TOSHIBA TD7624AFN_01

TD7624AFN
TENTATIVE
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD7624AFN
2
3-WIRE AND I C BUS SYSTEM, 1.3 GHz DIRECT TWO MODULUS-TYPE FREQUENCY
SYNTHESIZER FOR TV AND CATV
The TD7624AFN can be combined with a micro CPU to create a
highly functional frequency synthesizer. The control data
conforms to 3-wire bus and standard I2C bus formats. BUS-SW
can be used to easily switch for easy tuner system set-up.
FEATURES
= Direct two modulus-type frequency synthesizer
= Standard I2C bus format control with built-in read mode
= 3-wire bus format control
= 18-bit and 19-bit automatic discrimination circuit
(when 3-wire bus selected)
= 4-bit bandswitch drive transistor
= 5-level A / D converter (when I2C bus selected)
Weight: 0.07 g (Typ.)
= Frequency Step : 31.25 kHz, 50 kHz and 62.5kHz (at 4 MHz
X’tal used)
= Phase lock detector
= Four address settings via address selector (when I2C bus selected)
= Power on reset circuit
= Flat, compact package : SSOP16 (0.65 mm pitch)
= Power on reset operation condition
Bandswitch register 1 to 4
: OFF
Tuning amplifier
: ON
Tuning voltage output (Vt)
: Low level
Charge-pump output current
: ±60 µA
Phase comparator reference frequency divider ratio
Note:
: 1 / 64
These devices are easy to be damaged by high static voltage or electric fields.
In regards to this, please handle with care.
000707EBA1
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general
can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the
buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and
to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or
damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the
most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling
Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..
· The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal
equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are
neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or
failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy
control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control
instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document
shall be made at the customer’s own risk.
· The products described in this document are subject to the foreign exchange and foreign trade laws.
· The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by
TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its
use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or
others.
· The information contained herein is subject to change without notice.
2001-03-01
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TD7624AFN
BLOCK DIAGRAM
MAXIMUM RATINGS (Ta = 25°C)
CHARACTERISTIC
SYMBOL
RATING
UNIT
Supply Voltage 1
VCC1
6.0
V
Supply Voltage 2
VCC2
12
V
Power Consumption
PD
560
mW
Operating Temperature
Topr
−20~85
°C
Storage Temperature
Tstg
−55~150
°C
Note 1: When using the device at above Ta = 25°C, decrease the power dissipation by
4.5 mW for each increase of 1°C.
Note 2: These devices are easy to be damaged by high static voltage or electric fields.
In regards to this, please handle with care.
RECOMMENDED SUPPLY VOLTAGE
PIN
No.
PIN NAME
3
VCC1 : PLL Power Supply
4
VCC2 : Band Switch Power Supply
MIN
TYP.
MAX
UNIT
4.5
5.0
5.5
V
VCC1
―
9.9
V
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TD7624AFN
PIN INTERFACE
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TD7624AFN
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, VCC1 = 5 V, VCC2 = 9 V, Ta = 25°C)
SYMBOL
TEST
CIRCUIT
TEST CONDITION
MIN
TYP.
