M61140FP Tuner Single Chip REJ03F0023-0130 Rev.1.3 Jun 14, 2004 Description The M61140FP is a semiconductor integrated circuit consisting of Tuner signal processing for NTSC color TV and VCRs. The circuit includes Mixer circuit in Tuning system, Oscillator circuit, PLL frequency synthesizer and VIF/SIF, which permits a smaller tuner system. Features • VIF/SIF Inter carrier type for NTSC Coil-less VCO Adjustment free AFT High-speed IF AGC • PLL Low phase noise and High-speed lock-up Built-in band switch driver (4 port) I2C bus control Available for both XO and external reference • Mixer/Oscillator Built-in U&V Oscillator and mixer Built-in IF Amplifier (Unbalanced Output) Application TV, VCR Recommended Operating Conditions Supply voltage range --- 4.75 to 5.25V Recommended supply voltage --- 5.0V Rev.1.3 Jun 14, 2004 page 1 of 27 M61140FP 2 3 4 5 6 7 8 9 Video det OUT Vreg RF AGC Delay IF AGC 2 EQ F/B OSC GND V OSC IN 1 V OSC OUT 1 V OSC OUT 2 M/O Vcc OSC GND 1 Rev.1.3 Jun 14, 2004 page 2 of 27 10 11 12 24 48 EQ AMP Vreg UHF OSC VHF OSC 23 LPF 22 U MIX 21 47 IF AGC DET 20 46 PSC 1/32, 1/33 19 V MIX PVHFH Mix Filter 1 18 Band driver 15bit P.G divider RF GND APC PVHFL Mix Filter 2 17 ADS RF AGC PFMST RF GND 16 AFT IF AMP RF AGC OUT V Band IN 15 QIF AMP MO Vcc PUHF 14 SCL Ref IN SDA Logic Vcc Logic GND Bus receiver Phase det 45 VCO F/B EQ IN Coil-less VCO 44 Video OUT 25 U Band IN 1 13 43 APC Filter 26 Ref divider LIM AMP VIF GND IF AGC 1 27 FM det 42 VIF GND 28 Logic Vcc XO Charge pump 41 AFT OUT 29 U OSC 2 40 QIF OUT 30 Logic GND U OSC 1 39 Audio OUT 31 V OSC IN 2 38 AF Bypass 32 Video det VIF IN 1 33 VIF Vcc IF amp 37 VIF IN 2 Vt Drive 34 CP 35 IF2 GND VIF Vcc IF2 Vcc 36 IF OUT IF2 GND Pin Configuration and Block Diagram U Band IN 2 M61140FP Absolute Maximum Ratings (Ta=25ºC, unless otherwise noted) Parameter Supply Voltage Symbol Vcc Ratings 6 Unit V MO Block PLL Block Maximum Allowable Input Input Voltage Note Vin Vimax 126 6 dBµV V Port Output Voltage Port Output Current (1) Vo Iopmax1 6 26 V mA Pin20 to 22,15 Pin20, 21 Port Output Current (2) Port Output Current (3) Iopmax2 Iopmax3 7 33 mA mA Pin15, 22 2 circuits are on at same time SDA Output Current Power Consumption Iosdamax Pd 10 750 mA mW Operating Temperature Topr –20 to +75 °C Storage Temperature Tstg –40 to +150 °C Pin25 to 27 Recommended circuit board. When Cu occupancy area is 50%. Temperature Characteristics (maximum ratings) Mounting in standard circuit board (70mm × 70mm × 1.6mmt Epoxy board of one side copper) Allowable power consumption Pd 1500 1250 1000 750 500 250 0 -20 0 25 50 75 100 Ambient temperature Ta (˚C) 125 150 Recommended Operating Condition (Ta=25ºC, unless otherwise noted) Parameter Guarantee Operating Voltage Symbol Vcc Supply Voltage Range Operating frequency of Crystal oscillator Vcc fopr Port output current (1) Port output current (2) Ioprt1 Ioprt2 Rev.1.3 Jun 14, 2004 page 3 of 27 Ratings 4.5~5.3 Unit V 4.75~5.25 4.0 V MHz 0~25 0~5 mA mA Note Refer to Data Pin 20,21 Pin 15,22 M61140FP Pin Description Pin No. 1 2 Pin name VIDEO DET OUT Vreg Function Circuit Diagram Video detected output terminal. SIF trap and SIF B.P.F. are connected to this terminal. Because of open emitter configuration, an externally connected drive resistor is necessary. 33 Regulated voltage output. Approximately 3V output. 33 50 1 50 2 9.9K 6.2K 3 RF AGC DELAY RF AGC terminal. This terminal combine 4.5MHz SIF signal input with set up the RF AGC delay point. The RF AGC delay point is set up by the DC component of input signal. AC component is FM detection threw the limiter amplifier. 33 40 3 5.1K 40p 43K 15p 4 44 IF AGC 2 IF AGC 1 IF AGC 2 terminal IF AGC 2 terminal. External capacitor effects AGC speed. When this terminal is grounded, the effect of VIF amp gain becomes minimum. 33 10K 2.5K 4 44 5 EQ F/B Equalizer feedback terminal. It is possible to change the frequency characteristic of the video signal by attaching L,C,R to this terminal. 