1/4 STRUCTURE TYPE PRODUCT SERIES FEATURES Silicon Monolithic Integrated Circuit Step down DC/DC converter controller for Laptop PC BD9526AMUV ■ ■ ■ ■ Built in 2ch H3REG DC/DC converter controller The Light load mode efficiency is improved by SLLM (Simple Light Load Mode) Adjustable Switching Frequency (f=200kHz~500kHz) Built in 3ch Linear Regulator ○Absolute Maximum ratings (Ta=25℃) Parameter Terminal voltage Power dissipation 1 Power dissipation 2 Power dissipation 3 Power dissipation 4 Operating temperature range Storage temperature range Junction Temperature Symbol VIN1, VIN2, CTL EXTVCC, FB1, FB2, Is+1, Is+2, MCTL FS1, FS2, REF1, REF2, LG1,LG2,TEST1,TEST2 BOOT1, BOOT2 BOOT1-SW1, BOOT2-SW2, HG1-SW1, HG2-SW2 HG1 HG2 EN1, EN2 DGND, PGND1, PGND2 Pd1 Pd2 Pd3 Pd4 Topr Tstg Tjmax Limits 30 *1*2 7 *1*2 INTVCC+0.3 *1*2 35 *1*2 7 *1*2 BOOT1+0.3 *1*2 BOOT2+0.3 *1*2 6 *1*2 AGND±0.3 *1*2 3 Unit V V V V V V V V V 0.38* 4 0.88 * 5 2.06 * 6 4.56 * W W W W -10～+100 -55～+150 +150 ℃ ℃ ℃ *1 Do not however exceed Pd. *2 Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle. *3 Reduced by 3.0mW for each increase in Ta of 1℃ over 25℃ (when don’t mounted on a heat radiation board ) *4 Reduced by 7.0mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB which has 1 layer. (Copper foil area : 0mm2)) *5 Reduced by 16.5mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB which has 4 layers. (1st and 4th copper foil area : 20.2mm2, 2nd and 3rd copper foil area : 5505mm2)) *6 Reduced by 36.5mW for increase in Ta of 1℃ over 25℃. (when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB which has 4 layers. (All copper foil area : 5505mm2)) ○Operating supply voltage range (Ta=25℃) Parameter Terminal voltage ★ Symbol MIN. MAX. VIN1,VIN2 7 25 Unit V EXTVCC 4.5 5.5 V CTL -0.3 25 V EN1, EN2 -0.3 5.5 V BOOT1, BOOT2 4.5 30 V BOOT1-SW1, BOOT2-SW2, HG1-SW1, HG2-SW2 -0.3 5.5 V REF1, REF2 1 2.75 V Is+1, Is+ 2, FB1, FB2 1.9 5.6 V MCTL -0.3 INTVCC+0.3 V This product is not designed for protection against radioactive rays. Status of this document The Japanese version of this document is the official specification. This translated version is intended only as a reference, to aid in understanding the official version. If there are any differences between the original and translated versions of this document, the official Japanese language version takes priority. REV. B 2/4 ○Electrical characteristics (unless otherwise noted, Parameter Symbol Ta=25℃ VIN1=VIN2=12V, CTL=5V, EN1=EN2=5V, REF1=2.5V, REF2=1.65V, RFS1=RFS2=51kΩ) Min. Limit Typ. Max. Unit Condition VIN1 Bias Current VIN2 Bias Current 1 IIN1 IIN2_1 - 130 100 200 150 μA μA VIN2 Bias Current 2 IIN2_2 - 20 40 μA -0.3 2.3 -0.3 2.3 - 0 0 1 1 10 10 0.8 25 3 0.8 5.5 3 μA μA V V μA V V μA 4.90 200 - 5.00 - 5.10 180 50 V mA mV mV IINTVCC1=1mA IREG2=0mA VIN=7.5 to 25V IINTVCC=0 to 30mA 3.27 100 3.27 100 - 3.30 3.30 - 3.33 33 33 3.33 20 30 V mA mV mV V mA mV mV IREG1=1mA 4.2 2 - 4.4 4 1.0 4.6 8 2.0 V ms Ω EXTVCC: Sweep up 4.0 2.45 50 4.2 2.65 100 4.4 2.85 200 V V mV INTVCC: Sweep up REG2: Sweep up INTVCC, REG2: Sweep down REF1×2 -25m 5 REF2×2 -25m 3 -1 REF1×2 25 1 REF2×2 16 1 - REF1×2 +25m 50 3 REF2×2 +25m 32 3 1 V μA kΩ V μA kΩ μA 0.860 0.570 3.5 - 0.960 0.670 7 0.2 1.060 0.770 14 0.4 μs μs μs μs - 3.0 2.0 2.0 0.5 6.0 4.0 4.0 1.0 Ω Ω Ω Ω REF×2×0.66 0.5 REF×2×0.7 1 REF×2×0.74 2 V ms 43 - 50 2.5 2.5 57 10 10 mV μA μA 0.5 1.0 2.0 ms -0.3 - 0.3 V 1.5 - 3.0 V VIN1 Shutdown Current ISHD1 VIN2 Shutdown Current ISHD2 CTL Low Voltage VCTLL CTL High Voltage VCTLH CTL Bias