Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MLN Series
MLN SurgeArray™ Suppressor
RoHS
Description
SurgeArray™ devices are intended to suppress ESD, EFT
and other transients in order to protect integrated circuits
or other sensitive components operating at any voltage
up to 18VDC. SurgeArray™ devices are rated to the IEC
61000-4-2 human body model ESD to help products attain
EMC compliance. The array offers excellent isolation and
low crosstalk between sections.
Size Table
Metric
EIA
3216
1206
The inherent capacitance of the SurgeArray™ Suppressor
permits it to function as a filter/suppressor, thereby
replacing separate Zener/capacitor combinations.
The MLN array is manufactured using the Littelfuse
Multilayer technology process and is similar to the
Littelfuse ML and MLE Series of discrete leadless chips.
Applications
Features
•
Data, Diagnostic
I/O Ports
Communications/
Cellular Phones
•
Analog Signal/
Sensor Lines
•
Computer/DSP
Products
•
Portable/HandHeld Products
•
Industrial Instruments
Including Medical
•
Mobile
•
RoHS Compliant
•
Low leakage
•
Four individual
devices in one chip
•
Operating voltage
up to 18VM(DC)
•
ESD rated to IEC
61000-4-2 (Level 4)
•
-55ºC to 125ºC
operating temp range
•
AC characterized
for impedance and
capacitance
•
Low-profile, PCMCIA
compatible
•
Low adjacent channel
crosstalk, -55dB
at 10MHz (Typ)
Absolute Maximum Ratings
• For ratings of individual members of a series, see device ratings and specifications table.
Continuous
MLN Series
Units
5.5 - 18
V
Operating Ambient Temperature Range (TA)
-55 to +125
ºC
Storage Temperature Range (TSTG)
-55 to +150
ºC
Steady State Applied Voltage:
DC Voltage Range (VM(DC))
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MLN.html for current information.
MLN SurgeArray™ Suppressor
Revision: August 10, 2010
MLN Series
The MLN SurgeArray™ Suppressor is designed to
help protect components from transient voltages that
exist at the circuit board level. This device provides four
independent suppressors in a single leadless chip in order
to reduce part count and placement time as well as save
space on printed circuit boards.
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MLN Series
Device Ratings and Specifications Any Single Section
Maximum Ratings (125ºC)
Maximum
Maximum
Maximum
Maximum
NonNonClamping
Continuous
repetitive
repetitive
Voltage (at
Working
Surge Current Surge Energy Noted 8/20μs)
Voltage
(8/20μs)
(10/1000μs)
Current
Part Number
VM(DC)
I TM
WTM
Specifications (25ºC)
Typical ESD
Supression Voltage
(Note1)
Nominal Voltage
at 1mA DC Test
Current
(Note 2)
(Note 3)
8kV Contact 15kV Air VN(DC)
Min
Peak Clamp Peak
VC
Capacitance
at 1 MHz
(1V p-p)
(Note 4)
C
TYP
MAX
VN(DC)
Max
(V)
(A)
(J)
(V)
(V)
(V)
(V)
(V)
(V)
(pF)
(pF)
5.5
30
0.10
15.5 at 2A
60
35
45
7.10
10.8
430
520
V9MLN41206
9.0
30
0.10
23.0 at 2A
95
50
75
11.0
16.0
250
300
V14MLN41206
14.0
30
0.10
30.0 at 2A
110
55
85
15.9
20.3
140
175
V18MLN41206
18.0
30
0.10
40.0 at 2A
165
63
100
22.0
28.0
100
125
V18MLN41206L
18.0
30
0.05
50.0 at 1A
200
95
130
25.0
35.0
45
75
V5.5MLN41206
NOTES:
1. Tested to IEC61000-4-2 Human Body Model (HBM) discharge test circuit.
2. Direct discharge to device terminals (IEC preffered test method).
3. Corona discharge through air (represents actual ESD event)
4. Capacitance may be customized, contact Sales.
Peak Current and Energy Derating Curve
Peak Pulse Current Test Waveform for Clamping Voltage
PERCENT OF PEAK VALUE
For applications exceeding 125ºC ambient temperature, the
peak surge current and energy ratings must be reduced.