MAX
UNIT
Supply Voltage 1
VCC1
―
―
4.5
5.0
5.5
V
Supply Current 1
ICC1
1
13
16
21
mA
Supply Voltage 2
VCC2
―
VCC1
―
9.9
V
Bandswitch : 1 Band ON
IBD = 30 mA (LOAD)
―
35
39
Bandswitch : 2 Band ON
IBD = 40 mA (TOTAL LOAD)
―
50
58
CHARACTERISTIC
ICC2-1
1
Supply Current 2
ICC2-2
Bandswitch Drive Current
Bandswitch : OFF
Vt : OFF
―
mA
IBD
3
Maximum Drive Current / 1 port
―
―
30
mA
IBDMAX
3
Maximum Total Drive Current
―
―
50
mA
VBD
Sat
3
IBD = 30 mA
―
0.2
0.4
V
X’tal Operating Range
OSCfin
―
―
3.2
―
4.5
MHz
X’tal Negative Resistance
OSCR
1
―
1.0
1.5
―
kΩ
X’tal External Input Level
OSCin
―
3.2 MHz~4.5 MHz, Rx = 91 kΩ
250
―
1000
mVp-p
15-bit counter
1024
―
32767
14-bit counter
1024
―
16384
f = 80~150 MHz
−25
―
+5
f = 150~1300 MHz
−30
―
+5
Bandswitch Drive Maximum LOAD
Bandswitch Drive Voltage Drop
Ratio Setting Range
Prescaler Input Sensitivity
N14
N13
Vin1
Vin2
―
2
Ratio
dBmW
Lock Output Low Voltage
VLkL
1
(lock mode, 3-wire bus mode)
―
―
0.4
V
Lock Output High Voltage
VLkH
1
(unlock mode, 3-wire bus
mode)
4.6
―
―
V
Logic Input Low Voltage
VBsL
1
Pins 13 to 15
−0.3
―
1.5
V
Logic Input High Voltage
VBsH
1
Pins 13 to 15
3.0
―
VCC1
+0.3
V
Logic Input Current (low)
IBsL
1
Pins 13 to 15
−20
―
10
Logic Input Current (high)
IBsH
1
Pins 13 to 15
−10
―
20
BUS-SW Low Input Voltage
VBIL
1
―
0.0
―
0.8
BUS-SW High Input Voltage
VBIH
1
―
4.2
―
VCC1
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µA
V
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TD7624AFN
SYMBOL
TEST
CIRCUIT
TEST CONDITION
MIN.
TYP.
MAX.
BUS-SW Low Current (low)
IBIL
1
―
−200
―
―
BUS-SW Low Current (high)
IBIH
1
―
―
―
200
Charge Pump Output Current
Ichg
2
CP = [0]
±50
±60
±90
CP = [1]
±230
±280
±420
ACK Output Voltage
VACK
1
―
―
0.4
V
A / D Converter Input Voltage
VADC
―
0.0
―
VCC1
V
CHARACTERISTIC
2
ISINK = 3 mA (I C-bus mode)
―
Set-up Time
Ts
2
―
―
Enable Hold Time
TsL
2
―
―
Next Enable Stop Time
TNE
6
―
―
6
―
―
Next Clock Stop Time
(3-wire bus mode)
Refer to data timing chart
TNC
Clock Width
Tc
2
―
―
Enable Set-up Time
TL
10
―
―
Data Hold Time
TH
2
―
―
SCL Clock Frequency
fSCL
0
―
100
Bus Free Time Between a STOP and
START Condition
tBUF
4.7
―
―
4.0
―
―
Hold Time (Repeated) START
Condition
tHD;STA
―
Low Period of the SCL Clock
tLOW
4.7
―
―
High Period of the SCL Clock
tHIGH
4.0
―
―
4.7
―
―
UNIT
µA
µA
µs
kHz
µs
2
(I C bus mode)
Refer to data timing chart
Set-up Time for a Repeated START
Condition
tSU;STA
Data Hold Time
tHD;DAT
0
―
―
Data Set-up Time
tSU;DAT
250
―
―
Rise Time of both SDA and SCL
Signals
tR
―
―
1000
Fall Time of both SDA and SCL
Signals
tF
―
―
300
Set-up Time for STOP Condition
tSU;STO
4.0
―
―
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ns
µs
5/21
TD7624AFN
Fig.1
Fig.2
3-wire bus data timing chart (Falling edge timing)
2
I C bus data timing chart (Falling edge timing)
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TD7624AFN
OPERATION INSTRUCTIONS
TD7624AFN can be controlled with either the 3-wire bus or standard I2C bus.
The 3-wire bus mode is equipped with an 18-bit / 19-bit automatic selection circuit.
Frequency steps can be switched, depending on the voltage applied to the BUS-SW pin.
The I2C bus conforms to the standard I2C bus format. The bus supports two-way bus communications control,
consisting of WRITE mode where data are received and READ mode where data are transmitted. In READ
mode, the voltage applied on the A / D converter input pin can be transmitted and output with 5-level
resolution.
(This function is only valid when the I2C bus is selected. When the 3-wire bus is selected, the A / D converter
input pin function as the LOCK output pin.)
Addresses can be set using the hardware bits. Three programmable addresses are supported. 3-wire bus and
standard I2C bus are switches by the voltage applied on the BUS-SW pin.
