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TSL2672
Digital Proximity Detector
General Description
The TSL2672 family of devices provides proximity detection
when coupled with an external IR LED. The devices incorporate
a constant-current LED sink driver to pulse the external IR LED
and achieve very low average power consumption using the
low-power wait state with programmable wait time between
proximity measurements. In addition, the devices are
register-set and pin-compatible with the TSL2671 series and
include a number of new and improved features, such as
improved signal-to-noise and measurement accuracy. A
proximity offset register allows compensation for optical
system crosstalk between the IR LED and the sensor. To prevent
false measurements, a proximity saturation bit indicates that
the internal analog circuitry saturated. Interrupts have been
enhanced with the addition of a sleep-after-interrupt feature
that also allows for single-cycle operation.
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of TSL2672, Digital Proximity Detector
are listed below:
Figure 1:
Added Value Of Using TSL2672
Benefits
Features
• Enables Operation in IR Light Environments
• Patented Dual-Diode Architecture
• Eliminates IR LED System Cross Talk
• Programmable Proximity Offset Adjustment
• Prevents False Proximity Detection in Bright Light
• Proximity Saturation Indicator Bit
• Allows Multiple Power-level Selection without
External Passives
• Programmable LED Drive Current
• Proximity Detection with an Integrated LED Driver in a
Single Device
• Register Set- and Pin-Compatible with the TSL2x71 Series
• Proximity Detection
• Reduced Proximity Count Variation
• Programmable Offset Control Register
• Saturation Indicator
• Programmable Analog Gain and Integration Time
• Current Sink Driver for External IR LED
• 16,000:1 Dynamic Range
ams Datasheet
[v1-00] 2016-Mar-23
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TSL2672 − General Description
• Maskable Proximity Interrupt
• Programmable Upper and Lower Thresholds with
Persistence Filter
• Power Management
• Low Power 2.2mA Sleep State with User-Selectable
Sleep-After-Interrupt Mode
• 90 mA Wait State with Programmable Wait Time from
2.7 ms to > 8 seconds
• I²C Fast Mode Compatible Interface
• Data Rates up to 400 kbit/s
• Input Voltage Levels Compatible with VDD or 1.8-V
Bus
• Small 2 mm x 2 mm ODFN Package
Applications
TSL2672, Digital Proximity Detector is ideal for:
• Mobile Handset Touchscreen Control and Automatic
Speakerphone Enable
• Mechanical Switch Replacement
• Printer Paper Alignment
End Products and Market Segments
• Mobile Handsets, Tablets, Laptops, and HDTVs
• White Goods
• Toys
• Digital Signage
• Printers
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ams Datasheet
[v1-00] 2016-Mar-23
TSL2672 − General Description
Functional Block Diagram
The functional blocks of this device are shown below:
Figure 2:
TSL2672 Block Diagram
Interrupt
Prox LED
Current Driver
Prox Control
Prox
Integration
VDD
Prox
ADC
Upper Limit
Prox
Data
Lower Limit
Wait Control
INT
I2C Interface
LDR
SCL
SDA
CH0
GND
CH1
ams Datasheet
[v1-00] 2016-Mar-23
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TSL2672 − Pin Assignments
Pin Assignments
Figure 3:
Package FN Dual Flat No-Lead (Top View)
VDD 1
6 SDA
SCL 2
5 INT
GND 3
4 LDR
Not Actual Size
Figure 4:
Terminal Functions
Terminal
Type
Description
Name
No
GND
3
INT
5
O
Interrupt — open drain (active low).
LDR
4
O
LED driver for proximity emitter — open drain.
SCL
2
I
I²C serial clock input terminal — clock signal for I²C serial data.
SDA
6
I/O
VDD
1
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Power supply ground. All voltages are referenced to GND.
I²C serial data I/O terminal — serial data I/O for I²C.
Supply voltage.
ams Datasheet
[v1-00] 2016-Mar-23
TSL2672 − Detailed Description
Detailed Description
Proximity detection requires only a single external LED. This
external LED is driven by an internal LED current driver, which
pulses the LED with current for approximately 7 microseconds.
The number of pulses, from 1 to 255, and the current level, from
1.9 mA to 120 mA, can be programmed and together provide a
16,000:1 contiguous dynamic range. Because the driver is a
constant current sink, no external current limiting resistor is
required to protect the LED.
In addition to the internal LED current driver, the TSL2672
proximity detector provides ON-chip photodiodes, oscillator,
integrating amplifier, ADC, state machine controller,
programmable interrupt and I²C interface to provide a
complete proximity detection solution.
Each device has two photodiodes; a channel 0 photodiode
(CH0), which is responsive to both visible and infrared light, and
a channel 1 photodiode (CH1), which is primarily responsive to
only infrared light. The user selects the appropriate diode for
their application.
The integrating amplifier and ADC converts the selected
photodiode current into a digital value providing up to 16 bits
of resolution. Upon completion of a proximity conversion cycle,
the result is transferred to the proximity data registers where it
is available to be read.
Communication with the device is accomplished over a fast (up
to 400 kHz), two-wire I²C serial bus for easy connection to a
microcontroller or embedded controller. The digital output of
the device is inherently more noise-immune when compared
to an analog interface.
The device provides a separate pin for level-style interrupts to
simplify and improve system efficiency by eliminating the need
to poll for proximity data. When interrupts are enabled, an
interrupt is generated when the proximity data either exceeds
an upper threshold or is less than a lower threshold. Once
generated, the interrupt remains asserted until cleared by the
controlling firmware. In addition, a programmable interrupt
persistence filter allows the user to determine the number of
consecutive out-of-range measurements necessary to trigger
an interrupt.
ams Datasheet
[v1-00] 2016-Mar-23
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TSL2672 − Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or
any other conditions beyond those indicated under
Recommended Operating Conditions is not implied. Exposure
to absolute-maximum-rated conditions for extended periods
may affect device reliability.
