DATA SHEET CMOS INTEGRATED CIRCUIT µPD5716GR CMOS MMIC 4 x 2 IF SWITCH MATRIX FEATURES • 4 independent IF channels, integral switching to channel input to either channel output • Integrated 4 bit decoder • Frequency range : f = 250 to 2 150 MHz • High isolation D/U ratio : ISL = 29 dB TYP. • Insertion loss : LINS = 6.7 dB TYP. @ZO = 50 Ω • Insertion loss flatness : ∆LINS = 0.7 dB TYP. • Control voltage : VCONT = 0 V/+5.0 V • 16-pin plastic HTSSOP package APPLICATIONS • DBS IF switching • Switch box • 4 × 2 switching application for microwave signal ORDERING INFORMATION Part Number µPD5716GR-E1 Order Number Package µPD5716GR-E1-A 16-pin plastic HTSSOP (Pb-Free) Marking D5716 Supplying Form • Embossed tape 12 mm wide • Pin 8, 9 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: µPD5716GR-A Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. Document No. PU10620EJ01V0DS (1st edition) Date Published June 2006 NS CP(K) µPD5716GR ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Supply Voltage Switch Control Voltage 1 to 4 Symbol Ratings Unit VDD +6.0 V VCONT1 to 4 +6.0 V Note W Total Power Dissipation Ptot 2 Input Power Pin +15 dBm Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −65 to +150 °C Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C RECOMMENDED OPERATING CONDITIONS (TA = +25°C) Parameter Supply Voltage Control Voltage (H) Note Control Voltage (L) Symbol MIN. TYP. MAX. Unit VDD +4.0 +5.0 +5.5 V VCONT (H) +4.0 +5.0 +5.5 V VCONT (L) −0.2 0 +0.4 V Note VDD−0.4 V ≤ VCONT (H) ≤ VDD+0.2 V ELECTRICAL CHARACTERISTICS (TA = +25°C, VDD = +5.0 V, VCONT = 0 V/+5.0 V, Pin = 0 dBm, ZO = 50 Ω, each port, unless otherwise specified) Parameter Insertion Loss Symbol LINS Test Conditions MIN. TYP. MAX. Unit f = 0.25 to 2.15 GHz − 6.7 9.0 dB ∆LINS LINS (0.95 GHz) − LINS (2.15 GHz) − 0.7 3.0 dB Isolation D/U-ratio1 Note 1 ISL1 f = 0.25 to 0.95 GHz 28 35 − dB Isolation D/U-ratio2 Note 1 ISL2 f = 0.95 to 2.15 GHz 25 29 − dB Output Return Loss RLout f = 0.25 to 2.15 GHz 10 13 − dB Note 2 ICONT VDD = +5.0 V, − 50 100 µA − 50 100 µA Insertion Loss Flatness Control Current VCONT = +5.0 V/0 V, non-RF Supply Current IDD VDD = +5.0 V, VCONT = +5.0 V/0 V, non-RF Notes 1. Isolation Desire Un-desire (D/U)-ratio = (Signal leakage (off-state)) − (Insertion loss (on-state)) 2. Per 1 control pin 2 Data Sheet PU10620EJ01V0DS µPD5716GR PIN CONNECTIONS (Top View) 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 Pin No. Pin Name Pin No. Pin Name 1 IN-C 16 IN-B 2 GND 15 GND 3 IN-D 14 IN-A 4 GND 13 GND 5 GND 12 VDD 6 OUT2 11 OUT1 7 VCONT3 10 VCONT1 8 VCONT4 9 VCONT2 Remark Back side. : GND Data Sheet PU10620EJ01V0DS 3 µPD5716GR TRUTH TABLE State Output Signal Control Pins No. Mode OUT1 OUT2 VCONT1 VCONT2 VCONT3 VCONT4 1 AA IN-A IN-A Low Low Low Low 2 AB IN-B Low Low Low High 3 AC IN-C Low Low High Low 4 AD IN-D Low Low High High 5 BA IN-A Low High Low Low 6 BB IN-B Low High Low High 7 BC IN-C Low High High Low 8 BD IN-D Low High High High IN-B 9 CA IN-A High Low Low Low 10 CB IN-C IN-B High Low Low High 11 CC IN-C High Low High Low 12 CD IN-D High Low High High 13 DA IN-A High High Low Low 14 DB IN-B High High Low High 15 DC IN-C High High High Low 16 DD IN-D High High High High IN-D Remark High : +5.0 Vdc, Low : 0 Vdc FUNCTIONAL DIAGRAM IN-B GND IN-A GND VDD OUT1 VCONT1VCONT2 9 4 : 16 DECODER 16 1 8 IN-C GND IN-D GND GND VCONT3VCONT4 OUT2 Remark Back Side : GND 4 Data Sheet PU10620EJ01V0DS µPD5716GR EVALUATION CIRCUIT (VDD = +5.0 V, VCONT1 to VCONT4 = 0 V/+5.0 V, Pin = 0 dBm, ZO = 50 Ω, DC Blocking Capacitor = 1 000 pF) VDD 1 000 pF OUT1 1 000 pF 1 000 pF IN-A VCONT1 1 000 pF 1 000 pF VCONT2 IN-B 16 9 1 8 ZO = 50 Ω IN-C VCONT4 1 000 pF (RF Bypass Condenser) 1 000 pF IN-D VCONT3 1 000 pF 1 000 pF (DC Blocking Condenser) OUT2 Remark Back Side : GND ZO = 50 Ω 1 000 pF (DC Blocking Condenser) The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Data Sheet PU10620EJ01V0DS 5 µPD5716GR ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD (Top View) (Bottom View) C1 C1 C1 C1 C1 C2 C2 C2 C2 C2 C1 Notes 1. 