AOS Semiconductor Product Reliability Report AO8807 rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: (408) 830-9742 www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AO8807. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AO8807 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AO8807 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 1.8V. This device is suitable for use as a load switch. -RoHS Compliant -Halogen Free 2 II. Die / Package Information: Process Package Type Lead Frame Die Attach Bond wire Mold Material Flammability Rating Backside Metallization Moisture Level AO8807 Standard sub-micron Low voltage P channel process TSSOP-8 Cu, D/pad, Ag spot Ag epoxy 2 mils Au wire Epoxy resin with silica filler UL-94 V-0 Ti / Ni / Ag Up to Level 1 * Note * based on info provided by assembler and mold compound supplier III. Result of Reliability Stress for AO8807 Test Item Test Condition Time Point Lot Attribution Solder Reflow Precondition HTGB 168hr 85°°c /85RH +3 cycle reflow@260°°c - 3 lots Temp = 150°°c , Vgs=100% of Vgsmax 168hrs 500 hrs 1000 hrs 1 lot Temp = 150°°c , Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs 130 +/- 2°°c , 85%RH, 33.3 psi, Vgs = 80% of Vgs max 100 hrs 121°°c , 29.7psi, RH=100% 96 hrs -65°°c to 150°°c , air to air, 250 / 500 cycles (Note A*) HTRB 0 77 pcs 0 77 pcs / lot 77 pcs 0 77 pcs / lot 165 pcs 0 55 pcs / lot 165 pcs 0 55 pcs / lot 165 pcs 0 3 lots (Note B**) Temperature Cycle 495 pcs 3 lots (Note B**) Pressure Pot Number of Failures 1 lot (Note A*) HAST Total Sample size 3 lots (Note B**) 55 pcs / lot 3 III. Result of Reliability Stress for AO8807 Continues DPA Internal Vision Cross-section X-ray CSAM NA 5 5 5 5 5 5 0 NA 5 5 0 Bond Integrity Room Temp 150°°c bake 150°°c bake 0hr 250hr 500hr 40 40 40 40 wires 40 wires 40 wires 0 Solderability 245°°c 5 sec 15 15 leads 0 Note A: The HTGB and HTRB reliability data presents total of available AO8807 burn-in data up to the published date. Note B: The pressure pot, temperature cycle and HAST reliability data for AO8807 comes from the AOS generic package qualification data. IV. Reliability Evaluation FIT rate (per billion): 46 MTTF = 2478 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AO8807). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10 9 7 MTTF = 10 / FIT = 2.17 x 10 hrs = 2478 years / [2x2x77x500x258] = 46 Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tjs = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tju =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV/K 4