Figure 5:
Absolute Maximum Ratings Over Operating Free-Air Temperature Range (unless otherwise noted)
Symbol
Parameter
VDD(1)
Min
Supply voltage
Max
Units
3.8
V
Input terminal voltage
-0.5
3.8
V
Output terminal voltage (except LDR)
-0.5
3.8
V
5
V
Output terminal voltage (LDR)
Tstg
ESDHBM
Output terminal current (except LDR)
-1
20
mA
Storage temperature range
-40
85
°C
ESD tolerance, human body model
±2000
V
Note(s):
1. All voltages are with respect to GND.
Figure 6:
Recommended Operating Conditions
Symbol
Parameter
VDD
Supply voltage
VDD
Supply voltage
VLDR
LED driver
voltage
TA
Operating
free-air
temperature
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Conditions
Min
Nom
Max
Unit
(TSL26721 & TSL26725) (I²C Vbus = VDD)
2.4
3
3.6
V
(TSL26723 & TSL26727) (I²C Vbus = 1.8 V)
2.7
3
3.6
V
LDR pulse ON
0
3.6
LDR pulse OFF
0
4.8
-30
70
V
°C
ams Datasheet
[v1-00] 2016-Mar-23
TSL2672 − Absolute Maximum Ratings
Figure 7:
Operating Characteristics; V DD = 3 V, TA = 25°C (unless otherwise noted)
Symbol
Parameter
IDD
VOL
Test Conditions
Typ
Max
Active — LDR pulse OFF
200
250
Wait state
90
Sleep state - no I²C
activity
2.2
Supply current
Min
Unit
μA
4
3 mA sink current
0
0.4
6 mA sink current
0
0.6
INT, SDA output low voltage
V
ILEAK
Leakage current, SDA, SCL,
INT pins
−5
5
μA
ILEAK
Leakage current, LDR pin
−5
5
μA
VIH
SCL, SDA input high voltage
VIL
TSL26721, TSL26725
0.7 VDD
TSL26723, TSL26727
1.25
V
TSL26721, TSL26725
0.3 VDD
TSL26723, TSL26727
0.54
SCL, SDA input low voltage
V
Figure 8:
Proximity Characteristics; VDD = 3 V, TA = 25°C, PGAIN = 1´, PEN = 1 (unless otherwise noted)
Parameter
Test Conditions
IDD
Supply current
LDR pulse ON
ADC conversion time
step size
PTIME = 0xFF
Min
PTIME = 0xFF
ADC count value
λp = 850 nm, Ee = 263.4μW/cm2,
PTIME = 0xFB, PPULSE = 4
ADC output
responsivity
ams Datasheet
[v1-00] 2016-Mar-23
λp = 850 nm, PTIME = 0xFB,
PPULSE = 1
Max
3
2.58
ADC number of
integration steps (1)
ADC counts per
step (1)
Typ
2.73
Unit
mA
2.9
ms
1
256
steps
0
1023
counts
CH0 diode
1500
2000
2500
CH1 diode
900
1200
1500
counts
CH0 diode
1.90
CH1 diode
1.14
counts/
μW/
cm2
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TSL2672 − Absolute Maximum Ratings
Parameter
Gain scaling, relative
to 1x gain setting
Noise (1) (2) (3)
Test Conditions
Min
Typ
PGAIN = 2x
2
PGAIN = 4x
4
PGAIN = 8x
8
Ee = 0, PTIME = 0xFB, PPULSE = 4 (6)
CH0 diode
0.5
CH1 diode
0.5
Max
Unit
x
%FS
LED pulse count (1)
0
255
pulses
LED pulse period
16.0
μs
LED pulse width —
LED ON time
7.3
μs
120 mA: PDRIVE = 0 & PDL = 0
LED drive current
ISINK sink current
@ 1.6 V, LDR pin
87
116
60 mA: PDRIVE = 1 & PDL = 0
58
30 mA: PDRIVE = 2 & PDL = 0
29
15 mA: PDRIVE = 3 & PDL = 0
14.5
15 mA: PDRIVE = 0 & PDL =1
12.9
7.5 mA: PDRIVE =1 & PDL =1
6.4
3.8 mA: PDRIVE =2 & PDL =1
3.2
1.9 mA: PDRIVE =3 & PDL =1
1.6
145
mA
PDRIVE = 0 and PDL = 0 (116 mA), PPULSE = 64
Maximum operating
distance (1)(4)(5)
Emitter: λp = 850 nm, 20º half angle, and 60 mW/sr
Object: 16 × 20-inch, 90% reflective Kodak Gray
Card (white surface)
Optics: Open view (no glass, no optical
attenuation)
18
inches
Note(s):
1. Parameter is ensured by design or characterization and is not tested.
2. Proximity noise is defined as one standard deviation of 600 samples.
3. Proximity noise typically increases as √PPULSE
4. Greater operating distances are achievable with appropriate optical system design considerations. See available ams application
notes for additional information.
5. Maximum operating distance is dependent upon emitter and the reflective properties of the object’s surface.
6. Proximity noise test was done using the following circuit:
VDD
22 W
VDD
TSL2672
3
GND
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15.0 W
1
1 mF
4
LDR
ams Datasheet
[v1-00] 2016-Mar-23
TSL2672 − Absolute Maximum Ratings
Figure 9:
Wait Characteristics; V DD = 3 V, TA = 25°C, WEN = 1 (unless otherwise noted)
Test
Conditions
Parameter
Wait step size
Channel
WTIME = 0xFF
Wait number of integration steps (1)
Min
Typ
Max
Unit
2.58
2.73
2.9
ms
256
steps
Max
Unit
400
kHz
1
Note(s):
1. Parameter ensured by design and is not tested.
Figure 10:
AC Electrical Characteristics; VDD = 3 V, TA = 25°C, (unless otherwise noted)
Test
Conditions
Symbol
Parameter (1)
f(SCL)
Clock frequency (I²C only)
0
t(BUF)
Bus free time between start and stop
condition
1.3
μs
t(HDSTA)
Hold time after (repeated) start
condition. After this period, the first
clock is generated.