PERCENT OF RATED VALUE
100
90
80
70
60
50
40
100
90
50
10
O1
t
t1
30
TIME
t2
Figure 2
20
10
0
-55
50
60
70
80
90
100
110
120
Figure 1
Example:
01 = Virtual Origin of Wave
T = Time from 10% to 90% of Peak
T1 = Rise Time = 1.25 x T
T2 = Decay Time
(Impulse Duration)
130 140 150
AMBIENT TEMPERATURE ( oC)
For an 8/20 μs Current Waveform:
8μs = T1 = Rise Time
20μs = T2 = Virtual Time
to Half Value
Typical Performance Curves
Impedance vs Frequency, 1206 Size
Equivalent Series Resistance
10000
1000
1000
Impeance |Z| (Ω)
OHMS
100
10
1
100
V5.5
V9
10
V14
V18
V18L
0.1
1MHz
10MHz
100MHz
1GHz
1
10GHz
Frequency
Figure 3
0.1
0.1
Figure 4
1
10
100
1000
Frequency (MHz)
©2010 Littelfuse, Inc.
MLN SurgeArray™ Suppressor
Revision: August 10, 2010
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MLN.html for current information.
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MLN Series
Typical Performance Curves (continued)
Nominal Voltage Stability to IEC 1000-4-2 (8kV Contact
Method, One Section)
1206 Size Pulse Rating for Long Duration Surges
(Any Single Section)
100
25
V18
NUMBER OF SURGES
1
100
V14
15
2
Surge Current (A)
NOMINAL VOLTAGE
VNOM (V)
20
V9
10
V5.5
10
103
10
1
5
∞
104
106
0
10
Figure 5
100
1000
10000
0.1
10
NUMBER OF DISCHARGES
100
Figure 6
V-I Characteristic, 1206 size
1000
10000
Square Wave Impulse Duration (μs)
Capacitance vs Frequency, 1206 Size
500
100
V18L
MAXIMUM CLAMP VOLTAGE
V5.5
V18
MAXIMUM STANDBY
400
V14
V5.5
Capacitance (pF)
Varistor Voltage (V)
V9
V18L
V18
V14
10
V9
300
V9
200
V5.5
V14
V18
100
V18L
1
10μA
100μA
1mA
10mA
100mA
1A
10A
100A
0
0.1
Current (A)
Figure 7
Figure 8
1
10
100
1000
Frequency (MHz)
Adjacent Channel Crosstalk
0
Crosstalk (dB)
-20
-40
-60
V18L
V14
V18
V9
-80
V5.5
VIN = 1VRMS
Z = 50Ω
-100
-120
0.001
Figure 9
0.01
0.1
1
10
100
1000
Frequency (MHz)
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MLN.html for current information.
MLN SurgeArray™ Suppressor
Revision: August 10, 2010
MLN Series
105
0
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MLN Series
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
components in surface mount technology are IR Re-flow
and Wave soldering. Typical profiles are shown on the right.
Reflow Solder Profile
250
The recommended solder for the MLN suppressor is
a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb).
Littelfuse also recommends an RMA solder flux.
MAXIMUM TEMPERATURE
230°C
TEMPERATURE °C
200
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
40-80
SECONDS
ABOVE 183°C
150
RAMP RATE
<2°C/s
100
PREHEAT DWELL
50
PREHEAT ZONE
0
When using a reflow process, care should be taken to
ensure that the MLN chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
0
0.5
1.0
1.5
Figure 10
2.0
2.5
3.0
3.5
4.0
TIME (MINUTES)
Wave Solder Profile
300
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50ºC before cleaning.
