Hi-performance Regulator IC Series for PCs Main Power Supply IC for Note PC (Linear Regulator Integrated) No.10030ECT06 BD9524MUV ●Description BD9524MUV is a switching regulator controller with high output current which can achieve low output voltage (2.0V~5.5V) from a wide input voltage range (7V~25V). High efficiency for the switching regulator can be realized by utilizing an external 3 TM N-MOSFET power transistor. A new technology called H Reg is a Rohm proprietary control method to realize ultra high transient response against load change. SLLM (Simple Light Load Mode) technology is also integrated to improve efficiency in light load mode, providing high efficiency over a wide load range. For protection and ease of use, the soft start function, variable frequency function, short circuit protection function with timer latch, over voltage protection with timer latch, and Power good function are all built in. This switching regulator is specially designed for Main Power Supply. ●Features 3 TM 1) 2ch H Reg Switching Regulator Controller 2) Adjustable Simple Light Load Mode (SLLM), Quiet Light Load Mode (QLLM) and Forced continuous Mode 3) Thermal Shut Down (TSD), Under Voltage Lock Out (UVLO), Over Current Protection (OCP), Over Voltage Protection (OVP), Short circuit protection with timer-latch (SCP) 4) Soft start function to minimize rush current during startup 5) Switching Frequency Variable (f=200KHz~500KHz) 6) Power good circuit 7) 2ch Linear regulator 8) VQFN032V5050 package ●Applications Laptop PC, Desktop PC, LCD-TV, Digital Components ●Maximum Absolute Ratings (Ta=25℃) Parameter Terminal voltage Power dissipation 1 Power dissipation 2 Power dissipation 3 Power dissipation 4 Operating temperature range Storage temperature range Junction Temperature Symbol VIN, CTL EXTVCC, PGOOD1, PGOOD2FB1, FB2, Is+1, Is+2, MCTL FS1, FS2, REF1, REF2, SS1, SS2, LG1, LG2 BOOT1, BOOT2 BOOT1-SW1, BOOT2-SW2, HG1-SW1, HG2-SW2 HG1 HG2 EN1, EN2 DGND, PGND1, PGND2 Pd1 Pd2 Pd3 Pd4 Topr Tstg Tjmax Limits 30 *1*2 7*1*2 REG1+0.3*1*2 35*1*2 7*1*2 BOOT1+0.3*1*2 BOOT2+0.3 *1*2 6 *1*2 AGND±0.3 *1*2 0.38 *3 0.88 *4 2.06 *5 4.56 *6 -10 ~ +100 -55 ~ +150 +150 Unit V V V V V V V V V W W W W ℃ ℃ ℃ *1 Do not however exceed Pd. *2 Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle. *3 Reduced by 3.0mW for each increase in Ta of 1℃ over 25℃ (when don’t mounted on a heat radiation board ) *4 Reduced by 7.0mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB which has 1 layer. (Copper foil area : 0mm2)) *5 Reduced by 16.5mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB which has 4 layers. (1st and 4th copper foil area : 20.2mm2, 2nd and 3rd copper foil area : 5505mm2)) *6 Reduced by 36.5mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB which has 4 layers. (All copper foil area : 5505mm2)) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/20 2010.03 - Rev.C Technical Note BD9524MUV ●Operating Conditions (Ta=25℃) Parameter Terminal voltage Symbol VIN EXTVCC CTL EN1, EN2 BOOT1, BOOT2 BOOT1-SW1, BOOT2-SW2, HG1-SW1, HG2-SW2 PGOOD1, PGOOD2 FS1, FS2 REF1, REF2 Is+1, Is+ 2, FB1, FB2 MCTL MIN. 7 4.5 -0.3 -0.3 4.5 -0.3 -0.3 0.09 1 1.9 -0.3 MAX. 25 5.5 25 5.5 30 5.5 5.5 1.25 2.75 5.6 REG1+0.3 Unit V V V V V V V V V V V *This product should not be used in a radioactive environment. ●Electrical characteristics (unless otherwise noted, Ta=25℃ VIN=12V, CTL=5V, EN1=EN2=5V, REF1=2.5V, REF2=1.65V, FS1=FS2=0.582V) Standard Value Unit Conditions Parameter Symbol MIN. TYP. MAX. VIN standby current ISTB 70 150 250 μA CTL=5V, EN1=EN2=0V VIN bias current IIN 0 45 130 μA EXTVCC=5V Shut down mode current ISHD -10 0 10 μA CTL=0V CTL Low voltage VCTLL -0.3 0.8 V CTL High voltage VCTLH 2.3 25 V CTL bias current ICTL 1 3 μA VCTL=5V EN Low voltage VENL -0.3 0.8 V EN High voltage VENH 2.3 5.5 V EN bias current IEN 1 3 μA VEN=3V [5V linear regulator] REG1 output voltage VREG1 4.90 5.00 5.10 V IREG1=1mA Maximum current IREG1 200 mA IREG2=0mA Line Regulation REG1I 90 180 mV VIN=7.5 to 25V Load Regulation REG1L 30 50 mV IREG1=0 to 30mA [3.3V linear regulator] REG2 output voltage VREG2 3.27 3.30 3.33 V IREG2=1mA Maximum current IREG2 100 mA Line regulation REG2I 20 mV VIN=7.5 to 25V Load regulation REG2L 30 mV IREG2=0 to 100mA [5V switch block] EXTVCC input threshold voltage VCC_UVLO 4.2 4.4 4.6 V EXTVCC: Sweep up EXTVCC input delay time TVCC 2 4 8 ms Switch Resistance RVCC 1.0 2.0 Ω [Under voltage lock out block for DC/DC] REG1 threshold voltage REG1_UVLO 4.0 4.2 4.4 V REG1: Sweep up REG2 threshold voltage REG2_UVLO 2.45 2.65 2.85 V REG2: Sweep up Hysteresis voltage dV_UVLO 50 100 200 mV REG1, REG2: Sweep down [Error amplifier block] REF1×2 REF1×2 Feedback voltage 1 VFB1 REF1×2 V -25m +25m FB1 bias current IFB1 20 45 90 μA FB1=5V Output discharge resistance 1 RDISOUT1 0.5 1 3 kΩ REF2×2 REF2×2 Feedback voltage 2 VFB2 REF2×2 V -25m +25m FB2 bias current IFB2 10 30 60 μA FB2=3.3V Output discharge resistance 2 RDISOUT2 0.5 1 3 kΩ REF1, REF2 bias current IREF1, IREF2 -10 10 μA www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/20 2010.03 - Rev.C Technical Note BD9524MUV ●Electrical characteristics - Continued (unless otherwise noted, Ta=25℃ VIN=12V, CTL=5V, EN1=EN2=5V, REF1=2.5V, REF2=1.65V, FS1=FS2=0.582V) Standard Value Unit Conditions Parameter Symbol MIN. TYP. MAX. [H3RegTM block] On Time 1 TON1 0.810 0.960 1.110 μs REF=2.5V On Time 2 TON2 0.520 0.670 0.820 μs REF=1.65V Maximum On Time TONMAX 3.5 7 14 μs Minimum Off Time TOFFMIN 0.2 0.4 μs FS1, FS2 bias current IFS -10 0 10 μA [FET driver block] HG higher side ON resistor HGHON 3.0 6.0 Ω HG lower side ON resistor HGLON 2.0 4.0 Ω LG higher side ON resistor LGHON 2.0 4.0 Ω LG lower side ON resistor LGLON 0.5 1.0 Ω [Over Voltage Protection block] REF×2 REF×2 REF×2 Latch Type OVP Threshold voltage VLOVP V ×1.15 ×1.175 ×1.20 Latch Type OVP delay time TLOVP 50 150 300 μs [Short circuit protection block] REF×2× REF×2 REF×2 SCP Threshold voltage VSCP V 0.66 ×0.7 ×0.74 Delay time TSCP 0.5 1 2 ms [Current limit protection block] Maximum offset voltage dVSMAX 50 65 80 mV Is+1 bias current IISP1 2.5 10 μA Is+2 bias current IISP2 2.5 10 μA [Power good block] REF×2 REF×2 REF×2 Power good low threshold VPGTHL V ×0.87 ×0.90 ×0.93 REF×2 REF×2 REF×2 Power good high threshold VPGTHH V ×1.07 ×1.10 ×1.13 Power good low voltage VPGL 0.1 0.2 V IPGOOD=1mA Power good leakage current ILEAKPG -2 0 2 μA VPGOOD=5V [Soft Start block] Charge current ISS 1.8 2.5 3.2 μA Standby voltage VSS_STB 50 mV [SLLM mode control block] MCTL terminal voltage 1 VCONT -0.3 0.3 V Continuous mode 2 QL M mode MCTL terminal voltage 2 VQLLM 1.5 3.0 V (Maximum LG off time : 50μs) 2 SL M mode MCTL terminal voltage 3 VSLLM 4.5 REG1+0.3 V (Maximum LG off time : ∞) MCTL float level VMCTL 1.5 3.0 V ●Output condition table CTL Low Low Low Low High High High High Input EN1 Low Low High High Low Low High High www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. EN2 Low High Low High Low High Low High REG1(5V) OFF OFF OFF OFF ON ON ON ON 3/20 Output REG2(3.3V) DC/DC1 OFF OFF OFF OFF OFF OFF OFF OFF ON OFF ON OFF ON ON ON ON DC/DC2 OFF OFF OFF OFF OFF ON OFF ON 2010.03 - Rev.C Technical Note BD9524MUV 31 1 32 22 24 23 PGND1 LG1 SW1 HG1 BOOT1 PGND2 REG1 VIN 2 3 LG2 SW2 HG2 BOOT2 REG1 VIN Vo2 Adjustable Vo1 Adjustable ●Block Diagram, Application circuit 26 25 REG1 REG1 AGND 13 DGND FS2 TSD FS1 EN1 EN2 FB1 FB2 REG2 REF1 17 8 16 FB1 FB1 REF1 Soft Start Block SS1 EN1 21 19 28 REG2 29 REG1 7~ 25V 5V 3.3V REG1 SL2M Mode Control MCTL2 MCTL1 REG2 SS1 27 VIN VIN SS2 12 PGOOD1 Is+1 3.3V Reg VIN EXTVCC 18 30 MCTL 6 CTL SS2 4 Soft Start Block REF2 FB2 FB2 EN2 Reference Block CL1 Power Good Block Power Good Block 5V Reg 9 REG2 20 Current Limit Protect UVLO Thermal Protection REG1 REG2 Is+2 Current Limit Protect PGOOD2 CL2 5 REG2 15 SS1 SS2 10 REF2 14 VIN SCP1 H3RegTM Controller Block Timer H3RegTM Controller Block FS1 SL2MTM Block MCTL1 7 Short Circuit Protect MCTL2 SL2MTM Block Over Voltage Protect Timer VIN SCP2 11 Short Circuit Protect FS2 CL1 SCP1 Overlap Protection Circuit Overlap Protection Circuit Over Voltage Protect CL2 SCP2 *Apply the supply voltage EXTVCC pin after REG1 pin is operated. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 4/20 2010.03 - Rev.C Technical Note BD9524MUV SW1 HG1 BOOT1 EN1 PGOOD1 SS1 CTL REF1 ●Pin Configuration 24 23 22 21 20 19 18 17 PGND1 25 16 Is+1 LG1 26 15 FB1 EXTVCC 27 14 FS1 REG2 28 13 AGND FIN REG1 29 ●Pin Function Table PIN No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Reverse 12 MCTL PIN name SW2 HG2 BOOT2 EN2 PGOOD2 SS2 DGND REF2 Is+2 FB2 FS2 MCTL AGND FS1 FB1 Is+1 REF1 CTL SS1 PGOOD1 EN1 BOOT1 HG1 SW1 PGND1 LG1 EXTVCC REG2 REG1 VIN LG2 PGND2 FIN www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 3 4 5 6 7 8 REF2 2 DGND 1 SS2 9 Is+2 PGOOD2 PGND2 32 EN2 10 FB2 BOOT2 LG2 31 HG2 11 FS2 SW2 VIN 30 PIN Function Highside FET source pin 2 Highside FET gate drive pin 2 HG Driver power supply pin 2 Vo2 ON/OFF pin (High=ON, Low=OFF) Vo2 Power Good Open Drain Output pin Vo2 soft start pin Ground Vo2 output voltage setting pin Current sense pin +2 Vo2 output voltage sense pin, current sense pin -2 Input pin for setting Vo2 frequency Mode shift pin (Low=continuous, Middle=QLLM, High=SLLM) Input pin Ground Input pin for setting Vo1 frequency Vo2 output voltage sense pin, current sense pin -1 Current sense pin +1 Vo1 output voltage setting pin Linear regulator ON/OFF pin (High=ON, Low=OFF) Vo1 soft start pin Vo1 Power Good Open Drain Output pin Vo1 ON/OFF pin (High=ON, Low=OFF) HG Driver power supply pin 1 Highside FET gate drive pin 1 Highside FET source pin 1 Lowside FET source pin 1 Lowside FET gate drive pin 1 Outside power supply input pin 3.3V linear regulator output pin 5V linear regulator output pin Power supply input pin Lowside FET gate drive pin 2 Lowside FET source pin 2 Exposed Pad, Connect to GND 5/20 2010.03 - Rev.C Technical Note BD9524MUV ●Reference data EN 5V/div EN 5V/div PGOOD 5V/div PGOOD 5V/div SS 1V/div Vo 2V/div SS 1V/div Vo 2V/div Fig.1 wake up (Vo=5.0V) CTL 10V/div REG1 2V/div REG2 2V/div Fig.2 wake up (Vo=3.3V) Fig.3 wake up (REG1, REG2) Vo 20mV/div Vo 20mV/div Vo 20mV/div IL 2A/div IL 2A/div IL 2A/div SW 5V/div LG 5V/div SW 5V/div LG 5V/div SW 5V/div LG 5V/div Fig.4 CONT Mode (Io=0A) Fig.5 CONT Mode (Io=0.4A) Fig.6 CONT Mode (Io=1.4A) Vo 20mV/div Vo 20mV/div Vo 20mV/div IL 2A/div IL 2A/div IL 2A/div SW 5V/div LG 5V/div SW 5V/div LG 5V/div SW 5V/div LG 5V/div Fig.7 QLLM (Io=0A) Fig.8 QLLM (Io=0.4A) Fig.9 QLLM (Io=1.4A) Vo 20mV/div Vo 20mV/div Vo 20mV/div IL 2A/div IL 2A/div IL 2A/div SW 5V/div LG 5V/div SW 5V/div LG 5V/div SW 5V/div LG 5V/div Fig.10 SLLM (Io=0A) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Fig.11 SLLM (Io=0.4A) 6/20 Fig.12 SLLM (Io=1.4A) 2010.03 - Rev.C Technical Note BD9524MUV ●Reference data 500 1200 VIN=12V, Vo=5.0V Frequency[kHz] ON TIME[usec] 1000 1.0 Vo=5.0V 0.5 Vo=3.3V 350 300 250 600 200 400 CONT Mode (5.0V) CONT Mode (3.3V) QLLM, SLLM (3.3V) QLLM, SLLM (3.3V) 200 0 0.40 0.80 FS[V] 1.20 0 .0 0 1.60 CONT Mode (VIN=19) CONT Mode (VIN=12) CONT Mode (VIN=7) 400 800 0.0 0.00 450 frequency [KHz] 1.5 Fig.13 FS-ON TIME 0 .4 0 0 .8 0 FS[V ] 1 .2 0 1 .6 0 150 QLLM,SLLM (VIN=19) QLLM,SLLM (VIN=12) QLLM,SLLM (VIN=7) QLLM (VIN=7, 12, 19V) 100 50 0 0.001 SLLM 0.01 0.1 Io [A] 1 10 Fig.15 Io-frequency (Vo1=5.0V) Fig.14 FS-frequency 100 100 90 80 SLLM CONT Mode 10 60 IVIN [mA] efficiency [%] 70 50 40 30 QLLM 1 QLLM CONT Mode 20 SLLM 10 0.1 0 1 10 100 Io [mA] 1000 10000 Fig.16 Io-efficiency (VIN=12V, Vo1=5.0V) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 7 10 13 16 19 VIN [V] 22 25 Fig.17 VIN-IVIN (Io=0A, Vo1=5.0V) 7/20 2010.03 - Rev.C Technical Note BD9524MUV ●Pin Descriptions ・VIN This is the main power supply pin. The input supply voltage range is 7V to 25V. The duty cycle of BD9524MUV is determined by input voltage and control output voltage. Therefore, when VIN voltage fluctuated, the output voltage also becomes unstable. Since VIN line is also the input voltage of switching regulator, stability depends on the impedance of the voltage supply. It is recommended to establish bypass capacitor and CR filter suitable for the actual application. ・CTL When CTL pin voltage is at least 2.3V the status of the linear regulator output becomes active (REG1=5V, REG2=3.3V). Conversely, the status switches off when CTL pin voltage goes lower than 0.8V. The switching regulator doesn’t become active when the status of CTL pin is low, if the status of EN pin is high. ・EN When EN pin voltage is at least 2.3V, the status of the switching regulator becomes active. Conversely, the status switches off when EN pin voltage goes lower than 0.8V. ・REG1 This is the output pin for 5V linear regulator and also active in power supply for driver and control circuit of the inside. The standby function for REG1 is determined by CTL pin. The voltage is 5V, with 100mA current ability. It is recommended that a 10uF capacitor (X5R or X7R) be established between REG1 and GND. ・REG2 This is the output pin for 3.3V linear regulator. The standby function for REG2 is determined by CTL. The voltage is 3.3V, with 100mA current ability. It is recommended that a 10uF capacitor (X5R or X7R) be established between