0.6
μs
t(SUSTA)
Repeated start condition setup time
0.6
μs
t(SUSTO)
Stop condition setup time
0.6
μs
t(HDDAT)
Data hold time
0
μs
t(SUDAT)
Data setup time
100
ns
t(LOW)
SCL clock low period
1.3
μs
t(HIGH)
SCL clock high period
0.6
μs
tF
Clock/data fall time
300
ns
tR
Clock/data rise time
300
ns
Ci
Input pin capacitance
10
pF
Min
Typ
Note(s):
1. Specified by design and characterization; not production tested.
ams Datasheet
[v1-00] 2016-Mar-23
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TSL2672 − Absolute Maximum Ratings
Parameter Measurement Information
Figure 11:
Timing Diagrams
t(LOW)
t(R)
t(F)
VIH
SCL
VIL
t(HDSTA)
t(BUF)
t(HDDAT)
t(HIGH)
t(SUSTA)
t(SUSTO)
t(SUDAT)
VIH
SDA
VIL
P
Stop
Condition
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S
S
P
Start
Condition
ams Datasheet
[v1-00] 2016-Mar-23
TSL2672 − Typical Characteristics
Typical Characteristics
Figure 12:
Spectral Responsivity
1
Normalized Responsivity
0.8
0.6
Ch 0
0.4
Ch 1
0.2
0
300
400
500
600
700
800
900 1000 1100
λ − Wavelength − nm
Figure 13:
Normalized Responsivity vs. Angular Displacement
1.0
Both Axes
Optical Axis
Normalized Responsivity
0.8
0.6
0.4
0.2
0
−90
ams Datasheet
[v1-00] 2016-Mar-23
-Q
+Q
−60
−30
0
30
60
Q − Angular Displacement − °
90
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TSL2672 − Typical Characteristics
Figure 14:
Typical LDR Current vs. Voltage
160
PDL = 0
140
LDR Current — mA
120
120 mA
100
80
60
60 mA
40
30 mA
20
15 mA
0
0
0.5
1
1.5
2
2.5
3
2.5
3
LDR Voltage − V
Figure 15:
Typical LDR Current vs. Voltage
20
PDL = 1
18
16
LDR Current — mA
14
15 mA
12
10
8
7.5 mA
6
4
3.8 mA
2
1.9 mA
0
0
0.5
1
1.5
2
LDR Voltage − V
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ams Datasheet
[v1-00] 2016-Mar-23
TSL2672 − Typical Characteristics
Figure 16:
Response to White LED vs. Temperature
Response — Normalized to 25° C
115%
110%
105%
Ch 0
100%
95%
Ch 1
90%
0
10
20
30
40
50
Temperature − °C
60
70
Figure 17:
Response to IR (850 nm) LED vs. Temperature
115%
Response — Normalized to 25° C
Ch 0
110%
Ch 1
105%
100%
95%
90%
0
ams Datasheet
[v1-00] 2016-Mar-23
10
20
30
40
50
Temperature − °C
60
70
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TSL2672 − Typical Characteristics
Figure 18:
Normalized IDD vs.VDD and Temperature
VDD and TEMPERATURE
IDD — Active Current Normalized @ 3 V, 25C
110%
108%
106%
104%
0C
102%
100%
50C
25C
75C
98%
96%
94%
92%
2.7
2.8
2.9
3
3.1
3.2
3.3
VDD — V
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ams Datasheet
[v1-00] 2016-Mar-23
TSL2672 − Principles Of Operation
Principles Of Operation
System States
An internal state machine provides system control of the
proximity detection and power management features of the
device. At power up, an internal power-ON-reset initializes the
device and puts it in a low-power Sleep state.
When a start condition is detected on the I²C bus, the device
transitions to the Idle state where it checks the Enable register
(0x00) PON bit. If PON is disabled, the device will return to the
Sleep state to save power. Otherwise, the device will remain in
the Idle state until the proximity function is enabled. Once
enabled, the device will execute the Prox and Wait states in
sequence as indicated in Figure 19. Upon completion and
return to Idle, the device will automatically begin a new
prox-wait cycle as long as PON and PEN remain enabled.
If the Prox function generates an interrupt and the
Sleep-After-Interrupt (SAI) feature is enabled, the device will
transition to the Sleep state and remain in a low-power mode
until an I²C command is received. See the Interrupts section for
additional information.
Figure 19:
Simplified State Diagram
Sleep
I2C
Start
!PON
Idle
INT & SAI
PEN
Prox
ams Datasheet
[v1-00] 2016-Mar-23
Wait
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Proximity Detection
Proximity detection is accomplished by measuring the amount
of light energy, generally from an IR LED, reflected off an object
to determine its distance. The proximity light source, which is
external to the TSL2672 device, is driven by the integrated
proximity LED current driver as shown in Figure 20.
Figure 20:
Proximity Detection
PDL(r0x0D,b0)
PPULSE(r0x0E)
PDRIVE(r0x0F, b7:6)
VDD
External IR
LED
LDR
PGAIN(r0x0F, b3:2)
POFFSET(r0x1E)
PTIME(r0x02)
Prox LED
Current Driver
PVALID(r0x13, b1)
PSAT(r0x13, b6)
Prox Control
PDIODE(r0x0F, b5:4)
Object
Prox
Integration
Prox
ADC
Prox
Data
PDATAH(r0x019)
PDATAL(r0x018)
CH1
CH0
Background Energy
The LED current driver, output on the LDR terminal, provides a
regulated current sink that eliminates the need for an external
current limiting resistor. The combination of proximity LED
drive strength (PDRIVE) and proximity drive level (PDL)
determine the drive current. PDRIVE sets the drive current to
120 mA, 60 mA, 30 mA, or 15 mA when PDL is not asserted.
However, when PDL is asserted, the drive current is reduced by
a factor of about 8 at VLDR = 1.6 V. To drive an external light
source with more than 120 mA or to minimize ON-chip ground
bounce, LDR can be used to drive an external p-type transistor,
which in turn drives the light source.
Referring to the Detailed State Machine figure, the LED current
driver pulses the external IR LED as shown in Figure 21 during
the Prox Accum state. Figure 21 also illustrates that the LED ON
pulse has a fixed width of 7.3 μs and period of 16.0 μs. So, in
addition to setting the proximity drive current, 1 to 255
proximity pulses (PPULSE) can be programmed. When deciding
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ams Datasheet
[v1-00] 2016-Mar-23
TSL2672 − Principles Of Operation
on the number of proximity pulses, keep in mind that the signal
increases proportionally to PPULSE, while noise increases by
the square root of PPULSE.
Figure 21:
Proximity LED Current Driver Waveform
Reflected IR LED +
Background Energy
LED On
Background
Energy
LED Off
7.3 ms
16.0 ms
IR LED Pulses
Figure 20 illustrates light rays emitting from an external IR LED,
reflecting off an object, and being absorbed by the CH0 and
CH1 photodiodes. The proximity diode selector (PDIODE)
determines which of the two photodiodes is used for a given
proximity measurement. Note that neither photodiode is
selected when the device first powers up, so PDIODE must be
set for proximity detection to work.
