Reliability Report

AOS Semiconductor
Product Reliability Report
AOC2804B,
rev A
Molded CSP Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
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This AOS product reliability report summarizes the qualification result for AOC2804B. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOC2804B passes AOS quality
and reliability requirements. The released product will be categorized by the process family and
be routine monitored for continuously improving the product quality.
I. Reliability Stress Test Summary and Results
Test Item
Test Condition
Time Point
Total
Sample
Size
Number
of
Failures
Reference
Standard
HTGB
Temp = 150°C ,
Vgs=100% of Vgsmax
168 / 500 /
1000 hours
462 pcs
0
JESD22-A108
HTRB
Temp = 150°C ,
Vds=80% of Vdsmax
168 / 500 /
1000 hours
462 pcs
0
JESD22-A108
-
2772 pcs
0
JESD22-A113
96 hours
693 pcs
0
JESD22-A110
Precondition
(Note A)
HAST
168hr 85°C / 85%RH +
3 cycle reflow@260°C
(MSL 1)
130°C , 85%RH,
33.3 psia,
Vds = 80% of Vdsmax
H3TRB
85°C , 85%RH,
Vds = 80% of Vdsmax
1000 hours
693 pcs
0
JESD22-A101
Autoclave
121°C , 29.7psia,
RH=100%
96 hours
693 pcs
0
JESD22-A102
Temperature
-65°C to 150°C ,
250 / 500 /
693 pcs
0
JESD22-A104
air to air,
1000 cycles
Cycle
Note: The reliability data presents total of available generic data up to the published date.
Note A: MSL (Moisture Sensitivity Level) 1 based on J-STD-020
II. Reliability Evaluation
FIT rate (per billion): 5.09
MTTF = 22440 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one
failure per billion hours.
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Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 5.09
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MTTF = 10 / FIT = 22440 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from burn-in tests
H = Duration of burn-in testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
Af
259
87
32
13
5.64
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
130 deg C
150 deg C
2.59
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