MAXIMUM WAVE 260°C
TEMPERATURE °C
250
200
150
SECOND PREHEAT
100
FIRST PREHEAT
50
Figure 11
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
TIME (MINUTES)
3.5
4.0
4.5
©2010 Littelfuse, Inc.
MLN SurgeArray™ Suppressor
Revision: August 10, 2010
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MLN.html for current information.
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MLN Series
Product Dimensions (mm)
PAD LAYOUT DEMENSIONS
CHIP LAYOUT DIMENSIONS
W
T
E
D
X
A
P
B
L
C
BW
S
MLN Series
BL
1206 Size
Dimension
IN
MM
A
0.890
0.035
B
1.650
0.065
C
2.540
0.100
D
0.460
0.018
E
0.790
0.030
L
0.126 -/+0.008
3.200 -/+0.200
W
0.063 -/+0.008
1.600 -/+0.200
T
0.053 Max
1.350 Max
BW
0.016 -/+0.004
0.410 -/+0.100
BL
0.007 +0.01/- 0.002
0.180 +0.25/-0.050
P
0.030 Ref
0.760 Ref
X
0.045 -/+0.004
1.140 -/+0.100
S
0.015 -/+0.004
0.380 -/+0.100
Part Numbering System
V 18 ML N 4 1206 L W T
PACKING OPTIONS*
A: Bulk Pack, 2500 pieces
H: 7in (178mm) Diameter Reel, 2500 pieces
T: 13in (330mm) Diameter Reel, 10,000 pieces
END TERMINATION
W: Ag/Pd/Pt (Silver/Platinum/Palladium)
CAPACITANCE OPTION
(no letter): Standard
L: Low Capacitance Version
DEVICE FAMILY
TVSS Device
MAXIMUM DC
WORKING VOLTAGE
MULTILAYER DESIGNATOR
SERIES DESIGNATOR
N: Array
NUMBER OF SECTIONS
DEVICE SIZE: 1206: 120mil x 60mil
Packaging*
Quantity
Device Size
13” Inch Reel
("T" Option)
7” Inch Reel
("H" Option)
Bulk Pack
("A" Option)
1206
10,000
2,500
2,500
*(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags.
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MLN.html for current information.
MLN SurgeArray™ Suppressor
Revision: August 10, 2010
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MLN Series
Tape and Reel Specifications
t1
D0
P0
PRODUCT
IDENTIFYING
LABEL
P2
PLASTIC CARRIER TAPE
E
F
K0
W
B0
t2
D1
P1
Symbol
EMBOSSMENT
TOP TAPE
A0
Description
8mm
NOMINAL
178mm
OR 330mm
DIA. REEL
Dimensions in Millimeters
A0
Width of Cavity
Dependent on Chip Size to Minimize Rotation.
B0
Length of Cavity
Dependent on Chip Size to Minimize Rotation.
K0
Depth of Cavity
Dependent on Chip Size to Minimize Rotation.
W
Width of Tape
F
Distance Between Drive Hole Centers and Cavity Centers
3.5 -/+0.5
8 -/+0.2
1.75 -/+0.1
E
Distance Between Drive Hole Centers and Tape Edge
P1
Distance Between Cavity Center
4 -/+0.1
P2
Axial Distance Between Drive Hole Centers and Cavity Centers
2 -/+0.1
P0
Axial Distance Between Drive Hole Centers
4 -/+0.1
D0
Drive Hole Diameter
1.55 -/+0.05
D1
Diameter of Cavity Piercing
1.05 -/+0.05
T1
Embossed Tape Thickness
0.3 Max
T2
Top Tape Thickness
0.1 Max
Notes :
• Conforms to EIA-481-1, Revision A
• Can be supplied to IEC publication 286-3
©2010 Littelfuse, Inc.
MLN SurgeArray™ Suppressor
Revision: August 10, 2010
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MLN.html for current information.