Single-chip Type with Built-in FET Switching Regulator Series Output 1.5A or Less High Efficiency Step-down Switching Regulator with Built-in Power MOSFET BD9151MUV No.09027EAT11 ●Description ROHM’s high efficiency dual step-down switching regulator BD9151MUV is a power supply designed to produce a low voltage including 1.8 volts or 1.2 volts from 2.8 volts to 5.0 volts power supply line. Reset circuits of input power supply voltage and external Pch MOSFET gate controller are incorporated. Offers high efficiency with our original pulse skip control technology and synchronous rectifier. Employs a current mode control system to provide faster transient response to sudden change in load. ●Features 1) Offers fast transient response with current mode PWM control system. TM 2) Offers highly efficiency for all load range with synchronous rectifier (Pch/Nch FET) and SLLM (Simple Light Load Mode) 3) Incorporates soft-start function. 4) Incorporates Thermal / ULVO protection functions. 5) Incorporates thermal protection and short-current protection circuit with timer latch function. . 6) Incorporates shutdown function Icc=0µA(Typ.) 7) Incorporates reset function 8) Incorporates Pch MOSFET gate controller 9) Employs small surface mount package : VQFN020V4040 ●Applications Power supply for LSI including DSP, Micro computer and ASIC ●Absolute maximum ratings (Ta=25℃) Parameter Symbol AVCC PVcc VEN VSW1 VSW2 Pd1 Pd2 Pd3 Pd4 Topr Tstg Tjmax Vcc Voltage EN Voltage SW Voltage Power Dissipation Operating Temperature Range Storage Temperature Range Maximum Junction Temperature *1 *2 *3 *4 *5 Unit V V V V V W W W W ℃ ℃ ℃ Pd, ASO and Tj=150℃ should not be exceeded. IC only 1-layer. mounted on a 74.2mm×74.2mm×1.6mm glass-epoxy board, occupied area by copper foil : 10.29mm2 4-layer. mounted on a 74.2mm×74.2mm×1.6mm glass-epoxy board, occupied area by copper foil : 10.29mm2 , 2-3 layers 5505 mm2 4-layer. mounted on a 74.2mm×74.2mm×1.6mm glass-epoxy board, occupied area by copper foil : 5505mm2, in each layers ●Operating conditions (Ta=-40~+85℃) Parameter Vcc Voltage EN Voltage SW Average Output Current *6 Limit -0.3~+7*1 -0.3~+7*1 -0.3~+7 -0.3~+7 -0.3~+7 0.34*2 0.70*3 2.21*4 3.56*5 -40~+85 -55~+150 +150 Symbol AVCC、PVCC VEN ISW1 ISW2 Min. 2.8 0 - Typ. 3.3 - Max. 5.5 5.5 0.4*6 0.8*6 Unit V V A A Pd and ASO should not be exceeded. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 1/16 2009.08 - Rev.A Technical Note BD9151MUV ●Electrical Characteristics ◎(Unless otherwise noted, Ta=25℃, AVCC=PVCC=3.3V, EN=AVCC) Limit Parameter Symbol MIN. TYP. Standby Current ISTB 0 Bias Current ICC 400 EN Low Voltage VENL GND EN High Voltage VENH 2 Vcc EN Input Current IEN 1 Oscillation Frequency FOSC 0.8 1.0 RONP1 0.27 Pch FET ON Resistance RONP2 0.18 0.27 RONN1 Nch FET ON Resistance RONN2 0.18 ITH Sink Current 1 ITHSI1 10 20 ITH Source Current 1 ITHSO1 10 20 ITH Sink Current 2 ITHSI2 10 20 ITH Source Current 2 ITHSO2 10 20 FB Reference Voltage 1 FB1 1.773 1.800 FB Reference Voltage 2 FB2 1.182 1.200 UVLO Threshold Voltage VUVLOL 2.4 2.5 UVLO Release Voltage VUVLOH 2.45 2.6 Reset Threshold Voltage PG1 2.74 2.87 Reset Release Voltage PG2 2.84 2.97 Reset ON resistance RONPG 140 Reset Delay TPG 8 16 MONI Discharge Resistance RMONI 110 PGATEB Sink Current IPGATEB 1.5 4 Soft start time TSS 0.25 0.5 Timer latch time TLATCH 0.5 1.0 0.9 VSCP1 Output Short circuit Threshold Voltage VSCP2 0.6 MAX 10 800 0.8 10 1.2 0.46 0.30 0.46 0.30 1.827 1.218 2.6 2.8 3.00 3.10 240 32 190 6.5 1.0 2.0 1.26 0.84 Unit µA µA V V µA MHz Ω Ω Ω Ω µA µA µA µA V V V V V V Ω ms Ω uA ms ms V V