REG2 and GND. It is available to set REF and SS by the resistance division value from REG2 in case REF are not set from an external power supply. ・EXTVCC This is the external input pin to REG1. When EXTVCC is beyond 4.4V, it supplies REG1 as EXTVCC is the power supply. ・REF This is the setting pin for output voltage of switching regulator. It is so convenient to be synchronized to outside power supply. This IC controls the voltage in the status of 2×REF≒FB. ・FB This is the feedback pin from the output of switching regulator. This IC controls the voltage in the status of 2×REF≒FB. ・SS This is the setting pin for soft start. The rising time is determined by the capacitor connected between SS and GND, and the fixed current inside IC after it is the status of low in standby mode. It controls the output voltage till SS voltage catch up the REF pin to become the double of the SS terminal voltage. ・FS This is the input pin for setting the frequency. It is available to set it in frequency range is 200KHz to 500kHz. ・Is+ This is the sense pin for output current. In case it is connected to side of the coil resistance for sense current and the voltage is set 65mV(typ) or more higher than FB pin voltage, the switching operation turns OFF. ・PGOOD This is the open drain pin for deciding the output of switching regulator. ・MCTL This is the switching shift pin for SLLM (Simple Light Load Mode). The efficiency in SLLM mode improves in setting MCTL pin to 1.5V or more. In case MCTL terminal voltage range is from 1.5 to 3.0V, LG maximum OFF time is 40usec, from 4.5V to REG1+0.3V, LG maximum OFF time is to infinity. It is in continuous mode that MCTL pin voltage is set 0.3V or less. ・AGND,DGND This is the ground pin. ・BOOT This is the power supply pin for high side FET driver. The maximum voltage range to GND pin is to 35V, to SW pin is to 7V. In switching operations, the voltage swings from (VIN+REG1) to REG1 by BOOT pin operation. ・HG This is the highside FET gate drive pin. It is operated in switching between BOOT to SW. In case the output MOS is 3ohm /the status of Hi, 2ohm/the status of Low, it is operated hi-side FET gate in high speed. ・SW This is the ground pin for high side FET drive. The maximum voltage range to GND pin is to 30V. Switching operation swings from the status of BOOT to the status of GND. ・LG This is the lowside FET gate drive pin. It is operated in switching between REG1 to PGND. In case the output MOS is 2ohm /the status of Hi, 0.5ohm/the status of Low, it is operated low-side FET gate in high speed. ・PGND This is the ground pin for low side FET drive. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/20 2010.03 - Rev.C Technical Note BD9524MUV ● Explanation of Operation The BD9524MUV is a 2ch synchronous buck regulator controller incorporating ROHM’s proprietary H3RegTM CONTROLLA control system. When VOUT drops due to a rapid load change, the system quickly restores VOUT by extending the TON time interval. Thus, it serves to improve the regulator’s transient response. Activating the Light Load Mode will also exercise Simple Light Load Mode (SLLM) control when the load is light, to further increase efficiency. H3RegTM control (Normal operation) VOUT When VOUT falls to a reference voltage (2×REF), the drop is detected, activating the H3RegTM CONTROLLA system. 2×REF tON= HG 2×REF 1 × VIN f [sec]・・・(1) HG output is determined by the formula above. LG (VOUT drops due to a rapid load change) VOUT Io When VOUT drops due to a rapid load change, and the voltage remains below reference voltage after the programmed tON time interval has elapsed, the system quickly restores VOUT by extending the tON time, improving the transient response. tON+α HG LG Light Load Control (SLLM) VOUT In SLLM (MCTL=”High voltage”), when the status of LG is OFF and the coil current is within 0A (it flows to SW from VOUT.), SLLM function is operated to prevent output next HG. The status of HG is ON, when VOUT falls below reference voltage again. 2×REF HG LG 0A (QLLM) VOUT In QLLM (MCTL=”Hiz or Middle voltage”), when the status of LG is OFF and the coil current is within 0A (it flows to SW from VOUT.), QLLM function is operated to prevent output next HG. Then, VOUT falls below the output programmed voltage within the programmed time (typ=40μs), the status of HG is ON. In case VOUT doesn’t fall in the programmed time, the status of LG is ON forcedly and VOUT falls. As a result, he status of next HG is ON. 2×REF HG LG 0A 3 TM *Attention: H Reg CONTROLLA monitors the supplying current from capacitor to load, using the ESR of output capacitor, and realize the rapid response. Bypass capacitor used at each load (Ex. Ceramic capacitor) exercise the effect with connecting to each load side. Do not put a ceramic capacitor on COUT side of power supply. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 9/20 COUT Load 2010.03 - Rev.C Technical Note BD9524MUV ● Timing Chart • Soft Start Function Soft start is exercised with the EN pin set high. Current control takes effect at startup, enabling a moderate output voltage “ramping start.” Soft start timing and incoming current are calculated with formulas (2) and (3) below. EN TSS Soft start time SS Tss= VOUT REF×Css 2μA(typ) [sec] ・・・(2) Incoming current IIN= Co×VOUT [A] ・・・(3) Tss (Css: Soft start capacitor; Co: Output capacitor) IIN ・Timer Latch Type Short Circuit Protection REF×1.4 Short protection kicks in when output falls to or below REF × 1.4 (setting voltage × 0.7). When the programmed time period elapses, output is latched OFF to prevent destruction of the IC. Output voltage can be restored either by reconnecting the EN pin or disabling UVLO. VOUT SCP EN / UVLO ・Over Voltage Protection 150μs(typ) or less When output rise to or above REF×2.35 (output setting voltage ×1.175), output over voltage protection is exercised, and low side FET goes up maximum for reducing output.(LG=High, HG=Low). When output falls within the programmed time (typ=150μs), it returns to the standard mode. When the programmed time period elapses, output is latched OFF to prevent destruction of the IC. Output voltage can be restored either by reconnecting the EN pin or disabling UVLO. 150μs(typ) or more REF×2.35 VOUT 150μs(typ) Latch OVP EN / UVLO ・Over current protection circuit tON tON During the normal operation, when VOUT becomes less than reference voltage, HG becomes High during the time tON . However, when inductor current exceeds ILIMIT threshold, HG becomes OFF. After 2.5μsec(typ), HG becomes ON again if the output voltage is lower than the specific voltage level and IL is lower than ILIMIT level. 2.5usec tON HG LG ILIMIT IL Vo 2×REF increase Io www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10/20 2010.03 - Rev.C Technical Note BD9524MUV ● External Component Selection 1. Inductor (L) selection The inductor value is a major influence on the output ripple current. As formula (4) below indicates, the greater the inductor or the switching frequency, the lower the ripple current. (VIN-VOUT)×VOUT [A]・・・(4) ΔIL= L×VIN×f The proper output ripple current setting is about 30% of maximum output current. ΔIL=0.3×IOUTmax. [A]・・・(5) ΔIL VIN IL VOUT L L= Co (VIN-VOUT)×VOUT ΔIL×VIN×f [H]・・・(6) (ΔIL: output ripple current; f: switch frequency) Output ripple current ※Passing a current larger than the inductor’s rated current will cause magnetic saturation in the inductor and decrease system efficiency. In selecting the inductor, be sure to allow enough margin to assure that peak current does not exceed the inductor rated current value. ※To minimize possible inductor damage and maximize efficiency, choose a inductor with a low (DCR, ACR) resistance. 2.Output Capacitor (CO) Selection VIN VOUT L ΔVOUT=ΔIL×ESR [V]・・・(7) ESR Co CEXT When determining the proper output capacitor, be sure to factor in the equivalent series resistance required to smooth out ripple volume and maintain a stable output voltage range. Output ripple voltage is determined as in formula (7) below. Load (ΔIL: Output ripple current; ESR: CO equivalent series resistance) ※ In selecting a capacitor, make sure the capacitor rating allows sufficient margin relative to output voltage. Note that a lower ESR can minimize output ripple voltage. Output Capacitor Please give due consideration to the conditions in formula (8) below for output capacity, bear in mind that output rise time must be established within the soft start time frame. Co+CEXT≦ TSS×(Limit-IOUT) VOUT Tss: Soft start time Limit: Over current detection 2A(Typ) ・・・(8) Note: Improper capacitor may cause startup malfunctions. 3. Input Capacitor (Cin) Selection The input capacitor selected must have low enough ESR resistance to fully support large ripple output, in order to prevent extreme over current. The formula for ripple current IRMS is given in (9) below. VIN Cin VOUT L IRMS=IOUT× √VIN(VIN-VOUT) [A]・・・(9) VIN Co Where VIN=2×VOUT, IRMS= IOUT 2 Input Capacitor A low ESR capacitor is recommended to reduce ESR loss and maximize efficiency. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 11/20 2010.03 - Rev.C Technical Note BD9524MUV 4. MOSFET Selection Loss on the main MOSFET VIN Pmain=PRON+PGATE+PTRAN main switch = VOUT L VOUT ×RON×IOUT2+Ciss×f×VDD+ VIN 2 VIN ×Crss×IOUT×f IDRIVE ・・・(10) (Ron: On-resistance of FET; Ciss: FET gate capacitance; f: Switching frequency Crss: FET inverse transfer function; IDRIVE: Gate peak current) Co synchronous switch Loss on the synchronous MOSFET Psyn=PRON+PGATE = VIN-VOUT ×RON×IOUT2+Ciss×f×VDD ・・・(11) VIN 5. Setting Detection Resistance (Detect ILIMIT at the peak current) (A) High accuracy current detective circuit (use the low resistance) VIN The over current protection function detects the output ripple current peak value. This parameter (setting value) is determined as in formula (13) below. R L VOUT ILMIT= IL 65mV(typ) R Co [A]・・・(12) (R: Detection resistance) OCP 65mV Current limit (B) Low loss current detective circuit (use the DCR value of inductor) VIN IL L RL r VOUT r×C ILMIT=65mV(typ)× Co C When the over current protection is detected by DCR of inductor L, this parameter (setting value) is determined as in formula (13) below. (Application circuit:P18) L (RL= r×C OCP L [A]・・・(13) ) (RL: the DCR value of inductor) Current limit 65mV (C) Low loss current detective circuit (the DCR value of inductor : high) VIN ILIMIT= 65mV(typ) k×RL IL L (1-k)RL kRL R1 R2 VOUT Co ( k= R2 R1+R2 , L RL [A]・・・(14) = kR1C ) (RL: the DCR value of inductor) C 65mV Current limit www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 12/20 2010.03 - Rev.C Technical Note BD9524MUV 6. Setting standard voltage (REF) VIN REF 3 TM H Reg CONTROLLA Outside voltage R It is available to set the reference voltage (REF) with outside supply voltage ×2 [V] by using outside power supply voltage. Q S FB R0 R0 REG2(3.3V) VIN R1 REF H3RegTM CONTROLLA R2 R Q S It is available to set the reference voltage (REF) by the resistance division value from REG2 in case REF is not set from an external power supply. REF= R2 R1+R2 ×REG2 [V]・・・(15) FB R0 R0 7. Setting output voltage This IC is operated that output voltage is REF×2≒FB. And it is operated that output voltage is feed back to FB pin. VIN H3RegTM REF CONTROLLA VIN R Q Output voltage SLLM Driver S SLLM Circuit FB R0 R0 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 13/20 2010.03 - Rev.C Technical Note BD9524MUV ●I/O Equivalent Circuit 1, 24pin (SW2, SW1) BOOT 2, 23pin (HG2, HG1) BOOT 3, 22pin (BOOT2, BOOT1) BOOT HG HG SW SW 4, 21pin (EN2, EN1) 5, 20pin (PGOOD2, PGOOD1) 6, 19pin (SS2, SS1) REG1 8, 17pin (REF2, REF1) 9, 16pin (Is+2, Is+1) 10, 15pin (FB2, FB1) 12pin (MCTL) 18pin (CTL) REG1 11, 14pin (FS2, FS1) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 14/20 2010.03 - Rev.C Technical Note BD9524MUV ●I/O Equivalent Circuit 26, 31pin (LG1, LG2) 27pin (EXTVCC) REG1 28pin (REG2) REG1 REG1 29pin (REG1) 30pin (VIN) VIN ●Evaluation Board Circuit (Vo1=5V f1=300kHz Vo2=3.3V f2=400kHz) 18 BOOT1 CTL EN1 EN1 HG1 R3 REG1 21 EN1 4 EN2 EN2 EN2 29 REG2 3.3V REG2 VO1 SW1 R47 L1 R46 R48 16 27 EXTVCC FB1 15 C22 C32 C20 C33 R44 C23 R45 C34 Is+1 C21 R43 Q1 25 REG2 TPQ6 R10 R40 R57 R56 Q5 R55 C19 R39 REG1 C4 VIN VIN C8 REF2 SW2 1 LG2 31 SS2 PGND2 32 14 FS2 13 C9 10 REG1 PGOOD1 MCTL DGND AGND www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. PGOOD2 20 VO2 L2 R37 R21 R33 C11 R24 C12 C29 C30 C10 R29 D2 R15 R54 R28 C13 TPQ5 R63 Q6 R52 PGOOD1 R20 REG1 5 C16 R31 C36 FS2 MCTL C28 Q3 9 C31 7 R32 R25 FB2 R12 C15 Q4 FS1 R17 12 C14 R30 Is+2 11 R34 SW2 SS1 C7 C18 R14 2 C37 6 REG2 HG2 R35 R18 19 FS1 3 C5 REG2 R16 BOOT2 C17 R22 R7 REF1 D4 R27 C6 8 R13 C26 R26 R9 VIN 26 28 17 R58 Q2 R6 R8 VIN LG1 PGND1 C3 R5 REG2 C25 C24 R49 REG1 C2 EXTVCC 24 C27 D1 R4 REG1 5V Vo1 SW1 23 D3 R50 R19 REG1 22 VIN C35 VIN C1 R2 CTL VIN R11 30 R42 CTL VIN REG1 BD9524MUV R1 R41 VIN 12V PGOOD2 R36 15/20 2010.03 - Rev.C Technical Note BD9524MUV DESIGNATION RATING PART No. COMPANY DESIGNATION RATING PART No. COMPANY ROHM R1 0Ω MCR03EZHJ000 ROHM R58 1MΩ MCR03PZHZF1004 R2 0Ω MCR03EZHJ000 ROHM R63 - - - R3 0Ω MCR03EZHJ000 ROHM C1 10uF(25V) CM32X7R106M25A KYOCERA R4 0Ω MCR03EZHJ000 ROHM C2 10uF(6.3V) GRM21BB10J106KD MURATA R5 0Ω MCR03EZHJ000 ROHM C3 10uF(6.3V) GRM21BB10J106KD