33 2.2K 500 5 6 OSC GND OSC ground terminal. Rev.1.3 Jun 14, 2004 page 4 of 27 7K 50 M61140FP Pin No. 7 Pin name V OSC IN 1 8 9 V OSC OUT 1 V OSC OUT 2 10 V OSC IN 2 Function VHF oscillator circuit is connected externally. When band byte bit PUHF is set "1", bias current of oscillator transistor turns OFF. Circuit Diagram 24 600 400 600 400 7 9 8 11 12 U OSC 1 U OSC 2 UHF oscillator circuit is connected externally. When band byte bit PUHF is set "1", bias current of oscillator transistor turns ON. 36 400 3p 11 400 3p 12 2.5p 2.5p 13 14 U BAND IN 1 U BAND IN 2 UHF RF input terminal. Input type is balance input. In the case of unbalance input, grounding of either pin 13 or 14 with capacitor is required, while input to the other pin. 24 13 1.8K 14 1.8K 15 PUHF Band change drive terminal. Output configuration is PNP open collector. When band selection bit PUHF is set "1", current is output. 24 47K 15 16 V BAND IN VHF RF input terminal. Input type is unbalance. 24 2.2K 16 2.2K 17 RF GND RF (Mixer) GND terminal. Rev.1.3 Jun 14, 2004 page 5 of 27 2.2K 2.2K 10 M61140FP Pin No. 18 19 20 21 Pin name MIX FILTER 1 MIX FILTER 2 PVHFH PVHFL Function Mixer output terminal. The output terminal is open collector type, single-tuned filter is connected. This pin is pull-up through power supply in order for voltage to be above 4.2V. Band change drive terminal. Output configuration is PNP open collector. When band selection bit PVHFL or PVHFH is set "1", current is output. Circuit Diagram 24 200 20p 19 200 20p 28 47K 20 21 22 23 PFMST RF AGC OUT Band change drive terminal. Output configuration is PNP open collector. When band selection bit PFMST is set "1", current is output. Reference frequency or divided frequency of local are output by test mode condition. 28 RF AGC output terminal. It is current drive type. 33 47K 22 24 50 23 24 MO Vcc 25 ADS Mixer and oscillator block power supply. Address setting input terminal. Address bit "MA1","MA2" is selected by the potential at this terminal. 28 40K 1K 25 13K Rev.1.3 Jun 14, 2004 page 6 of 27 4K 18 4K M61140FP Pin No. 26 Pin name SCL Function SCL input terminal. Circuit Diagram 28 1K 26 27 SDA SDA input terminal. Reading and 2 writing of data confirm to I C bus of Philips. 28 1K 27 ACK 28 Logic Vcc Logic block power supply. 29 REF IN Reference frequency input terminal. Connect crystal oscillator at this terminal, or external signal (Sine wave).In this case of using external sine wave signal, pull down this terminal with 1.5k to 3.3kΩ. 28 1.3K Logic GND Logic block power supply. 31 VT DRIVE Filter transistor drive terminal. As for drive output, control bit "OS" controls it On or OFF 28 32 CP Charge pump output terminal. When the phase of the divide frequency of local is lead compared with the reference frequency, the "source" current state becomes active. If it is lag, the "sink" current becomes active. If the phase are the same, the high impedance state becomes active. 32 VIF Vcc VIF block power supply. 34 IF2 Vcc Power supply terminal exclusively for IF amp output (pin 34) circuit. 35 IF OUT IF amp output terminal. This terminal is a low impedance and output IF frequency. D 1K 31 150 OS 34 20 35 Rev.1.3 Jun 14, 2004 page 7 of 27 1.3K 29 30 33 500 500 50 U M61140FP Pin No. 36 37 38 Pin name IF2 GND Function IF2 grand terminal. This grand is exclusively used by circuit of IF amplifier VIF IN 1 VIF IN 2 IF signal thew SAW filter is input. It is a balance type input. Circuit Diagram 33 2K 37 38 2K 14K 39 40 AF BYPASS AUDIO OUT AF bypass terminal. It is connected to one of the input of a differential amplifier, external capacitor provides AC filtering. When resistor is connected in series with capacitor, it is possible to lows the amplitude of the audio output. When audio output terminal is not used, please connect pin 22 to GND. 33 Sound output terminal. De-emphasis is achieved by external components. 