Conditions EN=0V In standby mode In active mode VEN=2V AVCC = PVCC =3.3V AVCC = PVCC =3.3V AVCC = PVCC =3.3V AVCC = PVCC =3.3V VFB1=2.0V VFB 1=1.6V VFB 2=1.4V VFB 2=1.0V ±1.5% ±1.5% AVCC =3.3→0V AVCC =0→3.3V AVCC =3.3V→0V AVCC =0V→3.3V AVCC =3.3V In SCP/TSD operation FB1=1.8→0V FB2=1.2→0V ●Top View 4.0±0.1 4.0±0.1 D9151 1.0Max. Lot No. 0.08 S C0.2 2.1±0.1 5 6 20 16 1.0 10 15 0.5 2.1±0.1 0.4±0.1 1 0.02 +0.03 -0.02 (0.22) S 11 0.25 +0.05 -0.04 VQFN020V4040 (Unit :mm) Fig.1 BD9151MUV TOP View www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 2/16 2009.08 - Rev.A Technical Note BD9151MUV ●Block Diagram VCC VOUT3 PGATE PGATEB AVCC MONI VCC UVLO/ Delay AGND PGOOD Comp RESET VCC FB1 VOUT1 PVCC1 Current Comp Current R Gm Amp Q VCC Slope1 EN SW1 Driver Logic ITH1 PGND1 SCP1 Delay CLK1 VREF OSC SCP/ TSD UVLO CLK2 VCC Delay PVCC2 SCP2 VOUT2 VOUT1 + Soft Start AGND Sense/ Protect S Current Current Comp FB2 R Gm Amp Q S Soft Start/ Delay VOUT2 SW2 + Slope2 AGND Sense/ Protect Driver CLK2 Logic PGND2 ITH2 AGND Fig.2 BD9151MUV Block Diagram ●Pin No. & function table Pin Pin PIN Function No. name 1 PGND2 Ch2 Low side source pin 2 PGND2 Ch2 Low side source pin Pin No. 11 12 Pin name AGND AVCC PGATEB 3 PVCC2 Ch2 High side FET source pin 13 4 PVCC1 Ch1 High side FET source pin 14 5 PGND1 Ch1 Low side source pin 15 PIN Function Ground Power supply input pin External Pch MOS Gate Drive pin (Low Active) PGATEB reverse logic output signal PGATE (High Active) MONI 3.3V Output monitor pin 6 SW1 Ch1 Pch/Nch FET drain output pin 16 ITH2 Ch2 GmAmp output pin / Connected phase compensation capacitor 7 8 SW1 FB1 Ch1 Pch/Nch FET drain output pin Ch1 output voltage detect pin 17 18 FB2 EN Ch2 output voltage detect pin Enable pin (High Active) 9 ITH1 Ch1 GmAmp output pin /Connected phase compensation capacitor 19 SW2 Ch2 Pch/Nch FET drain output pin 20 SW2 Ch2 Pch/Nch FET drain output pin 10 RESET RESET Output pin www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 3/16 2009.08 - Rev.A Technical Note BD9151MUV ●Characteristics data【BD9151MUV】 2.0 【VOUT1=1.8V】 1.5 1.0 【VOUT1=1.8V】 OUTPUT VOLTAGE:VOUT[V] OUTPUT VOLTAGE:VOUT[V] Ta=25℃ Io=0A 【VOUT2=1.2V】 0.5 1.5 【VOUT2=1.2V】 1.0 VCC=3.3V Ta=25℃ Io=0A 0.5 0.0 1 2 3 4 INPUT VOLTAGE:VCC[V] 5 0 1 2 3 4 EN VOLTAGE:VEN[V] Fig.3 VCC – VOUT1,VOUT2 1.80 VCC=3.3V VCC=3.3V Io=0AIo=0A 90 Vcc=3.3V 【VOUT1=1.8V】 80 【VOUT2=1.2V】 【VOUT2=1.2V 設定】 1.23 1.20 1.18 VCC=3.3V Io=0A -40 80 -20 0 20 40 60 TEMPERATURE:Ta[℃] 50 Vcc=5V 【VOUT2=1.2V】 Ta=25℃ 10 1 Ta=25℃ *VOUT2=1mA loaded 0 1 10 100 OUTPUT CURRENT:IOUT[mA] 1000 Fig.8 VOUT1 Efficiency 1.2 1.0 VCC=3.3V 10 100 OUTPUT CURRENT:IOUT[mA] 1.1 1 0.9 Ta=25℃ 0.8 0.8 1000 -40 Fig.9 VOUT2 Efficiency -20 0 20 40 TEMPERATURE:Ta[℃] 60 2.8 80 1.6 200 NMOS 125 100 75 1.4 1.2 1.0 0.8 0.6 50 0.4 25 0.2 0 -40 -20 600 0 20 40 60 80 TEMPERATURE:Ta[℃] CIRCUIT CURRENT:I CC [μA] PMOS 150 5.3 1.8 225 175 3.8 4.3 4.8 INPUT VOLTAGE:VCC[V] Fig.11 VCC-Fosc 2.0 VCC=3.3V 250 3.3 Fig.10 Ta- Fosc EN VOLTAGE:VEN[V] ON RESISTANCE:RON[mΩ] 30 *VOUT1=1mA loaded 0 275 Vcc=5V 【VOUT1=1.8V】 40 10 FREQUENCY:FOSC[MHz] FREQUENCY:FOSC[MHz] EFFICIENCY:η[%] 60 20 50 20 1.2 70 30 60 80 80 40 70 Fig. 7 Ta-VOUT1 Vcc=3.3V 【VOUT2=1.2V】 90 4 100 Fig. 6 Ta-VOUT1 100 1 2 3 OUTPUT CURRENT:IOUT[A] Fig.5 IOUT - VOUT 1.15 1.75 0 20 40 60 TEMPERATURE:Ta[℃] VCC=3.3V Ta=25℃ 0 EFFICIENCY:η[%] 1.83 OUTPUT VOLTAGE:VOUT[V] OUTPUT VOLTAGE:VOUT[V] 【VOUT1=1.8V】 -20 0.5 5 1.25 -40 【VOUT2=1.2V】 1.0 Fig.4 VEN - VOUT 1.85 1.78 【VOUT1=1.8V】 1.5 0.0 0.0 0 300 OUTPUT VOLTAGE:VOUT[V] 2.0 2.0 100 Fig.12 Ta – RONN, RONP