The power-on reset circuit is built in this product, and the detection voltage is designed about 1.4 V.
If it raises to voltage of operation after making it stop for a while near the voltage of a power-on reset circuit of
operation at the time of starting of a power supply, a power-on reset circuit may not operate normally.
FUNCTION CHART
2
NAME
3-WIRE BUS MODE
I C BUS MODE
BUS-SW
[OPEN] or [VCC]
[GND]
CL / SCL
CLOCK INPUT
SCL INPUT
DA / SDA
DATA INPUT
SDA IN / OUTPUT
EN / ADR
ENABLE INPUT
ADDRESS
LOCK / ADC
LOCK
ADC
― 3-WIRE BUS COMMUNICATIONS CONTROL ―
The 3-wire bus used normal 18-bit and 19-bit data (bandswitch information and programmable counter
information) and 27-bit test data (charge pump current setting, reference frequency divider ratio setting,
and testing item functions) are available.
The program frequency can be calculated together with normal data and test data.
fosc = fr × N
fosc : Program frequency
fr
: Phase comparator reference frequency (Step frequency)
N
: Counter total ratio
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TD7624AFN
(1) Normal data
Depending on the voltage (OPEN, VCC) applied on the BUS-SW pin and the transfer DATA bit length,
the X’tal divider ratio setting, phase comparator reference frequency, and step frequency of the normal
data are as shown in the table below.
NORMAL DATA FUNCTION TABLE
BUS-SW INPUT
TRANSFER DATA
X’TAL RATIO
REFERENCE
FREQUENCY
STEP FREQUENCY
[VCC]
18-bit
Cannot be set
←
←
[VCC]
19-bit
1 / 80
50 kHz
50 kHz
[OPEN]
18-bit
1 / 64
62.5 kHz
62.5 kHz
[OPEN]
19-bit
1 / 128
31.25 kHz
31.25 kHz
Note 1: The step frequency at 4 MHz X'tal used
Note 2: During "OPEN", automatically set with transmitted bit length
(18«19 possible)
Fig.3
Normal data format (18-bit transmission)
Fig.4
Normal data format (19-bit transmission)
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TD7624AFN
l 18-bit DATA TRANSMISSION :
During a high level of the enable signal, the data is clocked into the register on the falling edge of the
clock.
The clock number during a high level of the enable signal must be set to 18-bit for the latch condition.
(The number of clock rising edges is 18).
For latch timing, the first four bits, which control the bandswitch buffers, are loaded at the fifth rising
edge of the clock, and the data is updated.
The programmed counter data transmits the 18-bit data, latched on the falling edge of the enable signal.
During 18-bit data transmission, “N14” programmable counter data is constantly set to [0] , and the
phase comparator reference frequency divider ratio is automatically set to “1 / 64”.
Details of the data timing, see the data timing chart (Figure 1)
l 19-bit DATA TRANSMISSION :
During a high level of the enable signal, the data is clocked into the register on the falling edge of the
clock.
The clock number during a high level of the enable signal must be set to 19-bit for the latch condition.
(The number of clock rising edge is 19).
For latch timing, the first four bits, which control the bandswitch buffers, are loaded at the fifth rising
edge of the clock, and the data is updated.
The programmed counter data transmits the 19-bit data, latched on the falling edge of the enable signal.
During 19-bit data transmission, the phase comparator reference frequency divider ratio is automatically
set to “1 / 80” or “1 / 128” in BUS-SW mode.
Details of the data timing, see the data timing chart (Figure 1)
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TD7624AFN
(1) TEST MODE
In the test mode, the settings can be changed and the functions can be checked.
Change from the normal mode to the test mode with a 27-bit or more of clock and data transmission
during a high level of the enable signal.
The data are latched at the 27th falling edge of the clock signal, validating the previous 27-bit data. The
latch timing is the same as normal data.
The 4-bit bandswitch data are latched at the 5th bit rising edge of the clock signal, and the data is
updated.
The programmable counter data are latched at the 20th bit rising edge of the clock signal, and the data is
updated.
The test data are latched at the 27th bit falling edge of the clock signal, and the data is updated.
When the mode is changed from test to normal, RSa changes depending on the data bit length (18 or 19
bits, automatic discrimination). The data set in RSb in test mode are retained (see the table below).
