Accessories Datasheet HSP-7 • Thermal Pad suitable for NOVA22 Panel Mount SSRs • Easy to use thermal interface material • Excellent alternative to thermal grease TYPICAL PROPERTIES Description Parameters Material Color Thickness [inch (mm)] Adhesive Chomerics T725 Pink 0.005 (0.127) No Thermal Impedance [°C-in²/W] (1) 0.06 @ 25 psi Thermal Conductivity [W/m-K] (1) 0.07 Flame Rating V0 Continuous Temperature Range [°C] -55 to 125 Volume Resistivity [Ohm-cm] > 10^4 MOUNTING SURFACE PREPARATION The mounting surface, usually the heat sink, should be clean and free from machining oils and aluminum dust, and may be cleaned with any common solvent, such as isopropyl alcohol (IPA) if necessary. The surface of the heat sink may be anodized, chromate coated or unfinished aluminum. INSTALLATION OF HSP-7 PADS HSP-7 material does not require pre-heating of the heat sink prior to installing the HSP-7 pad onto the heat sink, because of the phase change nature of the HSP-7 material, please follow the process temperature/pressure guidelines below to ensure the best results for a specific assembly process: Temperature/Pressure Process Step Removing pad from clear carrier liner Recommended Range Temp. of Roll: less than 38°C (100°F) Heat Sink Temp: 16°C to 38°C (60°F to 100°F) Installing pad onto “cold” heat sink Roll Temp: 21°C to 38°C (70°F to 100°F) Installation Pressure: 25 to 50 psi (2) Heat Sink Temp: 24°C to 38°C (75°F to 100°F) Installing pad onto “warm” heat sink Roll Temp: 21°C to 38°C (70°F to 100°F) Installation Pressure: 25 to 50 psi (2) Removing protective blue release liner Temp of Heat Sink/Pad Assembly: Less than 38°C (100°F) When removing the pull-tab, use a quick, lifting motion. This is preferable over peeling the pull-tab from the HSP-7 pad and heat sink. To ensure optimal “wetting” of the HSP-7 pad to the heat sink. It is recommended that the parts be allowed to dwell one hour prior to attempting release liner removal. Do not forget to visit us at: www.crydom.com Copyright © 2016 Crydom Inc. Specifications subject to change without notice. Accessories Datasheet MECHANICAL SPECIFICATIONS Tolerances: ±0.02 in / 0.5 mm All dimensions are in: inches [Millimeters] .67 [17] 1.55 [39.4] .005 [0.1] GENERAL NOTES (1) This value is provided for reference only. Follow installation instructions for accurate thermal performance. (2) Apply pressure to the HSP-7 pad with a soft “press-pad” for 2 to 3 seconds. Rev. 100615 Do not forget to visit us at: www.crydom.com Copyright © 2016 Crydom Inc. Specifications subject to change without notice. Accessories Datasheet ANNEX - ENVIROMENTAL INFORMATION The environmental information disclosed in this annex including the EIP Pollution logo are in compliance with People’s Republic of China Electronic Industry Standard SJ/T11364 – 2006, Marking for Control of Pollution Caused by Electronic Information Products. Part Name Toxic or hazardous Substance and Elements Lead (Pb) Mercury (Hg) Cadmium (Cd) Hexavalent Chromium (Cr (VI)) Polybrominated biphenyls (PBB) Polybrominated diphenyl ethers (PBDE) Semiconductor die Solder 附件 - 环保信息 此附件所标示的包括电子信息产品污染图标的环保信息符合中华人民共和国电子行业标准 SJ/T11364 - 2006, 电子信息产品污染控制标识要求。 部件 名称 铅 汞 镉 有毒有害物质或元素 六价铬 多溴联苯 (Pb) (Hg) (Cd) (Cr (VI)) 半导体芯片 焊接点 50 Do not forget to visit us at: www.crydom.com Copyright © 2016 Crydom Inc. Specifications subject to change without notice. (PBB) 多溴二苯醚 (PBDE)