33 30K 39 1K 100 30K 1K 200 40 41 QIF OUT QIF output terminal. FM signal which is converted to 4.5MHz is output. Additionally, this pin has dual function of being VIF VCO type selection. Connected to GND via 1.2kΩ 33 400 30K 6p 41 42 AFT OUT AFT output terminal. Because of pulse-like signal output, a smoothing capacitor is connected externally. In addition, AFT detection sensitivity is set by external resistor. 33 300u 50 42 300u 43 VIF GND VIF GND terminal. Rev.1.3 Jun 14, 2004 page 8 of 27 M61140FP Pin No. 45 Pin name APC FILTER Function APC filter terminal. It is the loop filter terminal which a VIF signal is made to lock VCO and keeps frequency constant. Circuit Diagram 28 33 21K 17 45 46 VIDEO OUT Video output terminal. The signal inputted into the EQI terminal is outputted. 21K 33 200 46 47 VCO F/B VCO feedback terminal. The feedback is to keep the free-running frequency of the built-in VCO. 33 20K 47 48 EQ IN The video signal threw the SIF trap is input to this terminal. DC impression from pin 1 is required for the input to 48 pins. 33 100 48 Rev.1.3 Jun 14, 2004 page 9 of 27 10K 300 300 M61140FP Setting Data M61140FP's bus format is based on Philips's I2C-bus. Bidirectional bus communication control can be performed. It consists of WRITE mode which receives various data, and READ mode which transmits data. Recognition in WRITE mode and READ mode is performed by specification of the last bit on Address Byte (R/W bit). When the setup of a R/W bit is "0", it is set as WRITE mode and, in the case of "1", is set as READ mode. Furthermore, it has the address in which four programs are possible. It enables this to use two or more devices on the same I2C bus. Moreover, four programmable addresses are possible. Therefore, two or more devices become usable on I2C bus. A setup of an address is chosen by the voltage impressed to an address setting terminal (ADS:25 pin). If the address Byte in agreement is received, a data line will be set to "L" between knowledge, and at the time of WRITE mode, if Data Byte is received, SDA line between knowledge will be set to "L." It shows a definition of bus protocol admitted in the following. Mode_1 STA CA DB1 DB2 CB1 CB2 STO Mode_2 STA CA CB1 CB2 DB1 DB2 STO Mode_3 STA CA DB1 DB2 STO Mode_4 STA CA CB1 CB2 STO STA : Start condition STO : Stop condition CA : Chip address DB1 : Divider data byte 1 DB2 : Divider data byte 2 CB1 : Control data byte 1 CB2 : Band data byte 2 Rev.1.3 Jun 14, 2004 page 10 of 27 M61140FP (1) WRITE mode The information of 5 bytes required for circuit operational chip address, control data and band SW data of 2 bytes and divider data of 2 bytes. after the chip address input, 2 or 4 bytes can be received. Function bit is contained in the first and the third data byte to distinguish between divider and 'control data/band SW data', with "0" going ahead of divider data, and "1" going ahead of 'control data/band SWdata'. The timing of Writing data for bus protocol Mode is shown in the figure below. Divider data uses 15 bits and is read in at the rise of the eighth clock bit of the second byte divider data (DB2). Control data (CB1) and band SW-data (BB) are each read in at the rise of their eighth clock bit. Timing Chart SDA address DB1 DB2 CB2 CB1 SCL Read into latch Read into latch Read into latch Write mode data format Byte MSB LSB Address Byte (CA) 1 1 0 0 0 MA1 MA0 R/W=0 A Divider Byte1 (DB1) Divider Byte2 (DB2) 0 N7 N14 N6 N13 N5 N12 N4 N11 N3 N10 N2 N9 N1 N8 N0 A A Control Byte (CB1) Band Byte (CB2) 1 X CP X T2 X T1 X T0 PUHF Rsa PFMST Rsb PVHFH OS PVHFL A A Programmable Address Bit Address input voltage applied to ADS [V] MA1 MA0 0 to 0.1xVcc 0 0 Open or 0.2 to 0.3xVcc 0 1 0.4xVcc to 0.6xVcc 0.9xVcc to Vcc 1 1 0 1 N14 to N0 : Set up for division ratio of the programmable divider Frequency of VCO fvco: fvco=fref x N Division ratio N: N=N14(2^14 )+N13(2^13 )+ --- +N0(2^0) Range of division ratio N: N=1,024 to 32,767 fref: Reference frequency of phase comparator CP: Set up the charge pump current CP Charge pump current * 0 70µA 1 300µA Note:* Current of charge