50 × 53 × 0.51 mm double sided copper clad RO4003 (Rogers) board (εr = 3.38). 2. Au plated on pattern 3. : Through holes 4. C1, C2: 1 000 pF 6 Data Sheet PU10620EJ01V0DS µPD5716GR TYPICAL CHARACTERISTICS (TA = +25°C, VDD = +5.0 V, VCONT = 0 V/+5.0 V, Pin = 0 dBm, ZO = 50 Ω, unless otherwise specified) SIGNAL LEAKAGE vs. FREQUENCY (INx-OUT, all states) INSERTION LOSS vs. FREQUENCY (INx-OUT, all states) –3 –30 SIGNAL LEAKAGE (dB) Insertion Loss LINS (dB) –4 Other mode –5 –6 –7 On channel mode : AA, BB, CC, DD –8 –40 –50 –60 –70 –9 –10 0.0 0.5 1.0 1.5 2.0 2.5 –80 0.0 3.0 1.0 1.5 2.0 2.5 3.0 Frequency f (GHz) Frequency f (GHz) INPUT RETURN LOSS vs. FREQUENCY OUTPUT RETURN LOSS vs. FREQUENCY 0 0 Input deselected Output Return Loss RLout (dB) Input Return Loss RLin (dB) 0.5 –10 –20 Input selected –30 –40 0.0 0.5 1.0 1.5 2.0 2.5 3.0 –10 –20 –30 –40 –50 0.0 Frequency f (GHz) 0.5 1.0 1.5 2.0 2.5 3.0 Frequency f (GHz) Remark The graphs indicate nominal characteristics. Data Sheet PU10620EJ01V0DS 7 µPD5716GR INSERTION LOSS vs. ON CHANNEL MODE INSERTION LOSS vs. ON CHANNEL MODE 0.0 0.0 f = 0.25 GHz f = 0.95 GHz –1.0 Insertion Loss LINS (dB) Insertion Loss LINS (dB) –1.0 –2.0 –3.0 –4.0 –5.0 –6.0 –7.0 –2.0 –3.0 –4.0 –5.0 –6.0 –7.0 AA AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD ON CHANNEL MODE ON CHANNEL MODE INSERTION LOSS vs. ON CHANNEL MODE INSERTION LOSS vs. ON CHANNEL MODE 0.0 0.0 f = 1.50 GHz f = 2.15 GHz –1.0 Insertion Loss LINS (dB) Insertion Loss LINS (dB) –1.0 –2.0 –3.0 –4.0 –5.0 –6.0 –7.0 –2.0 –3.0 –4.0 –5.0 –6.0 AA AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD –7.0 ON CHANNEL MODE AA AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD ON CHANNEL MODE Remark The graphs indicate nominal characteristics. 8 AA AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD Data Sheet PU10620EJ01V0DS µPD5716GR ISOLATION D/U-RATIO vs. ON CHANNEL MODE ISOLATION D/U-RATIO vs. ON CHANNEL MODE 0 0 f = 0.25 GHz –20 –30 –40 –50 –60 –70 –80 f = 0.95 GHz Isolation D/U-Ratio ISL (dB) Isolation D/U-Ratio ISL (dB) –10 –10 –20 –30 –40 –50 –60 AA AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD AA AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD ON CHANNEL MODE ON CHANNEL MODE ISOLATION D/U-RATIO vs. ON CHANNEL MODE ISOLATION D/U-RATIO vs. ON CHANNEL MODE 0 –10 –15 –20 –25 –30 –35 –40 f = 2.15 GHz –5 Isolation D/U-Ratio ISL (dB) Isolation D/U-Ratio ISL (dB) –5 0 f = 1.50 GHz –10 –15 –20 –25 –30 –35 –40 –45 –50 –45 AA AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD AA AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD ON CHANNEL MODE ON CHANNEL MODE Remark The graphs indicate nominal characteristics. Data Sheet PU10620EJ01V0DS 9 µPD5716GR OUTPUT RETURN LOSS vs. ON CHANNEL MODE OUTPUT RETURN LOSS vs. ON CHANNEL MODE 0 0 –5 –10 –15 –20 –25 –30 –35 –40 f = 0.95 GHz Output Return Loss RLout (dB) Output Return Loss RLout (dB) f = 0.25 GHz –5 –10 –15 –20 –25 –30 –35 –40 AA AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD AA AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD ON CHANNEL MODE ON CHANNEL MODE OUTPUT RETURN LOSS vs. ON CHANNEL MODE OUTPUT RETURN LOSS vs. ON CHANNEL MODE 0 0 –5 –10 –15 –20 –25 –30 –35 –40 f = 2.15 GHz Output Return Loss RLout (dB) Output Return Loss RLout (dB) f = 1.50 GHz AA AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD –5 –10 –15 –20 –25 –30 –35 –40 AA AB AC AD BA BB BC BD CA CB CC CD DA DB DC DD ON CHANNEL MODE ON CHANNEL MODE Remark The graphs indicate nominal characteristics. 10 Data Sheet PU10620EJ01V0DS µPD5716GR PACKAGE DIMENSIONS 16-PIN PLASTIC HTSSOP (UNIT: mm) (0.4) 8 16 1 (2.7) 5.5±0.3 9 0.20±0.10 0.65±0.1 (1.8) (0.5) 0.20±0.10 6.4±0.3 (0.1) 5.2±0.2 0.9±0.2 (2.5) (1.5) Remark ( ) : Reference value Data Sheet PU10620EJ01V0DS 11 µPD5716GR RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Partial Heating Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Caution Do not use different soldering methods together (except for partial heating). 12 Data Sheet PU10620EJ01V0DS IR260 HS350 NOTICE 1. 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