www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. VCC=3.3V 0.0 500 400 300 200 VCC=3.3V 100 0 -40 -20 0 20 40 60 TEMPERATURE:Ta[℃] Fig.13 Ta-EN1,EN2 4/16 80 -4 0 -2 0 0 20 40 60 80 T EM PER AT U R E:T a[℃ ] Fig.14 Ta-Icc 2009.08 - Rev.A Technical Note BD9151MUV VCC=3.3V,Ta=25℃ VOUT1 VCC=3.3V,Ta=25℃ VOUT3 VOUT1 VCC=3.3V,Ta=25℃ VOUT1 VOUT3 VOUT2 VOUT2 Fig.15 Soft start waveform (Io1=0mA,Io2=0mA,Io3=0mA) RESET PGATE VOUT2 Fig.16 Soft start waveform (Io1=400mA,Io2=800mA,Io3=600mA) SW1 Fig.17 Soft start waveform (Io1=0mA,Io2=0mA,PGATE) SW1 VOUT1 VOUT2 VCC=3.3V,Ta=25℃,VOUT1=1.8V VOUT1 VOUT1 Fig.18 Soft start waveform (Io1=0mA,Io2=0mA,RESET) VCC=3.3V,Ta=25℃,VOUT1=1.8V Fig.19 SW1 waveform (Io=0mA) Fig.20 SW1 waveform (Io=400mA) VCC=3.3V,Ta=25℃,VOUT=1.8V SW2 SW2 VCC=3.3V,Ta=25℃,VOUT2=1.2V VOUT2 VOUT1 VCC=3.3V,Ta=25℃,VOUT2=1.2V IOUT1 VOUT2 Fig.21 SW2 waveform (Io=0mA) Fig.22 SW2 waveform (Io=800mA) VCC=5V,Ta=25℃,VOUT=1.8V VCC=5V,Ta=25℃,VOUT2=1.2V VCC=5V,Ta=25℃,VOUT2=1.2V VOUT2 VOUT1 Fig.23 VOUT1 transient response (Io=200mA→400mA / 10usec) VOUT2 IOUT2 IOUT2 IOUT1 Fig.24 VOUT1 transient response (Io=400mA→200mA/ 10usec) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. Fig.25 VOUT2 transient response (Io=400mA→800mA/ 10usec) 5/16 Fig.26 VOUT2 transient response (Io=800mA→400mA/ 10usec) 2009.08 - Rev.A Technical Note BD9151MUV ●Operation BD9151MUV is a synchronous rectifying step-down switching regulator that achieves faster transient response by employing current mode PWM control system. It utilizes switching operation in PWM (Pulse Width Modulation) mode for heavier load, TM while it utilizes SLLM (Simple Light Load Mode) operation for lighter load to improve efficiency. ○Synchronous rectifier It does not require the power to be dissipated by a rectifier externally connected to a conventional DC/DC converter IC, and its P.N junction shoot-through protection circuit limits the shoot-through current during operation, by which the power dissipation of the set is reduced. ○Current mode PWM control Synthesizes a PWM control signal with a inductor current feedback loop added to the voltage feedback. ・PWM (Pulse Width Modulation) control The oscillation frequency for PWM is 1 MHz. SET signal form OSC turns ON a high side MOS FET (while a low side MOS FET is turned OFF), and an inductor current IL increases. The current comparator (Current Comp) receives two signals, a current feedback control signal (SENSE: Voltage converted from IL) and a voltage feedback control signal (FB), and issues a RESET signal if both input signals are identical to each other, and turns OFF the high side MOS FET (while a low side MOS FET is turned ON) for the rest of the fixed period. The PWM control repeat this operation. TM ・SLLM (Simple Light Load Mode) control When the control mode is shifted from PWM for heavier load to the one for lighter load or vise versa, the switching pulse is designed to turn OFF with the device held operated in normal PWM control loop, which allows linear operation without voltage drop or deterioration in transient response during the mode switching from light load to heavy load or vise versa. Although the PWM control loop continues to operate with a SET signal from OSC and a RESET signal from Current Comp, it is so designed that the RESET signal is held issued if shifted to the light load mode, with which the switching is tuned OFF and the switching pulses are thinned out under control. Activating the switching intermittently reduces the switching dissipation and improves the efficiency. SENSE Current Comp RESET VOUT Level Shift R Q FB SET Driver