Datasheet

Nichia STS-DA1-1124B
<Cat.No.100728>
SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE
MODEL : NSSW157T
NICHIA CORPORATION
-0-
LED
Nichia STS-DA1-1124B
<Cat.No.100728>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Allowable Reverse Current
Power Dissipation
Operating Temperature
Storage Temperature
Dice Temperature
Soldering Temperature
IFP Conditions
:
Symbol
IF
IFP
IR
PD
Topr
Tstg
Tj
Tsld
Pulse Width ≤ 10msec.
Absolute Maximum Rating
150
200
85
540
-40 ~ +100
-40 ~ +100
120
Reflow Soldering : 260°C
Hand Soldering : 350°C
and
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Forward Voltage
VF
Luminous Flux
φv
x
Chromaticity Coordinate
y
-
(Ta=25°C)
Unit
mA
mA
mA
mW
°C
°C
°C
for 10sec.
for 3sec.
Duty ≤ 1/10
Condition
IF=80[mA]
IF=80[mA]
IF=80[mA]
IF=80[mA]
(Ta=25°C)
Max.
Unit
3.6
V
lm
-
Typ.
(3.2)
(30)
0.344
0.355
Forward Voltage Measurement allowance is ± 0.05V.
Luminous flux value is traceable to the CIE 127:2007-compliant national standards.
Please refer to CIE 1931 chromaticity diagram.
(3) Ranking
Item
Luminous Flux
Rank P11
Rank P10
Rank P9
Symbol
Condition
φv
IF=80[mA]
Min.
30.3
25.5
21.4
(Ta=25°C)
Max.
Unit
36.0
lm
30.3
25.5
Luminous Flux Measurement allowance is ± 7%.
Color Ranks
x
y
x
y
0.287
0.295
Rank b3
0.283
0.304
0.305
0.330
0.296
0.276
Rank b5
0.287
0.307
0.295
0.315
0.307
0.315
x
y
0.311
0.294
x
y
-1-
0.307
0.315
(IF=80mA,Ta=25°C)
Rank b4
0.304
0.330
0.330
0.330
0.360
0.339
0.311
0.294
Rank b6
0.307
0.330
0.315
0.339
0.330
0.318
Nichia STS-DA1-1124B
<Cat.No.100728>
x
y
0.330
0.339
Rank c1
0.330
0.361
0.360
0.385
0.357
0.361
x
y
0.330
0.318
Rank c2
0.330
0.357
0.339
0.361
0.356
0.351
Color Coordinates Measurement allowance is ± 0.005.
Basically, a shipment shall consist of the LEDs of a combination of the above ranks.
The percentage of each rank in the shipment shall be determined by Nichia.
2.INITIAL
OPTICAL/ELECTRICAL
CHARACTERISTICS
Please refer to “CHARACTERISTICS” on the following pages.
3.OUTLINE
DIMENSIONS
AND
MATERIALS
Please refer to “OUTLINE DIMENSIONS” on the following page.
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to “TAPING DIMENSIONS” and “PACKING” on the following pages.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT
NUMBER
The first six digits number shows lot number.
The lot number is composed of the following characters;
- Year
( 9 for 2009, A for 2010 )
- Month ( 1 for Jan., 9 for Sep., A for Oct., B for Nov. )
- Nichia's Product Number
- Ranking by Color Coordinates, Ranking by Luminous Flux
-2-
Nichia STS-DA1-1124B
<Cat.No.100728>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Temperature Cycle
Moisture Resistance Cyclic
High Temperature Storage
Temperature Humidity
Storage
Low Temperature Storage
Standard
Test Method
JEITA ED-4701
300 301
JEITA ED-4701
303 303A
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
Steady State Operating Life
Condition 1
Steady State Operating Life
Condition 2
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Vibration
Electrostatic Discharges
Adhesion Strength
Number of
Damaged
0/22
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Note
2 times
Tsld=245 ± 5°C,
5sec.
using flux
Lead-free Solder (Sn-3.0Ag-0.5Cu)
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
Ta=100°C
1 time
over 95%
0/22
100 cycles
0/50
10 cycles
0/22
1000 hrs.
0/22
1000 hrs.
0/22
Ta=-40°C
1000 hrs.
0/22
Ta=25°C, IF=80mA
1000 hrs.
0/22
500 hrs.
0/22
1000 hrs.
0/22
500 hrs.
0/22
1000 hrs.
0/22
48min.
0/22
3 times
0/22
Ta=60°C,
RH=90%
Tested with Nichia standard circuit board.
Ta=25°C, IF=150mA
Tested with Nichia standard circuit board.
