=-40°C
1.8
1.8
-50
-25
0
25
50
75
100
125
150
175
0
4
8
12
16
Tc (°C)
20
24
28
Vcc
Figure 15. Undervoltage shutdown
Figure 16. Turn-On voltage slope
Vusd (V)
(dVout/dt)on (V/ms)
16
500
450
14
Vcc=13V
RI=0.87Ohm
400
12
350
10
300
250
8
200
6
150
4
100
2
50
0
0
-50
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
Figure 17. ILIMH vs. Tcase
75
100
125
150
175
Figure 18. Turn-Off voltage slope
Ilimh (A)
(dVout/dt)off (V/ms)
150
500
140
450
Vcc=13V
130
400
120
350
110
300
100
250
90
200
80
150
70
100
60
50
50
Vcc=13V
RI=0.87Ohm
0
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
16/34
50
Tc (°C)
Tc (°C)
-50
-25
0
25
50
75
Tc (°C)
DocID13342 Rev 7
100
125
150
175
VND5004A-E, VND5004ASP30-E
Electrical specifications
Figure 19. CS_DIS high level voltage
Vcsdh (V)
Figure 20. CS_DIS clamp voltage
Vcsdcl (V)
4
8
3.5
7.5
3
7
2.5
6.5
2
6
1.5
5.5
1
5
0.5
4.5
0
4
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
Figure 21. CS_DIS low level voltage
Vcsdl (V)
4
3.5
3
2.5
2
1.5
1
0.5
0
-50
-25
0
25
50
75
100
125
150
175
Tc (°C)
DocID13342 Rev 7
17/34
33
Application information
3
VND5004A-E, VND5004ASP30-E
Application information
Figure 22. Application schematic
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3.1
MCU I/Os protection
When negative transients are present on the VCC line, the control pins will be pulled
negative to approximately -1.5V.
ST suggests the insertion of resistors (Rprot) in the lines to prevent the µC I/Os pins from
latching up.
The values of these resistors provide a compromise between the leakage current of the µC,
the current required by the HSD I/Os (input levels compatibility) and the latch-up limit of the
µC I/Os.
-VCCpeak/Ilatchup ≤ Rprot ≤ (VOHμC-VIH) / IIHmax
Calculation example:
For VCCpeak= - 1.5V and Ilatchup ≥ 20mA; VOHμC ≥ 4.5V
75Ω ≤ Rprot ≤ 240kΩ.
Recommended values: Rprot =10kΩ, CEXT=10nF
3.2
Load dump protection
Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the
VCCPK max rating. The same applies if the device will be subject to transients on the VCC
line that are greater than the ones shown in the ISO 7637-2: 2004(E) table.
18/34
DocID13342 Rev 7
VND5004A-E, VND5004ASP30-E
3.3
Application information
Maximum demagnetization energy (VCC = 13.5 V)
Figure 23. Maximum turn off current versus inductance
100
A
B
C
I (A)
10
1
1
L (mH)
10
100
A: Tjstart = 150°C single pulse
B: Tjstart = 100°C repetitive pulse
C: Tjstart = 125°C repetitive pulse
VIN, IL
Demagnetization
Demagnetization
Demagnetization
t
Note:
Values are generated with RL = 0 Ω.
In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse
must not exceed the temperature specified above for curves A and B.
DocID13342 Rev 7
19/34
33
Package and PC board thermal data
VND5004A-E, VND5004ASP30-E
4
Package and PC board thermal data
4.1
MultiPowerSO-30 thermal data
Figure 24. MultiPowerSO-30 PC board
*$3*06
Note:
Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4
area= 58mm x 58mm, PCB thickness=2mm, Cu thickness=35µm (front and back side),
Copper areas: from minimum pad lay-out to 16cm2).
