- Comchip Technology

MATERIAL DATA SHEET
Material #
CDSUR & CDSU series (0603) (Halogen Free)
Product Line
SOD-523F
Date
2012/2/20
Rev.
F
COMPONENT DETAILS
No.
1
2
3
4
5
Construction
element
FR-4 Board
Wafer
Al wire
Silver paste
Molding
Compound
Material group
Material weight
(mg)
Substrate/
Terminal
Diode
Conductor
Welding
Outer
Total weight
1.357
0.029
0.001
0.006
1.881
Material
CAS
if applicable
Average mass
(%)
Copper
7440-50-8
10~30%
Epoxy Resin
67-64-1
30~60%
Fillers
19287-45-7
10~20%
E-Glass Fabric
14808-60-7
30~60%
Silicon
7440-21-3
90.40%
Aluminum
7429-90-5
0.10%
Sum(%)
Traces
41.45
0.89
Gold
7440-57-5
9.50%
Al i
Aluminum
7429 90 5
7429-90-5
99 00%
99.00%
Silicon
7440-21-3
<1%
Modified Epoxy Resin
29690-82-2
5~25%
Silver
7440-22-4
76~85%
Imidazole
827-43-0
1~4%
Amide
461-58-5
1~4%
4%
Silica
60676-86-0
70~90%
88%
Epoxy Resin
29690-82-2
6~16%
Phenolic Resin
9003-35-4
5~15%
Carbon Black
1333-86-4
0.1~1%
0.03
8%
0.18
57.45
88%
6%
5%
0%
3.274
99%
Comchip Technology CO., LTD.
www.comchiptech.com
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