BIPOLAR DIGITAL INTEGRATED CIRCUIT UPB1510GV ED 3.0 GHz INPUT DIVIDE BY 4 PRESCALER IC FOR DBS TUNERS DESCRIPTION The UPB1510GV is a 3.0 GHz input divide by 4 prescaler IC for DBS tuner applications. This IC is suitable for use of frequency divider for PLL synthesizer block. This IC is a shrink package version of the µPB585G so that this small package contributes to reduce the mounting space. This IC is manufactured using our 20 GHz fT NESAT IV silicon bipolar process. This process uses silicon nitride IN U passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability. FEATURES • High operating frequency : fin = 0.5 to 3.0 GHz • High-density surface mounting : 8-pin plastic SSOP (4.45 mm (175) ) : ICC = 14 mA TYP. @ VCC = 5 V :÷4 APPLICATIONS O NT • Low current consumption • Fixed division • Prescaler between local oscillator and PLL frequency synthesizer included modulus prescaler • DBS tuners with kit use of VHF/UHF band PLL frequency synthesizer ORDERING INFORMATION (Solder Contains Lead) Part Number µPB1510GV-E1 Package 8-pin plastic SSOP Marking 1510 Supplying Form • Embossed tape 8 mm wide • Pin 1 indicates pull-out direction of tape (4.45 mm (175) ) • Qty 1 kpcs/reel DI SC Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPB1510GV ORDERING INFORMATION (Pb-Free) Part Number µPB1510GV-E1-A Package 8-pin plastic SSOP Marking 1510 (4.45 mm (175) ) Supplying Form • Embossed tape 8 mm wide • Pin 1 indicates pull-out direction of tape • Qty 1 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPB1510GV Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. Document No. PU10311EJ01V0DS (1st edition) (Previous No. P12752EJ2V0DS00) Date Published January 2003 CP(K) The mark shows major revised points. µPB1510GV PIN CONNECTIONS 1 8 2 7 3 6 4 INTERNAL BLOCK DIAGRAM D CLK IN CLK Pin Name 1 VCC 2 IN 3 IN 4 GND 5 GND 6 NC 7 OUT 8 NC IN U 5 IN Pin No. ED (Top View) D Q Q CLK Q OUT Q Amp. O NT SYSTEM APPLICATION EXAMPLE RF unit block of DBS tuners 1st IF Input (from DBS Converter) MIX. BPF SAW Baseband Output AGC Amp. FM Demod. µ PB1510GV DI SC OSC 2 ÷4 Prescaler LPF Data Sheet PU10311EJ01V0DS PLL Synthesizer for VHF/UHF Band µPB1510GV PIN EXPLANATION Pin No. 1 Pin Name VCC Applied Voltage Pin Voltage (V) (V) 4.5 to 5.5 − Function and Application Supply voltage pin. ED This pin must be equipped with bypass capacitor (example: 1 000 pF) to minimize ground impedance. 2 IN − 1.7 to 4.95 Signal input pin. This pin should be coupled to signal source with capacitor (example: 1 000 pF) for DC cut. 3 IN − 1.7 to 4.95 Signal input bypass pin. This pin must be equipped with bypass capacitor (example: 1 000 4, 5 GND 0 − IN U pF) to minimize ground impedance. Ground pin. Ground pattern on the board should be formed as wide as possible to minimize ground impedance. 