Logic S Gm Amp. ITH IL VOUT SW Load OSC Fig.27 Diagram of current mode PWM control PVCC Current Comp SENSE PVCC SENSE Current Comp FB FB SET GND SET GND RESET GND RESET GND SW GND SW IL GND IL(AVE) IL 0A VOUT VOUT(AVE) VOUT VOUT(AVE) Not switching Fig.29 SLLM Fig.28 PWM switching timing chart www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 6/16 TM switching timing chart 2009.08 - Rev.A Technical Note BD9151MUV ●Description of operations ・Soft start function EN terminal shifted to “High” activates a soft-starter to gradually establish the output voltage with the current limited during startup, by which it is possible to prevent an overshoot of output voltage and an inrush current. ・Shutdown function With EN terminal shifted to “Low”, the device turns to Standby Mode, and all the function blocks including reference voltage circuit, internal oscillator and drivers are turned to OFF. Circuit current during standby is 0µF (Typ.). ・UVLO function Detects whether the input voltage sufficient to secure the output voltage of BU9151MUV is supplied. And the hysteresis width of 100mV (Typ.) is provided to prevent output chattering. Each the outputs have UVLO. It is possible to set output sequence easy. ・Reset function When AVCC input voltage is over .2.97V (typ), after 16msec (typ.) delay, outputs RESET. The hysteresis is 100mV (Typ). ・Pch MOSFET gate controller function PGATEB pin has function to make FET active with steady current. With connecting Pch MOSFET gate, soft start turned to be ON. ・Discharge function MONI pin is open drain pin of Nch MOS. After 4msec (typ) delay from the time UVLO release, it turns to be OFF. By Low, UVLO detection of EN pin, Nch MOS becomes active and discharge the connection. ・External synchronous signal output function PGATE pin outputs High active after 4msec (Typ.) delay from the UVLO release. ・Start up sequence function BU9151MUV outputs output voltage 2ch (1.2V) after the UVLO release, and after 2msec(typ.) from the UVLO release, it outputs 1ch(1.8V), and the last, after 4msec from the UVLO release, PGATEB becomes active, and external Pch MOSFET will be ON, and outputs 3ch(VCC equivalent). During the OFF time, 3ch output is discharged by MONI pin, then 1ch output and 2ch output are naturally discharged. PG2 (2.97V) PG1 (2.87V) V UVLOH (2.6V) V UVLOL(2.5V) VCC EN VOUT1(1.8V) TSS TSS(0.5m s) TSS VOUT2(1.2V) TSS TSS(0.5ms) delay1 (2m s) PGATE TSS delay1 (2ms) delay2 (4ms) delay1 (2ms) delay2 (4m s) delay2 (4ms) PGATEB VOUT3(3.3V) TSS(1m s)* TSS(1m s)* discharge ON discharge ON RESET TPG (16ms) TPG (16ms) *Starting time of VOUT3 TSS(1m s)* discharge ON TPG (16m s) TSS=1ms (when BD9151MUV is used) It depends on gate capacity when using Pch MOSFET Fig.30 Soft start, Shut down, UVLO timing chart www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 7/16 2009.08 - Rev.A Technical Note BD9151MUV ・Short-current protection circuit with time latch function Turns OFF the output to protect the IC from breakdown when the incorporated current limiter is activated continuously for the fixed time(TLATCH) or more. The output thus held tuned OFF may be recovered by restarting EN or by re-unlocking UVLO. EN SCP VOUT1 Output voltage OFF latch Threshold voltage VOUT2 IL Limit IL1 IL2 Standby mode t2=TLATCH t1<TLATCH Active mode Standby mode Timer latch EN Active mode EN Fig.31 Timer latch short-current protection timing chart ●Switching regulator efficiency Efficiency ŋ may be expressed by the equation shown below: η= VOUT×IOUT Vin×Iin ×100[%]= POUT Pin ×100[%]= POUT POUT+PDα ×100[%] Efficiency may be improved by reducing the switching regulator power dissipation factors PDα as follows: Dissipation factors: 2 1) ON resistance dissipation of inductor and FET:PD(I R) 2) Gate charge/discharge dissipation:PD(Gate) 3) Switching dissipation:PD(SW) 4) ESR dissipation of capacitor:PD(ESR) 5) Operating current dissipation of IC:PD(IC) 2 2 1)PD(I R)=IOUT ×(RCOIL+RON) (RCOIL[Ω]:DC resistance of inductor, RON[Ω]:ON resistance of FET, IOUT[A]:Output current.) 