Ta=100°C, IF=65mA
Tested with Nichia standard circuit board.
60°C, RH=90%, IF=100mA
Tested with Nichia standard circuit board.
Ta=-40°C, IF=80mA
JEITA ED-4701
400 403
JEITA ED-4701
300 304
JEITA ED-4702
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s2
3directions, 4cycles
R=1.5kΩ, C=100pF
Test Voltage=2kV
5N, 10 ± 1 sec.
Negative/Positive
1 time
0/22
Thermal resistance of LED with Nichia standard circuit board : Rja ≒ 120°C/W
Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm
(2) CRITERIA FOR JUDGING DAMAGE
Criteria for Judgement
Min.
Max.
Item
Symbol Test Conditions
Forward Voltage
VF
IF=80mA
U.S.L.*)
Luminous Flux
φv
IF=80mA
L.S.L.**) 0.7
*) U.S.L. : Upper Standard Level
**) L.S.L. : Lower Standard Level
-3-
1.1
Nichia STS-DA1-1124B
<Cat.No.100728>
7.CAUTIONS
The LEDs are devices which are materialized by combining Blue LEDs and special phosphors.
Consequently, the color of the LEDs is changed a little by an operating current.
Care should be taken after due consideration when using LEDs.
(1) Moisture Proof Package
· When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage to the optical
characteristics of the LEDs.
For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
· The moisture proof package is made of an aluminum moisture proof bag.
A package of
a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag.
The silica gel changes its color from blue to red as it absorbs moisture.
(2) Storage
· Storage Conditions
Before opening the package :
The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a
year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel)
is recommended.
After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less.
The LEDs should be soldered
within 168 hours (7days) after opening the package.
If unused LEDs remain, they should be
stored in moisture proof packages, such as sealed containers with packages of moisture absorbent
material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag
and to reseal the moisture proof bag again.
· If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time, baking treatment should be performed using the following conditions.
Baking treatment : more than 24 hours at 65 ± 5°C
· This product has silver plated metal parts that are inside and/or outside the package body. The silver
plating becomes tarnished when being exposed to an environment which contains corrosive gases.
Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics.
Please do not expose the LEDs to corrosive atmosphere during storage.
· After assembly and during use, silver plating can be affected by the corrosive gases emitted by
components and materials in close proximity of the LEDs within an end product, and the gases entering
into the product from the external atmosphere. The above should be taken into consideration when
designing.
· Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
-4-
Nichia STS-DA1-1124B
<Cat.No.100728>
(3) Static Electricity
· Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
· All devices, equipment and machinery must be properly grounded. It is recommended that precautions
be taken against surge voltage to the equipment that mounts the LEDs.
· When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not.
It is easy to find
static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended).
· Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower,
or the LEDs do not light at the low current.
Criteria : (VF > 2.0V at IF=0.5mA)
(4) Application Design Considerations
· In designing a circuit, the current through each LED must not exceed the absolute maximum rating.
It is recommended to use Circuit B which regulates the current flowing through each LED.
In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the current through
the LEDs may vary due to the variation in forward voltage (VF) of the LEDs. In the worst case,
some LED may be subjected to stresses in excess of the absolute maximum rating.
(B)
(A)
...
...
· This product should be operated in forward bias. A driving circuit must be designed so that the product
is not subjected to either forward or reverse voltage while it is off. In particular, if a reverse voltage is
continuously applied to the product, such operation can cause migration resulting in LED damage.
· For stabilizing the LED characteristics, it is recommended to operate at 10% of the rated current or
higher.
-5-
Nichia STS-DA1-1124B
<Cat.No.100728>
· Thermal design of the end product is of paramount importance.
Please consider the heat generation
of the LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of LED placement
on the board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum dice temperature (Tj).
· Please determine the operating current with consideration of the ambient temperature local to the LED
and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS
in this specifications. Please also take measures to remove heat from the area near the LED
to improve the operational characteristics of the LED.
· The equation 1 indicates correlation between Tj and Ta, and the equation 2 indicates correlation
between Tj and Ts.
Tj=Ta + Rja W
1
Tj=Ts + Rjs W
2
Tj = Dice Temperature : °C, Ta = Ambient Temperature : °C,
Ts = Solder Temperature (Cathode Side) : °C,
Rja = Heat resistance from Dice to Ambient temperature : °C /W,
Rjs = Heat resistance from Dice to Ts measuring point ≒ 55°C /W,
W = Inputting Power (IF VF) : W
Ts Point
-6-
Nichia STS-DA1-1124B
<Cat.No.100728>
· Warpage of circuit board with soldered LEDs may result in damage or package breakage of the LEDs.