Referring again to Figure 21, the reflected IR LED and the
background energy is integrated during the LED ON time, then
during the LED OFF time, the integrated background energy is
subtracted from the LED ON time energy, leaving the external
IR LED energy to accumulate from pulse to pulse. The proximity
gain (PGAIN) determines the integration rate, which can be
programmed to 1×, 2×, 4×, or 8× gain. At power up, PGAIN
defaults to 1× gain, which is recommended for most
applications. For reference, PGAIN equal to 8× is comparable to
the TSL2771 1× gain setting. During LED On time integration,
the proximity saturation bit in the Status register (0x13) will be
set if the integrator saturates. This condition can occur if the
proximity gain is set too high for the lighting conditions, such
as in the presence of bright sunlight. Once asserted, PSAT will
remain set until a special function proximity interrupt clear
command is received from the host (see Command Register).
After the programmed number of proximity pulses have been
generated, the proximity ADC converts and scales the proximity
measurement to a 16-bit value, then stores the result in two
ams Datasheet
[v1-00] 2016-Mar-23
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TSL2672 − Principles Of Operation
8-bit proximity data (PDATAx) registers. ADC scaling is
controlled by the proximity ADC conversion time (PTIME) which
is programmable from 1 to 256 2.73-ms time units. However,
depending on the application, scaling the proximity data will
equally scale any accumulated noise. Therefore, in general, it is
recommended to leave PTIME at the default value of one
2.73-ms ADC conversion time (0xFF).
In many practical proximity applications, a number of optical
system and environmental conditions can produce an offset in
the proximity measurement result. To counter these effects, a
proximity offset (POFFSET) is provided which allows the
proximity data to be shifted positive or negative. Additional
information on the use of the proximity offset feature is
provided in available ams application notes.
Once the first proximity cycle has completed, the proximity
valid (PVALID) bit in the Status register will be set and remain
set until the proximity detection function is disabled (PEN).
For additional information on using the proximity detection
function behind glass and for optical system design guidance,
please see available ams application notes.
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ams Datasheet
[v1-00] 2016-Mar-23
TSL2672 − Principles Of Operation
Interrupts
The interrupt feature simplifies and improves system efficiency
by eliminating the need to poll the sensor for proximity values
outside a user-defined range. While the interrupt function is
always enabled and its status is available in the Status register
(0x13), the output of the interrupt state can be enabled using
the proximity interrupt enable (PIEN) field in the Enable register
(0x00).
Two 16-bit interrupt threshold registers allow the user to set
limits below and above a desired proximity range. An interrupt
can be generated when the proximity data (PDATA) is less than
the proximity interrupt low threshold (PILTx) or is greater than
the proximity interrupt high threshold (PIHTx).
It is important to note that the thresholds are evaluated in
sequence, first the low threshold, then the high threshold. As a
result, if the low threshold is set above the high threshold, the
high threshold is ignored and only the low threshold is
evaluated.
To further control when an interrupt occurs, the device provides
an interrupt persistence feature. The persistence filter allows
the user to specify the number of consecutive out-of-range
proximity occurrences before an interrupt is generated. The
persistence filter register (0x0C) allows the user to set the
proximity persistence filter (PPERS) values. See the persistence
filter register for details on the persistence filter values. Once
the persistence filter generates an interrupt, it will continue
until a special function interrupt clear command is received (see
Command Register).
Figure 22:
Programmable Interrupt
PIHTH(r 0x0B), PIHTL(r 0x0A)
Upper Limit
Prox
Integration
Prox
ADC
Prox Persistence
Prox
Data
Lower Limit
Channel 0
Channel 1
ams Datasheet
[v1-00] 2016-Mar-23
PPERS(r 0x0C, b7:4)
PILTH(r 0x09), PILTL(r 0x08)
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TSL2672 − Principles Of Operation
System Timing
The system state machine shown in Figure 19 provides an
overview of the states and state transitions that provide system
control of the device. This section highlights the programmable
features, which affect the state machine cycle time, and
provides details to determine system level timing.
When the proximity detection feature is enabled (PEN), the
state machine transitions through the Prox Init, Prox Accum,
Prox Wait, and Prox ADC states. The Prox Init and Prox Wait times
are a fixed 2.73 ms, whereas the Prox Accum time is determined
by the number of proximity LED pulses (PPULSE) and the Prox
ADC time is determined by the integration time (PTIME). The
formulas to determine the Prox Accum and Prox ADC times are
given in the associated boxes in Figure 22. If an interrupt is
generated as a result of the proximity cycle, it will be asserted
at the end of the Prox ADC state and transition to the Sleep state
if SAI is enabled.
When the power management feature is enabled (WEN), the
state machine will transition in turn to the Wait state. The wait
time is determined by WLONG, which extends normal operation
by 12× when asserted, and WTIME. The formula to determine
the wait time is given in the box associated with the Wait state
in Figure 23.
Figure 23:
Detailed State Diagram
Prox
Time: 2.73 ms
Sleep
Prox
Init
!PON
PEN
PPULSE: 0 ~ 255 pulses
Time: 16.0 μs/pulse
Range: 0 ~ 4.1 ms
I2C Start
Prox
Accum
Idle
INT & SAI
Time: 2.73 ms
PTIME: 1 ~ 256 steps
Time: 2.73 ms/step
Range: 2.73 ms ~ 699 ms
Prox
Wait
Prox
ADC
!WEN
WEN
Wait
WTIME: 1 ~ 256 steps
WLONG = 0
Time:
2.73 ms/step
Range: 2.73 ms ~ 699 ms
WLONG = 1
Time:
Range:
32.8 ms/step
32.8 ms ~ 8.39s
Note: PON, PEN, WEN, and SAI are fields in the Enable register (0x00).
Note(s):
1. PON, WEN, AEN, and SAI are fields in the Enable register (0x00).
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ams Datasheet
[v1-00] 2016-Mar-23
TSL2672 − Principles Of Operation
Power Management
Power consumption can be managed with the Wait state,
because the Wait state typically consumes only 90μA of I DD
current. An example of the power management feature is given
below. With the assumptions provided in the example, average
I DD is estimated to be 167 μA.