2)PD(Gate)=Cgs×f×V (Cgs[F]:Gate capacitance of FET, f[H]:Switching frequency, V[V]:Gate driving voltage of FET) 3)PD(SW)= 2 Vin ×CRSS×IOUT×f IDRIVE (CRSS[F]:Reverse transfer capacitance of FET, IDRIVE[A]:Peak current of gate.) 2 4)PD(ESR)=IRMS ×ESR (IRMS[A]:Ripple current of capacitor, ESR[Ω]:Equivalent series resistance.) 5)PD(IC)=Vin×ICC (ICC[A]:Circuit current.) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 8/16 2009.08 - Rev.A Technical Note BD9151MUV ●Consideration on permissible dissipation and heat generation As BU9151MUV functions with high efficiency without significant heat generation in most applications, no special consideration is needed on permissible dissipation or heat generation. In case of extreme conditions, however, including lower input voltage, higher output voltage, heavier load, and/or higher temperature, the permissible dissipation and/or heat generation must be carefully considered. For dissipation, only conduction losses due to DC resistance of inductor and ON resistance of FET are considered. Because the conduction losses are considered to play the leading role among other dissipation mentioned above including gate charge/discharge dissipation and switching dissipation. P=IOUT2×RON RON=D×RONH+(1-D)RONL 22 4 層基板 (表層放熱銅箔 ①①4 layers (copper foil area : 5505mm 5505mm )) (各層に銅箔積層 (copper foil in each) layers) θj-a=35.1 ℃/W θj-a=35.1 ℃/W 2 ②②4 layers (copper foil area : 10.29mm 10.29mm2)) 4 層基板 (表層放熱銅箔 2 2 (copper foil in 2-3 layers: 5505mm ) 5505mm ) (2,3 層に銅箔積層 θj-a=103.3 ℃/W θj-a=103.3 ℃/W 22 ③③1 layer (copper foil area : 10.29mm 1 層基板 (表層放熱銅箔 10.29mm)) θj-a=178.6 ℃/W θj-a=178.6 ℃/W ④④ICIConly 単体時 θj-a=367.6 ℃/W θj-a=367.6 ℃/W 4.0 ①3.56W Power Dissipation :Pd [W] 3.0 D:ON Duty(=VOUT/VCC) RONH:ON resistance of High side MOS FET RONL:ON resistance of Low side MOS FET IOUT:Output current ②2.21W 2.0 1.0 ③0.70W ④0.34W 0 0 25 50 75 100 105 125 150 Ambient Temperature :Ta [℃] Fig.32 Heat radiation characteristics (VQFN020V4040) If VCC=3.3V, VOUT1=1.8V, VOUT2=1.2V, RONH1=0.27Ω, RONL1=0.18Ω, RONH2=0.27Ω, RONL2=0.18Ω IOUT1=0.4A, IOUT2=0.8A, for example, D1=VOUT1/VCC=1.8/3.3=0.55 D2=VOUT2/VCC=1.2/3.3=0.36 RON1=0.55×0.27+(1-0.55)×0.18 =0.1485+0.081 =0.2295[Ω] RON2=0.36×0.27+(1-0.36)×0.18 =0.0972+0.1152 =0.2124[Ω] P=0.42×0.2295+0.82×0.2124=0.173[W] As RONH is greater than RONL in BU9151MUV, the dissipation increases as the ON duty becomes greater. With the consideration on the dissipation as above, thermal design must be carried out with sufficient margin allowed. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 9/16 2009.08 - Rev.A Technical Note BD9151MUV ●Selection of components externally connected 1. Selection of inductor (L) IL The inductance significantly depends on output ripple current. As seen in the equation (1), the ripple current decreases as the i nductor and/or switching frequency increases. ΔIL VCC ΔIL= IL (VCC-VOUT)×VOUT L×VCC×f [A]・・・(1) Appropriate ripple current at output should be 20% more or less of the maximum output current. VOUT L ΔIL=0.3×IOUTmax. [A]・・・(2) Co L= (VCC-VOUT)×VOUT ΔIL×VCC×f [H]・・・(3) (ΔIL: Output ripple current, and f: Switching frequency) Fig.33 Output ripple current ※Current exceeding the current rating of the inductor results in magnetic saturation of the inductor, which decreases efficiency. The inductor must be selected allowing sufficient margin with which the peak current may not exceed its current rating. If VCC=3.3V, VOUT=1.8V, f=1.0MHz, ΔIL=0.3×0.8A=0.24A, for example,(BD9151MUV) L= (3.3-1.8)×1.8 0.24×3.3×1.0M =2.02μ → 2.2[μH] ※Select the inductor of low resistance component (such as DCR and ACR) to minimize dissipation in the inductor for better efficiency. 2. Selection of output capacitor (CO) Output capacitor should be selected with the consideration on the stability region and the equivalent series resistance required to smooth ripple voltage. VCC Output ripple voltage is determined by the equation (4): VOUT L ESR ΔVOUT=ΔIL×ESR [V]・・・(4) (ΔIL: Output ripple current, ESR: Equivalent series resistance of output capacitor) Co Fig.34 Output capacitor www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. ※Rating of the capacitor should be determined allowing sufficient margin against output voltage. A 22μF to 100μF ceramic capacitor is recommended. Less ESR allows reduction in output ripple voltage. 10/16 2009.08 - Rev.A Technical Note BD9151MUV 3. Selection of input capacitor (Cin) VCC Input capacitor to select must be a low ESR capacitor of the capacitance sufficient to cope with high ripple current to prevent high transient voltage. ripple current IRMS is given by the equation (5): Cin VOUT L IRMS=IOUT× Co √VOUT(VCC-VOUT) VCC The [A]・・・(5) < Worst case > IRMS(max.) When Vcc=2×VOUT, IRMS= IOUT 2 If VCC=5.0V, VOUT=1.8V, and IOUTmax.=0.4A, (BD9151MUV) Fig.35 Input capacitor IRMS=2× √1.8(5.0-1.8) 5.0 =0.48[ARMS] A low ESR 22µF/10V ceramic capacitor is recommended to reduce ESR dissipation of input capacitor for better efficiency. 4. Determination of RITH, CITH that works as a phase compensator As the Current Mode Control is designed to limit a inductor current, a pole (phase lag) appears in the low frequency area due to a CR filter consisting of a output capacitor and a load resistance, while a zero (phase lead) appears in the high frequency area due to the output capacitor and its ESR. So, adding a zero to the power amplifier output with C easily compensates the phases and R as described below to cancel a pole at the power amplifier. fp(Min.) A 0 fz(ESR) IOUTMin. Phase [deg] 1 2π×RO×CO 1 fz(ESR)= 2π×ESR×CO fp= fp(Max.) Gain [dB] IOUTMax. Pole at power amplifier When the output current decreases, the load resistance Ro increases and the pole frequency lowers. 0 -90 fp(Min.)= 1 [Hz]←with lighter load 2π×ROMax.×CO fp(Max.)= 1 2π×ROMin.×CO Fig.36 Open loop gain characteristics A [Hz] ←with heavier load fz(Amp.) Gain [dB] Zero at power amplifier Increasing capacitance of the output capacitor lowers the pole frequency while the zero frequency does not change. (This is because when the capacitance is doubled, the capacitor ESR reduces to half.) 0 0 Phase [deg] -90 fz(Amp.)= 1 2π×RITH×CITH Fig.37 Error amp phase compensation characteristics www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 11/16 2009.08 - Rev.A Technical Note BD9151MUV RITH1 R1 CITH1 VOUT1 L1 COUT1 RESET ITH1 FB1 SW1 SW1 AGND PGND1 AVCC PVCC1 PGATEB PVCC2 U1 CIN1 CIN2 PGATE PGND2 COUT2 MONI PGND2 VOUT2 COUT3 ITH2 FB2 EN SW2 SW2 RITH2 L2 CITH2 VOUT3 Fig.38 External parts sketch Stable feedback loop may be achieved by canceling the pole fp (Min.) produced by the output capacitor and the load resistance with CR zero correction by the error amplifier. fz(Amp.)