SSPL2015 200V N-Channel MOSFET Main Product Characteristics VDSS 200V RDS(on) 0.13ohm(typ.) ID 18A ① TO - 220 Schematic Diagram Marking and Pin Assignment Features and Benefits Advanced Process Technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body recovery 175℃ operating temperature Lead free product Description These N-Channel enhancement mode power field effect transistors are produced using our proprietary MOSFET technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficiency switch mode power supplies. Absolute Max Rating Symbol Parameter Max. ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 18 ① ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 13 ① IDM Pulsed Drain Current ② 72 Power Dissipation ③ 150 W Linear Derating Factor 1.0 W/°C VDS Drain-Source Voltage 200 V VGS Gate-to-Source Voltage ± 30 V EAS Single Pulse Avalanche Energy @ L=4.2mH 412 mJ IAS Avalanche Current @ L=4.2mH 14 A -55 to +175 °C PD @TC = 25°C TJ TSTG www.goodark.com Operating Junction and Storage Temperature Range Page 1 of 7 Units A Rev.1.1 SSPL2015 200V N-Channel MOSFET Thermal Resistance Symbol Characteristics RθJC RθJA Typ. Max. Units Junction-to-case ③ — 1.0 °C/W Junction-to-ambient (t ≤ 10s) ④ — 62 °C/W Junction-to-Ambient (PCB mounted, steady-state) ④ — 40 °C/W Electrical Characteristics @TA=25℃ Symbol Parameter V(BR)DSS Drain-to-Source breakdown voltage RDS(on) Static Drain-to-Source on-resistance VGS(th) Gate threshold voltage IDSS Drain-to-Source leakage current IGSS Gate-to-Source forward leakage Qg unless otherwise specified Min. Typ. Max. Units V Conditions 200 — — — 0.13 0.15 — 0.27 — 2 — 4 — 2.26 — — — 1 — — 50 — — 100 — — -100 Total gate charge — 22.0 — Qgs Gate-to-Source charge — 6.6 — Qgd Gate-to-Drain("Miller") charge — 7.2 — VGS = 10V td(on) Turn-on delay time — 11.0 — VGS=10V, VDD =100V, tr Rise time — 25.5 — td(off) Turn-Off delay time — 21.9 — tf Fall time — 5.2 — ID =11A Ciss Input capacitance — 1038 — VGS = 0V Coss Output capacitance — 232 — Crss Reverse transfer capacitance — 51 — Ω V μA nA VGS = 0V, ID= 250μA VGS=10V,ID =11A TJ = 125°C VDS = VGS, ID = 250μA TJ = 125°C VDS =200V,VGS = 0V TJ = 125°C VGS =20V VGS = -20V ID = 18A, nC nS pF VDS=160V, RL=9.2Ω, RGEN=2.55Ω VDS = 25V ƒ = 1MHz Source-Drain Ratings and Characteristics Symbol IS ISM Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Min. Typ. Max. Units — — 18 ① A — — 72 A Conditions MOSFET symbol showing the integral reverse p-n junction diode. VSD Diode Forward Voltage — 0.89 1.3 V IS=11A, VGS=0V, TJ = 25°C trr Reverse Recovery Time — 136 — nS TJ = 25°C, IF =11A, di/dt = Qrr Reverse Recovery Charge — 900 — nC 100A/μs www.goodark.com Page 2 of 7 Rev.1.1 SSPL2015 200V N-Channel MOSFET Test Circuits and Waveforms Switch Waveforms: Notes: ①Calculated continuous current based on maximum allowable junction temperature. Package limitation current is 75A. ②Repetitive rating; pulse width limited by max. junction temperature. ③The power dissipation PD is based on max. junction temperature, using junction-to-case thermal resistance. ④The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C ⑤These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=175°C. www.goodark.com Page 3 of 7 Rev.1.1 SSPL2015 200V N-Channel MOSFET Typical Electrical and Thermal Characteristics Figure 2. Gate to source cut-off voltage Figure 1: Typical Output Characteristics Figure 3. Drain-to-Source Breakdown Voltage vs. Figure 4: Normalized On-Resistance Vs. Case Temperature www.goodark.com Temperature Page 4 of 7 Rev.1.1 SSPL2015 200V N-Channel MOSFET Typical Electrical and Thermal Characteristics Figure 5. Maximum Drain Current Vs. Case Figure 6.Typical Capacitance Vs. Drain-to-Source Temperature Voltage Figure7. Maximum Effective Transient Thermal Impedance, Junction-to-Case www.goodark.com Page 5 of 7 Rev.1.1 SSPL2015 200V N-Channel MOSFET Mechanical Data TO-220 PACKAGE OUTLINE DIMENSION_GN Symbol A A1 A2 b b1 b2 C D D1 D2 E E1 ФP ФP1 e e1 L L1 L2 L3 L4 Q1 Q2 Q3 Q4 www.goodark.com Dimension In Millimeters Min Nom Max 4.400 4.550 4.700 1.270 1.300 1.330 2.240 2.340 2.440 1.270 1.270 1.370 1.470 0.750 0.800 0.850 0.480 0.500 0.520 15.100 15.400 15.700 8.800 8.900 9.000 2.730 2.800 2.870 9.900 10.000 10.100 8.700 3.570 3.600 3.630 1.400 1.500 1.600 2.54BSC 5.08BSC 13.150 13.360 13.570 7.35REF 2.900 3.000 3.100 1.650 1.750 1.850 0.900 1.000 1.100 70 90 50 0 0 5 7 90 0 0 5 7 90 1 0 0 3 5 0 Page 6 of 7 Min 0.173 0.050 0.088 0.050 0.030 0.019 0.594 0.346 0.107 0.390 0.141 0.055 0.518 0.114 0.065 0.035 50 50 50 0 1 Dimension In Inches Nom Max 0.179 0.185 0.051 0.052 0.092 0.096 0.050 0.054 0.058 0.031 0.033 0.020 0.021 0.606 0.618 0.350 0.354 0.110 0.113 0.394 0.398 0.343 0.142 0.143 0.059 0.063 0.1BSC 0.2BSC 0.526 0.534 0.29REF 0.118 0.122 0.069 0.073 0.039 0.043 70 90 0 7 90 0 7 90 3 0 0 5 Rev.1.1 SSPL2015 200V N-Channel MOSFET Ordering and Marking Information Device Marking: SSPL2015 Package (Available) TO-220 Operating Temperature Range C : -55 to175 ºC Devices per Unit Package Type Units/Tube TO-220 Tubes/Inner Units/Inner Box Box 20 1000 50 Inner Boxes/Carton Box 6 Units/Carton Box 6000 Reliability Test Program Test Item Conditions Duration Sample Size High Tj=125℃ to 175℃ @ 80% 168 hours 3 lots x 77 devices Temperature of Max VDSS/VCES/VR 500 hours 1000 hours Reverse Bias(HTRB) High Tj=125℃ or 175℃ @ 100% 168 hours Temperature of Max VGSS 500 hours Gate 3 lots x 77 devices 1000 hours Bias(HTGB) www.goodark.com Page 7 of 7 Rev.1.1