Figure 24:
Power Management
System State
Machine State
Programmable
Parameter
Programmed
Value
Prox Init
Prox Accum
PPULSE
0x04
Duration
Typical
Current
2.73 ms
0.200 mA
0.064 ms
Prox Accum − LED ON
0.029 ms (1)
119 mA
Prox Accum − LED OFF
0.035 ms(2)
0.200 mA
2.73 ms
0.200 mA
2.73 ms
0.200 mA
49.2 ms
0.090 mA
Prox Wait
Prox ADC
PTIME
0xFF
WTIME
0xEE
WLONG
0
Wait
Note(s):
1. Prox Accum - LED ON time = 7.3μs per pulse × 4 pulses = 29.3μs = 0.029 ms
2. Prox Accum - LED OFF time = 8.7 μs per pulse × 4 pulses = 34.7μs = 0.035 ms
Average I DD Current = ((0.029 × 119) + (0.035 × 0.200) + (2.73 ×
0.200) + (49.2 × 0.090) + (2.73 × 0.200 × 2)) / 57 ≈ 167 μA
Keeping with the same programmed values as the example,
Figure 25 shows how the average IDD current is affected by the
Wait state time, which is determined by WEN, WTIME, and
WLONG. Note that the worst-case current occurs when the Wait
state is not enabled.
ams Datasheet
[v1-00] 2016-Mar-23
Page 21
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TSL2672 − Principles Of Operation
Figure 25:
Average IDD Current
WEN
WTIME
WLONG
WAIT State
Average IDD Current
0
n/a
n/a
0 ms
622 μA
1
0xFF
0
2.73 ms
490 μA
1
0xEE
0
49.2 ms
167 μA
1
0x00
0
699 ms
97 μA
1
0x00
1
8389 ms
91μA
I²C Protocol
Interface and control are accomplished through an I²C serial
compatible interface (standard or fast mode) to a set of registers
that provide access to device control functions and output data.
The devices support the 7-bit I²C addressing protocol.
The I²C standard provides for three types of bus transaction:
read, write, and a combined protocol (Figure 26). During a write
operation, the first byte written is a command byte followed by
data. In a combined protocol, the first byte written is the
command byte followed by reading a series of bytes. If a read
command is issued, the register address from the previous
command will be used for data access. Likewise, if the MSB of
the command is not set, the device will write a series of bytes
at the address stored in the last valid command with a register
address. The command byte contains either control information
or a 5-bit register address. The control commands can also be
used to clear interrupts.
The I²C bus protocol was developed by Philips (now NXP). For
a complete description of the I²C protocol, please review the
NXP I²C design specification at
http://www.i2c-bus.org/references/.
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ams Datasheet
[v1-00] 2016-Mar-23
TSL2672 − Principles Of Operation
Figure 26:
I²C Protocols
1
S
7
1
Slave Address
W
1
A
8
1
Command Code
8
A
1
Data Byte
A
8
1
1
...
P
I2C Write Protocol
1
S
7
1
Slave Address
R
1
8
A
Data
1
A
Data
1
...
A
P
I2C Read Protocol
1
7
1
1
S
Slave Address
W
A
8
1
1
7
1
1
Command Code
A
Sr
Slave Address
R
A
8
Data
1
8
1
A
Data
A
1
...
P
I2C Read Protocol — Combined Format
A
N
P
R
S
Sr
W
...
ams Datasheet
[v1-00] 2016-Mar-23
Acknowledge (0)
Not Acknowledged (1)
Stop Condition
Read (1)
Start Condition
Repeated Start Condition
Write (0)
Continuation of protocol
Master-to-Slave
Slave-to-Master
Page 23
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TSL2672 − Principles Of Operation
Register Set
The device is controlled and monitored by data registers and a
command register accessed through the serial interface. These
registers provide for a variety of control functions and can be
read to determine results of the ADC conversions. The register
set is summarized in Figure 27.
Figure 27:
Register Address
Address
Register Name
R/W
−−
COMMAND
W
0x00
ENABLE
0x02
Register Function
Reset Value
Specifies register address
0x00
R/W
Enables states and interrupts
0x00
PTIME
R/W
Proximity ADC time
0xFF
0x03
WTIME
R/W
Wait time
0xFF
0x08
PILTL
R/W
Proximity interrupt low threshold low
byte
0x00
0x09
PILTH
R/W
Proximity interrupt low threshold high
byte
0x00
0x0A
PIHTL
R/W
Proximity interrupt high threshold low
byte
0x00
0x0B
PIHTH
R/W
Proximity interrupt high threshold
high byte
0x00
0x0C
PERS
R/W
Interrupt persistence filters
0x00
0x0D
CONFIG
R/W
Configuration
0x00
0x0E
PPULSE
R/W
Proximity pulse count
0x00
0x0F
CONTROL
R/W
Control register
0x00
0x12
ID
R
Device ID
0x13
STATUS
R
Device status
0x00
0x18
PDATAL
R
Proximity data low byte
0x00
0x19
PDATAH
R
Proximity data high byte
0x00
0x1E
POFFSET
R/W
Proximity Offset register
0x00
ID
The mechanics of accessing a specific register depends on the
specific protocol used. See the section on I²C Protocol on the
previous pages. In general, the COMMAND register is written
first to specify the specific control-status-data register for
subsequent read/write operations.
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ams Datasheet
[v1-00] 2016-Mar-23
TSL2672 − Principles Of Operation
Command Register
The command register specifies the address of the target
register for future read and write operations, as well as issues
special function commands.
Figure 28:
Command Register
7
6
CMD
5
4
3
2
TYPE
Field
Bits
CMD
7
TYPE
6:5
1
0
ADDR/SF
Description
Select Command Register. Must write as 1 when addressing COMMAND register.
Selects type of transaction to follow in subsequent data transfers:
FIELD VALUE
DESCRIPTION
00
Repeated byte protocol transaction
01
Auto-increment protocol transaction
10
Reserved — Do not use
11
Special function — See description below
Transaction type 00 will repeatedly read the same register with each data access.
Transaction type 01 will provide an auto-increment function to read successive register
bytes.
ADDR/SF
4:0
Address field/special function field. Depending on the transaction type, see above, this
field either specifies a special function command or selects the specific
control-status-data register for subsequent read and write transactions. The field values
listed below apply only to special function commands:
FIELD VALUE
DESCRIPTION
00100
Interrupt set — forces an interrupt
00101
Proximity interrupt clear
other
Reserved — Do not write
The interrupt set special function command sets the interrupt bits in the status register
(0x13). For the interrupt to be visible on the INT pin, the proximity interrupt enable bit
(PIEN) in the enable register (0x00) must be asserted.
The interrupt set special function must be cleared with an interrupt clear special function.
The proximity interrupt clear special function clears any pending interrupt and is self
clearing.
ams Datasheet
[v1-00] 2016-Mar-23
Page 25
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TSL2672 − Principles Of Operation
Enable Register (0x00)
The ENABLE register is used to power the device ON/OFF, enable
functions, and interrupts.