Current ICTL EN Low Voltage VENL EN High Voltage VENH EN Bias Current IEN [5V Linear Regulator] INTVCC output Voltage VINTVCC INTVCC Maximum Current IINTVCC INTVCC Line regulation Reg.lINT INTVCC Load regulation Reg.LINT [3.3V Linear Regulator] REG1 Output Voltage VREG1 REG1Maximum Current IREG1 REG1Line regulation Reg.l1 REG1Load regulation Reg.L1 REG2 Output Voltage VREG2 REG2Maximum Current IREG2 REG2Line regulation Reg.l2 REG2Load regulation Reg.L2 [5V Switch Block] EXTVCC Input Threshold Voltage Vcc_UVLO EXTVCC Input Delay Time TVcc Switch Resistance RVcc [Under voltage lock out block for DC/DC] INTVCC Threshold Voltage REG1_UVLO REG2 Threshold Voltage REG2_UVLO Hysteresis voltage dV_UVLO [Error amplifier block] Feed back voltage 1 VFB1 FB1 Bias Current IFB1 Output Discharge Resistance 1 RDISOUT1 Feed back voltage 2 VFB2 FB2 Bias Current IFB2 Output Discharge Resistance 2 RDISOUT2 REF1, REF2 Bias Current IREF1, IREF2 [H3REG block] ON Time 1 TON1 ON Time 2 TON2 Maximum On Time TONMAX Minimum Off Time TOFFMIN [FET Driver block] HG higher side ON resistor HGHON HG lower side ON resistor HGLON LG higher side ON resistor LGHON LG lower side ON resistor LGLON [Short circuit protection block] SCP Threshold Voltage VSCP Delay Time TSCP [Current limit protection block] Maximum offset voltage dVSMAX Is+1 bias current IISP1 Is+2 bias current IISP2 [Soft Start block] Soft Start Time TSS [SLLM mode control block] MCTL terminal voltage 1 VCONT MCTL terminal voltage 2 VQLLM MCTL terminal voltage 3 VSLLM 4.5 - INTVCC+0.3 V MCTL float level VMCTL 1.5 - 3.0 V REV. B CTL=5V CTL=5V, EN1=EN2=0V CTL=5V, EN1=EN2=0V,EXTVCC=5V CTL=0V CTL=0V VCTL=5V VEN=3V VIN=7.5 to 25V IREG1=0 to 50mA IREG2=1mA VIN=7.5 to 25V IREG2=0 to 100mA FB1=5V FB2=3.3V REF=2.5V REF=1.65V Is+1=2V Is+2=2V Continuous mode QL2M mode (Maximum LG off time : 40usec) SL2M mode (Maximum LG off time : ∞) 3/4 ○Physical Dimensions 5.0±0.1 5.0±0.1 1.0Max. D9526A Lot No. 0.02 +0.03 -0.02 0.22 +0.05 -0.03 S 0.08 S 3.4±0.1 C0.2 8 9 32 25 3.4±0.1 0.4±0.1 1 VQFN032-V5050 (UNIT : mm) 16 24 17 0.25 +0.05 -0.04 0.75 0.5 ○Pin Description 1 3 FS2 PGND1 DGND 7 FS1 EN2 TEST2 (Vo2±5%) SCP1 14 RFS1 EN1 TEST1 (Vo1±5%) FB1 Thermal Protection 15 SS1 SS2 UVLO FB2 TM H Reg Controller Block FS1 TSD SCP2 Short Circuit Protect Timer 13 CL1 SCP1 SLLM Block MCTL1 TM 10 LG1 AGND MCTL2 H Reg Controller Block REF2 23 TM SLLM Block 3 24 Short through Protection Circuit TM 11 RFS2 22 INT VCC Short through Protection Circuit FS2 21 INTVCC INTVCC CL2 SCP2 HG1 20 2 INT VCC SW1 BOOT1 PGND2 3 Timer 4 Short Circuit Protect 5 LG2 HG2 SW2 BOOT2 VIN2 VIN2 Vo2 Adjustable Vo1 Adjustable ○Block Diagram, Application Circuit REF1 17 5V Reg VIN2 CL1 Over Current Protect REG2 CL2 Over Current Protect 8 REG2 3.3V Reg Is+1 16 VIN1 FB1 MCTL1 MCTL2 Reference Block 31 SLLM Mode Control REG2 FB2 INTVCC 9 EN1 26 30 19 REG2 TEST1 29 3.3V INTVCC EXTVCC INTVCC 3.3V VCC MCTL REG1 28 5V 12 27 CTL 7～25V VIN1 TEST2 VIN2 7～25V VIN2 18 25 REG1 6 32 VIN1 3.3V Reg REV. B PIN No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 - PIN Name LG2 PGND2 SW2 HG2 BOOT2 TEST2 DGND REF2 Is+2 FB2 FS2 MCTL AGND FS1 FB1 Is+1 REF1 CTL TEST1 BOOT1 HG1 SW1 PGND1 LG1 VIN1 EN1 REG1 EXTVCC REG2 INTVCC EN2 VIN2 FIN ＊Apply the supply voltage EXTVCC pin after INTVCC pin is operated. 