Please pay special attention to the orientation of the LEDs as to avoid LED failure caused by bow, twist
and warpage of the board.
· Depending on the position and direction of LED, the mechanical stress on the LED package can be
changed. Refer to the following figure.
E
D
Perforated line
A
B
Slit
C
Stress : A > B > C > D > E
· When separating the circuit boards with soldered LEDs, please use appropriate tools and equipment.
Hand brake without these tools and equipment may not be used.
(5) Handling Precautions
· Bare Hand
When handling the product, touching encapsulant with bare hands will contaminate its
surface that could affects on optical characteristics.
In the worst cases, excessive
force to the encapsulant by hands might result in catastrophic failure of the LEDs due to
wire deformation and/or breakage.
· Tweezers
Since silicone used as encapsulating resin in this product is a soft material, the upper surface of the
product is soft.
Pressuring onto the product might cause catastrophic failure of the LEDs due to
damage to encapsulant (such as scratch, chip-out and delamination) and wire (such as deformation and
breakage) and LED detachment.
-7-
Nichia STS-DA1-1124B
<Cat.No.100728>
· Pick and Place
Avoid direct contact to the encapsulant with the picking up nozzle.
Failure to comply might result in damage to encapsulant and in the worst cases,
catastrophic failure of the LEDs due to wire deformation and/or breakage.
· Drop
Please note that a package damage such as crack might occur when having dropped the product.
· Printed Circuit Board Assembled (PCB with LEDs soldered)
Do not stack assembled PCBs together. Since silicone is a soft material, abrasion
between two PCB assembled with silicone encapsulated LED might cause catastrophic failure
of the LEDs due to damage to encapsulant (such as scratch, chip-out and delamination) and wire
(such as deformation and breakage) and LED detachment.
-8-
Nichia STS-DA1-1124B
<Cat.No.100728>
(6) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Pre-heat
Pre-heat time
Peak
temperature
Soldering time
Condition
Reflow Soldering
Lead Solder
Lead-free Solder
180 ~ 200°C
120 ~ 150°C
120 sec. Max.
120 sec. Max.
240°C Max.
260°C Max.
Hand Soldering
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
10 sec. Max.
10 sec. Max.
refer to
refer to
Temperature - profile 1. Temperature - profile 2.
(N2 reflow is recommended.)
Although the recommended soldering conditions are specified in the above table, reflow or hand
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
<1 : Lead Solder>
<2 : Lead-free Solder>
2.5 ~ 5°C / sec.
2.5 ~ 5°C / sec.
Pre-heating
120 ~ 150°C 60sec.Max.
Above 200°C
1 ~ 5°C / sec.
240°C Max.
10sec. Max.
1 ~ 5°C / sec.
Above 220°C
120sec.Max.
120sec.Max.
[Recommended soldering pad design]
Pre-heating
180 ~ 200°C 60sec.Max.
260°C Max.
10sec. Max.
Use the following conditions shown in the figure.
(Unit : mm)
[Recommended metal solder stencil aperture]
Use the following conditions shown in the figure.
(Unit : mm)
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow.
It is recommended that the customer use the nitrogen reflow method.
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
-9-
Nichia STS-DA1-1124B
<Cat.No.100728>
(7) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs.
When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
· Do not clean the LEDs by the ultrasonic.
When it is absolutely necessary, the influence of ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
(8) Safety Guideline for Human Eyes
· The International Electrical Commission (IEC) published in 2006 IEC 62471:2006 Photobiological
safety of lamps and lamp systems which includes LEDs within its scope. Meanwhile LEDs were
removed from the scope of the IEC 60825-1:2007 laser safety standard, the 2001 edition of which
included LED sources within its scope. However, keep in mind that some countries and regions have
adopted standards based on the IEC laser safety standard IEC 60825-1:2001 which includes LEDs
within its scope.
Following IEC 62471:2006, most of Nichia LEDs can be classified as belonging to either Exempt
Group or Risk Group 1. Optical characteristics of a LED such as radiant flux, spectrum and light
distribution are factors that affect the risk group determination of the LED. Especially a high-power
LED, that emits light containing blue wavelengths, may be in Risk Group 2.
Great care should be taken when viewing directly the LED driven at high current or the LED with
optical instruments, which may greatly increase the hazard to your eyes.
(9) Others
· NSSW157 complies with RoHS Directive.
· Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had LEDs
incorporated into it.
· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such
as office equipment, communications equipment, measurement instruments and household appliances).
Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality
and reliability are required, particularly when the failure or malfunction of the LEDs may directly
jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor
control systems, automobiles, traffic control equipment, life support systems and safety devices).
· The customer shall not reverse engineer by disassembling or analysis of the LEDs without having prior
written consent from Nichia.