pump is typ current In the case of setting current 270µA,when PLL is locked, charge pump current is automatically switched to CP=O (70µA). Rev.1.3 Jun 14, 2004 page 11 of 27 M61140FP T2, T1, T0 : Set up for test mode CP T2 T1 T0 Charge pump Test output Test SW Mode 0 0 0 X CP switched off - OFF Normal mode 1 0 0 X CP switched on - OFF Normal mode X X 0 1 1 1 X 0 High impedance Sink - OFF OFF Test mode Test mode X 0 1 1 1 0 1 0 Source High impedance fREF OFF OFF Test mode Test mode 1 0 1 1 0 0 X 1 CP switched on High impedance f1/N ON OFF TV test mode Test mode Note : fREF and f1/N is available on pin PFMST(pin 22). Test SW is for the mix filter damping switch Rsa : Set up tuning step Rsa Rsb tuning step frequency @4MHz X'tal Division ratio 0 1 1 1 1/128 1/64 31.25kHz 62.5kHz X 0 1/80 50.0kHz OS : Set up drive output OS Drive output Mode 0 ON Normal mode 1 OFF("L")level Test mode PFMST, PUHF , PVHFL,PVHFH : PORT setting PFMST,PUHF,PVHFL,PVHFH Output 0 1 OFF ON PNP open collector output. When PUHF is "OFF", Mixer and Oscillator active VHF mode. (2) READ mode data format At the time of READ mode, a power-on reset state, a phase comparison machine lock detector output state, and the state of the charge pump current change SW are outputted to a master device. Read mode data format Byte Address Byte Status Byte MSB 1 POR LSB 1 FL 0 ACPS 0 X 0 X MA1 X MA0 X R/W=1 X A A X: 0 or 1 Don't care POR: Power on reset flag. Output is "1" at power-on Set to "1" when the time of a power supply voltage injection or power supply voltage falls in about 3V or less. Reset by "0", if a Request to Send is carried out in READ mode and a flag is returned. Power supply voltage is about 3v or more, Reset by "0", after returning a flag in READ mode. FL: Lock detector flag. Output is "1" at locked, output is "0" at unlocked. ACPS: Automatic charge pump current flag. Output is "0" at charge pump current automatically switched mode, output is "1" at other mode. Rev.1.3 Jun 14, 2004 page 12 of 27 M61140FP (3) Power on reset The initial status is shown as below when supply voltage is turned on. If supply voltage becomes less than about 3.0V, the initial status is set. Byte MSB LSB Divider Byte1 (DB1) 0 X X X X X X X Divider Byte2 (DB2) Control Byte (CB1) X 1 X 1 X 0 X 1 X X X 1 X 1 X 1 Band Byte (CB2) X X X X 0 0 0 0 (4) Data format example Ex1.US-TV-ch2 (fRF=55.25MHz,fosc=101MHz),CP sw=ON, Reference Frequency=4MHz,31.25kHzstep, PUHF="ON" Byte MSB LSB Address Byte Divider Byte1 (DB1) 1 0 1 0 0 0 0 0 0 1 MA1 1 MA0 0 R/W=0 0 A A Divider Byte2 (DB2) Control Byte (CB1) 1 1 0 1 1 0 0 0 0 0 0 0 0 1 0 0 A A X X X 0 0 0 1 A Band Byte (CB2) X 6 Divide ratio N =101*10 /31.25*10 = 3232 11 10 7 5 = 2 +2 +2 +2 3 2 Purchase of Renesas Technology electric corporation's I C components conveys a license under the Philips 2 2 2 I C Patent Rights to use these components in an I C system, provided that the system conforms to the I C Standard Specification as defined by Philips Rev.1.3 Jun 14, 2004 page 13 of 27 M61140FP Electrical Characteristics DC characteristics (Ta=25°C, Vcc=5.0V otherwise noted.) Symbol Measure point Input SG Condition switches set to position "1" unless otherwise noted IF Vcc current IF2 Vcc current IccIF IccIF2 33 34 - SW33=2 SW34=2 40 14 53 19 66 24 mA mA M/O Vcc current Logic Vcc current(1) IccRF IccLo1 24 28 - SW24=2 SW28=2 Port OFF 14 11 18 14 23 18 mA mA Logic Vcc current(2) Logic Vcc current(3) IccLo2 28 - 27 37 46 mA IccLo3 28 - SW28=2, Io(PVHFL) or Io(PVHFH)=20mA SW28=2, Io(PFMST) or Io(PUHF)=5mA 15 20 25 mA Item Rev.1.3 Jun 14, 2004 page 14 of 27 min Limits typ max Unit Note M61140FP Mixer and OSC Block (Ta=25°C, Vcc=5.0V otherwise noted.) Symbol Measure point Input SG Condition switches set to position "1" unless otherwise noted Conversion gain1 Conversion gain2 GvcV1 GvcV2 35,16 35,16 - fRF=55.25MHz, CW fRF=361.25MHz, CW 20 20 23 23 26 26 dB dB NF1 NF2 NFV1 NFV2 35 35 - fRF=55.25MHz, CW fRF=361.25MHz, CW - 16.5 17.5 18 20 dB dB