AOS Semiconductor Product Reliability Report AOD4132, rev B Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: (408) 830-9742 www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOD4132. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOD4132 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AOD4132 uses advanced trench technology to provide excellent RDS(ON), low gate charge and low gate resistance. This device is ideally suited for use as a low side switch in CPU core power conversion. -RoHS Compliant -Halogen Free 2 II. Die / Package Information: AOD4132 Standard sub-micron Low voltage N channel process Package Type 3 leads TO252 Lead Frame Bare Cu Die Attach Soft solder Bond wire Al, 5 &10mils Mold Material Epoxy resin with silica filler Flammability Rating UL-94 V-0 Backside Metallization Ti / Ni / Ag Moisture Level Up to Level 1 * Note * based on info provided by assembler and mold compound supplier Process III. Result of Reliability Stress for AOD4132 Test Item Test Condition Time Point Lot Attribution Total Sample size Solder Reflow Precondition HTGB 168hr 85°c /85%RH +3 cycle reflow@260°c Temp = 150°c , Vgs=100% of Vgsmax - 9 lots 1210pcs 0 168hrs 500 hrs 1000 hrs 164pcs 0 2 lots 77+5 pcs / lot 164pcs 0 77+5 pcs / lot 495pcs 0 50+5 pcs / lot 275pcs 0 50+5 pcs / lot 440pcs 0 (Note A*) HTRB HAST Pressure Pot Temp = 150°c , Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs 130 +/- 2°c , 85%RH, 33.3 psi, Vgs = 80% of Vgs max 100 hrs 121°c , 29.7psi, RH=100% 96 hrs 2 lots (Note A*) 9 lots (Note B**) 5 lots (Note B**) Temperature Cycle -65°c to 150°c , air to air, 250 / 500 cycles Number of Failures 8 lots (Note B**) 50+5 pcs / lot 3 III. Result of Reliability Stress for AOD4132 Continues DPA Internal Vision Cross-section X-ray CSAM NA 5 5 5 5 5 5 0 NA 5 5 0 Bond Integrity Room Temp 150°c bake 150°c bake 0hr 250hr 500hr 40 40 40 40 wires 40 wires 40 wires 0 Solderability 245°c 5 sec 15 15 leads 0 Solder dunk 260°°c 10secs 3 cycles 1 30 units 0 Note A: The HTGB and HTRB reliability data presents total of available AOD4132 burn-in data up to the published date. Note B: The pressure pot, temperature cycle and HAST reliability data for AOD4132 comes from the AOS generic package qualification data. IV. Reliability Evaluation FIT rate (per billion): 22 MTTF = 5279 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOD4132). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10 MTTF = 109 / FIT = 4.62 x 107hrs = 5279years / [2x2x164x500x258] = 22 Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K 4