When defective LEDs are found, the customer shall inform Nichia
directly before disassembling or analysis.
· The formal specifications must be exchanged and signed by both parties before large volume purchase begins.
· The appearance and specifications of the product may be modified for improvement without notice.
-10-
Nichia STS-DA1-1124B
<Cat.No.100728>
色度図
ICI Chromaticity Diagram
0.9
520
530
0.8
540
510
550
0.7
560
0.6
570
500
580
y
0.5
590
0.4
600
c1
b4
610
b3
0.3
c2
620
b6
490
630
b5
0.2
480
0.1
470
460
0
0
0.1
0.2
0.3
0.4
x
Color Coordinates Measurement allowance is ± 0.005.
-11-
0.5
0.6
0.7
0.8
2.5
相対光束 (a.u.)
Relative Luminous Flux (a.u.)
200
100
80
10
2.0
2.0
1.5
1.0
0.5
0.0
2.5
3.0
3.5
4.0
4.5
0
順電圧 VF (V)
Forward Voltage VF (V)
■ 周囲温度-順電圧特性
Ambient Temperature
TaVf vs.
Forward Voltage
100
150
200
250
IFP= 80mA
■ 周囲温度-相対光束特性
TaIv vs.
Ambient Temperature
Relative Luminous Flux
IFP= 80mA
1.4
相対光束 (a.u.)
Relative Luminous Flux (a.u.)
-12-
4.0
3.5
3.0
2.5
1.2
1.0
0.8
0.6
2.0
-60 -30
0
30
60
90
1000
200
150
100
10
1
順電流 IFP (mA)
Forward Current IFP (mA)
4.5
順電圧 VF (V)
Forward Voltage VF (V)
50
120
周囲温度 Ta (℃)
Ambient Temperature Ta (℃)
-60 -30
0
30
60
90
120
周囲温度 Ta (℃)
Ambient Temperature Ta (℃)
10
デューティー比 (%)
Duty Ratio (%)
■ 周囲温度-許容順電流特性
Ambient Temperature vs.
Allowable Forward Current
許容順電流 IF (mA)
Allowable Forward Current IF (mA)
順電流 IFP (mA)
Forward Current IFP (mA)
1000
Ta=25℃
■ デューティー比-許容順電流特性
Duty
Duty Ratio vs.
Ta=25℃
Allowable Forward Current
100
Derating
Rja=120℃/W
250
200
(58,150)
150
100
50
(100,48.0)
0
0
30
60
90
120
■ カソード側はんだ接合部温度-許容順電流特性
Solder TemperatureDerating_Ts
(Cathode Side) vs.
Allowable Forward Current
許容順電流 IF (mA)
Allowable Forward Current IF (mA)
Ta=25℃
■ 順電流-相対光束特性
IfIv
Forward Current vs.
Relative Luminous Flux
許容順電流 IFP (mA)
Allowable Forward Current IFP (mA)
■ 順電圧-順電流特性
VfIf
Forward Voltage vs.
Forward Current
周囲温度 Ta (℃)
Ambient Temperature Ta (℃)
250
200
(90,150)
150
100
(100,100)
50
0
0
30
60
90
120
カソード側はんだ接合部温度 Ts (℃)
Solder Temperature (Cathode Side) Ts (℃)
NSSW157
日亜化学工業 (株)
NICHIA CORPORATION
名称
Title
初期電気/光学特性
CHARACTERISTICS
管理番号
No.
100727 058932
Nichia STS-DA1-1124B
<Cat.No.100728>
型名 Model
■ 順電流-色度特性
Ifxy
Forward Current vs.
Chromaticity Coordinate
■ 発光スペクトル
Spectrum
Spectrum
相対発光強度 (a.u.)
Relative Emission Intensity (a.u.)
0.38
0.37
10mA
20mA
y
0.36
80mA
150mA
200mA
0.35
0.34
0.33
0.34
0.35
0.36
1.2
1.0
0.8
0.6
0.4
0.2
0.0
350
0.33
0.32
Ta=25℃
IF= 80mA
Ta=25℃
0.37
x
■ 周囲温度-色度特性
Taxy vs.
Ambient Temperature
Chromaticity Coordinate
450
550
650
波長 λ (nm)
Wavelength λ (nm)
■ 指向特性
Directivity
Directivity
IFP= 80mA
-13-
0.38
-20°
-30°
-40°
0.37
0.36
放射角度
Radiation Angle
-40℃
y
0℃
25℃
0.35
50℃
0.34
100℃
750
-10° 0° 10°
Ta=25℃
IFP= 80mA
20°
30°
40°
-50°
50°
60°
-60°
-70°
70°
-80°
80°
-90°
0.33
0.32
0.33
0.34
0.35
x
0.36
0.37
90°
1
0.5
0
0.5
相対照度 (a.u.)