REFERENCE FREQUENCY
DIVIDER RATIO SETTING VIA
TEST MODE
1 / 64
1 / 80
1 / 128
Fig.5
Note:
DATA
TRANSMISSION
LENGTH
SET REFERENCE
FREQUENCY
DIVIDER RATIO
18-bit
1 / 64
19-bit
1 / 128
18-bit
1 / 80
19-bit
1 / 80
18-bit
1 / 64
19-bit
1 / 128
Test data format
The data timing is the same as normal data.
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TD7624AFN
TEST DATA SPECIFICATIONS
= B4~B1
: Band drive data
[0] : OFF
[1] : ON
= N14~N0
: Programmable divider data
= CP
: Charge pump output current
[0] : ±60 µA (Typ.)
[1] : ±280 µA (Typ.)
= T2, T1, T0 : Test mode setting bits
CHARACTERISTIC
T2
T1
T0
NOTE
Normal operation
0
0
1
―
Reference signal output
1
0
0
Reference signal output : B4, Counter output : B2
1 / 2 counter divider output
1
0
1
Reference signal output : B4, 1 / 2 counter output : B2
Phase comparator test
0
0
0
Comparative signal input : DA
Reference signal input
: CL (check output : NF)
X : Don’t care
Note:
When testing the counter divider output, programmable counter data input is necessary.
= Rsa, Rsb
: X’tal Reference frequency divider ratio select bits
RSa
RSb
DIVIDER RATIO
STEP FREQUENCY
1
1
1 / 64
62.5 k
0
1
1 / 128
31.25 k
X
0
1 / 80
50.0 k
Note:
X : Don’t care
When the mode is changed from test to normal, RSa changes depending on the data bit length (18 or 19 bits,
automatic discrimination). The data set in RSb in test mode are retained.
= OS
: Tuning amplifier control bit
[0] : Tuning amp ON (Normal operation)
[1] : Tuning amp OFF (Tr. Output is Low Level)
= X
: Don’t care
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TD7624AFN
2
― I C BUS COMMUNICATIONS CONTROL―
The TD7624AFN conform to standard I2C bus format.
The I2C bus mode enables two-way bus communications with the WRITE mode, which receives data, and
READ mode, which status data.
WRITE and READ mode are set using the last bit (R / W bit) of the address byte.
If the last address bit is set to [0] , WRITE mode is set ; if set to [1] READ mode is set.
Address can be set using the hardware bits. Three programmable address can be programmed.
With this setting, multiple frequency synthesizers can be used in the same I2C bus line.
The address for the hardware bit setting can be selected by applying voltage to the address setting pin
(ADR : Pin 15). An address is selected according to the set bits.
When the correct address byte is received, during acknowledgment, serial data (SDA) line is “Low”.
If WRITE mode is set at this time, when the data byte is programmed, the serial data (SDA) line is “Low”
during the next acknowledgment.
a) WRITE mode (setting command)
When WRITE mode is set, Byte 1 segment the address data ; Bytes 2 and 3 segment the frequency data ;
Byte 4 segment the divider ratio setting and function setting data ; and Byte 5 segment the output port
data.
Data are latched and transferred at the end of Byte 3, Byte 4 and Byte 5.
Byte 2 and Byte 3 are latched and transferred is done with a two byte set (Byte 2 + Byte 3).
Once a correct address is received and acknowledged, the data type is determined according to [0] or [1]
set in the first bit of the next byte. That is, if the first bit is [0] , the data are frequency data ; if [1] ,
function setting or output port data.
Until the I2C bus STOP CONDITION is detected, the additional data can be input without transmitting
the address again. (Ex : Frequency sweep is possible with additional frequency data.)
If data transmission is aborted, data programmed before the abort are valid.
Byte 1 can set the hardware bit with address data.
The hardware bit is set with voltage applied to the address setting pin (ADR : Pin 15).
Bytes 2 and 3 are stored in the 15-bit shift register with counter data for the frequency setting, and
control the 15-bit programmable counter ratio.
