DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC2795GV GENERAL PURPOSE L-BAND DOWN CONVERTER DESCRIPTION The µPC2795GV is Silicon monolithic IC designed for L-band down converter. This IC consists of double balanced mixer, local oscillator, local oscillation buffer amplifier, IF buffer amplifier, and voltage regulator. The package is 8-pin SSOP suitable for high-density surface mount. FEATURES • Wide band operation fRF = 0.95 to 2.15 GHz • Supply voltage 5V • Low distortion IM3 = 55 dBc • Packaged in 8-pin SSOP suitable for high-density mounting ORDERING INFORMATION PART NUMBER PACKAGE µPC2795GV-E1 8-pin plastic SSOP (175 mil) PACKAGE STYLE Embossed tape 8 mm wide. 1 k/REEL Pin 1 indicates pull-out direction of tape For evaluation sample order, please contact your local NEC office. (Part number for sample order: µPC2795GV) INTERNAL BLOCK DIAGRAM 8 7 OSC Buffer PIN CONFIGURATION (Top View) 6 5 OSC REG1 IF Buffer REG2 1 8 2 7 3 6 4 5 1. RF input 2. GND 3. Vcc 4. IF out 5. OSC Base 2 6. OSC Collector 1 7. OSC Collector 2 8. OSC Base 1 MIX 1 2 3 4 Caution: Electro-static sensitive devices The information in this document is subject to change without notice. Document No. P11734EJ2V0DS00 (2nd edition) Date Published June 1998 N CP(K) Printed in Japan © 1996 µPC2795GV PIN EXPLANATIONS Pin Symbol NO. 1 Pin Volt Explanation (V, TYP.) RF IN 2.1 Equivalent Circuit RF signal input pin. Vcc Double balanced mixer with Tr.1 and Tr. 2. IF Lo Buffer 2 GND 0.0 Ground pin. 1 3 VCC 5.0 4 IF OUT 2.3 Power supply pin. IF output pin. Vcc This pin is assigned for the emitter follower output with low impedance. 4 5 OSC 2.8 Base 2 Base pin of oscillator with balanced amplifier. Connected to LC resonator through cuppling capacitor. 6 OSC 5.0 Collector 1 Collector pin of oscillator with balanced amplifier. Assemble LC resonator with 5 pin through capacitor to oscillate with active feedback loop. Loads should be connected to this pin. 7 OSC 5.0 Collector 2 Collector pin of oscillator with balanced amplifier. Assemble LC resonator with 8 pin through capacitor to oscillate with active feedback loop. Loads should be connected to this pin. 8 OSC Base 1 2.8 Base pin of oscillator with balanced amplifier. Connected to LC resonator through cuppling capacitor. 2 8 6 7 5 µPC2795GV ABSOLUTE MAXIMUM RATINGS (TA = 25 ° C, unless otherwise specified) PARAMETER Supply Voltage SYMBOL TEST CONDITION VCC TA = 85 °C *1 RATINGS UNIT 6.0 V 250 mW Power Dissipation PD Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −55 to +150 °C *1 Mounted on 50 × 50 × 1.6 mm double epoxy glass board. RECOMMENDED OPERATING RANGE PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply Voltage VCC 4.5 5.0 5.5 V Operating Ambient Temperature TA −40 +25 +85 °C ELECTRICAL CHARACTERISTICS (TA = 25 ° C, VCC = 5 V; *1) PARAMETER SYMBOL MIN. TYP. MAX. UNIT Circuit Current ICC 25.5 35.0 48.0 mA Lower Input Frequency fRF1 0.95 GHZ Upper Input Frequency fRF2 2.15 GHZ Conversion Gain 1 CG1 8.0 11.0 14.0 dB TEST CONDITIONS no input signal fRF = 950 MHz, PRF = −30 dBm, fIF = 402 MHz, POSC = −10dBm Conversion Gain 2 CG2 6.5 9.5 12.5 dB fRF = 2.15 GHz, PRF = −30 dBm, fIF = 402 MHz, POSC = −10 dBm Noise Figure 1 NF1 13.5 16.0 dB fRF = 950 MHz, fIF = 402 MHz, POSC = −10 dBm Noise Figure 2 NF2 