6, 8 NC − − Non connection pins. These pins should be opened. OUT − 1.0 to 4.7 Divided frequency output pin. This pin is designed as emitter follower output. This pin can be O NT connected to input of prescaler within PLL synthesizer through DC cut capacitor. DI SC 7 Data Sheet PU10311EJ01V0DS 3 µPB1510GV ABSOLUTE MAXIMUM RATINGS Symbol Test Conditions Supply Voltage VCC TA = +25°C Power Dissipation PD TA = +85°C Operating Ambient Temperature TA Storage Temperature Tstg Note Ratings Unit 6.0 V 250 mW −40 to +85 °C −55 to +150 °C MAX. Unit ED Parameter Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Symbol Supply Voltage VCC Operating Ambient Temperature TA MIN. TYP. IN U Parameter 4.5 5.0 5.5 V −40 +25 +85 °C ELECTRICAL CHARACTERISTICS (TA = −40 to +85°C, VCC = 4.5 to 5.5 V, ZS = ZL = 50 Ω) Parameter Circuit Current Symbol ICC fin (U)1 MIN. TYP. MAX. Unit No Signals 10.5 14 17 mA Pin = −10 to +6 dBm 3.0 − − GHz O NT Upper Limit Operating Frequency 1 Test Conditions Upper Limit Operating Frequency 2 fin (U)2 Pin = −15 to +6 dBm 2.7 − − GHz Lower Limit Operating Frequency fin (L) Pin = −15 to +6 dBm − − 0.5 GHz Input Power 1 Pin1 fin = 2.7 to 3.0 GHz −10 − +6 dBm Pin2 fin = 0.5 to 2.7 GHz −15 − +6 dBm Pout Pin = 0 dBm, fin = 2.0 GHz −12 −7 − dBm Input Power 2 DI SC Output Power 4 Data Sheet PU10311EJ01V0DS µPB1510GV TYPICAL CHARACTERISTICS (TA = +25°C, VCC = 5 V, unless otherwise specified) CIRCUIT CURRENT vs. SUPPLY VOLTAGE 20 ED 15 10 TA = +85˚C +25˚C –40˚C 5 1 0 2 3 4 5 6 7 Supply Voltage VCC (V) IN U Circuit Current ICC (mA) No signal INPUT POWER vs. INPUT FREQUENCY 20 20 TA = –40˚C 0 Input Power Pin (dBm) 10 Guaranteed operating range –10 –20 –30 VCC = 4.5 to 5.5 V –40 0 +25˚C +85˚C O NT –10 Guaranteed operating range +85˚C –20 –30 +25˚C –40˚C –40 TA = +25˚C –50 0.1 0.3 0.5 1 3 5 VCC = 5.0 V –50 0.1 0.3 0.5 10 1 3 5 10 Input Frequency fin (GHz) OUTPUT POWER vs. INPUT FREQUENCY OUTPUT POWER vs. INPUT FREQUENCY DI SC Input Frequency fin (GHz) 0 0 VCC = 5.0 V Pin = 0 dBm ZL = 50 Ω Output Power Pout (dBm) Input Power Pin (dBm) 10 Output Power Pout (dBm) INPUT POWER vs. INPUT FREQUENCY TA = +85˚C –5 +25˚C –40˚C –10 –15 0.1 0.3 0.5 1 3 5 10 TA = +25˚C Pin = 0 dBm ZL = 50 Ω VCC = 5.5 V –5 5.0 V 4.5 V –10 –15 0.1 Input Frequency fin (GHz) 0.3 0.5 1 3 5 10 Input Frequency fin (GHz) Data Sheet PU10311EJ01V0DS 5 µPB1510GV OUTPUT POWER vs. INPUT FREQUENCY 0 VCC = 5.5 V 5.0 V 4.5 V –5 –10 –15 0.1 0.3 0.5 1 3 5 TA = +85˚C Pin = 0 dBm ZL = 50 Ω –5 –10 –15 0.1 10 VCC = 5.5 V 5.0 V 4.5 V ED TA = –40˚C Pin = 0 dBm ZL = 50 Ω Output Power Pout (dBm) Output Power Pout (dBm) 0 OUTPUT POWER vs. INPUT FREQUENCY 0.3 0.5 1 3 5 Input Frequency fin (GHz) IN U Input Frequency fin (GHz) Remark The graphs indicate nominal characteristics. S11 vs. INPUT FREQUENCY VCC = 5.0 V, TA = +25°C, ZO = 50 Ω hp MARKER 4 3 GHz O NT S11 Z REF 1.0 Units 4 200.0 mUnits/ 27.159 Ω –27.582 Ω 1 : 500 MHz 2 : 1 000 MHz 3 : 2 000 MHz 4 : 3 000 MHz DI SC 4 3 1 2 START 0.500000000 GHz STOP 3.000000000 GHz 6 Data Sheet PU10311EJ01V0DS Frequency (MHz) S11 (Ω) 500 37.1−j207.8 1 000 14.2−j105.1 2 000 7.9−j35.8 3 