Relative Illuminance (a.u.)
NSSW157
日亜化学工業 (株)
NICHIA CORPORATION
名称
Title
初期電気/光学特性
CHARACTERISTICS
管理番号
No.
100405 058221
Nichia STS-DA1-1124B
<Cat.No.100728>
型名 Model
1
Nichia STS-DA1-1124B
<Cat.No.100728>
0.52
3
(2.6)
(1)
1.4
(0.2)
Cathode
1.56
K
0.86
(0.6)
(0.3)
2.6
Anode
0.54
A
保護素子
Protection device
項目 Item
材質 Materials
パッケージ材質
Package
封止樹脂
Encapsulating Resin
電極
Electrodes
耐熱性ポリマー
Heat-Resistant Polymer
シリコーン樹脂 ( 拡散剤+ 蛍光体入り)
Silicone Resin (with Diffused + Phosphor)
銅合金+ 銀メッキ
Ag Plating Copper Alloy
(注1)
バリは寸法に含まないものとします。
(NOTE1) The LED may have flash/flange which exceeds the tolerance of this print.
(注2) 本製品には静電気に対する保護素子が内蔵されています。
(NOTE2) NSSW157 has a protection device built in as a protection
circuit against static electricity.
型名 Model
NSSW157
日亜化学工業 (株)
NICHIA CORPORATION
-14-
名称
Title
外形寸法図
OUTLINE DIMENSIONS
管理番号
No.
100115054141
単位 Unit
mm
公差 Allow
±0.2
4±0.1
Φ 1.5+0.1
-0
±0.05
2
1.75±0.1
テーピング部 Taping part
0.2±0.05
リール部
Reel part
11.4±1
9±0.3
180+0
-3
Φ
±
13
0.2
13 ±
0.2
0.65±0.1
+1
Φ 60-0
21 ±0
.8
3.25±0.1
8+0.3
-0.1
3.5±0.05
4±0.1
0 .8
±
21
Cathode
Φ
Φ 1+0.1
ラベル
Label
1.6±0.1
トレーラ部/リーダ部 Trailer Part/Leader Part
エンボスキャリアテープ
Embossed carrier tape
-15引き出し方向
Pull direction
トレーラ部Min.160mm(空部)
Trailer part Min.160mm (No LEDs)
トップカバーテープ
Top cover tape
引き出し部Min.100mm(空部)
Reel Lead Min.100mm(No LEDs)
リーダ部Min.400mm
Leader part Min.400mm
数量 5,000個入/リール
Quantity 5,000pcs/Reel
型名 Model
NxxW157xT
日亜化学工業 (株)
NICHIA CORPORATION
名称
Title
テーピング仕様図
TAPING DIMENSIONS
管理番号
No.
100405054152
単位 Unit
mm
Nichia STS-DA1-1124B
<Cat.No.100728>
JIS C 0806電子部品テーピング準拠
: Packaging of Electronic
Taping is based on the
Components on Continuous Tapes.
LED装着部
LEDs mounting part
Nichia STS-DA1-1124B
<Cat.No.100728>
シリカゲルとともにリールをアルミ防湿袋に入れ、 熱シールにより封をする。
The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed.
アルミ防湿袋
Moisture proof foil bag
リール
Reel
ラベル Label
熱シール
Seal
WHITE LED
TYPE NxxW157xT
LOT
QTY.
xxxxxx-◇◇◇
PCS
RoHS
NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
シリカゲル
Moisture absorbent material
ダンボールで仕切りをする
The box is partitioned with the cardboard.
ラベル Label
WHITE LED
TYPE NxxW157xT
RANK ◇◇◇
QTY.
PCS
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Nichia
LED
基本梱包単位 Packing Unit
アルミ防湿袋
Moisture proof foil bag
梱包箱(段ボール)
Cardbord box
S
M
L
リール数
Reel/bag
チップ個数
Quantity/bag(pcs)
1reel
5,000 MAX.
箱の寸法
Dimensions(mm)
291×237×120×8t
259×247×243×5t
444×262×259×8t
リール数
Reel/box
7reel MAX.
15reel MAX.
30reel MAX.
型名 Model
NxxW157xT
日亜化学工業 (株)
NICHIA CORPORATION
-16-
チップ個数
Quantity/box(pcs)
35,000 MAX.
75,000 MAX.
150,000 MAX.
名称
Title
梱包仕様図
PACKING
管理番号
No.
100405054163