Figure 29:
Enable Register
7
6
5
4
3
2
1
0
Reserved
SAI
PIEN
Reserved
WEN
PEN
Reserved
PON
Field
Bits
Description
Reserved
7
Reserved. Write as 0.
SAI
6
Sleep after interrupt. When asserted, the device will power down at the end of a
proximity cycle if an interrupt has been generated
PIEN
5
Proximity interrupt enable. When enabled, the proximity interrupt drives the INT pin.
When disabled, the interrupt is masked from the INT pin, but remains visible in the
Status register (0x13).
Reserved
4
Reserved. Write as 0.
WEN
3
Wait enable. This bit activates the wait feature. Writing a 1 activates the wait timer.
Writing a 0 disables the wait timer.
PEN
2
Proximity enable. This bit activates the proximity function. Writing a 1 enables
proximity. Writing a 0 disables proximity.
Reserved
1
Reserved. Write as 0.
PON
0
Power ON. This bit activates the internal oscillator to permit the timers and ADC
channel to operate. Writing a 1 activates the oscillator. Writing a 0 disables the
oscillator.
Proximity Time Register (0x02)
The proximity timing register controls the integration time of
the proximity ADC in 2.73 ms increments. Upon power up, the
proximity time register is set to 0xFF. It is recommended that
this register be programmed to a value of 0xFF (1 integration
cycle).
Figure 30:
Proximity Integration Time Control Register
Field
Bits
PTIME
7:0
Page 26
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Description
VALUE
INTEG_CYCLES
TIME
MAX COUNT
0xFF
1
2.73 ms
1023
ams Datasheet
[v1-00] 2016-Mar-23
TSL2672 − Principles Of Operation
Wait Time Register (0x03)
Wait time is set 2.73 ms increments unless the WLONG bit is
asserted in which case the wait times are 12x longer. WTIME is
programmed as a 2’s complement number. Upon power up, the
wait time register is set to 0xFF.
Figure 31:
Wait Time Register
Field
Bits
WTIME
7:0
Description
REGISTER
VALUE
WAIT TIME
TIME (WLONG = 0)
TIME (WLONG = 1)
0xFF
1
2.73 ms
0.033 s
0xB6
74
202 ms
2.4 s
0x00
256
699 ms
8.4 s
Note(s):
1. The Proximity Wait Time Register should be configured before PEN is asserted.
Proximity Interrupt Threshold Registers (0x08 - 0x0B)
The proximity interrupt threshold registers provide the upper
and lower threshold values to the proximity interrupt
comparators. See Interrupts in the Principles Of Operation
section for detailed information. Upon power up, the interrupt
threshold registers reset to 0x00.
Figure 32:
Proximity Interrupt Threshold Registers
Register
Address
Bits
Description
PILTL
0x08
7:0
Proximity low threshold low byte
PILTH
0x09
7:0
Proximity low threshold high byte
PIHTL
0x0A
7:0
Proximity high threshold low byte
PIHTH
0x0B
7:0
Proximity high threshold high byte
ams Datasheet
[v1-00] 2016-Mar-23
Page 27
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TSL2672 − Principles Of Operation
Interrupt Persistence Filter Register (0x0C)
The interrupt persistence filter sets the number of consecutive
proximity cycles that are out-of-range before an interrupt is
generated. Out-of-range is determined by the proximity
interrupt threshold registers (0x08 through 0x0B). See
Interrupts in the Principles Of Operation section for further
information. Upon power up, the interrupt persistence filter
register resets to 0x00, which will generate an interrupt at the
end of each proximity cycle.
Figure 33:
Interrupt Persistence Filter Register
7
6
5
4
3
PPERS
2
1
0
Reserved
Field
Bits
Description
PPERS
7:4
Proximity persistence. Controls rate of proximity interrupt to the host processor
FIELD VALUE
0000
Every proximity cycle generates an interrupt
0001
1 proximity value out of range
0010
2 consecutive proximity values out of range
...
1111
Reserved
Page 28
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3:0
INTERRUPT PERSISTENCE FUNCTION
...
15 consecutive proximity values out of range
Reserved. Write as 0.
ams Datasheet
[v1-00] 2016-Mar-23
TSL2672 − Principles Of Operation
Configuration Register (0x0D)
The configuration register sets the proximity LED drive level and
wait long time.
Figure 34:
Configuration Register
7
6
5
4
3
2
Reserved
1
0
WLONG
PDL
Field
Bits
Description
Reserved
7:2
WLONG
1
Wait Long. When asserted, the wait cycles are increased by a factor 12x from that
programmed in the WTIME register.
PDL
0
Proximity drive level. When asserted, the proximity LDR drive current is reduced by 9.
Reserved. Write as 0.
Proximity Pulse Count Register (0x0E)
The proximity pulse count register sets the number of proximity
pulses that the LDR pin will generate during the Prox Accum
state.
Figure 35:
Proximity Pulse Count Register
7
6
5
4
3
2
1
0
PPULSE
Field
Bits
PPULSE
7:0
ams Datasheet
[v1-00] 2016-Mar-23
Description
Proximity Pulse Count. Specifies the number of proximity pulses to be generated.
Page 29
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TSL2672 − Principles Of Operation
Control Register (0x0F)
The Control register provides eight bits of miscellaneous
control to the analog block. These bits typically control
functions such as gain settings and/or diode selection.
Figure 36:
Control Register
7
6
5
PDRIVE
Field
Bits
PDRIVE(1)
7:6
PDIODE
PGAIN
Reserved
5:4
3:2
1:0
4
3
2
PDIODE
1
PGAIN
0
Reserved
Description
Proximity LED Drive Strength.
FIELD VALUE
LED STRENGTH — PDL = 0
LED STRENGTH — PDL = 1
00
120 mA
15 mA
01
60 mA
7.5 mA
10
30 mA
3.8 mA
11
15 mA
1.9 mA
Proximity Diode Selector.
FIELD VALUE
DIODE SELECTION
00
Proximity uses neither diode
01
Proximity uses the CH0 diode
10
Proximity uses the CH1 diode
11
Reserved — Do not write
Proximity Gain.
FIELD VALUE
PROXIMITY GAIN VALUE
00
1× gain
01
2× gain
10
4× gain
11
8× gain
Reserved. Write as 0.