MURATA R6 15kΩ MCR03PZHZF1502 ROHM C4 10uF(6.3V) GRM21BB10J106KD MURATA R7 47kΩ MCR03PZHZF4702 ROHM C5 0.01uF(50V) GRM188B11H103KD MURATA R8 30kΩ MCR03PZHZF3002 ROHM C6 0.01uF(50V) GRM188B11H103KD MURATA R9 30kΩ MCR03PZHZF3002 ROHM C7 1000pF(50 V) GRM188B11H102KD MURATA R10 * - - - C8 1000pF(50V) GRM188B11H102KD MURATA R11 * - - - C9 - - - R12 - - - C10 - - - R13 1MΩ MCR03PZHZF1004 ROHM C11 220uF 6TPE220MI SANYO - R14 51kΩ MCR03PZHZF5102 ROHM C12 - - R15 * - - - C13 * - - - R16 - - - C14 0.47uF(10V) GRM188B11A474KD MURATA R17 36kΩ MCR03PZHZF3602 ROHM C15 10uF(25V) CM32XR7106M25A KYOCERA R18 * - - - C16 10uF(25V) CM32XR7106M25A KYOCERA R19 * - - - C17 10uF(6.3V) GRM21BB10J106KD MURATA R20 100kΩ MCR03PZHZF1003 ROHM C18 - - - R21 0Ω MCR03EZHJ000 ROHM C19 - - - R22 * - - - C20 - - - R24 0Ω MCR03EZHJ000 ROHM C21 220uF 6TPE220MI SANYO - R25 0Ω MCR03EZHJ000 ROHM C22 - - R26 * - - - C23 * - - - R27 * - - - C24 0.47uF(10V) GRM188B11A474KD MURATA R28 0Ω MCR03EZHJ000 ROHM C25 10uF(25V) CM32XR7106M25A KYOCERA R29 0Ω MCR03EZHJ000 ROHM C26 10uF(25V) CM32XR7106M25A KYOCERA R30 0Ω MCR03EZHJ000 ROHM C27 10uF(6.3V) GRM21BB10J106KD MURATA R31 * - - - C28 - - - R32 0Ω MCR03EZHJ000 ROHM C29 - - - R33 5mΩ PMR100HZPFU5L00 ROHM C30 - - - R34 0Ω MCR03EZHJ000 ROHM C31 - - - R35 0Ω MCR03EZHJ000 ROHM C32 - - - R36 100kΩ MCR03PZHZF1003 ROHM C33 - - - R37 0Ω MCR03EZHJ000 ROHM C34 * - - - R39 0Ω MCR03EZHJ000 ROHM C35 * - - - R40 0Ω MCR03EZHJ000 ROHM C36 * - - - R41 * - - - C37 * - - - R42 * - - - D1 Diode RSX501L-20 ROHM R43 0Ω MCR03EZHJ000 ROHM D2 Diode RSX501L-20 ROHM R44 0Ω MCR03EZHJ000 ROHM D3 Diode RB520S-30 ROHM R45 * - - - D4 Diode RB520S-30 ROHM CDEP105NP-2R5MC32 CDEP105NP-2R5MC32 Sumida R46 0Ω MCR03EZHJ000 ROHM L1 2.5uH R47 0Ω MCR03EZHJ000 ROHM L2 2.5uH R48 5mΩ PMR100HZPFU5L00 ROHM Q1 FET uPA2702 NEC R49 0Ω MCR03EZHJ000 ROHM Q2 FET uPA2702 NEC R50 0Ω MCR03EZHJ000 ROHM Q3 FET uPA2702 NEC R52 - - - Q4 FET uPA2702 NEC R54 - - - Q5 - - - R55 - - - Q6 - - - R56 - - - U1 - BD9524MUV ROHM R57 - - - www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Sumida * Patterns for over current detection used DCR. 16/20 2010.03 - Rev.C Technical Note BD9524MUV ●Handling method of unused pin during using only 1ch DC/DC. If using only 1ch DC/DC and 2ch pin is set to be off at all times, please manage the unused pin as diagram below. PIN No, PIN Name Management SW2 GND 2 HG2 OPEN 3 BOOT2 GND 4 EN2 GND 5 PGOOD2 GND 6 SS2 GND 8 REF2 GND 9 Is+2 GND 10 FB2 GND 11 FS2 GND 31 LG2 OPEN 30 VIN C1 R2 CTL 18 BOOT1 CTL EN1 REG1 EN1 HG1 R3 22 21 EN1 4 EN2 SW1 23 24 VIN D3 R50 VIN VO1 C27 C25 R49 C26 C24 Q2 R51 SW1 R47 LG1 26 PGND1 25 REG2 Is+1 16 27 EXTVCC FB1 15 17 REF1 29 C2 REG2 3.3V C3 EXTVCC Vo1 28 REG2 R45 C34 R40 C23 R10 C22 C33 C32 C20 R44 TPQ6 R57 R56 Q5 R55 C19 R5 C21 R43 Q1 REG1 R41 REG1 5V R48 R19 D1 R46 VO1 R60 L1 C35 CTL VIN REG1 BD9524MUV R1 R11 VIN 12V R42 1 R39 C4 R6 R7 8 VIN REG2 R58 BOOT2 3 HG2 2 SW2 1 LG2 31 PGND2 32 C5 C7 R16 REF2 19 SS1 6 SS2 FS1 14 C18 FS1 R17 11 C28 7 13 9 FB2 10 REG1 FS2 MCTL 12 Is+2 MCTL DGND AGND www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. PGOOD1 20 PGOOD2 5 R21 PGOOD1 R20 17/20 2010.03 - Rev.C Technical Note BD9524MUV ●Notes for use 1. This integrated circuit is a monolithic IC, which (as shown in the figure below), has P isolation in the P substrate and between the various pins. A P-N junction is formed from this P layer and N layer of each pin, with the type of junction depending on the relation between each potential, as follows: When GND> element A> element B, the P-N junction is a diode. When element B>GND element A, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, as well as operating malfunctions and physical damage. Therefore, be careful to avoid methods by which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin. Resistor Transistor (NPN) Pin A Pin B C Pin B B E Pin A N P + N P+ P N Parasitic element N P+ P P substrate Parasitic element B N P+ N C E Parasitic element P substrate GND Parasitic element GND GND GND Other adjacent elements 2. In some modes of operation, power supply voltage and pin voltage are reversed, giving rise to possible internal circuit damage. For example, when the external capacitor is charged, the electric charge can cause a VCC short circuit to the GND. In order to avoid these problems, inserting a VCC series countercurrent prevention diode or bypass diode between the various pins and the VCC is recommended. Bypass diode Countercurrent VCC Pin 3. Absolute maximum rating Although the quality of this IC is rigorously controlled, the IC may be destroyed when applied voltage or operating temperature exceeds its absolute maximum rating. Because short mode or open mode cannot be specified when the IC is destroyed, it is important to take physical safety measures such as fusing if a special mode in excess of absolute rating limits is to be implemented. 