Figure 25. Rthj-amb Vs. PCB copper area in open box free air condition (one channel ON)
57+MBDPE&:
3&%&XKHDWVLQNDUHDFPA
*$3*06
20/34
DocID13342 Rev 7
VND5004A-E, VND5004ASP30-E
Package and PC board thermal data
Figure 26. MultiPowerSO-30 thermal impedance junction ambient single pulse (one
channel ON)
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*$3*06
Figure 27. Thermal fitting model of a double channel HSD in MultiPowerSO-30 (a)
$*9
a. The fitting model is a semplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
DocID13342 Rev 7
21/34
33
Package and PC board thermal data
VND5004A-E, VND5004ASP30-E
Equation 1: pulse calculation formula
ZTHδ = R TH ⋅ δ + Z THtp ( 1 – δ )
where δ = t p ⁄ T
Table 15. Thermal parameters for MultiPowerSO-30
22/34
Area/island (cm2)
Footprint
R1 (°C/W)
0.05
R2 (°C/W)
0.3
R3 (°C/W)
0.5
R4 (°C/W)
1.3
R5 (°C/W)
14
R6 (°C/W)
44.7
R7 (°C/W)
0.05
R8 (°C/W)
0.3
C1 (W.s/°C)
0.005
C2 (W.s/°C)
0.008
C3 (W.s/°C)
0.01
C4 (W.s/°C)
0.3
C5 (W.s/°C)
0.6
C6 (W.s/°C)
5
C7 (W.s/°C)
0.005
C8 (W.s/°C)
0.008
DocID13342 Rev 7
4
23.7
11
VND5004A-E, VND5004ASP30-E
4.2
Package and PC board thermal data
PQFN - 12x12 Power lead-less thermal data
Figure 28. 12x12 Power lead-less package PC board
*$3*06
Note:
Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4
area= 78mm x 78mm, PCB thickness=2mm, Cu thickness=35µm (front and back side),
Copper areas: minimum pad lay-out).
Figure 29. Rthj-amb Vs. PCB copper area in open box free air condition (one channel
ON)
3&%&XKHDW VLQNDUHD FPA *$3*06
DocID13342 Rev 7
23/34
33
Package and PC board thermal data
VND5004A-E, VND5004ASP30-E
Figure 30. PQFN - 12x12 Power lead-less package thermal impedance junction
ambient single pulse (one channel ON)
)RRWSULQW
FP FP FP &:
WLPHV
*$3*06
Figure 31. Thermal fitting model of a double channel HSD in PQFN - 12x12 Power lead-less(b)
b. The fitting model is a semplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
24/34
DocID13342 Rev 7
VND5004A-E, VND5004ASP30-E
Package and PC board thermal data
Equation 2: pulse calculation formula
Z THδ = R TH ⋅ δ + Z THtp ( 1 – δ )
where δ = t p ⁄ T
Table 16. Thermal parameters for PQFN - 12x12 Power lead-less
Area/island (cm2)
Footprint
R1 (°C/W)
0.3
R2 (°C/W)
0.15
R3 (°C/W)
4.2
R4 (°C/W)
4
8
16
9.6
9.4
9.2
9
R5 (°C/W)
15.1
10.5
8.5
5.5
R6 (°C/W)
16.7
12
9
6
R7 (°C/W)
0.3
R8 (°C/W)
0.15
C1 (W.s/°C)
0.021
C2 (W.s/°C)
0.015
C3 (W.s/°C)
0.2
C4 (W.s/°C)
1.9
2.2
2.32
2.45
C5 (W.s/°C)
2.45
7.3
13.7
20
C6 (W.s/°C)
11.85
22
25
30
C7 (W.s/°C)
0.021
C8 (W.s/°C)
0.015
DocID13342 Rev 7
25/34
33
Package and packing information
VND5004A-E, VND5004ASP30-E
5
Package and packing information
5.1
ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
5.2
MultiPowerSO-30 mechanical data
Figure 32. MultiPowerSO-30 outline
*$3*06
Table 17. MultiPowerSO-30 mechanical data
Millimeters
Symbol
Min.
A
26/34
Typ.
Max.
2.35
A2
1.85
2.25
A3
0
0.1
B
0.42
0.58
C
0.23
0.32
DocID13342 Rev 7
VND5004A-E, VND5004ASP30-E
Package and packing information
Table 17. MultiPowerSO-30 mechanical data (continued)
Millimeters
Symbol
Min.
Typ.
Max.
D
17.1
17.2
17.3
E
18.85
E1
15.9
“e”
1
19.15
16
F6
14.3
F7
5.45
F8
0.73
L
0.8
N
S
16.1
1.15
10 Deg
0 Deg
DocID13342 Rev 7
7 Deg
27/34
33
Package and packing information
5.3
VND5004A-E, VND5004ASP30-E
PQFN - 12x12 Power lead-less mechanical data
Figure 33. PQFN - 12x12 Power lead-less outline
*$3*06
28/34
DocID13342 Rev 7
VND5004A-E, VND5004ASP30-E
Package and packing information
Table 18. PQFN - 12x12 Power lead-less mechanical data
Millimeters
Symbol
Min.
Typ.
Max.