The program frequency can be calculated in the following formula :
fosc = fr × N
fosc : Program frequency
fr
: Phase comparator reference frequency (Step frequency)
N
: Counter total ratio
fr is calculated using the crystal oscillator frequency and the reference frequency divider ratio set in byte
4 (control byte). (fr = X’tal oscillator frequency / reference frequency divider ratio)
The reference frequency divider ratio can be set to 1 / 64, 1 / 128 and 1 / 80.
When using a 4 MHz crystal oscillator, fr = 62.5 kHz, 31.25 kHz and 50 kHz.
The step frequency are 62.5kHz, 31.25kHz, and 50kHz.
Byte 4 is a control byte used to set function. Bit 2 (CP) controls the output current of the charge-pump
circuit. When bit 2 is set to [0] : the output current is set to ±60 µA ; when set to [1] , ±280 µA.
Bit 3 (T2), Bit 4 (T1) and Bit 5 (T0) are used to set test mode. They are used to set the phase comparator
reference signal output, and counter divider output.
For details of test mode, see the test mode setting table.
Bit 6 (RSa) and Bit 7 (RSb) are used to set the X’tal reference frequency divider ratio.
For details of the X’tal reference frequency divider ratios, see the table for X’tal reference frequency
divider ratios.
Bit 8 (OS) is used to set the charge-pump drive amplifier output setting. When bit 8 is set to [0] the
output is ON (Normal Use) ; when set to [1] the output is OFF (Tr. Output is Low Level).
Byte 5 is used to set and control the output port (Bands 1~4).
When an output port set to [0] is OFF ; when set to [1] is ON.
Two output ports can be operation turned on, but be sure to keep the total output current under 50mA.
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TD7624AFN
b) READ mode (status request)
When READ mode is set, power-on reset operation status, phase comparator lock detector output status,
and 5-level A / D converter pin input voltage status are output to the master device.
Bit 1 (POR) indicates the power-on reset operation status. When the power supply of VCC1 stops, bit 1 is
set to [1] . The condition for reset to [0] , voltage supplied to VCC1 is 3 V or higher, transmission is
requested in READ mode, and the status is output. (when VCC1 is turned on, bit 1 is also set to [1] .)
Bit 2 (FL) indicates the phase comparator lock status. When locked, [1] is output ; when unlocked, [0]
is output.
Bits 6, 7 and 8 (A2, A1, A0) indicate the 5-level A / D converter status. The voltage applied to the A / D
converter input pin (pin 12) is output through a 5-level resolution.
For the voltage applied on the A / D converter input pin, 5-level resolution, and the output bits, see the
table.
(Ex : The AFT output voltage data can be given to the master device.)
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TD7624AFN
DATA FORMAT
a) WRITE MODE
BYTE
MSB
LSB
1
Address Byte
1
1
0
0
0
MA1
MA0
R / W=0
ACK
2
Divider Byte (1)
0
N14
N13
N12
N11
N10
N9
N8
ACK
3
Divider Byte (2)
N7
N6
N5
N4
N3
N2
N1
N0
ACK (L)
4
Control Byte
1
CP
T2
T1
T0
RSa
RSb
OS
ACK (L)
5
Band SW Byte
×
×
×
×
B4
B3
B2
B1
ACK (L)
×
ACK
(L)
:
:
:
DON’T Care
Acknowledged
Latch and transfer timing
b) READ MODE
BYTE
MSB
1
Address Byte
2
Status Byte
LSB
1
1
0
0
0
MA1
MA0
R/W=1
ACK
POR
FL
1
1
1
A2
A1
A0
―
ACK
:
Acknowledged
DATA SPECIFICATIONS
l MA1, MA0 : Programmable hardware address bits
ADDRESS PIN APPLIED VOLTAGE
MA1
MA0
0~0.1 VCC1
0
0
0.4 VCC1~0.6 VCC1
1
0
0~VCC1
0
1
0.9 VCC1~VCC1
1
1
l CP : Charge-pump output current setting
[0] : ±60 µA (Typ.)
[1] : ±280 µA (Typ.)