4.GND potential Make sure the potential for the GND pin is always kept lower than the potentials of all other pins, regardless of the operating mode. 5. Thermal design In order to build sufficient margin into the thermal design, give proper consideration to the allowable loss (Power Dissipation) in actual operation. 6. Short-circuits between pins and incorrect mounting position When mounting the IC onto the circuit board, be extremely careful about the orientation and position of the IC. The IC may be destroyed if it is incorrectly positioned for mounting. Do not short-circuit between any output pin and supply pin or ground, or between the output pins themselves. Accidental attachment of small objects on these pins will cause shorts and may damage the IC. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 18/20 2010.03 - Rev.C Technical Note BD9524MUV 7. Operation in strong electromagnetic fields Use in strong electromagnetic fields may cause malfunctions. Use extreme caution with electromagnetic fields. 8. Thermal shutdown circuit This IC is provided with a built-in thermal shutdown (TSD) circuit, which is activated when the operating temperature reaches 175℃ (standard value), and has a hysteresis range of 15℃ (standard). When the IC chip temperature rises to the threshold, all the inputs automatically turn OFF. Note that the TSD circuit is provided for the exclusive purpose shutting down the IC in the presence of extreme heat, and is not designed to protect the IC per se or guarantee performance when or after extreme heat conditions occur. Therefore, do not operate the IC with the expectation of continued use or subsequent operation once the TSD is activated. 9. Capacitor between output and GND When a larger capacitor is connected between the output and GND, Vcc or VIN shorted with the GND or 0V line – for any reason – may cause the charged capacitor current to flow to the output, possibly destroying the IC. Do not connect a capacitor larger than 1000uF between the output and GND. 10. Precautions for board inspection Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be certain to use proper discharge procedure before each process of the operation. To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handling, transfer and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup. 11. GND wiring pattern When both a small-signal GND and high current GND are present, single-point grounding (at the set standard point) is recommended, in order to separate the small-signal and high current patterns, and to be sure the voltage change stemming from the wiring resistance and high current does not cause any voltage change in the small-signal GND. In the same way, care must be taken to avoid wiring pattern fluctuations in any connected external component GND. ●Power Dissipation [mW] 1000 70mm×70mm×1.6mm 880mW Power Dissipation [Pd] 800 Glass-epoxy PCB θj-a=142.0℃/W 600 With no heat sink θj-a=328.9℃/W 400 380mW 200 0 25 50 75 100 125 150 [℃] Ambient Temperature [Ta] www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 19/20 2010.03 - Rev.C Technical Note BD9524MUV ●Ordering part number B D 9 Part No. 5 2 4 M Part No. U V - Package MUV : VQFN032V5050 E 2 Packaging and forming specification E2: Embossed tape and reel VQFN032V5050 <Tape and Reel information> 5.0 ± 0.1 5.0±0.1 1.0MAX 3.4±0.1 0.4 ± 0.1 1 8 9 32 16 25 24 0.75 0.5 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold ) (0.22) ( reel on the left hand and you pull out the tape on the right hand 3.4 ± 0.1 +0.03 0.02 -0.02 S C0.2 Embossed carrier tape Quantity Direction of feed 1PIN MARK 0.08 S Tape 17 +0.05 0.25 -0.04 1pin (Unit : mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Reel 20/20 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2010.03 - Rev.C Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. 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Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. R1010A