Note(s):
1. LED STRENGTH currents are nominal values. Specifications can be found in the Proximity Characteristics table.
Page 30
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ams Datasheet
[v1-00] 2016-Mar-23
TSL2672 − Principles Of Operation
ID Register (0x12)
The ID Register provides the value for the part number. The ID
register is a read-only register.
Figure 37:
ID Register
7
6
5
4
3
2
1
0
ID
Field
Bits
ID
7:0
Description
0x32 = TSL26721 & TSL26725
Part number identification
0x3B = TSL26723 & TSL26727
Status Register (0x13)
The Status Register provides the internal status of the device.
This register is read only.
Figure 38:
Status Register
7
6
5
Reserved
PSAT
PINT
4
3
2
Reserved
1
0
PVALID
Reserved
Field
Bit
Reserved
7
Reserved. Read as 0.
PSAT
6
Proximity Saturation. Indicates that the proximity measurement
saturated.
PINT
5
Proximity Interrupt. Indicates that the device is asserting a proximity
interrupt.
Reserved
4:2
PVALID
1
Proximity Valid. Indicates that the proximity channel has completed
an integration cycle after PEN has been asserted.
Reserved
0
Reserved. Read as 0.
ams Datasheet
[v1-00] 2016-Mar-23
Description
Reserved. Read as 0.
Page 31
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TSL2672 − Principles Of Operation
Proximity Data Registers (0x18 - 0x19)
Proximity data is stored as a 16-bit value. When the lower byte
is read, the upper byte is latched into a shadow register. The
shadow register ensures that both bytes are the result of the
same proximity cycle, even if additional proximity cycles occur
between the lower byte and upper byte register readings. The
simplest way to read both bytes is to perform a two-byte I²C
read operation using the auto-increment protocol, which is set
in the Command register TYPE field.
Figure 39:
Proximity Data Registers
Register
Address
Bits
Description
PDATAL
0x18
7:0
Proximity data low byte
PDATAH
0x19
7:0
Proximity data high byte
Proximity Offset Register (0x1E)
The 8-bit proximity offset register provides compensation for
proximity offsets caused by device variations, optical crosstalk,
and other environmental factors. Proximity offset is a
sign-magnitude value where the sign bit, bit 7, determines if
the offset is negative (bit 7 = 0) or positive (bit 7 = 1). At power
up, the register is set to 0x00. The magnitude of the offset
compensation depends on the proximity gain (PGAIN),
proximity LED drive strength (PDRIVE), and the number of
proximity pulses (PPULSE). Because a number of environmental
factors contribute to proximity offset, this register is best suited
for use in an adaptive closed-loop control system. See available
ams application notes for proximity offset register application
information.
Figure 40:
Proximity Offset Register
7
6
SIGN
5
4
3
2
1
0
MAGNITUDE
Field
Bit
Description
SIGN
7
Proximity Offset Sign. The offset sign shifts the proximity data negative when equal to
0 and positive when equal to 1.
MAGNITUDE
6:0
Page 32
Document Feedback
Proximity Offset Magnitude. The offset magnitude shifts the proximity data positive
or negative, depending on the proximity offset sign. The actual amount of the shift
depends on the proximity gain (PGAIN), proximity LED drive strength (PDRIVE), and
the number of proximity pulses (PPULSE).
ams Datasheet
[v1-00] 2016-Mar-23
TSL2672 − Application Information Hardware
Application Information
Hardware
LED Driver Pin with Proximity Detection
In a proximity sensing system, the IR LED can be pulsed by the
TSL2672 with more than 100 mA of rapidly switching current,
therefore, a few design considerations must be kept in mind to
get the best performance. The key goal is to reduce the power
supply noise coupled back into the device during the LED
pulses.
The first recommendation is to use two power supplies; one for
the device V DD and the other for the IR LED. In many systems,
there is a quiet analog supply and a noisy digital supply. By
connecting the quiet supply to the V DD pin and the noisy supply
to the LED, the key goal can be meet. Place a 1-μF low-ESR
decoupling capacitor as close as possible to the V DD pin and
another at the LED anode, and a 22-μF capacitor at the output
of the LED voltage regulator to supply the 100-mA current
surge.
Figure 41:
Proximity Sensing Using Separate Power Supplies
VBUS
Voltage
Regulator
VDD
1 mF
C*
RP
GND
TSL2672
RP
RPI
INT
SCL
Voltage
Regulator
LDR
22 mF
1 mF
SDA
IR LED
* Cap Value Per Regulator Manufacturer Recommendation
If it is not possible to provide two separate power supplies, the
device can be operated from a single supply. A 22-Ω resistor in
series with the V DD supply line and a 1-μF low ESR capacitor
effectively filter any power supply noise. The previous capacitor
placement considerations apply.
ams Datasheet
[v1-00] 2016-Mar-23
Page 33
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TSL2672 − Application Information Hardware
Figure 42:
Proximity Sensing Using Single Power Supply
VBUS
22 W
Voltage
Regulator
VDD
22 mF
1 mF
RP
GND
TSL2672
RP
RPI
INT
SCL
LDR
1 mF
SDA
IR LED
V BUS in the above figures refers to the I²C bus voltage which is
either V DD or 1.8 V. Be sure to apply the specified I²C bus voltage
shown in the Ordering & Contact Information for the specific
device being used.
The I²C signals and the Interrupt are open-drain outputs and
require pullup resistors. The pull-up resistor (R P) value is a
function of the I²C bus speed, the I²C bus voltage, and the
capacitive load. The ams EVM running at 400 kbps, uses 1.5-kΩ
resistors. A 10-kΩ pull-up resistor (RPI) can be used for the
interrupt line.
Page 34
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ams Datasheet
[v1-00] 2016-Mar-23
TSL2672 − Application Information Hardware
PCB Pad Layouts
Suggested land pattern based on the IPC-7351B Generic
Requirements for Surface Mount Design and Land Pattern
Standard (2010) for the small outline no-lead (SON) package is
shown in Figure 43.