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TD7624AFN
l T2, T1, T0 : Test mode setting
CHARACTERISTIC
T2
T1
T0
NOTE
Normal operation
0
0
1
―
Reference signal output
1
0
0
Reference signal output
1 / 2 counter divider output
1
0
1
Reference signal output : B4, 1 / 2 counter output : B2
Phase comparator test
0
0
0
Comparative signal input : SDA
Reference signal input
: SCL (check output : NF)
Note:
: B4, Counter output : B2
When testing the counter divider output, programmable counter data input is necessary.
l RSa, RSb : X’tal reference frequency divider ratio select bits
RSa
RSb
DIVIDER RATIO
STEP FREQUENCY
1
1
1 / 64
62.5 k
0
1
1 / 128
31.25 k
X
0
1 / 80
50.0 k
X : Don’t care
l OS : Tuning amplifier control setting
[0] : Tuning amp ON (Normal operation)
[1] : Tuning amp OFF (Tr. Output is Low Level)
l POR : Power-on reset flag
[0] : Normal operation
[1] : Reset operation
l FL : Lock detect flag
[0] : Unlocked
[1] : Locked
l A2, A1, A0 : 5-level A / D converter status.
ADC PIN APPLIED VOLTAGE
A2
A1
A0
0.60 VCC1~VCC1
1
0
0
0.45 VCC1~0.60 VCC1
0
1
1
0.30 VCC1~0.45 VCC1
0
1
0
0.15 VCC1~0.30 VCC1
0
0
1
0~0.15 VCC1
0
0
0
*:
Accuracy is ±0.03 × VCC1
l X : DON’T Care
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TD7624AFN
2
I C BUS CONTROL SUMMARY
The bus control format of TD7624AFN conforms to the Philips I2C bus control format.
Data transmission format
(1) Start / Stop condition
(2) Bit transfer
(3) Acknowledge
(4) Slave address
A6
A5
A4
A3
A2
A1
A0
R/W
1
1
0
0
0
*
*
0
Purchase of TOSHIBA I2C components conveys a
license under the Philips I2C Patent Rights to use
these components in an I2C system, provided that
the system conforms to the I2C Standard
Specification as defined by Philips.
2001-03-01
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TD7624AFN
TEST CIRCUIT 1
Evaluation circuit board
TEST CIRCUIT 2
Input sensitivity test circuit
Test mode circuit
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TD7624AFN
TEST CIRCUIT 3
Bandswitch drive test circuit
SYSTEM APPLICATION DIAGRAM
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TD7624AFN
TYPICAL INPUT SENSITIVITY CURVE
FILTER COMPONENT EXPRESSION
C1
R1
C2
with
Kv
Icomp
ωn
N
ε
fc
= [Kv * Icomp/(2π)] / (ωn2 * N)
= [2 * ε] / (ωn * C1)
= 1 / (2π * fc *R1)
:
= Oscillator control sensitivity (radian / Second / Volts)
= Charge-pump current (A)
= Natural radian frequency (radian / Second)
= Total counter ratio
= Dumping-factor (generally : dumping-factor is about 0.5~1.0)
= filter cut-off frequency with combination resistor R1.
(generally : fc is about fr (reference frequency) / 20)
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HANDLING PRECAUTIONS
1.
The device should not be inserted into or removed from the test jig while the voltage is being applied:
otherwise the device may be degraded or break down.
Do not abruptly increase or decrease the power supply to the device either. (See Figure 1.)
Overshoot or chattering of the power supply may cause the IC to be degraded.
To avoid this filters should be incorporated on the power supply line.
2.
The peripheral circuits described in this datasheet are given only as system examples for evaluating the
device's performance. Toshiba intend neither to recommend the configuration or related values of the
peripheral circuits nor to manufacture such application systems in large quantities.
Please note that high-frequency characteristics of the device may vary depending on the external
components, mounting method and other factors relating to the application design. Therefore, the
characteristics of application circuits must be evaluated at the responsibility of the users incorporating the
device into their design.
Toshiba only guarantee the quality and characteristics of the device as described in this datasheet and do
not assume any responsibility for the customers application design.
3.
In order to better understand the quality and reliability of Toshiba semiconductor products and to
incorporate them into design in an appropriate manner, please refer to the latest Semiconductor Reliability
Handbook (Integrated Circuits) published by Toshiba Semiconductor Company.
The handbook can also be viewed online at
http://doc.semicon.toshiba.co.jp/noseek/us/sinrai/sinraifm.htm.
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PACKAGE DIMENSIONS
Weight: 0.07 g (Typ.)
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