000 27.1−j27.5 10 µPB1510GV S22 vs. OUTPUT FREQUENCY S22 Z REF 1.0 Units 4 200.0 mUnits/ 60.925 Ω 104.77 Ω hp MARKER 4 750 MHz 4 3 1 : 125 MHz 2 : 250 MHz 3 : 500 MHz 4 : 750 MHz Frequency (MHz) S22 (Ω) 125 55.5+j6.7 250 53.7+j30.4 IN U 2 ED VCC = 5.0 V, fin = 500 MHz, TA = +25°C, ZO = 50 Ω 1 O NT START 0.125000000 GHz STOP 0.750000000 GHz 500 55.0+j60.3 750 60.9+j104.8 Frequency (MHz) S22 (Ω) 125 28.5+j11.5 250 27.6+j23.6 500 20.5+j50.7 750 15.6+j98.2 VCC = 5.0 V, fin = 3.0 GHz, TA = +25°C, ZO = 50 Ω S22 Z REF 1.0 Units 4 200.0 mUnits/ 15.613 Ω 98.168 Ω hp 4 3 DI SC MARKER 4 750 MHz 2 1 1 : 125 MHz 2 : 250 MHz 3 : 500 MHz 4 : 750 MHz START 0.125000000 GHz STOP 0.750000000 GHz Data Sheet PU10311EJ01V0DS 7 µPB1510GV TEST CIRCUIT Supply Voltage 5±0.5 V ED 1 000 pF 1 000 pF Signal Generator 50 Ω 1 8 C1 1 000 pF Counter HP5350B (Spectrum Analyzer) 1 000 pF 2 50 Ω 7 C4 C2 HP8665A C3 4 6 OPEN IN U 3 1 000 pF OPEN 5 DI SC O NT The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 8 Data Sheet PU10311EJ01V0DS µPB1510GV 1P VCC IN OUT IN U C1 C4 C3 ;;;;;;; ;;;;;;; ; ; ; ;; ; ; ; C2 IN ED ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD OUT O NT µ PB1506/08/09GV COMPONENT LIST Value 1 000 pF (1) 35 µ m thick double-sided copper-clad 50 × 50 × 0.4 mm polyimide board. (2) Back side : GND pattern (3) Solder plated on pattern : Through holes (5) of pin 3 : Pattern should be removed. (6) of pin 5 : Short chip must be attached to be grounded. ;;;;;; (4) DI SC C1 to C4 Notes Data Sheet PU10311EJ01V0DS 9 µPB1510GV PACKAGE DIMENSIONS 8-PIN PLASTIC SSOP (4.45 mm (175) ) (UNIT: mm) ED 5 8 detail of lead end 3˚+7˚ –3˚ 2.9±0.1 IN U 4 1 4.94±0.2 1.8 MAX. 3.2±0.1 1.5±0.1 0.87±0.2 0.575 MAX. 0.65 0.5±0.2 0.10 M 0.15+0.10 –0.05 O NT 0.3+0.10 –0.05 DI SC 0.1±0.1 10 Data Sheet PU10311EJ01V0DS 0.15 µPB1510GV NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). (3) Keep the wiring length of the ground pins as short as possible. RECOMMENDED SOLDERING CONDITIONS ED (4) Connect a bypass capacitor (example: 1 000 pF) to the VCC pin. This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Wave Soldering Peak temperature (package surface temperature) : 260°C or below : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds IN U VPS Condition Symbol Time at peak temperature Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (package surface temperature) : 215°C or below Time at temperature of 200°C or higher : 25 to 40 seconds Preheating time at 120 to 150°C : 30 to 60 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260°C or below O NT Infrared Reflow Soldering Conditions Time at peak temperature IR260 VP215 WS260 : 10 seconds or less Preheating temperature (package surface temperature) : 120°C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (pin temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 DI SC Caution Do not use different soldering methods together (except for partial heating). Data Sheet PU10311EJ01V0DS 11