= fp(Min.) 1 2π×RITH×CITH www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. = 1 2π×ROMax.×CO 12/16 2009.08 - Rev.A Technical Note BD9151MUV ●BD9151MUV Caution of Board layout RITH1 R1 CITH1 L1 RESET ITH1 FB1 AGND PGND1 AVCC PVCC1 PGATEB PVCC2 PGATE PGND2 MONI PGND2 ITH2 FB2 COUT1 SW1 SW1 U1 COUT3 VOUT1 EN SW2 RITH2 CIN1 CIN2 COUT2 VOUT2 SW2 L2 CITH2 VOUT3 Fig.39 Example of board layout ①Lay out the input ceramic capacitor CIN closer to the pins PVCC and PGND, and the output capacitor Co closer to the pin PGND. ②Lay out CITH and RITH between the pins ITH and GND as neat as possible with least necessary wiring. ※VQFN020V4040 (BD9151MUV) has thermal PAD on the reverse of the package. The package thermal performance may be enhanced by bonding the PAD to GND plane which take a large area of PCB. ●Recommended parts list, using the application above Symbol Parts name Value L1,2 Inductor 2.2µH CIN1,CIN2 Ceramic capacitor 22µF Cout1,Cout2 Ceramic capacitor CITH1 Ceramic capacitor RITH1 Resistor CITH2 RITH2 Company TDK TAIYO YUDEN Parts number LTF5022-2R2N3R2 NR3012T2R2M Murata GRM32EB11A226KE20 22µF Murata GRM31CB30J226KE18 330pF Murata GRM18 Series 22kΩ Rohm MCR03 Series Ceramic capacitor 220pF Murata GRM18 Series Resistor 15kΩ Rohm MCR03 Series U1 Pch FET - Rohm RT1A040ZP Cout3 Ceramic capacitor 22µF Murata GRM31CB30J226KE18 R1 Resistor 10kΩ Rohm MCR03 Series ※The parts list presented above is an example of recommended parts. Although the parts are sound, actual circuit characteristics should be checked on your application carefully before use. Be sure to allow sufficient margins to accommodate variations between external devices and BU9151MUV when employing the depicted circuit with other circuit constants modified. Both static and transient characteristics should be considered in establishing these margins. When switching noise is substantial and may impact the system, a low pass filter should be inserted between the VCC and PVCC pins, and a schottky barrier diode or snubber established between the SW and PGND pins. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 13/16 2009.08 - Rev.A Technical Note BD9151MUV ●I/O Equivalent circuits ・EN pin ・SW1,SW2 PVCC PVCC PVCC EN SW1,SW2 ・FB1,FB2 pin ・ITH1,ITH2 pin AVCC FB1,FB2 ITH1,ITH2 ・PGATEB pin ・RESET,MONI pin AVCC AVCC RESET,MONI PGATEB ・PGATE pin AVCC PGATE Fig.40 I/O Equivalent circuits www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 14/16 2009.08 - Rev.A Technical Note BD9151MUV ●Notes for use 1. Absolute Maximum Ratings While utmost care is taken to quality control of this product, any application that may exceed some of the absolute maximum ratings including the voltage applied and the operating temperature range may result in breakage. If broken, short-mode or open-mode may not be identified. So if it is expected to encounter with special mode that may exceed the absolute maximum ratings, it is requested to take necessary safety measures physically including insertion of fuses. 2. Electrical potential at GND GND must be designed to have the lowest electrical potential In any operating conditions. 3. Short-circuiting between terminals, and mis-mounting When mounting to pc board, care must be taken to avoid mistake in its orientation and alignment. Failure to do so may result in IC breakdown. Short-circuiting due to foreign matters entered between output terminals, or between output and power supply or GND may also cause breakdown. 