Cross modulation1 CMV1 35 - -28 -25 - dBm Cross modulation2 CMV2 35 - fd=55.25MHz, CW fud=fd6MHz, AM100kHz, 30% fd=361.25MHz, CW fud=fd6MHz, AM100kHz, 30% -28 -25 - dBm CS beat1 CS1 35 - 55 60 - dBc CS beat1 CS2 35 - fp=241.25MHz, fs=245.75MHz fc=244.83MHz, AM100kHz, 30% fp=241.25MHz, fs=245.75MHz fc=244.83MHz, AM100kHz,30% 55 60 - dBc Conversion gain3 Conversion gain4 GvcU3 GvcU4 35 35 - fRF=367.25MHz, CW fRF=801.25MHz, CW 27 27 30 30 33 33 dB dB NF1 NF2 NFU1 NFU2 35 35 - fRF=367.25MHz, CW fRF=801.25MHz, CW - 11.5 13 13 15 dB dB cross modulation1(-) CMU1(-) 35 - -31 -28 - dBm cross modulation1(+) CMU1(+) 35 - fd=367.25MHz, CW fud=fd-6MHz, AM100kHz, 30% fd=367.25MHz, CW fud=fd+6MHz, AM100kHz, 30% -37 -34 - dBm cross modulation2(-) CMU2(-) 35 - -31 -28 - dBm cross modulation2(+) CMU2(+) 35 - fd=801.25MHz, CW fud=fd-6MHz, AM100kHz, 30% fd=801.25MHz, CW fud=fd+6MHz, AM100kHz, 30% -37 -34 - dBm CS beat3 CS3 35 - fp=615.25MHz, fs=627.75MHz fc=618.83MHz, VoIF=-10dBm 55 60 - dBc Item V H F U H F Rev.1.3 Jun 14, 2004 page 15 of 27 min Limits typ max Unit Note M61140FP Mixer and OSC Block (Ta=25°C,Vcc=5.0V otherwise noted.) Symbol Measure point Input SG 6ch beat INT6ch 35 - A5ch beat INTA5ch 35 - 5ch beat INT5ch 35 - PSC beat1 PSC183 35 PSC beat2 PSC beat3 PSC366 PSC732 35 35 VHF OSC Power supply shift VHF OSC Swon Drift ∆fosc_v Item B e a t O S C Condition switches set to position "1" unless otherwise noted min Limits typ max Unit fp=83.25MHz, fs=87.75MHz VoIF=-10dBm fp=91.25MHz, VoIF=-10dBm 55 60 - dBc 60 65 - dBc 60 65 - dBc - fp1=83.25MHz, fp=77.25MHz VoIF=-10dBm fosc=183MHz - - -85 dBm - fosc=366MHz fosc=732MHz - - -85 -85 dBm dBm 35 - ∆Vcc=10% - - ±500 kHz ∆foscv_t 35 - VccOn 3sec to 5min - - ±500 kHz VHF OSC C/N1 C/N(V1) 35 - 65 - - dBc VHF OSC C/N2 C/N(V2) 35 - fp=83.25MHz, VoIF=-10dBm +/-50kHz offset fp=241.25MHz, VoIF=-10dBm +/-50kHz offset 65 - - dBc UHF OSC Power supply shift UHF OSC Swon Drift ∆fosc_u 35 - ∆Vcc =10% - - ±500 kHz ∆foscu_t 35 - VccOn 3sec to 5min 55 - - kHz UHF OSC C/N C/N(U) 35 - fp=615.25MHz, VoIF=-10dBm +/-50kHz offset 65 - - dBc Rev.1.3 Jun 14, 2004 page 16 of 27 Note M61140FP PLL Block (Ta=25°C,Vcc=5.0V otherwise noted.) Condition switches set to position "1" unless otherwise noted Symbol Measure point Input SG High input voltage Low input voltage ViH ViL 26,27 26,27 - SW26,27=2 SW26,27=2 High input current IiH 26,27 - Low input current IiL 26,27 - Low output voltage VoSL 27 Leakage current High input current IoSLK ViAH Low input current P O R T C P Item S D A / S C L S D A A D S V T X i n min Limits typ max Unit 2.3 - - Vcc 1.0 V V SW25A,26,27=2 Vi=4.0V SW25A,26,27=2 Vi=0.4V - - 10 µA - -1 -10 µA - SW25A,27=2 Io=3mA - - 0.4 V 27 25 - SW25A,27=2 Vo=5.0V SW25,25A=2 Vi=5.0V - - 10 600 µA µA IiAL 25 - SW25,25A=2 Vi=0.4V - - -200 µA Output voltage1 Output voltage2 Vop1 Vop2 20,21 15,22 - SW20,21=2 Io=-25mA SW15,22=2 Io=-5mA 4.6 4.6 4.8 4.8 - V V Leakage current IopLK 15 20~22 - - - 10 µA High output current IcpH 32 - SW15,20,21,22=2 output "OFF" SW32=2 Vo=2.5V ±170 ±300 ±400 µA Low output current Leakage current IcpL 32 - SW32=2 Vo=2.5V ±55 ±75 ±115 µA IcpLK 32 - SW32=2 Vo=2.5V,output "OFF" - - 50 nA Iovt 31 - SW31=2 Vo=0.5V - - 2.0 mA fxin 29 - 3.2 4.0 4.4 MHz Rxin Vixin 29 29,22 SG17 2.0 50 - 600 kΩ mVp -p Tuning drive output Operational frequency of Crystal OSC Absolute Value Sensitivity of External signal Rev.1.3 Jun 14, 2004 page 17 of 27 SW29=2,Sine wave signal input Data(T2,T1,T0)="01X" Note *14 M61140FP Data input Block (Ta=25°C,Vcc=5.0V otherwise noted.) Condition switches set to position "1" unless otherwise noted Input SG Symbol Measure point Clock frequency Bus free time fSCL tBUF 26 27 0 1.3 100 - 400 - kHz µsec Data hold time SCL LOW hold time tHDSTA tLOW 27 26 0.6 1.3 - - µsec µsec SCL HIGH hold time Set up time tHIGH 26 0.6 - - µsec tSUSTA 26,27 0.6 - - µsec Data hold time Data set up time tHDDAT tSUDAT 26,27 26,27 0 100 - - µsec nsec Rise time Fall time tR tF 26,27 26,27 - - 