AOS Semiconductor Product Reliability Report AOI4184, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: (408) 830-9742 www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOI4184. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOI4184 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AOI4184 used advanced trench technology and design to provide excellent RDS(ON) with low gate charge. With the excellent thermal resistance of the DPAK package, those devices are well suited for high current load applications. -RoHS Compliant -Halogen Free 2 II. Die / Package Information: AOI4184 Standard sub-micron Low voltage N channel process 3 leads TO251A Bare Cu Soft solder G: Au 1.3mils, S: Al 20mils Soft solder UL-94 V-0 Ti / Ni / Ag Up to Level 1 * Process Package Type Lead Frame Die Attach Bond wire Mold Material Flammability Rating Backside Metallization Moisture Level Note * based on info provided by assembler and mold compound supplier III. Result of Reliability Stress for AOI4184 Test Item Test Condition Time Point Lot Attribution Total Sample size Solder Reflow Precondition HTGB 168hr 85°°c /85%RH +3 cycle reflow@260°°c - 3 lots 495pcs 0 Temp = 150°°c , Vgs=100% of Vgsmax 168hrs 500 hrs 1000 hrs 82pcs 0 1 lot (Note A*) HTRB Temp = 150°°c , Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs Pressure Pot Temperature Cycle 130 +/- 2°°c , 85%RH, 33.3 psi, Vgs = 80% of Vgs max 121°°c , 29.7psi, RH=100% -65°°c to 150°°c , air to air 82pcs 100 hrs 3 lots 96 hrs 250 / 500 cycles 77+5 pcs / lot 0 1 lot (Note A*) HAST Number of Failures 77+5 pcs / lot 165pcs 0 (Note B**) 3 lots 50+5 pcs / lot 165pcs 0 (Note B**) 3 lots 50+5 pcs / lot 165pcs 0 (Note B**) 50+5 pcs / lot 3 III. Result of Reliability Stress for AOI4184 (Standard) Continues DPA Internal Vision Cross-section X-ray CSAM NA 5 5 5 5 5 5 0 NA 5 5 0 Bond Integrity Room Temp 150°°c bake 150°°c bake 0hr 250hr 500hr 40 40 40 40 wires 40 wires 40 wires 0 Solderability 245°°c 5 sec 15 15 leads 0 Note A: The HTGB and HTRB reliability data presents total of available AOI4184 burn-in data up to the published date. Note B: The pressure pot, temperature cycle, HAST and HTS reliability data for AOI4184 comes from the AOS generic package qualification data. IV. Reliability Evaluation FIT rate (per billion): 43 MTTF = 2639 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOI4184). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)] = 1.83 x 109 / [2x164x500x258] = 43 9 7 MTTF = 10 / FIT =2.31 x 10 hrs = 2639 years Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s )] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10 -5eV / K 4