A
2
2.2
A1
0
0.05
b
0.35
0.47
C
0.50
D
11.90
12.10
Dh1
4.65
4.95
Dh2
10.45
10.65
Dh3
4.80
5
Dh4
4.80
5
E
11.90
12.10
Eh1
2.15
2.45
Eh2
5.15
5.45
Eh3
1.70
2
e1
0.90
e2
3.45
e3
1.10
f
0.50
f1
0.60
L
0.75
0.95
L1
1.65
1.90
L2
0.76
0.78
M
11.10
11.30
N
11.10
11.30
v
0.1
w
0.05
y
0.05
y1
0.1
DocID13342 Rev 7
29/34
33
Package and packing information
5.4
VND5004A-E, VND5004ASP30-E
MultiPowerSO-30 packing information
The devices can be packed in tube or tape and reel shipments (see the Table 1: Devices
summary for packaging quantities).
Figure 34. MultiPowerSO-30 tube shipment (no suffix)
Tube dimension
Dimension
A
mm
29
435
532
3.82
23.6
0.8
Base Q.ty
Bulk Q.ty
Tube length (± 0.5)
C
B
A
B
C (± 0.13)
Figure 35. MultiPowerSO-30 tape and reel shipment (suffix “TR”)
Reel dimension
Dimension
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
D (min)
G (+ 2 / -0)
N (min)
T (max)
mm
1000
1000
330
1.5
13
20.2
32
100
38.4
Tape dimensions
According to Electronic Industries Association (EIA)
Standard 481 rev. A, Feb 1986
Description
Dimension
mm
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 (± 0.1)
P
D (± 0.1/-0)
D1 (min)
F (± 0.1)
K (max)
P1 (± 0.1)
32
4
24
1.5
2
14.2
2.2
2
End
Start
Top
cover
tape
No components
Components
No components
500 mm min
500 mm min
Empty components pockets
User direction of feed
30/34
DocID13342 Rev 7
VND5004A-E, VND5004ASP30-E
5.5
Package and packing information
PQFN - 12x12 Power lead-less packing information
The devices can be packed in tray or tape and reel shipments (see the Table 1: Devices
summary for packaging quantities).
Figure 36. PQFN - 12x12 Power lead-less tray shipment (no suffix)
Reel dimension
Dimension
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
D (min)
G (+ 2 / -0)
N (min)
T (max)
mm
1000
1000
330
1.5
13
20.2
32
100
38.4
Tape dimensions
According to Electronic Industries Association (EIA) Standard
481 rev. A, Feb 1986
Description
Dimension
mm
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 (± 0.1)
P
D (± 0.1/-0)
D1 (min)
F (± 0.1)
K (max)
P1 (± 0.1)
32
4
24
1.5
2
14.2
2.2
2
End
Start
Top
cover
tape
No components
Components
No components
500 mm min
500 mm min
Empty components pockets
User direction of feed
DocID13342 Rev 7
31/34
33
Package and packing information
VND5004A-E, VND5004ASP30-E
Figure 37. PQFN - 12x12 Power lead-less tape and reel shipment (suffix “TR”)
Tape dimensions
Dimension
mm
A0 ± 0.1
12.30
B0 ± 0.1
12.30
K0 ± 0.1
2.15
F ± 0.1
11.50
E ± 0.1
1.75
W ± 0.3
24
P2 ± 0.1
2
P0 ± 0.1
4
P1 ± 0.1
16
T ± 0.05
D
D1 (min)
0.30
1.50
1.50
Reel dimensions
Dimension
Base Q.ty
Bulk Q.ty
A (max)
B (min)
C (± 0.2)
D (min)
G (+ 2 / -0)
N (min)
T (max)
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mm
1500
1500
330
1.5
13
20.2
32
100
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6
Revision history
Revision history
Table 19. Document revision history
Date
Revision
15-Sep-2003
1
Initial release.
21-Jun-2004
2
MultiPowerSO-30 package insertion.
22-Mar-2006
3
Major general update
4
Document converted into new ST corporate template.
Contents and lists of tables and figures added.
Section 3.3: Maximum demagnetization energy (VCC = 13.5 V)
added.
Section 5: Package and packing information updated
29-Oct-2007
5
Section Table 12.: Electrical transient requirements (part 1) - Added
note 3: “Suppressed load dump (pulse 5b) is withstood with a
minimum load connected as specified in Table 4.: Absolute
maximum ratings.”
24-Sep-2013
6
Updated disclaimer.
28-Oct-2013
7
Updated footnote 2 into the Table 12: Electrical transient
requirements (part 1) and Table 13: Electrical transient requirements
(part 2).
02-Jul-2007
Changes
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VND5004A-E, VND5004ASP30-E
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