4. Thermal shutdown protection circuit Thermal shutdown protection circuit is the circuit designed to isolate the IC from thermal runaway, and not intended to protect and guarantee the IC. So, the IC the thermal shutdown protection circuit of which is once activated should not be used thereafter for any operation originally intended. 5. Inspection with the IC set to a pc board If a capacitor must be connected to the pin of lower impedance during inspection with the IC set to a pc board, the capacitor must be discharged after each process to avoid stress to the IC. For electrostatic protection, provide proper grounding to assembling processes with special care taken in handling and storage. When connecting to jigs in the inspection process, be sure to turn OFF the power supply before it is connected and removed. 6. Input to IC terminals + This is a monolithic IC with P isolation between P-substrate and each element as illustrated below. This P-layer and the N-layer of each element form a P-N junction, and various parasitic element are formed. If a resistor is joined to a transistor terminal as shown in Fig 41. ○P-N junction works as a parasitic diode if the following relationship is satisfied; GND>Terminal A (at resistor side), or GND>Terminal B (at transistor side); and ○if GND>Terminal B (at NPN transistor side), a parasitic NPN transistor is activated by N-layer of other element adjacent to the above-mentioned parasitic diode. The structure of the IC inevitably forms parasitic elements, the activation of which may cause interference among circuits, and/or malfunctions contributing to breakdown. It is therefore requested to take care not to use the device in such manner that the voltage lower than GND (at P-substrate) may be applied to the input terminal, which may result in activation of parasitic elements. Resistor Transistor (NPN) ESR Pin A C Pin B B E Pin A N P + N P P + N Parasitic element N P+ P substrate Parasitic element GND B N P P C + N E Parasitic element P substrate Parasitic element GND GND GND Other adjacent elements Fig.41 Simplified structure of monorisic IC 7. Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. 8 . Selection of inductor It is recommended to use an inductor with a series resistance element (DCR) 0.1Ω or less. Especially, in case output voltage is set 1.6V or more, note that use of a high DCR inductor will cause an inductor loss, resulting in decreased output voltage. Should this condition continue for a specified period (soft start time + timer latch time), output short circuit protection will be activated and output will be latched OFF. When using an inductor over 0.1Ω, be careful to ensure adequate margins for variation between external devices and BU9151MUV, including transient as well as static characteristics. Furthermore, in any case, it is recommended to start up the output with EN after supply voltage is within operation range. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 15/16 2009.08 - Rev.A Technical Note BD9151MUV ●Ordering part number B D 9 Part No. 1 5 1 M Part No. U V - E 2 Packaging and forming specification Package MUV: VQFN20V4040 E2: Embossed tape and reel (VQFN20V4040) VQFN020V4040 <Tape and Reel information> 4.0±0.1 4.0±0.1 2.1±0.1 1.0 0.4±0.1 1 6 16 0.5 Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 5 20 10 15 2500pcs (0.22) S C0.2 Embossed carrier tape Quantity 11 2.1±0.1 0.08 S +0.03 0.02 –0.02 1.0MAX 1PIN MARK Tape +0.05 0.25 –0.04 1pin (Unit : mm) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. Reel 16/16 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2009.08 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. 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