- Comchip Technology

MATERIAL DATA SHEET
SMD Diodes Specialist
Material #
CZRFR & CZRF series(1005) (Halogen Free)
Product Line
Integrated Passive & Active Devices
Date
2011/10/5
Rev.
F
COMPONENT DETAILS
No.
1
2
3
4
5
Construction
element
FR-4 Board
Wafer
Al wire
Silver paste
Molding
Compound
Material group
Material
CAS
if applicable
Average mass
(%)
Copper
7440-50-8
27.62%
Nickel
7440-02-0
4.244%
Gold
7440-57-5
0.140%
Continuous Filament Fiber Glass
65997-17-3
68.00%
Silicon
7440-21-3
94.64%
Aluminum
7429-90-5
0.23%
Titanium
7440-32-6
0.04%
G ld
Gold
7440 57 5
7440-57-5
5 09%
5.09%
Aluminum
7429-90-5
99.00%
Silicon
7440-21-3
1.00%
Epoxy Resin A type
25068-38-6
4~15%
Modified Epoxy Resin
29690-82-2
1~10%
Silver
7440-22-4
76~85%
Imidazole
827-43-0
1~4%
Material weight
(mg)
Substrate/
Terminal
Diode
Conductor
Welding
Outer
Total weight
Comchip Technology CO., LTD.
2.716
0.057
0.002
0.012
3.762
Amide
461-58-5
1~4%
Silica
60676-86-0
70~90%
Epoxy Resin
29690-82-2
6~16%
Phenolic Resin
9003-35-4
5~15%
Carbon Black
1333-86-4
0.1~1%
6.549
www.comchiptech.com
TEL: +886-2-86776675
FAX: +886-2-86776672
1/1
Sum(%)
41.47
0.87
0.03
0.18
57.44
Traces