300 300 nsec nsec Set up time tSUSTO 26 0.6 - - µsec Item min Limits typ max Unit Note Timing chart SDA tLOW tBU tf tr tHDSTA SCL tHDSTA [STOP] [START] condition condition Rev.1.3 Jun 14, 2004 page 18 of 27 tHDDAT tHIGH tSUDAT tSUSTA [START] condition tSUSTO [STOP] condition M61140FP VIF Block1 (Ta=25°C, Vcc=5.0V otherwise noted.) Symbol Measure point Input SG Video output level Sync tip voltage Vodet VoSNK 46 46 SG1 SG2 Video S/N VideoS/ N BW 46 SG2 1 SG3 Input sensitivity Max. IF input VinMIN VinMAX 1,37,38 1,37,38 SG4 SG5 AGC range Capture range U GR CR-U 46,37,38 Capture range L Inter modulation CR-L IM D/G D/P Item Condition switches set to position "1" unless otherwise noted min Limits typ max Unit Note 0.85 1.1 1.15 1.3 1.35 1.5 Vp-p V 48 50 - dB *1 6 7 - MHz *2 Vo=-3dB point Vo=-3dB point 101 45 105 52 - dBµV dBµV *3 *4 GR = VinMAX - Vin MIN SG9 52 0.6 60 0.8 - dB MHz *5 *6 46,37,38 1 SG9 SG11 1.1 32 1.5 40 - MHz dB *7 *8 DG DP 1 1 SG12 SG12 - 3 3 5 5 % deg Input impedance Input capacitance Zin Yin 37,38 37,38 - - 2k 5 - Ω pF RF AGC max voltage RF AGC min voltage V23H 23 SG6 4 4.3 4.6 V V23L 23 SG7 0 0.3 0.6 V RFAGC Delay point Vi23 23,37,38 SG8 82 85 88 dBµV Video out freq. response 5MHz LPF DC 40MHz @3pin open *9 VIF Block2 (Ta=25°C,Vcc=5.0V otherwise noted.) Condition switches set to position "1" unless otherwise noted Symbol Measure point Input SG Freerun frequency fvco 42 SG17 SW42,29=2,44pin "GND" Data (T2,T1,T0="01X") AFT Sensitivity µ 42 SG10 AFT high output voltage V42H 42 AFT Low output voltage AFT center voltage V42L AFT center voltage Item Limits min -500 typ - max 500 Unit Note kHz *15 @360k/360k 0.1µF 12 24 36 mV/ kHz *10 SG10 4.3 4.7 5 V 42 SG10 0 0.3 0.7 V V42C1 42 SG18 frequency=58.75MHz 2.4 2.5 2.6 V V42C2 42 SG2 frequency=45.75MHz 2.4 2.5 2.6 V Rev.1.3 Jun 14, 2004 page 19 of 27 M61140FP SIF Block (Ta=25°C,Vcc=5.0V otherwise noted.) Symbol Measure point Input SG Condition switches set to position "1" unless otherwise noted min Audio out level Audio out THD VoAF THDAF 40 40 SG13 SG13 SW3=2 @Pin39:0.22µF SW3=2 @Pin39:0.22µF 500 - 770 0.4 1040 0.9 mVrms % AF S/N Limiting sensitivity AF S/N LIM 40 3,40 SG16 SG14 SW3=2 @Pin39:0.22µF SW3=2 S/N=30dB Point 51 - 56 50 55 dB dBµV *11 *12 AMR QIF output AMR VoQIF 40 41 SG15 SG16 SW3=2 SW3=2 44 86 50 92 - dB dBµV *13 Item Limits typ max Note Unit Measurement Diagram Vt 33V 22K 100p 10p 0. 01u 01µ 18K 2200p 0. 1u 1µ I2C BUS 4MHz 5V 2 1 1 2 2 1 2 2 1 A SW 29 SW 31 SW 32 1 2 0. 01µ 01u SW 28 SW 33 1 35 IF 2 GN D 33 IF 2 V cc VI F Vc c 31 30 29 28 10p Log ic G N D 27 26 A Log ic Vcc 38 Bu s rec eiv er XO Char ge pump SW 24 0. 01µ 01u 43 0. 1µ 1u 1000p 2 22 APC SW 46 47p PS C 1/32, 1/33 IF A G C DE T 27p V ba nd in 1n U MIX SW 15 1n 0. 1µ 1u 47 LP F 48 Vr eg 1 UH F OS C VH F OS C EQ AMP 15 µ u 1 2 1n 14 2 21 V MIX 1 LP F 20 15bit P. G d ivider 46 V4 6B 50 2.2K 0. 22 µ 200 27p 19 IF AMP 45 V4 6A 1 0. 01µ 01u 2 RF AG C 44 SW 44 SW 22 1n U band in 13 1 AF T VI F G N D SW 42 Ph as e det QI F AMP 42 0. 1µ 1u 360K 1 V 2 18 360K TP 42 2 10K SW 21 2 0. 01µ 01u 16 5V 1 Coil-les s VC O 41 1n Re f divider LI M AMP 7.5K 15 0. 01µ 01u 0. 01u 01µ SW 22 17 40 TP 40 B and driver 0 RF G N D 39 0. 22µ TP 41 TP 23 0. 1µ 1u 1 FM det 2 1 25 1n 50 5V SW 26 32 Video det IF a mp 37 VIF in 34 A V SW 25 10 n 36 2 2 2 SW 27 47u 47µ SW 34 0. 01µ 01u S W25A 2 24 1 TP 35 1 1 M/O Vcc 1 A 1n 5V A A 23 5V OS C GN D 2 3 4 5 6 7 8 9 10 11 12 330 5p 0. 01µ 01u 10K 5p 5p 68 56p 0. 022µ 022u SW 3 2200p 1n 10p TP 4 240 22K 5p 5. 6K 1K 2p 1 0. 5p 10 K 2 100K 2. 7K 1n 2200p 56p 2200p 100K TP 1 7. 