Figure 43:
Suggested FN Package PCB Layout
2.70
1.20
1.20
0.35 6
0.65
0.65
TOP VIEW
Note(s):
1. All linear dimensions are in millimeters.
2. This drawing is subject to change without notice.
ams Datasheet
[v1-00] 2016-Mar-23
Page 35
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TSL2672 − Package Information
Package Information
Figure 44:
Package FN — Dual Flat No-Lead Packaging Configuration
PACKAGE FN
Dual Flat No-Lead
TOP VIEW
398 10
PIN OUT
TOP VIEW
PIN 1
355
10
2000 100
2000
100
VDD 1
6 SDA
SCL 2
5 INT
GND 3
4 LDR
Photodiode Array Area
END VIEW
SIDE VIEW
295
Nominal
650 50
203 8
650
BSC
BOTTOM VIEW
CL
of Photodiode Array Area
(Note B)
2
300
50
CL of Solder Contacts
1 Nominal
144 Nominal
CL of Solder Contacts
CL of Photodiode Array Area (Note 2B)
PIN 1
750 150
RoHS
Pb
Green
Lead Free
Note(s):
1. All linear dimensions are in micrometers.
2. The die is centered within the package within a tolerance of ±75 μm.
3. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
4. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
5. This package contains no lead (Pb).
6. This drawing is subject to change without notice.
Page 36
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ams Datasheet
[v1-00] 2016-Mar-23
TSL2672 − Carrier Tape & Reel Information
Carrier Tape & Reel Information
Figure 45:
Package FN Carrier Tape
TOP VIEW
2.00 0.05
1.75
4.00
8.00
1.50
4.00
B
+ 0.30
− 0.10
3.50 0.05
1.00
0.25
A
B
A
DETAIL B
DETAIL A
5 Max
5 Max
2.18 0.05
0.254
0.02
Ao
0.83 0.05
Ko
2.18 0.05
Bo
Note(s):
1. All linear dimensions are in millimeters. Dimension tolerance is ±0.10 mm unless otherwise noted.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 178 millimeters in diameter and contains 3500 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481-B.
6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.
ams Datasheet
[v1-00] 2016-Mar-23
Page 37
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TSL2672 − Soldering Information
The FN package has been tested and has demonstrated an
ability to be reflow soldered to a PCB substrate.
Soldering Information
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure 46:
Soldier Reflow Profile
Parameter
Reference
Device
Average temperature gradient in preheating
2.5°C/s
tsoak
2 to 3 minutes
Time above 217°C (T1)
t1
Max 60 s
Time above 230°C (T2)
t2
Max 50 s
Time above Tpeak −10°C (T3)
t3
Max 10 s
Peak temperature in reflow
Tpeak
260°C
Soak time
Temperature gradient in cooling
Max −5°C/s
Figure 47:
Solder Reflow Profile Graph
Tpeak
Not to scale — for reference o
T3
T2
Temperature (C)
T1
Time (s)
t3
t2
tsoak
t1
Note(s):
1. Not to scale - for reference only.
Page 38
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ams Datasheet
[v1-00] 2016-Mar-23
TSL2672 − Storage Information
Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is dry-baked prior to
being packed for shipping. Devices are packed in a sealed
aluminized envelope called a moisture barrier bag with silica
gel to protect them from ambient moisture during shipping,
handling, and storage before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture
barrier bag is 12 months from the date code on the bag when
stored under the following conditions:
• Shelf Life: 12 months
• Ambient Temperature: < 40ºC
• Relative Humidity: < 90%
Rebaking of the devices will be required if the devices exceed
the 12 month shelf life or the Humidity Indicator Card shows
that the devices were exposed to conditions beyond the
allowable moisture region.
Floor Life
The FN package has been assigned a moisture sensitivity level
of MSL 3. As a result, the floor life of devices removed from the
moisture barrier bag is 168 hours from the time the bag was
opened, provided that the devices are stored under the
following conditions:
• Floor Life: 168 hours
• Ambient Temperature: < 30ºC
• Relative Humidity: < 60%
If the floor life or the temperature/humidity conditions have
been exceeded, the devices must be rebaked prior to solder
reflow or dry packing.
Rebaking Instructions
When the shelf life or floor life limits have been exceeded,
rebake at 50ºC for 12 hours.
ams Datasheet
[v1-00] 2016-Mar-23
Page 39
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TSL2672 − Ordering & Contact Information
Ordering & Contact Information
Figure 48:
Ordering Information
Ordering Code
Device
Address
Package - Leads
Interface Description
TSL26721FN
TSL26721
0x39
FN−6
I²C Vbus = VDD Interface
TSL26723FN
TSL26723
0x39
FN−6
I²C Vbus = 1.8 V Interface
TSL26725FN
TSL26725 (1)
0x29
FN−6
I²C Vbus = VDD Interface
TSL26727FN
TSL26727 (1)
0x29
FN−6
I²C Vbus = 1.8 V Interface
Note(s):
1. Contact ams for availability.
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
[email protected]
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbaderstrasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
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TSL2672 − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
ams Datasheet
[v1-00] 2016-Mar-23
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TSL2672 − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
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ams Datasheet
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TSL2672 − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
ams Datasheet
[v1-00] 2016-Mar-23
Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
Page 43
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TSL2672 − Revision Information
Revision Information
Changes from 133 (2012-May) to current revision 1-00 (2016-Mar-23)
Page
Content of TAOS datasheet was updated to the latest ams design
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision
2. Correction of typographical errors is not explicitly mentioned.
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ams Datasheet
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TSL2672 − Content Guide
Content Guide
ams Datasheet
[v1-00] 2016-Mar-23
1
1
2
2
3
General Description
Key Benefits & Features
Applications
End Products and Market Segments
Functional Block Diagram
4
5
Pin Assignments
Detailed Description
6
10
Absolute Maximum Ratings
Parameter Measurement Information
11
Typical Characteristics
15
15
16
19
20
21
22
24
25
26
26
27
27
28
29
29
30
31
31
32
32
Principles Of Operation
System States
Proximity Detection
Interrupts
System Timing
Power Management
I²C Protocol
Register Set
Command Register
Enable Register (0x00)
Proximity Time Register (0x02)
Wait Time Register (0x03)
Proximity Interrupt Threshold Registers (0x08 - 0x0B)
Interrupt Persistence Filter Register (0x0C)
Configuration Register (0x0D)
Proximity Pulse Count Register (0x0E)
Control Register (0x0F)
ID Register (0x12)
Status Register (0x13)
Proximity Data Registers (0x18 - 0x19)
Proximity Offset Register (0x1E)
33
33
35
Application Information Hardware
LED Driver Pin with Proximity Detection
PCB Pad Layouts
36
37
38
Package Information
Carrier Tape & Reel Information
Soldering Information
39
39
39
39
39
Storage Information
Moisture Sensitivity
Shelf Life
Floor Life
Rebaking Instructions
40
Ordering & Contact Information
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TSL2672 − Content Guide
41
42
43
44
Page 46
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RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
ams Datasheet
[v1-00] 2016-Mar-23