14.0 16.5 dB fRF = 2.15 GHz, fIF = 402 MHz, POSC = −10 dBm Maximum Output Power 1 PO(sat) 1 2.0 5.0 dBm fRF = 950 MHz, PRF = 0 dBm, fIF = 402 MHz, POSC = −10 dBm Maximum Output Power 2 PO(sat) 2 0.0 3.5 dBm fRF = 2.15 GHz, PRF = 0 dBm, fIF = 402 MHz, POSC = −10 dBm *1 By measurement circuit. STANDARD CHARACTERISTICS (TA = 25 ° C, VCC = 5 V; *1) PARAMETER 3rd Order Intermodulation SYMBOL MIN. TYP. MAX. UNIT IM31 55 dBc IM32 55 dBc fRF = 2.15, 2.18 GHz, PRF = −25 dBm, fOSC = 2.63 GHz, POSC = −10 dBm Distortion 2 Oscillator Frequency fRF = 950, 980 MHz, PRF = −25 dBm, fOSC = 1430 MHz, POSC = −10 dBm Distortion 1 3rd Order Intermodulation TEST CONDITIONS fosc 1.35 2.65 GHZ *1 By measurement circuit. 3 µPC2795GV TYPICAL CHARACTERISTICS fRF vs. CG 16 14 14 CG - Conversion Gain - dB CG - Conversion Gain - dB fRF vs. CG 16 12 TA = 25 ˚C 10 TA = –40 ˚C 8 TA = 85 ˚C 6 4 VCC = 5 V fIF = 402 MHZ PRF = –30 dBm POSC = –10 dBm 2 0 2.0 1.2 1.6 fRF - Input Frequency - GHz 0.8 TA = –40 ˚C TA = 25 ˚C 10 8 TA = 85 ˚C 6 4 VCC = 5 V fIF = 480 MHZ PRF = –30 dBm POSC = –10 dBm 2 0 2.4 fIF vs. CG 16 18 14 12 TA = 85 ˚C TA = 25 ˚C 10 8 6 4 CG - Conversion Gain - dB 14 TA = –40 ˚C 16 VCC = 5 V fIF = 402 MHZ POSC = –10 dBm 2 0 0.8 2.0 1.2 1.6 fRF - Input Frequency - GHz 12 10 TA = 25 ˚C 8 TA =–40 ˚C 6 TA = 85 ˚C 4 VCC = 5 V fRF = 2.15 GHZ PRF = –30 dBm POSC = –10 dBm 2 0 2.4 600 300 400 500 fIF - Intermediate Frequency - MHz POSC vs. POUT VCC vs. ICC 4 50 fRF = 950 MHZ 40 –20 ICC - Circuit Current - mA Pout - Output Power - dBm –10 fRF = 2.15 GHZ –30 –40 –50 –40 2.4 2.0 1.2 1.6 fRF - Input Frequency - GHz 0.8 fRF vs. NF 20 NF - Noise Figure - dB 12 VCC = 5 V PRF = –30 dBm fIF = 480 MHZ TA = 25 ˚C 0 –10 –30 –20 POSC - Oscillator Input Power - dBm 10 TA = 25 ˚C 30 TA = 85 ˚C 20 TA = –40 ˚C 10 0 0 1 4 3 2 VCC - Supply Voltage - V 5 6 µPC2795GV STANDARD CHARACTERISTICS Pin vs. Pout Pin vs. Pout 20 20 10 950 MHZ 0 950 + 980 MHz –10 –20 –30 –40 VCC = 5 V fRF1 = 950 MHZ fRF2 = 980 MHZ fOSC = 1430 MHZ POSC = –10 dBm fIF = 480 MHZ TA = 25 ˚C –50 –60 –70 –80 –40 2.15 GHZ 0 Pout - Output Power - dBm Pout - Output Power - dBm 10 –30 –20 –10 0 2.15 + 2.18 GHz –10 –20 –30 –40 VCC = 5 V fRF1 = 2.15 GHZ fRF2 = 2.18 GHZ fOSC = 2.63 GHZ POSC = –10 dBm fIF = 480 MHZ TA = 25 ˚C –50 –60 –70 –80 –40 10 –30 Pin - Input Power - dBm Pin vs. Pout 10 950 MHZ Pout - Output Power - dBm Pout - Output Power - dBm 0 950 + 980 MHz –10 –20 –30 –40 VCC = 5 V fRF1 = 950 MHZ fRF2 = 980 MHZ fOSC = 1430 MHZ POSC = –10 dBm fIF = 480 MHZ TA = –40 ˚C –50 –60 –70 10 –30 –20 –10 0 2.15 GHZ 0 2.15 + 2.18 GHz –10 –20 –30 –40 VCC = 5 V fRF1 = 2.15 GHZ fRF2 = 2.18 GHZ fOSC = 2.63 GHZ POSC = –10 dBm fIF = 480 MHZ TA = –40 ˚C –50 –60 –70 –80 –40 10 –30 Pin - Input Power - dBm –20 –10 0 10 Pin - Input Power - dBm Pin vs. Pout Pin vs. Pout 20 20 10 10 950 MHZ Pout - Output Power - dBm 0 Pout - Output Power - dBm 0 20 10 950 + 980 MHz –10 –20 –30 –40 VCC = 5 V fRF1 = 950 MHZ fRF2 = 980 MHZ fOSC = 1430 MHZ POSC = –10 dBm fIF = 480 MHZ TA = 85 ˚C –50 –60 –70 –80 –40 –10 Pin vs. Pout 20 –80 –40 –20 Pin - Input Power - dBm –30 –20 –10 Pin - Input Power - dBm 0 2.15 GHZ 0 2.15 + 2.18 GHz –10 –20 –30 –40 VCC = 5 V fRF1 = 2.15 GHZ fRF2 = 2.18 GHZ fOSC = 2.63 GHZ POSC = –10 dBm fIF = 480 MHZ TA = 85 ˚C –50 –60 –70 10 –80 –40 –30 –20 –10 0 10 Pin - Input Power - dBm 5 µPC2795GV STANDARD CHARACTERISTICS (VCC = 5 V, TA = 25 ° C) RF Input Impedance (@1 pin) OSC Frequency Range*¹ 0 RL 0 dBm 5 dB/ 2.704 GHZ –10 –20 1.349 G Å• 2.720 G –30 –40 1 2 CENTER 2.000 GHZ RBW 1.0 MHZ VBW 1.0 MHZ SPAN 1.600 GHZ SWP 50 ms *1 Measured at IF output pin (4 pin) START 900 MHZ STOP MARKER 3 GHZ Re [Ω] Im [Ω] 1 : 950 MHZ 41.5 –152 (1.10 pF) 2 : 2150 MHZ 11.2 –54.9 (1.35 pF) OSC Input Impedance (@8 pin) IF Output Impedance 2 2 1 1 START 900 MHz STOP 3 GHz MARKER Re [Ω] Im [Ω] 1 : 1350 MHz 9.22 –36.1 (3.27 pF) 26.9 (1.63 nH) 2 : 2630 MHz 31.5 6 START 300 MHz STOP 600 MHz MARKER Re [Ω] Im [Ω] 1 : 402.8 MHz 9.48 11.2 (9.40 nH) 2 : 479.5 MHz 10.4 13.4 (4.46 nH) µPC2795GV MEASUREMENT CIRCUIT VCC OSC IN 0.1 µF 1 µF 100 pF 150 Ω 8 150 Ω 7 OSC Buffer 100 pF 6 5 OSC REG1 REG2 IF Buffer MIX 1 100 pF 2 1000 pF 3 1 µF 4 1000 pF 0.1 µ F RF IN VCC IF OUT 7 µPC2795GV APPLICATION CIRCUIT EXAMPLE VCC Vtune 0.1 µF L : 7 mm 12 kΩ 0.1 µF 1000 pF 150Ω 150Ω HVU316 HVU316 1000 pF 12 kΩ 12 kΩ 2 pF 3 pF 4 pF 3 pF 2 pF 8 7 OSC Buffer 6 5 OSC REG1 REG2 IF Buffer MIX 1 100 pF 2 1000 pF 3 1 µF 4 1000 pF 0.1 µF RF IN VCC IF OUT The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 8 µPC2795GV Illustration of the application circuit assembled on evaluation board RF in Lo in C7 Vtune C4 C5 C6 VCC VCC C4 IF out UPC2795GV R2 CV1 C2 R2 Vtu C3 C1 R11 C4 R11 C5 C3 C2 R2 CV2 Cv1 = CV2 : HVU316 C1 : 4 pF C2 : 2 pF C3 : 3 pF C4 : 1000 pF L VCC C5 : 0.1 µ F C6 : 1 µF C7 : 100 pF R1 : 150 Ω R2 : 12 kΩ shows short circuited strip for ground shows cutout 9 µPC2795GV PACKAGE DIMENSIONS 8 PIN PLASTIC SSOP (unit : mm) 8 5 + 7˚ 3˚ – 3˚ detail of lead end 1 4 4.94±0.2 3.0 MAX. 0.15 –0.05 0.5±0.2 0.1±0.1 0.65 10 0.87±0.2 +0.10 1.5±0.1 1.8 MAX. 3.2±0.1 0.575 MAX. 0.3 +0.10 –0.05 0.10 M 0.15 µPC2795GV NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). (3) Keep the track length of the ground pins as short as possible. (4) A low pass filter must be attached to VCC line. (5) A matching circuit must be externally attached to output port. RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales officers in case other soldering process is used or in case soldering is done under different conditions. For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). µPC2795GV Soldering process Infrared ray reflow Soldering conditions Symbol Peak package’s surface temperature: 235 °C or below, IR35-00-3 Reflow time: 30 seconds or below (210 °C or higher), Note Number of reflow process: 3, Exposure limit : None Peak package’s surface temperature: 215 °C or below, VPS VP15-00-3 Reflow time: 40 seconds or below (200 °C or higher), Note Number of reflow process: 3, Exposure limit Wave soldering : None Solder temperature: 260°C or below, WS60-00-1 Reflow time: 10 seconds or below, Note Number of reflow process: 1, Exposure limit Partial heating Terminal temperature: 300 °C or below, method Flow time: 3 seconds or below, Note Exposure limit : None : None Note Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 °C and relative humidity at 65 % or less. Caution Do not apply more than single process at once, except for “Partial heating method”. 11 µPC2795GV The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5