5K 22 µ u 50 Vt Rev.1.3 Jun 14, 2004 page 20 of 27 2200p 6800p 27K 100K 27K M61140FP Input Signal SG 50ohm termination 1 2 f0=45.75MHz f0=45.75MHz Vi=90dBµV Vi=90dBµV fm=20kHz CW 3 4 f1=45.75MHz f2=Frequency Variable f0=45.75MHz Vi=90dBµV Vi=70dBµV Level Variable CW CW fm=20kHz 5 6 f0=45.75MHz f0=45.75MHz Level Variable Vi=80dBµV fm=20kHz CW 7 8 f0=45.75MHz f0=45.75MHz Vi=110dBµV Level Variable CW CW 9 10 f0=Frequency Variable f0=Frequency Variable Vi=90dBµV Vi=90dBµV fm=20kHz CW 11 f1=45.75MHz f2=42.17MHz f3=41.25MHz Vi=90dBµV Vi=80dBµV Vi=80dBµV CW CW CW 12 f0=45.75MHz TV moduration=87.5% 13 f0=4.5MHz Sync Tip Level 90dBµ 10 stair-steps waveform Vi=90dBµV fm=1kHz +/- 25kHz dev 14 15 f0=4.5MHz f0=4.5MHz Level Variable Vi=90dBµV fm=1kHz fm=1kHz +/- 25kHz dev AM=30% 16 17 f0=4.5MHz f0=4.0MHz Vi=90dBµV Level Variable CW CW 18 f0=58.75MHz Vi=90dBµV CW Rev.1.3 Jun 14, 2004 page 21 of 27 AM=77.8% mixed signal AM=77.8% AM=14.0% AM=77.8% mixed signal M61140FP Measurement of Electrical Characteristic Notes 1. Video S/N Input SG2 to VIF IN and measure the video out (Pin 46) noise in r.m.s. at TP46B through a 5MHz (-3dB) L.P.F. S/N=20log 0.7xVodet NOISE (dB) 2. Video Band Width 1. Measure the 1MHz component level of Video output TP1 with a spectrum analyzer when SG3 (f2=44.75MHz) is input to VIF IN. At that time, measure the voltage at TP44 with SW8, set to position 2, and then fix V8 at that voltage. 2. Reduce f2and measure the value of (f2-f1) when the (f2-f1) component level reaches -3dB from the 1MHz component level as shown below. Video det out -3dB 1MHz BW (f2-f1) 3. Input sensitivity Input SG4 (Vi=90dBµ) to VIF IN , and then gradually reduce Vi and measure the input level when the 20kHz component of Video output TP46A reaches -3dB from Vo det level. 4. Maximum Allowable Input 1. Input SG5 (Vi=90dBµ) to VIF IN, and measure the level of the 20kHz component of Video output. 2. Gradually increase the Vi of SG and measure the input level when the output reaches -3dB. 5. AGC control Range GR=VinMAX-VinMIN (dB) 6. Capture range U 1. Increase the frequency of SG9 until the VCO is out of locked-oscillation 2. And decrease the frequency of SG9 and measure the frequency fU when the VCO is locked. CR-U=fU-45.75 (MHz) 7. Capture range L 1. Decrease the frequency of SG9 until the VCO is out of locked-oscillation. 2. And increase the frequency of SG9 and measure the frequency fL when the VCO is locked. CR-L=45.75-fL (MHz) 8. Inter modulation 1. Input SG11 to VIF IN, and measure video output TP9 with an oscilloscope. 2. Adjust AGC filter voltage V44 so that the minimum DC level of the output waveform is 1.5V. 3. At that time, measure TP1 with a spectrum analyzer The inter modulation is defined as a difference between 0.92MHz and3.58 MHz frequency components. 9. RF AGC Operating Voltage: Input SG8 to VIF IN and gradually reduce Vi and then measure the input level when RF AGC output reaches 1/2Vcc, as shown below. V23 V23H 1/2Vcc V23L Vi Rev.1.3 Jun 14, 2004 page 22 of 27 M61140FP 10. AFT sensitivity, Maximum AFT voltage, Minimum AFT voltage 1. Input SG10 to VIF IN, and set the frequency of SG10 so that the voltage of AFT output TP42 is 3(V). This frequency is named f(3). 2. Set the frequency of SG10 so that the AFT output voltage is 2(V). This frequency is named f(2). 3. IN the graph shown below, maximum and minimum DC voltage are V42H and V42L, respectively. V42 µ= 1000mV f(2)-f(3) (KHz) V42H 3V (mV/KHz) 2V V42L f(2) f(3) 11. AF S/N 1. Input SG19 to LIM IN, and measure the output noise level of Audio output (TP40). This level is named VN. S/N=20log VoAF VN (dB) 12. Limiting Sensitivity 1. Input SG14 to LIM IN, and measure the 1kHz component level of AF output TP40. 2. Input SG17 to LIM IN, and measure the noise level of AF output TP40 . 3. The input limiting sensitivity is defined as the input level when the difference between each 1kHz components of audio output (TP40) is 30dB, as shown below. AF Audio output while SG14 is input. 30dB Audio output while SG17 is input. 13. AM Rejection 1. Input SG15 to LIM IN, and measure the output level of Audio output (TP40). This level is named VAM. 2. AMR is AMR=20Log Vo AF (mVrms) VAM (mVrms) (dB) 14. Xin sensitivity of external signal 1. Input data that Control byte data CP,T2,T1,T0 is "0100" and Rsa,Rsa is"01" 2. The Reference frequency is output to Pin 22, measure the frequency with counter. 