Silicon Technology Reliability

Silicon Technology Reliability
Vishay Siliconix
BCD-18 TECHNOLOGY ACCELERATED OPERATING LIFE TEST RESULT
Sample Size
Equivalent Device Hours
Failure Rate in FIT
82
3 566 796
255.131
Failure Rate in FIT is calculated according to JEDEC standard JESD85, Methods for Calculating Failure Rates in Units of FITs,
based on accelerated high temperature operating life test results by using an apparent activation energy of 0.7 eV. The junction
temperature of the device at use is assumed to be 55 °C. A constant failure rate distribution is assumed. The upper confidence
bound of the failure rate is 60 %.
Document Number: 65373
Revision: 18-Nov-10
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