4/4 ○Output condition table Input Output CTL EN1 EN2 REG1(3.3V) REG2(3.3V) INTVCC DC/DC1 Low Low Low OFF OFF OFF OFF DC/DC2 OFF Low Low High OFF OFF OFF OFF OFF Low High Low OFF OFF OFF OFF OFF Low High High OFF OFF OFF OFF OFF High Low Low ON ON ON OFF OFF High Low High ON ON ON OFF ON High High Low ON ON ON ON OFF High High High ON ON ON ON ON ○NOTE FOR USE (1) Absolute maximum rating The device may be destroyed when applied voltage or operating temperature exceeds its absolute maximum rating. Because the source, such as short mode or open mode, cannot be identified if the device is destroyed, it is important to take physical safety measures (such as fusing) if a special mode in excess of absolute rating limits is to be implemented. (2) Supply line In case the motor’s reverse electromotive force gives rise to the return of regenerative current, measures should be taken to establish a channel for the current, such as adding a capacitor between the power supply and GND. In determining the approach to take, make sure that no problems will be posed by the various characteristics involved, such as capacitance loss at low temperatures with an electrolytic capacitor. (3) GND potential Make sure the potential for the GND pin is always kept lower than the potentials of all other pins, regardless of the operating mode. (4) Thermal design Be sure to factor in allowable power dissipation (Pd) in actual operation, and to build sufficient margin into the thermal design to accommodate this power loss. (5) Operation in strong magnetic fields (6) ASO (7) Thermal shutdown circuit Use in strong electromagnetic fields may cause malfunctions. Exercise caution with respect to electromagnetic fields. Set the parameters so that output Tr will not exceed the absolute maximum rating or ASO value when the IC is used. This IC is provided with a built-in thermal shutdown (TSD) circuit, which is activated when the chip temperature reaches the threshold value listed below. When TSD is on, the device goes to high impedance mode. Note that the TSD circuit is provided for the exclusive purpose shutting down the IC in the presence of extreme heat, and is not designed to protect the IC per se or guarantee performance when or after extreme heat conditions occur. Therefore, do not operate the IC with the expectation of continued use or subsequent operation once the TSD is activated. TSD ON temperature [℃] (typ.) Hysteresis temperature [℃] 175 (8) (typ.) 15 Ground wiring pattern When both a small-signal GND and high current GND are present, single-point grounding (at the set standard point) is recommended, in order to separate the small-signal and high current patterns, and to be sure the voltage change stemming from the wiring resistance and high current does not cause any voltage change in the small-signal GND. In the same way, care must be taken to avoid wiring pattern fluctuations in any connected external component GND. (9) Heat sink (FIN) Since the heat sink (FIN) is connected with the Sub, short it to the GND. (10) For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of wiring. (11) Short-circuits between pins and and mounting errors Do not short-circuit between output pin and supply pin or ground, or between supply pin and ground. Mounting errors, such as incorrect positioning or orientation, may destroy the device. REV. B Appendix Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM CO.,LTD. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact your nearest sales office. ROHM Customer Support System www.rohm.com Copyright © 2009 ROHM CO.,LTD. THE AMERICAS / EUROPE / ASIA / JAPAN Contact us : webmaster @ rohm.co. jp 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan TEL : +81-75-311-2121 FAX : +81-75-315-0172 Appendix-Rev4.0