3. Input sensitivity is defined as the input level when the frequency is less than plus-or-minus 1ppm of 31.25kHz. 15. Freerun frequency 1. Input data that Control byte data CP,T2,T1,T0 is "01X". 2. The Reference frequency is output to Pin 42, measure the frequency with counter. This frequency is named fmoni. Freerun frequency (foUS) is 52.9524[MHz] - fmoni x 9 [MHz] Freerun frequency (foJP) is 65.9512[MHz] - fmoni x 9 [MHz] Rev.1.3 Jun 14, 2004 page 23 of 27 0. 01µ Rev.1.3 Jun 14, 2004 page 24 of 27 46 47 48 22µ 3 *4 *21 0.022µ 4 5 Vt 10K 6 7.5K 68 5p OS C GN D 2200p 2p 8 *6 5p 6800p 2200p 7 *12 9 *8 56p 5p 10 100K *11 5p 1n 27K 0.5p 10p 11 *7 12 *10 100K *7 13 56p 2 UH F OS C U MIX V MIX 25 14 RF A GC delay 0. 1µ V ideo det Vr eg VH F OS C Bu s rec eiv er 26 RF GND *3 VI F G N D 240 IF a mp 1 LP F PS C 1/32, 1/33 15bit P.G d ivider IF AMP 27 A DS 15 330 45 15µ 44 16 EQ AMP IF A G C DE T 28 Log ic V cc B and dr iver 0. 1µ 27K 43 0.22 µ RF AG C Ph as e det Re f divider XO 29 S CL 17 47p 30 Log ic G ND SD A *13 5V to MO D 18 200 0. 1µ 42 APC AF T Co il-les s VC O 31 Ch arge pump 32 0. 01µ 10 p 19 1000p 41 360K 33 VI F V cc *5 M/ O V cc V ideo out 0. 1µ 40 QI F AMP 34 0. 1µ *1 20 AF T out 39 LI M AMP FM det 35 0. 01µ 47 µ 2200p Re f in ( 4MHz ) 21 360K 38 5V 7.5K 36 IF 2 G ND 0. 01µ *14 18K 5V 100p 22 0. 01µ 37 23 0.22µ 1n *15 1n 0. 01µ 5V Vt 22K *20 24 1. 5K for J AP A N mode A udio out QI F out 1n *2 SA W 33 V 0. 01µ 27K 27p 27p 5. 6K 1K 2200p 0. 01µ *9 50 *17 *18 2200p 2. 7K 1n 1n *16 1n 0. 01µ 2.2K 0. 01µ 0. 01µ *19 5V 0. 1µ 100K U ban d in PU H F V ba nd in PV HF H PV HFL PF MS T RF A GC o ut M61140FP Application Example M61140FP Application Note *1 *2 *3 *4 *5 *6,7 *8 *9 *10 *11 *12 *13,14 *15 *16-19 *21 2SC2643 equivalent made by Renesas 45.75MHz SAW Filter made by EPCOS 4.5MHz Trap: TPSRA4M50B00 made by Murata 4.5MHz B.P.F.: SFSRA4M50EF00 made by Murata HC-49/U equivalent made by Daishinku. Load capacitance=20pF,Motinal resistance: Less 300 Ω HVC306B, HVC306C equivalent made by Renesas HSC277 equivalent made by Renesas 0.1mm 3mm φ 6t x2 P886ANS-0194VN made by TOKO 0.5mm 2.4mm φ 1.5t 0.5mm 2.4mm φ 2.5t 0.5mm 2.4mm φ 8.5t The bypass capacitor of Vcc is arranged near the LogicGND pin. In order to mitigate the surroundings lump by the VIF input, the balanced connection from a SAW filter to the VIF input pin of 37.38 recommends a putter which serves as a 1t coil by Tip C or the jumper. In order to stop digital beat which goes via the port output from Logic Vcc, bypass capacitor arranged near the port output pin. It is high impedance. keep away from VideodetOUT and EQ F/B pin. Notes about the handling of IC *20 * The direct power supply impression to Vt terminal is forbidden. When power supply impression is required, please impress through the resistance for current restrictions. Depending on the case, it is drive current from 31 pin, and excessive collector current flows and breaks to an external transistor. Because there is a possibility of also destroying IC by the destruction. Since this IC is using the detailed process, be careful of serge enough. Especially careful 1,7,8,9,10,25,26,27,32,48 pins. Rev.1.3 Jun 14, 2004 page 25 of 27 M61140FP Application Board Example Rev.1.3 Jun 14, 2004 page 26 of 27 M61140FP Package Dimensions JEITA Package Code RENESAS Code Previous Code P-LQFP48-7x7-0.50 PLQP0048KB-A 48P6Q-A MASS[Typ.] 0.2g HD *1 D 36 25 37 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 24 bp c c1 *2 E HE b1 Reference Symbol 48 13 1 ZE Terminal cross section Nom D 6.9 7.0 7.1 E 6.9 7.0 7.1 A2 12 c A A2 F 1.4 8.8 9.0 9.2 HE 8.8 9.0 9.2 A1 0 0.1 0.2 bp 0.17 0.22 0.27 0.09 0.145 A1 1.7 0.20 b1 c L 0° e y *3 bp Detail F x 0.08 y 0.10 0.75 ZD 0.75 ZE L1 Rev.1.3 Jun 14, 2004 page 27 of 27 8° 0.5 x L 0.20 0.125 c1 L1 e Max HD A Index mark ZD Dimension in Millimeters Min 0.35 0.5 1.0 0.65 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. 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